Abstract: A process for seaming seamed component for use in seaming members useful in electrostatographic, contact electrostatic, digital and other like machines, including: a) compounding an adhesive; b) forming the adhesive in contact with a first side of the seam and the mutually mating members; c) contacting the adhesive and first side of the seam to a first heated clamp; d) contacting the second side of the seam to a second heated clamp; e) subjecting the adhesive in contact with the mutually mating members to a first cure at a first temperature to form a cured adhesive; and f) subjecting the cured adhesive to a second cure at a second temperature to form a dual-cured adhesive, wherein the second temperature is higher than the first temperature.

Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (&mgr;m) and maximum particle size D2 (&mgr;m) respectively satisfy Equations (2) and (3) below, 3<S<17  (1) D1≦5  (2) D2≦0.5(h1+h2)  (3) (wherein h1 represents the height of the protuberant electrode in the electronic component, and h2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.

Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Abstract: A method and apparatus for making garments that can cool or heat the wearer of the garment. In one embodiment, the method comprises the steps of providing a pattern board having a channel configuration formed thereon that defines at least one channel circuit, disposing a first fusible fabric over the channel configuration of the pattern board, disposing a length of tubing over the channel configuration and depressing the tubing into the channels, disposing a second fabric over the tubing and first fusible fabric to form a first laminate assembly, and applying heat and pressure to the laminate assembly to form a laminate garment structure.

Abstract: A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

Abstract: A film is adhered to a metal plate of a condensing heat exchanger by a cured layer of silicone RTV elastomer to prevent corrosion of the condensing heat exchanger. A layer of solid silicon RTV elastomer including an organosilicone functional group is applied on the pretreated metal surface. The metal plate is heated and a protective film is then applied. The film is adhered to the surface of the metal sheet by curing the layer of silicone RTV elastomer with the water. The water reacts with the organosilicone functional groups on the silicone RTV elastomer layer, cross-linking the organosilicone functional groups to create an adhesive surface which adheres the film to the surface.

Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less.

Abstract: A pressure sensitive adhesive consisting of a polyurethane foam is used for adhering decorative parts to automobiles and other vehicles. The adhesive is characterized by high tensile strength and elongation, excellent peel strength and good thermal and mechanical stress tolerance.

Abstract: A process for producing a composite material with an intermediate layer made from a thermoplastic polymer, an intermediate layer arranged thereupon, and a heat-cured layer applied to the intermediate layer, where the bonding material of the intermediate layer is a thermoplastic, the process comprising providing the materials for the intermediate layer, an optional decorative layer, and the heat-cured layer each in the form of a sheet, then bonding the sheets to the backing material at temperatures from 150 to 300° C. The intermediate layer and the backing may be composed of the same thermoplastic. The intermediate layer and the heat-cured layer may also be applied to both sides of the backing. The layered composite material may furthermore comprise a decorative layer between the intermediate layer and the heat-cured layer.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: Moisture-curable silicone sealing compositions that are tacky and self-supporting at room temperature prior to cure. When measured at 25°±1° C. at a frequency of 0.1 rad/sec, the compositions have a storage shear modulus of at least 9.0 KPa, a loss shear modulus of at least 4.0 KPa, and a viscosity of at least 98.5 KPa Sec.

Abstract: An electrical part mounting apparatus includes a pressure measuring member for measuring the pressure of a pressure head, and a moving speed control member for controlling the moving speed of the pressure head. Accordingly, the electrical part mounting apparatus can freely change the pressure and the moving speed of the pressure head to desired values, and is suitable for connection between electrical parts.

Abstract: An article is made by co-curing a lay up on a composite bond jig of fiber-reinforced composite materials having a lower layer, at least one elongated hollow mandrel of a stiffened graphite fabric having its lower surface adhered to the upper surface of the lower layer, and an upper layer adhered to the top and side surfaces of the hollow mandrel and at least portions of the upper surface of the bottom layer.

Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).

Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.

Abstract: A process for adhering a layer of organic paint to the surface of a glass sheet, and the products produced thereby. The process comprises applying a layer of a water-based silicate paint to the surface of the glass sheet, heating to cure the paint, forming the glass sheet into a shape, sensitizing the water based paint with a layer of silane material, applying a layer of organic paint over the layer of sensitized water-based silicate paint, and curing the organic paint to provide organic paint adhered to the glass surface.

Abstract: A decorated article is disclosed which has a uniform color tone and which is excellent in heat resistance and humidity resistance which can be produced by preparing a base material, a surface of which is composed of an overlay, by injection molding or the like, the overlay having a wood material layer, a first side of the wood material layer constituting a surface of the overlay; providing a thermosetting coloring layer comprising at least one thermosetting resin, or a modified resin thereof, selected from the group of urethane resins, epoxy resins, amino-alkyd resins, and acrylic resins on the first side of the wood material layer; and laminating the surface of the thermosetting coloring layer with a thermoplastic resin sheet by a glue, and carrying out hot-pressing. The thermosetting coloring layer 15 may be formed by laminating a coloring layer 15A and a sealing layer 15B in that order.

Abstract: A lightweight, three dimensional structural article having low radar reflectivity characteristics and good mechanical properties is fabricated from a syntactic foam core having a structural outer skin. A syntactic foam sealing adhesive film is applied to the surface of syntactic foam core and under the outer skin to both seal the foam core and adhere the outer skin. The syntactic foam sealing adhesive is formulated to provide a uniform layer and to reduce the fabrication time and labor while improving the overall radar absorbing characteristics of the structural article.

Abstract: A method of bonding two or more substrates together which comprises

Abstract: A method for bonding a plurality of non-magnetic members includes the steps of (1) mating the non-magnetic members via an uncured adhesive interposed between their surfaces to be bonded; (2) applying pressure to their mated portions between a pressing magnet jig and a pressure-receiving, soft-magnetic jig; and (3) curing the adhesive while applying pressure.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.

Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device.

Abstract: A composite multifunctional microstructure which comprises at least one functionalizing material associated with a microstructure wherein the microstructure comprises a layer of relief forming material preferably comprising an at least partially UV curable relief forming polymer having a plurlaity of relief features formed therein to provide at least one retaining feature and wherein the functionalizing material is deposited within and substantially or partially fills or lines the at least one retaining feature, method for the preparation thereof.

Abstract: A multi-layer recording medium including a light-transmitting substrate, a first information recording layer formed on the substrate, an intermediate layer at least part of which is formed of a photo-curable resin film, and which is formed on the first information recording layer, a second information recording layer formed on a surface of the intermediate layer opposite to the surface facing the first information signal layer, and a protective layer formed on the second information signal layer. A method for producing such multi-layer recording medium is also disclosed.

Abstract: The invention relates to a method for using adhesive polymers containing conductive fillers to manufacture iontophoretic devices in which the conductive lead and the conducted printed trace are strongly mechanically bonded together and resulting in electronic interconnection between the conductive lead and conductive printed trace.

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.

Abstract: An acoustic liner employable in jet engine housing construction for sound absorption such as for inclusion in nacelle components. The liner has a solid backface sheet having a surface to which is attached a first side of a honeycomb core structure. Attached to the opposing second side of the honeycomb core structure is a mesh structure to which is attached a perforated face sheet to be exposed to the exterior. As is thus apparent, the liner of the present invention provides a mesh situated below a protective perforate sheet. This construction produces an acoustic liner having substantially the efficiency of a linear liner system and the durability of a perforate face sheet system.