Interposing Intermediate Laminate Between Non-coated Laminae Patents (Class 156/313)
  • Publication number: 20080299345
    Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
    Type: Application
    Filed: March 28, 2008
    Publication date: December 4, 2008
    Inventors: Yasumasa MORISHIMA, Kenji Kita, Shinichi Ishiwata
  • Patent number: 7452493
    Abstract: A method of manufacturing a protective cover (24) for a component of a vehicle includes assembling multiple layers to form a charge (22). The charge (22) is formed within a mold (50) of the component to form a multi-contoured laminate (58). The protective cover (24) is separated from the multi-contoured laminate (58). A method of forming a down stream part structure or mold (167) for a component includes assembling multiple layers to form a charge (78). The charge (78) is formed within an original mold of the component to form a multi-contoured laminate (76). A splash is separated from the multi-contoured laminate (76). A protective cover, such as the cover (24), is for a vehicle component and includes a contour holding layer (36) and a protective laminate layer (34). The contour holding layer (36) and the protective laminate layer (34) are formed within a mold of the vehicle component to form the protective cover.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: November 18, 2008
    Assignee: The Boeing Company
    Inventors: Jeffrey T. Wirrick, Michael J. Cloud
  • Publication number: 20080280134
    Abstract: The invention relates to a process for the production of fibre-reinforced composite components in which an outer film is bonded with a layer containing fibre- reinforced polyurethane, characterised in that a) first an elastic intermediate layer which has a modulus of elasticity of 0.5 MPa to 50 MPa and a thickness of 0.3 mm to 6 mm, is applied to the outer film which has a thickness in the range of 0.2 mm to 5 mm, and then b) at least one other layer is applied to the back of the intermediate layer, at least one layer containing fibre-reinforced polyurethane being applied.
    Type: Application
    Filed: March 7, 2006
    Publication date: November 13, 2008
    Inventors: Ingo Kleba, Frank Berghahn, Andreas Petersohn, Hans-Guido Wirtz, Klaus Franken, Detlef Mies, Marc Schutze, Dirk Wegener
  • Publication number: 20080271354
    Abstract: A device and method for formation of indicia adjacent to a mirrored surface yielding substantially distortion free reflections of said indicia in said mirrored surface. Mirrors so formed can be employed as background for photographs and graphics and produced in small quantities and be free of double images of common mirror surface graphics.
    Type: Application
    Filed: May 5, 2008
    Publication date: November 6, 2008
    Inventor: Grant Phillips Bostrom
  • Publication number: 20080248282
    Abstract: A method is provided for fixing a silicone gel component, including a step of contacting the gel component with a sheet made of microporous material, such that the silicone gel is attracted upon contact with the sheet, thereby forming an assembly in which the component is fixed to the sheet without glue or adhesive. The method is applicable to the production of modules for protecting a human body part, in particular the foot.
    Type: Application
    Filed: April 9, 2008
    Publication date: October 9, 2008
    Applicant: MILLET INNOVATION
    Inventors: Jean-Luc MARTIN, Jean-Claude MILLET
  • Publication number: 20080178922
    Abstract: A solar panel apparatus and method. The apparatus has an optically transparent member comprising a predetermined thickness and an aperture surface region. The apparatus has a solar cell coupled to a portion of the optically transparent member. In a specific embodiment, the solar cell includes a transparent polymeric member and a plurality of photovoltaic regions provided within a portion of the transparent polymeric member. In a specific embodiment, the plurality of photovoltaic regions occupies at least about 10 percent of the aperture surface region of the transparent polymeric member and less than about 80% of the aperture surface region of the transparent polymeric member.
    Type: Application
    Filed: July 25, 2006
    Publication date: July 31, 2008
    Applicant: Solaria Corporation
    Inventors: Kevin R. Gibson, Alelie T. Funcell
  • Publication number: 20080163978
    Abstract: Extrusion and lamination processes are provided for producing multi-layer constructions wherein metal and polyolefin layers are bonded through a tie-layer comprising a base resin and two functionalized ethylene polymers.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 10, 2008
    Inventor: Maged G. Botros
  • Publication number: 20080131697
    Abstract: A method for constructing a multi-dimensional effect decorative covering comprising combining a translucent medium with a colorant such as ink, applying the translucent medium having the colorant to at least one surface of at least one of a plurality of transparent films, and layering the plurality of transparent films upon one another whereby the applied translucent medium having the colorant is between at least two of the plurality of transparent films.
    Type: Application
    Filed: July 19, 2007
    Publication date: June 5, 2008
    Inventor: Michael Solano
  • Patent number: 7292448
    Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: November 6, 2007
    Assignee: Sony Corporation
    Inventors: Toshichika Urushibara, Koji Shiozawa, Masakazu Okabe, Yukiko Hyodo, Yusuke Masuda, Tadayuki Miyamoto
  • Patent number: 7264853
    Abstract: A pellicle membrane is mounted between an outer frame and an inner frame. At least one of the frames is attached to the reticle without using conventional adhesives. The pellicle and reticle may be used in a lithography system. The pellicle allows radiation to pass through the pellicle to the reticle and may prevent particles from passing through the pellicle.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: September 4, 2007
    Assignee: Intel Corporation
    Inventors: Florence Eschbach, Paul Zimmerman, Alexander Tregub, Fu-Chang Lo
  • Patent number: 7211353
    Abstract: A non-aqueous electrolytic solution is provided comprising a non-aqueous solvent, an electrolyte salt, and a siloxane-modified polyoxyalkylene compound having (poly)organosiloxane structures at both ends of polyoxyalkylene. A secondary battery using the same has improved temperature characteristics and high-output characteristics.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: May 1, 2007
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Meguru Kashida, Satoru Miyawaki, Mikio Aramata, Shoji Ichinohe
  • Patent number: 7186311
    Abstract: The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: March 6, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Kyouyuu Jo, Yasufumi Miyake
  • Patent number: 7089659
    Abstract: A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically conducting patterns having inclined surfaces at the ends by printing an electrically conducting paste on the main surface of the ceramic green sheet; forming ceramic patterns having inclined surfaces at the ends among the electrically conducting patterns by printing a ceramic paste with a distance of not smaller than 10?m from the electrically conducting patterns; and laminating ceramic green sheets on which are formed the electrically conducting and ceramic patterns.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: August 15, 2006
    Assignee: Kyocera Corporation
    Inventors: Toshihiro Iwaida, Seiichi Koizumi
  • Patent number: 6908318
    Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: June 21, 2005
    Assignee: 3M Innovative Properties Company
    Inventor: Kohichiro Kawate
  • Patent number: 6835274
    Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: December 28, 2004
    Assignee: Sony Corporation
    Inventors: Noriyuki Honda, Yasuhiro Suga
  • Patent number: 6770164
    Abstract: An improved method of attaching a semiconductor die to an organic substrate and an improved semiconductor package are herein disclosed. The die package comprises a die secured to a printed circuit board (PCB) with an adhesive tape. The adhesive tape may be of ingle or multi-layer construction. In one embodiment, a tri-layer tape is disclosed having a carrier layer sandwiched between two identical adhesive layers. In one embodiment, a method is disclosed utilizing a pressure sensitive, thermoset adhesive tape. In another embodiment, a method is disclosed utilizing a B-stageable thermoset adhesive. In yet another embodiment, a method using a pressure sensitive adhesive is disclosed. In still yet another embodiment, a method is disclosed wherein the adhesive is a hybrid material having both thermoset and thermoplastic components.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: August 3, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Edward A. Schrock, Tongbi Jiang
  • Patent number: 6722501
    Abstract: A package assembly including a housing that has an attachable portion and a manually removable portion. Also included is a length of attachment strip material having opposite major surfaces defined by stretch release adhesive extending between its opposite ends. The length of attachment strip material has a first part adhered along the outer surface of the attachable portion of the housing, and a second part extending from one end of the first part; and that second part of the length of attachment strip material is disposed to restrict adhesion between it and a planar surface to which the first part of the length of attachment strip material is adhered to support the housing along that surface.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: April 20, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Michael D. Hamerski, Ronald C. Johansson
  • Publication number: 20040007324
    Abstract: The invention relates to a method for producing a multi-layer document card, especially an identity card made of plastic, comprising several layers. Said card comprises a card core with at least one card core layer, a protective layer on at least one side of said card core, and adhesive layers between the individual card layers. The card core is printed on either on one or two sides.
    Type: Application
    Filed: May 5, 2003
    Publication date: January 15, 2004
    Inventors: Ralf Henn, Dirk Fischer, Matthias Schumacher
  • Patent number: 6632498
    Abstract: Heat-activatable single-sided self-adhesive tape, characterized by a) a heat-activatable double-sided adhesive film strip based on thermoplastic rubber, tackifier resin and reactive resin, b) a double-sided self-adhesive tape laminated onto one side of the said strip, and c) if desired, release paper or a release film on one side of the adhesive tape.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: October 14, 2003
    Assignee: tesa AG
    Inventors: Dieter Zimmermann, Harald Kehler, Walter Schulze
  • Patent number: 6610165
    Abstract: A method for coating an orifice plate and an orifice plate having a non-wetting coating thereon is provided. To form the plate, material having non-wetting characteristics can be provided as a surface of a transfer block. The non-wetting material is preferably Teflon (PTFE) and the transfer block is preferably a relatively soft material, which preferably has good heat transfer properties, such as aluminum. The surface of the transfer block comprising the non-wetting material can be pressed against the orifice plate, preferably under heating conditions. In one embodiment of the invention, the non-wetting surface is pressed against a secondary transfer block to coat the secondary transfer block with the non-wetting material and the coated surface of this second block is pressed against the orifice plate, preferably under heating conditions.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: August 26, 2003
    Assignee: Illinois Tool Works Inc.
    Inventors: Gregory A. Myhill, Norma Miller
  • Patent number: 6605357
    Abstract: A PEI film to be bonded is disposed on a glass epoxy substrate through an alkane film, and a position to be adhered is heated to a temperature not less than the glass transition point Tg of the PEI film, thereby forming an adhesion-improving layer in which the alkane is dispersed into the PEI film, in the PEI film at the interface with the glass epoxy substrate. That is, the PEI film is bonded to the glass epoxy substrate through the adhesion-improving layer. Therefore, an adhesive strength is improved because the adhesion-improving layer has an elastic modulus lower than that of the PEI film.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: August 12, 2003
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Katsuaki Kojima, Hiroyasu Iwama
  • Patent number: 6602373
    Abstract: An adhesive system comprises two layers of adhesive, one layer being relatively thin and the other being optionally thicker, being separated by a permeable web. The relatively thin layer of the adhesive system provides a relatively weak initial bond between a substrate and an object to be adhered to a substrate, so that the object can be repositioned on the substrate if desired. Pressure is then applied to make the two layers of adhesive come into contact with one another through the permeable web, such that the layers function as an integral layer to provide a strong bond. The permeable web also provides tensile strength and structural support for brittle or extensible articles.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: August 5, 2003
    Assignee: Avery Dennison Corporation
    Inventor: James E. McGuire, Jr.
  • Patent number: 6592402
    Abstract: An interface system is provided for adhering a pair of electrical connector components together. A first connector component has a first interface surface with a first set of elongated, mutually spaced adhesive flow fins. A second connector component has a second interface surface with a second set of elongated adhesive flow fins for disposition between the first set of adhesive flow fins. The flow fins of at least one of the first or second sets thereof are tapered from enlarged ends of the fins to reduced ends thereof for forcing liquid adhesive material between the interface surfaces longitudinally of the fins from the enlarged ends thereof toward the reduced ends thereof automatically when the interface surfaces are brought together.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: July 15, 2003
    Assignee: Molex Incorporated
    Inventors: Scott P. Marceau, Brenda R. Courim, Frank T. Keyser
  • Patent number: 6589383
    Abstract: The present invention provides an tonically conductive composition comprising a linear copolymer of a compound (A) having two functional groups (a) and a compound (B) having two functional groups (b) and an electrolyte; as well as a battery containing it. Preferably, a polymer having a network structure obtained by reacting the linear copolymer having functional group (b) at each end with a compound having three or more functional groups (a) is used in the ionically conductive composition of the present invention.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: July 8, 2003
    Assignees: Mitsubishi Paper Mills Limited, Nippon Unicar Company Limited
    Inventors: Kazuchiyo Takaoka, Koshiro Ikegami, Kenji Hyodo, Hiroaki Watanabe, Takakazu Hino, Naoki Shikano, Eiji Andou
  • Publication number: 20030062114
    Abstract: A dustfree filling and sealing apparatus is disclosed. A pair of wrapping clean films 10 which are free of cleaning are supplied from a pair of wrapping clean film supply means 1. Two outer layer films 10b are peeled off and removed from the wrapping clean films 10 by a pair of outer layer film peeling-off means 2. Thus, clean surfaces of inner layer films 10a appear. The two inner layer films 10a are conveyed by a pair of inner layer film conveying means 4 so that these films are opposed. An object 15 is inserted between the inner layer films 10a by an object filling means 5. The inner layer films 10a are sealed by an impulse seal head 6. The present invention also discloses a wrapping clean film producing method and a dustfree container.
    Type: Application
    Filed: May 16, 2002
    Publication date: April 3, 2003
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masahisa Yamaguchi, Hiroshi Yamamoto, Koji Otsuka
  • Publication number: 20030019574
    Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.
    Type: Application
    Filed: October 29, 2001
    Publication date: January 30, 2003
    Inventors: Myung-Sam Kang, Keon-Yang Park, Jang-Kyu Kang
  • Patent number: 6508910
    Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: January 21, 2003
    Assignee: Hexcel Corporation
    Inventors: Ligui Zhou, Philippe D. Christou
  • Patent number: 6495259
    Abstract: A method of bonding a rubber substrate to an epoxy resin based substrate which is particularly suitable for constructing selected components of rocket motors such as motor cases. The subject method includes disposing an acrylate between the substrates to be bonded together. The interfacial layer preferably has at least one rubber constituent and at least one acrylate therein. The disclosed method is particularly suitable for, but not limited to, bonding an unvulcanized EPDM rubber substrate to an aliphatic-type epoxy resin based composite substrate containing fibrous reinforcement elements such as graphite or carbon fibers. Upon disposing the disclosed interfacial layer between the substrates to be bonded, the substrates are preferably co-cured at an elevated temperature to complete the bonding thereof.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: December 17, 2002
    Assignee: Alliant Techsystems Inc.
    Inventor: Alan I. Kasner
  • Publication number: 20020185220
    Abstract: An apparatus and method for splicing photographic films is disclosed, where the films are conveyed along a path and supported by a track element. Upon being positioned to receive a splice, the films are clamped between a movable splice pad and the track element. The clamping action produced by the movable splice pad substantially eliminates the problem of film foldovers caused by curling at the trailing end of a film. A splice head is lowered to apply a splice tape to the films, thereby forming the splice. The films are spliced together in a flattened state, producing a continuous web of film which can be wound onto a roll or core for further processing.
    Type: Application
    Filed: June 8, 2001
    Publication date: December 12, 2002
    Inventors: Gunnar Gudmundson, Douglas A. Kenyon, Leslie G. Weidman
  • Publication number: 20020179227
    Abstract: A tire bead holder assembly for centering and gripping a circular tire bead before placement on a bead setter has circumferentially spaced radially moveable fingers actuated by a chain drive for simultaneous controlled movement of the fingers and application of centering pressure without distortion of the bead.
    Type: Application
    Filed: June 5, 2001
    Publication date: December 5, 2002
    Inventors: Francis Cornet, Michel Lemaire
  • Publication number: 20020179238
    Abstract: A method and an apparatus for edge joining of strip shaped plate or sheet elements of veneer (42, 48) by application of a hotmelt glue to at least one of the veneer edges to be joined and then forcing the elements (42, 48) together edge to edge before the glue solidifies, characterized in applying the glue in fully melted condition through heated nozzle means (40, 44) arranged so as to direct the applied glue as a jet or flow directly against a middle area of the relevant edge or edges is described. Preferably, the supporting area (2) for the opposite veneer strip (48) edge is located at a higher level (50) and preferably partly overhead the nozzle (40,44). By means of the described method and apparatus it is achieved that the total edge area of the veneer elements being heated, while gluing, is small, thereby not inducing any drying effect of importance on the veneer elements.
    Type: Application
    Filed: May 29, 2002
    Publication date: December 5, 2002
    Inventors: Hardy Vesterby Hansen, Per Vesterby Hansen
  • Patent number: 6475324
    Abstract: A plate mounting tape with a self-adhesive composition on both sides of a polyolefin substrate, in particular PE foam film substrate having low variation in thickness and having a compressive stress value of 10-80, in particular 10-50 N/cm2 under 50% compressive deformation.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: November 5, 2002
    Assignee: tesa AG
    Inventors: Manfred Hartmann, Wolfgang Schacht
  • Patent number: 6450092
    Abstract: A method for applying a gravure printing plate to a gravure printing drum including applying a release liner on the gravure printing drum, wherein a release layer of the release liner faces away from the drum, applying a double-sided adhesive foil to the gravure printing drum, wherein the two edges of the adhesive foil overlap, cutting through the overlapping edges of the adhesive foil and through the release liner, removing the release liner and attaching the two cut edges of the adhesive foil to the drum, applying a release liner on the gravure printing drum, wherein a release layer of the release liner faces towards the adhesive foil, applying the gravure printing plate onto the double-sided adhesive foil, wherein the two edges of the plate overlap in the area of the release liner, cutting through the overlapping edges of the gravure printing plate and through the release liner; and removing the release liner and attaching the two cut edges of the gravure printing plate to the adhesive foil.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: September 17, 2002
    Assignee: Creoscitex Corporation Ltd.
    Inventors: Yosef Kamir, Serge Steinblatt
  • Patent number: 6440257
    Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: August 27, 2002
    Assignee: Hexcel Corporation
    Inventors: Ligui Zhou, Philippe D. Christou
  • Patent number: 6419774
    Abstract: A fibrous core material is disposed between and bonded to metal skins to form a structural laminate having comparable strength to steel sheets of greater weight.
    Type: Grant
    Filed: July 17, 2000
    Date of Patent: July 16, 2002
    Inventor: David D'Arcy Clifford
  • Patent number: 6406782
    Abstract: A multi-layer article which may be provided in the form of a tape comprises a conformable, compressible, melt flow-resistant core layer having first and second major surfaces, a sealant layer on the first major surface of the core layer, and optionally a bonding layer on the second major surface of the core layer. The sealant layer and the bonding layer each have a surface available for contacting a separate substrate. Various thermoset and foam core layers are disclosed as are thermosettable and thermoplastic sealant layers. The articles are useful for sealing two substrates together, particularly where one of the substrates is glass. Thus, the articles are especially adapted for sealing motor vehicle windshields to a frame. Various assemblies and methods for producing the same are also described.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 18, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Michael A. Johnson, Clayton A. George, Robert J. Boettcher
  • Patent number: 6388893
    Abstract: A block of foam is wrapped with a conductive foil to replace a metal spring used to both support and ground an electrical component in an electronic device. In particular, the foam block wrapped in foil may be used to support a video board in a display device while grounding the EMI shielding on the board and related components. The foil is preferably adhered to the foam block with an adhesive.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 14, 2002
    Assignees: Sony Corporation, Sony Electronics
    Inventor: Rafael Calderon
  • Publication number: 20020053400
    Abstract: A method for producing preforms from fiber composite semi-finished products and polymer provides for use of the preforms as components after the curing process. Initially, on a working surface, a bonded fabric is formed by alternately placing layers of cut dry fiber composite semi-finished product sections and polymer layers with predetermined shapes on top of each other. A specified preform is formed from the bonded fabric by forming appropriate parts of this fabric and subsequently curing the parts. The polymer layers exhibit a shape that ensures bonding of cut semi-finished product sections in their overlapping areas. The polymer layers contain local recesses in order to minimize shearing stress between the semi-finished product layers in areas of the local recesses when forming the individual profile parts of the bonded fabric. A preform produced pursuant to this method results.
    Type: Application
    Filed: October 15, 2001
    Publication date: May 9, 2002
    Inventors: Torsten Lorenz, Franz Stadler, Stefan Utecht
  • Patent number: 6372080
    Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: April 16, 2002
    Assignee: Hitachi Chemical Company, Ltd
    Inventors: Hidekazu Matsuura, Yoshihide Iwazaki, Naoto Ohta
  • Patent number: 6372827
    Abstract: A multi-layer article which may be provided in the form of a tape comprises a conformable, compressible, melt flow-resistant core layer having first and second major surfaces, a sealant layer on the first major surface of the core layer, and optionally a bonding layer on the second major surface of the core layer. The sealant layer and the bonding layer each have a surface available for contacting a separate substrate. Various thermoset and foam core layers are disclosed as are thermosettable and thermoplastic sealant layers. The articles are useful for sealing two substrates together, particularly where one of the substrates is glass. Thus, the articles are especially adapted for sealing motor vehicle windshields to a frame. Various assemblies and methods for producing the same are also described.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: April 16, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Michael A. Johnson, Clayton A. George, Robert J. Boettcher
  • Patent number: 6355134
    Abstract: In a method for joining two or more solid parts, a foil is provided between the two parts, the foil is heated to an elevated temperature by means of a thermode such that it becomes soft, and then the foil is cooled down below the elevated temperature, thus providing a permanent connection. The method can be used for bonding a gas-permeable membrane to a housing such as to produce a liquid chromatography degasser. The bonding method ensures that no unwanted substances are released when liquid comes into contact with the bonding region.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: March 12, 2002
    Assignee: Agilent Technologies, Inc.
    Inventors: Manfred Berndt, Werner Karl Schomburg, Zeno Rummler, Ralf-Peter Peters, Mario Hempel
  • Patent number: 6352610
    Abstract: A composite material is described which is characterized by a substrate based on vegetable materials, in particular vegetable fibers, vegetable fiber raw materials or vegetable fiber semifinished products, and by a nanocomposite which is in functional contact with said substrate and is obtainable by surface modification of a) colloidal inorganic particles with b) one or more silanes of the general formula (I) Rx—Si—A4−x  (I) where the radicals A are identical or different and are hydroxyl groups or groups which can be removed hydrolytically, except methoxy, the radicals R are identical or different and are groups which cannot be removed hydrolytically and x is 0, 1, 2 or 3, where x≧1 in at least 50 mol % of the silanes; under the conditions of the sol-gel process with a below-stoichiometric amount of water, based on the hydrolysable groups which are present, with formation of a nanocomposite sol, and further hydrolysis and condensation of the nanocomposite sol, if desired,
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: March 5, 2002
    Assignee: Institut für Neue Materialien gemeinnützige GmbH
    Inventors: Helmut Schmidt, Martin Mennig, Gerhard Jonschker
  • Publication number: 20010052389
    Abstract: An improved direct liquid-feed fuel cell having a solid membrane electrolyte for electrochemical reactions of an organic fuel. Catalyst utilization and catalyst/membrane interface improvements are disclosed. Specifically, the catalyst layer is applied directly onto the membrane electrolyte.
    Type: Application
    Filed: August 20, 2001
    Publication date: December 20, 2001
    Applicant: California Institute of Technology, California corporation
    Inventors: William Chun, Sekharipuram R. Narayanan, Barbara Jeffries-Nakamura, Thomas I. Valdez, Juergen Linke
  • Patent number: 6325882
    Abstract: A method of producing individual personal-sized bars of soap with a water-resistant supporting medium being provided integral with each bar for enabling its suspension for air drying after each use. The preferred method incorporates an intermittent feeding technique whereby a portion of the medium protrudes beyond one end of a soap bar. An alternative method incorporates a feeding technique resulting in soap bars wherein the medium and the soap material of each bar are the same length. A hole is provided either through the medium alone in the preferred method, or through both the soap and the medium in the alternative method. The method may include the additional step of providing a soap-compatible adhesive to opposite sides of the supporting medium.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: December 4, 2001
    Inventor: Karl S. Schroeder
  • Patent number: 6312548
    Abstract: The bonding of components is facilitated by a conductive pattern which generates heat upon being irradiated with microwave or RF energy. The electrically conductive pattern is positioned on a first component surface and a curable resin having adhesive properties is applied thereto. A second component surface is placed in contacting relation with the resin and the conductive pattern is irradiated with microwave or RF energy to facilitate curing wherein the components are bonded together along the pattern. The conductive pattern can be utilized without adhesive resin wherein heat generated via the application of microwave or RF energy causes components to fuse together. The conductive pattern can be enveloped by polymeric material, wherein the polymeric material becomes the adhesive for bonding components when microwave or RF energy is applied.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: November 6, 2001
    Assignee: Lambda Technologies
    Inventors: Zakaryae Fathi, Richard S. Garard, Jianghua Wei
  • Patent number: 6302993
    Abstract: The invention provides a process, and product thereof, for forming a chemically resistant fusion bonded between chemically dissimilar materials by use of an acid-based terpolymer for protective garments. The olefin terpolymers are preferably copolymers of an olefin, an acid and an ester. The process involves placing the olefin terpolymer film between two dissimilar films such as a facepiece and the fabric material of the garments and applying heat and pressure. The resulting fusion bonded film composite is strong, flexible and upon the application of sufficient stress exhibits total cohesive rupture failure.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: October 16, 2001
    Assignee: LakeLand Industries
    Inventors: W. Novis Smith, Joel McCloskey, Kelly Bradford
  • Patent number: 6238805
    Abstract: A low-stress interface between materials having different thermal coefficients of expansion and method for fabricating same includes using a laminated composite layer having a lateral thermal coefficient of expansion (TCE) that is matched to the TCE of another layer of material that is joined thereto. Using a laminate material having a lateral TCE similar to the TCE of the material to which it is joined equalizes the lateral thermal expansion of the two materials at the interface therebetween and minimizes the stress placed on the material that joins the two materials. Furthermore, the layer of material to which the laminate is joined can also be a laminate.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: May 29, 2001
    Assignee: Agilent Technologies, Inc.
    Inventor: Phillip W. Barth
  • Publication number: 20010000585
    Abstract: This invention relates to making nonwoven fabrics which are durable for machine washing and durable for other wet and hard use or abusive applications. The inventive fabrics comprise two layers of fabric sheet bonded together at closely spaced locations where the bonding includes fibers from both fabrics thoroughly involved with the binder. The inventive fabrics retain the qualities of a spunlaced nonwoven fabric which include low cost, comfort, drapability, softness, absorbency, breathability and others while having the durability comparable to traditional knitted or woven fabrics.
    Type: Application
    Filed: December 7, 2000
    Publication date: May 3, 2001
    Inventors: Charles C. Cruise, Robert H. Peterson, James T. Summers
  • Patent number: 6217696
    Abstract: A plate mounting tape with a self-adhesive composition on both sides of a polyolefin substrate, in particular PE foam film substrate having low variation in thickness and having a compressive stress value of 10-80, in particular 10-50 N/cm2 under 50% compressive deformation.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: April 17, 2001
    Assignee: Beiersdorf AG
    Inventors: Manfred Hartmann, Wolfgang Schacht
  • Patent number: 6210522
    Abstract: An adhesive bonding laminate includes a first thermoplastic adhesive film that is capable of adhesively bonding to an epoxy coating and a second thermoset adhesive film that is capable of adhesively bonding to a passivated surface of a substrate. The first thermoplastic adhesive film is adhesively bonded to the second thermoset adhesive film. Ink jet printheads, ink jet print cartridges and methods of attaching a flexible circuit to substrate employ the adhesive bonding laminate.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: April 3, 2001
    Assignee: Lexmark International, Inc.
    Inventors: Jeanne Marie Saldanha Singh, Paul Timothy Spivey