Abstract: A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.

Abstract: An apparatus for distributing a soap based release agent upon a surface comprising; a means for metering a controlled quantity of a liquid metallic soap into a pressurized water stream to form a pressurized aqueous solution having a controlled dilution ratio of soap to water, at least one manifold connected to receive the pressurized aqueous solution, and a plurality of nozzles mounted upon the manifold to uniformly distribute the pressurized liquid solution upon at least one surface. The surface may further be defined as a planar surface, moving unidirectional along a fixed path at a predetermined variable speed and defined by a surface area of length multiplied by width. The planar surface has a fixed width, wherein the surface area moving past a fixed point for a predetermined period of time is a function of the speed of the planar surface moving past the fixed point.

Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.

Abstract: A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.

Abstract: A film and a method of applying the film to a handrail of an escalator or moving walkway are provided. The film can be a single or double layered film. Printed matter, e.g. advertising, can be applied to or between the films. An apparatus and related method for applying the film are also included and rely on the motion of the handrail to unroll a supply of the film, with one or more rollers pressing the film onto the handrail.

Abstract: A device for manufacturing a composite sheet (5) comprising at least one corrugated sheet (1) and at least one flat sheet (3), which is glued to the wave peaks of the corrugated sheet (1), said device comprising at least one fluted roller (13) for shaping and/or maintaining the shape of the corrugated sheet (1), said roller being covered with the corrugated sheet (1) around a portion of its circumference during operation, and a gluing unit (27) for applying a liquid glue used to attach the corrugated sheet (1) to the flat sheet (3), with said gluing unit (27) having a gluing roller (45) whose outer surface (47) is continuously coated with a glue film and whose axis is essentially parallel to that of the fluted roller (13), said gluing roller being driven at approximately the same peripheral speed as that of the fluted roller (13), and with it being possible, using means for moving the rollers closer together (53, 65, 67, 69), to move said gluing roller, with its outer surface (47) against the portion of the c

Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: In a method of manufacturing a cylindrical electrophotographic photoconductor, an adhesive is applied to an inside of an opening end portion of a photosensitive drum, and the adhesive is detected by using a CCD laser displacement sensor. Then, a flange for supporting a center shaft to the inside of the opening end portion of the drum is fitted through the adhesive. The flange can be securely attached to the drum.

Abstract: In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a centering device insertable within a common center hole of the superimposed substrates. The centering device includes at least two contact pins configured to simultaneously contact an inside circumferential edge of the common center hole, where the contact pins retractably extend in substantially opposite directions to press against the inside circumferential edge of the common center hole and align the superimposed substrates. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the adhesive layer between the aligned substrates, the provisional bonding device partially bonding and provisionally fastening the aligned substrates.

Abstract: A method and apparatus for the manufacture of laminated compact disc. When forming an adhesive layer between a first substrate and a second substrate, and laminating the first substrate and second substrate to produce a disc, temperature and other conditions are adjusted based on the adhesive layer thickness of the manufactured optical disc, thus the viscosity of adhesive is changed to match each process. Accordingly, high quality discs can be consistently manufactured, and the operating efficiency of the manufacturing apparatus can be improved. Moreover, an optical disc free of bubbles mixed in the adhesive layer of a laminated optical disc can be stably manufactured.

Abstract: The invention relates to a method of manufacturing composite products. Thereby a number of elements to be assembled is provided and glue is applied to at least one surface of each element. The elements are assembled, and the assembled elements are subjected to pressure in a press. The invention is characterized in that amount of at least one component of the glue, applied at a specific point of glue application on an element, is controlled to be a function of the waiting time it takes before the point of glue application is subjected to the pressure in the press. It also relates to an apparatus for carrying out the method which is caracterized by a control unit (15) which is programmable to run a control sequence for the glue applicator (10) and/or the element feeder (6; 16) to provide an optimal applied glue amount.

Abstract: A liquid material dispensing system includes a nozzle tip that is adapted to dispense droplets of liquid material that expand in flight toward a substrate. The droplets elongate in orthogonal directions in a plane that is substantially transverse to the direction of travel of the droplets toward the substrate. Preferably, each droplet elongates in pattern width and in pattern length during its flight toward the substrate. The elongated droplets impact the substrate and contact adjacent droplets to form a generally rectangular layer of liquid material within a predetermined area on the substrate. Methods for forming a generally rectangular layer of liquid material on a substrate are also disclosed.

Abstract: A labeler for objects, such as fruit or vegetables, has a pickup head that includes a firing piston, and a larger piston that is coupled to the firing piston. The pickup head, along with other pickup heads, are provided on an assembly that rotates the heads in a circular manner. When each pickup head is at the 6 o'clock position, a burst of air pressure is provided to the firing piston, thereby causing it to fire and to cause the larger piston to move in an outward direction. This causes the pickup head to extend fully, to thereby cause a label positioned on an applicator at a distal end of the pickup head to contact an object and thereby apply the label to the object. At other positions besides the 6 o'clock position, a vacuum source provides a vacuum to the pickup heads, thereby maintaining the pickup heads in a fully retracted position, as well as providing a way for keeping the label on the applicator of the pickup head while the pickup head is rotating.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: A machine for applying adhesive to preset regions of products in general, particularly soles for shoes, comprising a conveyor for continuously moving individual products to be glued, a three-dimensional vision unit for acquiring a spatial shape of each individual product in transit, a first gluing head, which is driven by the vision unit to apply adhesive to a first portion of the product in transit, and at least one second gluing head, which is driven by the vision unit to apply the adhesive to a second portion of the product in transit which is different from the first portion.

Abstract: The method and apparatus allow more precise and quicker gluing of frames and mirrors or glass having different shapes and dimensions to furniture panels in general. According to the method, strips of glue are deposited onto a furniture panel by means of sprayer pistols or nozzles and then the frame or the mirror sheet is applied to the panel. The apparatus which carries out the method includes one or more cross-bars sliding over the panel supporting table, and slide carriages carrying the sprayer pistols or nozzles and running along the cross-bar. The apparatus having this configuration can apply the glue along any desired path which preferably matches with the frame or mirror shape. It is also possible to have the apparatus working in accordance with a program prepared in a computer control station.

Abstract: A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced.

Abstract: This invention overcomes the disadvantages of the prior art by providing an accurate moistening system which provides for less fluid waste and better wetting. This in turn causes better sealing of the envelope flap. The present invention is directed to, in a general aspect, a non-contact envelope flap moistening system which can be installed in a mailing machine apparatus. The flap moistening system comprises an array of inkjet print heads and a document scanner for sensing the envelope flap. Envelope flaps can be moistened by the flap moistening system by performing a method comprising the following steps: sensing the envelope flap; profile and/or the glue area of an envelope flap; building a firing sequence for the print head nozzles; and actuating the nozzles to precisely fire discreet fluid droplets onto the glue area of the envelope flap. The system provides precise fluid amounts for envelope sealing.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: Methods and apparatus are disclosed for producing gypsum board having at least one facing sheet, a core of cementitious material such as low density gypsum, and an intermediate layer of bond promoting material, such as higher density gypsum located therebetween. The apparatus includes a forming table having a transverse gap. The facing sheet travels along the forming table over the gap. A spreader roller has an outer surface extending partially into the gap to depress the facing sheet. The bond promoting material is deposited on the facing sheet upstream of the spreader roller and the spreader roller outer surface rotates in the same direction as the facing sheet to coat the facing sheet with the bond promoting material. The core layer material is deposited on the facing sheet downstream of the spreader roller on top of the bond promoting coating.

Abstract: A method and apparatus for manufacturing multiple die cut business forms is disclosed. One embodiment of a printing press according to the present invention includes a number of different stations that are connected together by a continuous web. Multiple die cut business forms are produced by a continuous process from stock paper to an output configuration such as continuous roll, fan fold, or cut sheet. One aspect of the present invention is that a silicone treated glassine stock paper substrate can be utilized to allow business forms to be produced with minimized curling.

Abstract: The method for measuring the diameter of a reel or roll of wound web material (N) involves the following steps: rotating said reel (L); detecting at least twice the moment when a given point (Lf) on the web material (N) passes a predetermined position; determining the time that elapses between said two passes or the amount of rotation (&agr;) of the supporting roller (5); and calculating the diameter (D) of the reel (L) from said time (T) and the peripheral speed (V) of the reel (L) of from said amount of rotation (&agr;) and the radius (R) of the supporting roller (5).

Abstract: A system for producing three dimensional components by bonding together successive layers of a porous material with droplets of a binder material. A binder printhead has an array of nozzles which controllably supply jets of binder material droplets to the layers of porous material. The printhead is scanned in a raster scan fashion over each layer of porous material along a first scan axis in one direction to provide first fast scanning paths of droplets. The printhead is then moved laterally of such one direction and is then moved along the fast-scan axis in the opposite direction to provide second fast scanning paths of droplets which are interlaced with the first scanning paths. The supply of the droplets to the porous material can be controlled so as to control the overlapping thereof to produce various desired surface and interior characteristics of the components.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: A method and apparatus are provided for applying swatches to a continuously traveling web, which is usually preprinted, and which is severed into sheets of a predetermined repeat length. When going from one size of repeat length to another size of repeat length, swatch-applying cylinders are profiled to match the cylinder velocity to the web velocity during a swatch application over a first portion of a revolution of the swatch cylinder and then the rotational velocity is changed substantially during a sync recovery portion of the cylinder's revolution. Preferably, the adhesive, which is applied to the web to adhere the swatches, is by an adhesive cylinder which is similarly provided with a matching velocity portion of a revolution and a sync recovery portion at a different velocity. The cutting operation is preferably by a knife cylinder which is also similarly profiled.

Abstract: A method for adhering a member and an apparatus for adhering the member to a base is useful for preventing warping of the member and non-uniformity of the strength of adhesion. After the adhesive application unit is positioned at a first position at a fixed distance from an initial application position of the base, movement of the unit is started from the first position with the moving unit while the action of discharging adhesive of the application unit is started. Next, the action of discharging adhesive of the application unit is completed at the final application position of the base and the movement is stopped at a second position at a fixed distance from the final application position of the base. This results in movement of the application unit at a constant speed from the initial application position to the final application position of the block. Therefore, non-uniformity of the adhesive layer at the initial application position and the final application position of the block can be prevented.

Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.

Abstract: Methods and apparatus for detecting imperfections in adhesive coatings formed on fingers of beams are disclosed. The present invention relates, in one aspect, to a method for preparing a first work piece for joining with a second work piece. The method involves forming a finger in the first work piece, then applying an adhesive coating on the finger. A determination is made to determine whether the adhesive coating is defective through the used of a sensing mechanism which is arranged to scan across a portion of the finger. In one embodiment, a defect in the adhesive coating on the finger is defined as a void.

Abstract: A method and an industrial robotic device for uniformly applying coatings at appropriate thickness and pitch upon a surface moves a spray applicator foam dispenser between two parallel tracks. The uniform application of foam at each pass is assured, by accelerating the speed of the foam dispenser at the end of each pass, by providing respective curved uphill distal ends of the tracks, so that the spray applicator foam dispenser moves up the curved distal ends and returns quickly while changing speed tilt and direction at the end of each pass.

Abstract: An adjustable gluing apparatus for dispensing glue onto articles, such as flaps of cartons on a packaging machine. A glue dispensing head attached to a clamping block is moved along a bar by a rack and pinion gear arrangement. The bar has rack teeth, and the pinion gear and attached pinion shaft are supported by the clamping block, which has an aperture receiving the bar. Turning an adjustment knob connected to the pinion shaft adjusts the position of the clamping block relative to the bar. Rotation of the pinion shaft is selectively allowed or prevented by a locking knob threadably engaged with the pinion shaft. The clamping block is further secured to the bar by a screw in the clamping block which contacts the back side of the bar to provide teeth-engagement adjustment for the rack and pinion gear teeth. The screw has an adjusting knob and a locking knob similar to that on the pinion shaft.

Abstract: An automatic means for labeling includes means for scanning a group of objects to determine the coordinates of an object in the group of objects, means for storing data representative of the determined coordinates of the object and means responsive to the data storage means for spraying self adhering materials in separate geometric areas with varying reflective properties to create an identifying pattern on the object.

Abstract: A flanging-trimming machine for differently shaped panels having peripheral edges. The machine covers the edges with an irremovable covering strip applied using an adhesive.

Abstract: A grommet strip manufacturing apparatus including a supply mechanism for feeding a grommet strip; a feed mechanism for feeding a cushion strip; and a guide for joining the moving grommet and cushion strips into a composite strip so as to provide longitudinally aligned engagement between an engagement surface of the grommet strip and a contact surface of the cushion strip. Also included is a dispenser for dispensing an adhesive between the engagement surface of the grommet strip and the contact surface of the cushion strip; a compression assembly for maintaining, for a given length of the composite strip, compression between the engagement and contact surfaces; and a take up mechanism for receiving from the compression assembly the composite strip.

Abstract: An apparatus and methods are provided for treating a workpiece such as a shoe component. The workpiece treating apparatus preferably includes a transporter for transporting a workpiece along a predetermined path of travel and a storage device for storing a plurality of predetermined parameters of each of a plurality of workpieces. A workpiece identifier is positioned responsive to the storage device for identifying the workpiece during travel along the predetermined path. A workpiece treatment applicator is positioned adjacent the transporter and responsive to the workpiece identifier for applying a treatment a workpiece being transported along the predetermined path of travel. A workpiece treatment position determiner preferably is positioned responsive to the workpiece identifier for continuously determining the position of the workpiece treatment applicator along a predetermined trajectory during treatment of the workpiece.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: An automated apparatus for applying sealant, for example to insulated glass, is disclosed. The apparatus comprises a computer control and a support structure on which is movably disposed a sealant applicator. The sealant applicator is selectively positionable along at least one axis via the computer control one or more sensors operate to provide the computer control with data regarding sealant application as the sealant is applied. The computer control is further operative to both determine the depth of sealant to be applied, and to effect positioning of the sealant applicator in response to data from the one or more sensors such that sealant applied does not exceed the determined depth.

Abstract: A paste applicator for drawing a paste film in a desired pattern on a substrate, including a table for detachably supporting a substrate, a paste reservoir tube to be filled with a paste, and a nozzle communicating with the paste reservoir and having a paste discharging port opposing to an upper surface of the substrate mounted on the table. A device is supplied for changing the relative positional relationship between the nozzle and the substrate mounted on the table. The paste is applied onto the substrate to form a desired pattern of the paste. A measuring device measures a position of a paste discharging port of a nozzle exchanged together with the paste reservoir tube by using a paste pattern formed by applying the paste onto the substrate held on the table using the exchanged nozzle. The center of the paste pattern nearly agrees with the center of the paste discharging port.

Abstract: A machine for applying a heat meltable composition includes a drive module, a light source module, and a nozzle module. The drive module attaches to the end of an elongate arm for moving the material with respect to the nozzle. The light module includes a laser for irradiating the composition as it passes through the nozzle and is applied to the material. The nozzle includes a mechanism for withdrawing the composition after flow is terminated to prevent the formation of strings in the composition. The modules are controlled by a process that provides a sequence of steps upon receipt of control signals from an operator foot pedal.

Abstract: In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

Abstract: A method and apparatus for generating three-dimensional decoration on a substrate. Controlled deposition of the decoration material on the substrate is achieved through formation and manipulation of an ink droplet at the end of a dispensing nozzle. The ink droplet is maintained by coordinating the delivery rate of the ink through the dispensing nozzle with the dispensing nozzle height and velocity. The ink droplet is optimally maintained to provide a controlled wetting of the substrate surface for deposition of a wide variety of inks.

Abstract: A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.

Abstract: A glue gun type gluing apparatus has glue guns 8a and 8b for applying glue to a gluing area in a joint flap 2 of a corrugated board sheet 1 for manufacturing a box, which runs on a box manufacturing line, a sheet end detection sensor 3 for detecting the front and rear ends of the corrugated board sheet 1, an encoder 7 for measuring the travel distance of the corrugated board sheet 1, and a control unit 9 for controlling the operation of the glue guns 8a and 8b. The control unit 9 learns and stores the position of gluing area on the basis of the information from the sheet end detection sensor 3 and the encoder 7 while the corrugated board sheet 1 is run at a low speed, and restricts the acquisition of detection signals by the sensor 3 during the time from the passing of the end point of the joint flap 2 to the arrival of the start point of the next joint flap 2.

Abstract: A glue application roll 1 rotating at a circumferential velocity v.sub.1 is moved to touch a downstream side corrugating roll (an upper corrugating roll) 9 rotating at a circumferential velocity v.sub.2 via a core paper 11 and, in response to variation in vibration, noise, drive torque or pressing reaction force of the glue application roll 1 caused thereby, a setting position of the glue application roll 1 to the downstream side corrugating roll 9 is adjusted, thus a gap between the glue application roll 1 and the downstream side corrugating roll 9 is maintained approximately at a thickness of the core paper 11.

Abstract: A paper corrugator machine has a closed loop for delivering warm adhesive from a source to a pan from which the adhesive is applied onto the crests of the corrugated paper flutes. To insure a delivery of the correct amount of adhesive to the flute crests, a predetermined amount of adhesive is first accumulated in a graduated column. Then, the adhesive delivery feed is switched from the closed loop to the graduated column. A detector senses upper and lower limits of the amount of the adhesive in the column. The rate of the delivery of adhesive is determined by how long it takes for the predetermined amount of adhesive to be delivered from the column to the corrugating machine. Responsive to this determination, the corrugating machine may be adjusted to apply more or less adhesive to the flute crests.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Abstract: A system for producing three dimensional components by bonding together successive layers of a porous material with droplets of a binder material. A binder printhead has an array of nozzles which controllably supply jets of binder material droplets to the layers of porous material. The printhead is scanned in a raster scan fashion over each layer of porous material along a first scan axis in one direction to provide first fast scanning paths of droplets. The printhead is then moved laterally of such one direction and is then moved along the fast-scan axis in the opposite direction to provide second fast scanning paths of droplets which are interlaced with the first scanning paths. The supply of the droplets to the porous material can be controlled so as to control the overlapping thereof to produce various desired surface and interior characteristics of the components.