Abstract: A method is provided to fabricate a wafer including a bonding layer interposed between a device wafer and a handle wafer. The method includes performing a first deposition process to deposit an ultraviolet (UV) shield layer on a backside surface of the handle wafer. A second deposition process is performed to deposit a stress compensation layer on an exposed surface of the UV shield layer. The UV shield layer blocks UV energy generated while performing the second deposition process from reaching the bonding layer.

Abstract: The invention relates to a method for the production of a shoe (1), especially of a sports shoe. To provide an effective and cost-efficient method for the shoe production, the invention comprises the steps: a) Production of a shoe upper (2) and of a shoe sole (3); b) Joining of the shoe upper (2) and the shoe sole (3) and inserting the joined shoe upper (2) and the shoe sole (3) into a flexible container element (4) which can be closed in an air-tight manner; c) Air-tight closing of the container element (4) and evacuating of the container element (4), so that the container element (4) presses together the joined shoe upper (2) and the shoe sole (3) within the container element (4); d) Connecting the shoe upper (2) and the shoe sole (3) within the container element (4) with another; e) Venting of the container element (4) and taking out the connected shoe upper (2) and shoe sole (3).

Abstract: A device for thermally welding workpieces including a heating element and a shielding gas supply is provided. The device includes a heating plate consisting of a thermal insulating material in which a groove is formed, said groove includes a heating element, relative to which a surface of a workpiece to be welded is positioned in close proximity to the heating element. A feed channel for a shielding gas is formed in the heating plate and communicates with the groove via at least one through-channel, and the feed channel for supplying shielding gas can be connected to a shielding gas source via a feed line and a valve. The device may further include an assembly for welding a first and a second workpiece, said assembly includes a first and second movement device for moving the workpieces towards one another.

Abstract: A method of welding at least two plastic components together is disclosed. The two plastic components are welded together at respective joining surfaces. The method comprises directing at least one infrared (IR) laser beam along the joining surfaces of the at least two plastic components. The IR laser beam heats the joining surfaces of the at least two plastic components to a welding temperature. The method also includes clamping the at least two plastic components together at the joining surfaces to create a weld.

Abstract: A flexible organic light-emitting diode (OLED) display panel and a flexible OLED display device are provided, and include a base substrate and a flexible structural layer which has at least two flexible layers disposed one on the other. The panel has a folding section for folding, the flexible layers are formed with a plurality of sets of relief holes defined within the folding section, and the relief holes of the adjacent flexible layers are staggered with respect to each other. When the OLED display panel is in a folded state, the relief holes of one of the flexible layers which is located at an inner ring of the folding section buffer a compression force, and the relief holes of another of the flexible layers which is located at an outer ring of the folding section buffer a tensile force.

Abstract: Methods for creating nodal vibration patterns in a granular material on a metal sheet, capturing the patterns in a working material and using the working material with the captured shapes to provide an end product. A tone is applied to the metal sheet which, based on the properties of the sheet and the tone frequency, create a specific pattern of nodal lines of vibration in the sheet. A particulate material placed on the sheet takes the shape of the nodal lines. An adhesive-coated sheet of working material is applied to the metal sheet and captures the particles in the shape of the nodal lines. The sheet of working material with the captured nodal line patterns is then used to produce a structure with strength, stiffness and other properties based on the embedded wave patterns. Alternately, the particles can be directly fused into a skeleton in the nodal line pattern shape.

Abstract: A plastic welding machine for welding plastic parts together is capable of controlling the weld force vector in both magnitude and direction.

Abstract: Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.

Abstract: A heating apparatus for heating and sterilizing or disinfecting a material used in dental treatment, the heating apparatus comprising a heating compartment with a heating element for heating all or part of the material within the heating compartment; at least one holder for receiving and holding at least a part of the material used in dental treatment inside the heating compartment; and an disinfection device having a light source for sterilizing all or part of the material within the heating compartment.

Abstract: A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

Abstract: A component assembly manufacturing method includes positioning a first component to a jig, applying an adhesive to at least one of an adhesion surface of the first component and an adhesion surface of a second component, positioning the second component to the first component by a magnetic force that acts between the second component and the jig, in a state in which the adhesive in an uncured state is arranged between the adhesion surface of the first component and the adhesion surface of the second component, and fixing the first component and the second component by the adhesive.

Abstract: An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.

Abstract: A method for manufacturing a capacitor element includes singulating a mother block into a plurality of laminate blocks having a shape of an elongated, substantially rectangular parallelepiped, by dividing the mother block in rows; rolling each of the plurality of laminate blocks; and singulating each of the plurality of laminate blocks into a plurality of laminate chips having a shape of a substantially rectangular parallelepiped, by dividing the plurality of laminate blocks after rolling in columns. The step of rolling each of the plurality of laminate blocks includes the step of moving the plurality of laminate blocks placed on a stage, along a direction in which the plurality of laminate blocks are arranged side by side, thereby sequentially pushing each of the plurality of laminate blocks to an end portion of the stage and causing each of the plurality of laminate blocks to rotationally fall from the end portion.

Abstract: A method of manufacturing a rotor for a magnet type rotating electrical machine includes the steps of: cutting and laminating pieces of the core of the rotor, to thereby form a core (3); mounting the core (3) on a rotating jig (10); forming a magnet piece (2p) into a predetermined shape by sintering; mounting a predetermined number of the magnet pieces (2p) on a regulating jig (20); pressing the magnet pieces (2p) by the regulating jig (20) while rotating the core (3) by the rotating jig (10), to thereby mount the magnet pieces (2p) on the core (3); and adjusting an axial position of the magnet piece (2p) so that an axial end surface of the core (3) and an axial end surface of the magnet piece (2p) are aligned with each other.

Abstract: An apparatus is configured to process a work piece and includes a robotic arm, a sealant discharger, and a plasma discharger. The robotic arm includes a distal end that is rotatable with respect to an axis of the robotic arm. The sealant discharger includes a sealant outlet configured to discharge sealant while the sealant outlet is at a first point. The sealant discharger is mounted on the distal end such that the first point is located on the axis. The plasma discharger includes a plasma outlet configured to discharge plasma while the plasma outlet is at a second point that is located a distance apart from the axis. The plasma discharger is mounted on the distal end such that the second point is rotatable around the axis.

Abstract: The present invention discloses a heat radiator, especially an infrared radiator, having at least one radiation source by means of which supplied electrical energy is convertible into heat radiation, as well as a control. This control comprises at least one frequency converter having a first, a second and a third output so that between the first and the third output a first alternating current is providable and between the second and the third output a second alternating current is providable by means of which the at least one radiation source is operable.

Abstract: A manual and an automatic fastening device for fastening a bonding element to a surface by means of a light-curing adhesive is disclosed. The fastening devices apply the bonding element to the surface with a specific contact pressure, before the light is irradiated onto the bonding element for curing the adhesive. As the bonding element consists of transparent material, the adhesive is cured between the fastening element and the surface.

Abstract: Disclosed are an activation method and a liquid pressure transfer technique, where a transfer film is supplied to the surface of a transfer liquid and then is activated, capable of continuously performing a precise transfer. In forming an appropriate transfer pattern on the surface of an object by pressing the object from the upper side of a transfer tank, in the transfer tank, a pre-activation guide mechanism that holds both sides of the film, which is supplied with the center position matching the center of the transfer tank, at horizontally equivalent positions of the transfer tank and guides the film to an activation area is disposed. Accordingly, the film is urged to swell up in the thickness direction, and, in the activation area, the film is coated with an activating agent in a state in which the guide action of the film using the pre-activation guide mechanism is cancelled.

Abstract: A method and system for manufacturing complex, three-dimensional textile structures is disclosed. These textile structures may be large and heavy and difficult to maneuver without damaging them. The method enables various types of joints to be constructed between textile panels plus the application of patches and details onto the surface of these panels. The method minimizes handling and damage to the textile material. The method also reduces the manpower required during the manufacturing process, thus minimizing manufacturing time and cost.

Abstract: An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

Abstract: Apparatus and method are disclosed for heat bonding or welding a thermoplastic component to a sealing member such as a film or foil having a thermoplastic portion. The apparatus preferably includes a 3-axis arrangement for accurate and repeatable positioning of the component and foil during bonding and for variation of bonding parameters, such as material, pressure, temperature and/or time.

Abstract: An apparatus and system for bonding substrates are presented. The apparatus includes a base member formed of an insulating material and an electric field generation part formed of a conductive material. The electric field generation part extends into the base member. The electric field generation part includes a trunk part and a branch part. The trunk part extends in a first direction. The branch part extends from the trunk part in a direction different from the first direction. A substrate is fixed on the base member. An adhesive is applied on the substrate in a shape that matches that of the electric field generation part. An electric field is generated using the electric field generation part and the substrate is bonded to another substrate. The apparatus prevents or reduces formation of air bubbles in the adhesive. A method of manufacturing a display device is also presented.

Abstract: A laser induced thermal imaging apparatus comprises a substrate support configured to support a substrate, a donor film holder configured to hold a donor film at a position over the substrate support, and a press unit comprising a first elastic member and a second elastic member disposed over the substrate support. The press unit is configured to move the first and second elastic members in a pressing direction toward the substrate support for pressing the donor film to the substrate to laminate the donor film onto the substrate. The second elastic member surrounds the first elastic member when viewed in the pressing direction and is more rigid than the first elastic member.

Abstract: A method for producing an organic EL panel includes an application step of applying a filler, a desiccant, a sealant and a fixing agent to positions on a encapsulation substrate opposing the position of an element, a positioning step of positioning an element substrate and the encapsulation substrate, a heating step of heating the encapsulation substrate, a defoaming step of removing gases incorporated within the filler and the like, a sticking substrates step of sticking the element substrate and the encapsulation substrate using a pair of surface plates, a gas introduction step of returning the periphery around the pressure welded element substrate and encapsulation substrate to an atmospheric pressure environment, a provisional fixing step of irradiating ultraviolet rays onto the fixing agent, and a seal curing step of irradiating ultraviolet rays onto the sealant, thereby curing the sealant.

Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, a donor film laminated to the lower supporting member, and an acceptor substrate sealed between the lower supporting member and the donor film, a first gripper positioned at an end side of the stage, the first gripper being configured to grip an end of the donor film and to move with the end of the donor film away from the acceptor substrate, and a first filling roll positioned over the donor film, the first filling roll being configured to blow ions toward the donor film while rotating toward the first gripper.

Abstract: A foil stamping method and device according to which a surface of a printing product (D) is provided with an adhesive layer in places intended to be imprinted and a transfer layer sticking to the printing product (D) in places intended to be imprinted. Prior to foil printing, a build-up adhesive is applied to the printing product (D), instead of or in addition to the adhesive layer, in the places intended to be semi-embossed and the pressure acts evenly across the entire surface of the printing product (D), namely also on the raised places resulting from semi-embossing and the remaining surroundings during foil printing. A foil transfer means (3) has a transfer roller (31) and a foil feeding means (4) associated with the foil transfer means (3), the outer surface of the transfer roller (31) being covered with an elastic cover of a small thickness.

Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.

Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, an acceptor substrate positioned on the lower supporting member, and a donor film laminated along with the lower supporting member via the acceptor substrate interposed therebetween according to the edge of the acceptor substrate, a gripper positioned at an end side of the stage to grip the end of the donor film and moving in a direction away from the acceptor substrate, and a peeling roll positioned on the donor film, including a supporting region supporting a portion of the donor film positioned between the acceptor substrate and the gripper, and including a peeling roll main body rotating itself in a direction of the gripper and a blind selectively covering the supporting region.

Abstract: One embodiment of the present invention provides a system for bonding a first substrate and a second substrate. During operation, the system starts by treating a first surface of the first substrate and a second surface of the second substrate with a hydrophilic treatment. The system then transfers a first oligomer layer onto the treated first surface and a second oligomer layer onto the treated second surface. Next, the system treats the first oligomer layer and the second oligomer layer for hydrophilic activation. The system subsequently brings the first oligomer layer into contact with the second oligomer layer, thereby allowing the two oligomer layers to adhere and form a single bonding layer between the first substrate and the second substrate. In particular, each of the first oligomer layer and the second oligomer layer is a polydimethylsiloxane (PDMS) layer.

Abstract: In accordance with one embodiment of the present invention, the invention comprises a continuous structural composite preform wet out system and method which takes as an input pre-formed structural composite structures with a structural foam core, passes these structures through a wetting system which may comprise sprayers, brushes, a die or dies, or other wetting means; applies a cure process such as ultraviolet light, heat, curing agent or other cure method, and produces a completed, cured structural composite structure such as a beam or panel for use in any structure as desired by the user. The improved structural composite wet out system of the invention provides run rate, ease of use, structure efficiency and handling advantages over the pultrusion systems of the prior art by achieving higher production rates, the ability to use light cure resins and the ability to produce composite structures of non-uniform cross-section.

Abstract: A method for applying at least one ply onto a tool or an uncured composite layup disposed on the tool includes automatically controlling slidably removing at least one nonstick separator relative to the at least one ply positioned on the at least one nonstick separator to inhibit at least a portion of the at least one ply from adhering to the tool or uncured composite layup while applying a moving compressive force to an outer surface of the at least one ply relative to a moving trailing edge of the at least one nonstick separator to adhere at least a portion of the at least one ply to the tool or to the uncured composite layup.

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Abstract: An apparatus for fabricating a fibre reinforced thermoplastic composite structure is described. The apparatus comprises a localised heat source arranged to heat a portion of a stack of fibre reinforced thermoplastic material layers and an ultrasonic transducer arranged to locally introduce ultrasonic energy waves to the heated portion of the fibre reinforced thermoplastic material layers. The apparatus makes it possible to achieve ultrasonic consolidation of the layers occurs.

Abstract: A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated.

Abstract: The invention relates to a method for manufacturing a label laminate. The method includes forming at least one water based adhesive layer on a belt, drying said at least one water based adhesive layer on the belt, unwinding a first material layer, unwinding a second material layer, attaching said at least one dried water based adhesive layer to the surface of the first material layer, and laminating the first material layer comprising at least one water based adhesive layer together with the second material layer in order to form the label laminate. The invention also relates to a label laminate and to a system for manufacturing a label laminate.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.

Abstract: A prepared mold tool having a thermoplastic surface layer polymer coating on the mold surface of the mold tool or prepared prepreg having a thermoplastic surface layer polymer coating on the surface of the thermoplastic fiber reinforced prepreg are described that enhance first ply laydown of thermoplastic fiber reinforced composite prepregs onto mold tools for prepreg forming or in situ tape placement. Resulting thermoplastic fiber reinforced composite parts from a thermoplastic fiber reinforced thermoplastic composite material having structural reinforcement fibers with one or more high performance polymers, and a thermoplastic surface layer polymer coating which forms a polymer blend with the high performance polymers of the thermoplastic fiber reinforced composite material thereby imparting improved properties, and methods for making and using same, are provided herein.

Abstract: A bonding method of a container having a base substrate, and a lid member adapted to form a space with the base substrate includes: providing the base substrate and the lid member, arranging the lid member so as to overlap a bonding area of the base substrate, making a pressing member have contact with an exterior surface of an area of the lid member surrounded by the bonding area, and performing bonding by irradiating the lid member with an energy beam in the state of making the pressing member have contact with the lid member.

Abstract: A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.

Abstract: A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

Abstract: A lamination apparatus, including: a substrate support; an adhesive film support that is disposed so as to be spaced from the substrate support; an air injection head that is disposed on a co-plane with the adhesive film support so as to be spaced apart from the substrate support or disposed so as to be further spaced apart from the substrate support than the adhesive film support; an air pump that supplies air to the air injection head; an air supply pipe that connects the air injection head with the air pump, wherein the air injection head includes an ion generation unit.

Abstract: A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: Disclosed are a method and a device for producing a strip (7) obtained by longitudinally welding together at least two individual strips (2, 3), characterized in that sections of the individual strips are deflected in a vertical direction (III) before being welded together, and the deflected sections of the strips (2, 3) are guided past a welding head of a welding apparatus (6) in the vertical direction (III) and are welded together by the welding head.

Abstract: The present invention relates to a method and apparatus for forming a composite structure, preferably for use in an absorbent structure used within the personal hygiene industry, such as for instance feminine hygiene garments, baby diapers and pants and adult incontinence garments. The present invention preferably provides a method and apparatus for depositing and positioning particulate materials in a desired pattern onto a moving carrier layer. The method allows accurate forming of a pattern of particulate material clusters at high production speed having improved attachment properties, with reduced raw material usage and relative low cost. The present invention foresees in the need for improved thin, flexible, lightweight absorbent structure having optimal absorption, distribution and retention.

Abstract: A laminating device for laminating a window on a display panel for displaying an image includes: a first plate on which the display panel is provided; a second plate on which the window is provided and which is adjacent to the first plate; an applier provided on the second plate and applying a resin on the window; a folder for connecting the first plate and the second plate, for folding to allow the second plate to face the first plate, and for disposing the window on the display panel with the resin therebetween; and a pressurizer for pressurizing the second plate in a direction of the first plate.

Abstract: A fusion splicing apparatus includes discharge electrodes 13 and 15 to discharge-heat and fusion-splice end faces 5a and 7a of optical fibers 1 and 3, fiber holders 17 and 19 to hold the optical fibers 1 and 3, V-groove blocks 21 and 23 to receive, position, and fix parts of the optical fibers 1 and 3 on the end face sides of the fiber holders 17 and 19, V-groove-block moving mechanisms 33 and 35 to move the V-groove blocks 21 and 23 so as to shift an axial center of the optical fibers 1 and 3 from a straight line between the discharge electrodes 13 and 15, and holder moving mechanisms 37 and 39 to move the fiber holders 17 and 19 so as to shift the axial center of the optical fibers 1 and 3 from the straight line between the discharge electrodes 13 and 15.

Abstract: An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.

Abstract: A method is disclosed for forming conductive vias in a substrate by filling preformed via holes, preferably through via holes, with conductive material. The method includes providing a plurality of preformed objects at least partly including ferromagnetic material on a surface of the substrate; providing a magnetic source on an opposite side of the substrate with respect to the plurality of preformed objects, thereby at least partly aligning at least a portion of the preformed objects with a magnetic field associated with the magnetic source; and moving the magnetic source relative the substrate, or vice versa, thereby moving the at least portion of the preformed objects into at least a portion of the via holes.

Abstract: The present invention is to provide a tack labeler capable of automatically adhering tack labels without using release papers to articles to be adhered.