Abstract: A bioplastic collapsible dispensing tube may include a collapsible tube having walls that include a bioplastic material; a distal end of the tube that is sealed; a proximal end of the tube, opposite the distal end, that has an opening; a nozzle on the opening; and a closure for the nozzle; wherein, when the closure is opened and the tube is collapsed, flowable material inside the tube is urged out of the nozzle; and the bioplastic material includes a bio resin selected from the group consisting of PEF, PBF, PTF, GPE, GPET, PLA, PDLA, PLLA, PHA, and PHBH. A method may include forming a tube and filling the tube with flowable material from the distal end.

Abstract: The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.

Abstract: An apparatus and method to work relatively rigid material such as cardboard in sheets, to make boxes. The apparatus includes a loader suitable to have, according to a desired order, substantially flat reinforcement elements, and gripping means movable between a first gripping position in which they cooperate with the loader to pick up the reinforcement elements, and a second positioning condition, in which they position the reinforcement elements on the sheet according to a predetermined positioning pattern.

Abstract: In a method for curing mineral wool that is mixed with binder through microwaves, generating additional heat through installation of microwave active substances is performed through curing the binder material.

Abstract: A method for producing sleeve-like labels, comprising: a step of unwinding a reel of heat-shrink film, which comprises a plurality of pre-pasted portions; a step of separating one band of heat-shrink film from the reel; a step of feeding the band of heat-shrink film to a forming spindle; a step of wrapping the band of heat-shrink-film around the forming spindle, a region of overlap being provided between a first longitudinal end of the band of heat-shrink film in contact with the forming spindle and the second longitudinal end of the hand of heat-shrink film, the pre-pasted portion being arranged at a portion of the overlap region; a step of transferring the sleeve-like label from the forming spindle to a container to be labeled.

Abstract: The present invention provides a curing device and a display panel assembly apparatus using the same. The display panel assembly apparatus comprises a liquid crystal filling device, an alignment assembly device, a transporting device and the curing device. The curing device comprises a supporting stage configured to support the display panel; and a plurality of curing units disposed above the supporting stage, wherein the curing units are arranged according to a sealant pattern of the sealant. The present invention can reduce the number and used power of the curing units.

Abstract: A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend.

Abstract: A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.

Abstract: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.

Abstract: A system including a dual cure composite structure is disclosed. The system also includes a first layer comprising a resin having a first and a second functional group. The system further includes a second layer comprising the resin having the first and the second functional group. The system also includes a third layer comprising the resin having the first and the second functional group. The system further includes a first covalent bond across an interface of the first and the second layer and a second covalent bond across another interface of the second and the third layer. The system further includes more than two layers comprising the resin having the first and second functional group. A method of manufacturing a system including a dual cure composite structure is also disclosed. The method includes providing a first layer comprising a resin having a first functional group and a second functional group. The method also includes applying a first curing source to partially cure the first layer.

Abstract: A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).

Abstract: An apparatus for forming freeform solid articles includes a head unit having a plurality of arc-shaped support arms. The support arms mount material feeders and power sources which are directed at a work table. The material feeders, power sources and movement of the head unit and work table are controlled by a computerized control system.

Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Abstract: A method of preparing a vehicle panel assembly for attaching the panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced sides, with the bead of heat activated adhesive provided on the second side of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. The longwave infrared radiation is applied to the adhesive side of the panel to directly heat the bead and thereby activate the adhesive. The ready-to-install adhesive may be applied on or adjacent to a gasket, such as a polyvinyl chloride (PVC) molding, a urethane molding, or the like.

Abstract: An apparatus and method to seal a spacer between a pair of substrates within an IG assembly having a pair of spaced apart substrates and a bondable spacer therebetween, having support means for supporting an IG assembly to be treated and zonal energy applying means to locally apply energy to selected zones of the IG assembly where said spacer is located without providing direct energy to the balance of the IG assembly.