Relieved Or Configured Pressing Face Patents (Class 156/581)
  • Patent number: 11904497
    Abstract: The invention is directed to a machine for compacting agricultural fibrous matter into a board, comprising a hopper for receiving the agricultural fibrous matter; an extruder comprising an extrusion passage downstream of the hopper; and a ram configured for moving in a reciprocal manner along the extrusion passage; wherein the extrusion passage further comprises a movable wall configured for moving between a feed position, opening the extrusion passage to the hopper, and an extrusion position, closing the extrusion passage.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: February 20, 2024
    Assignee: FIBIOTEX S.A.
    Inventor: Aleksandr Frolov
  • Patent number: 11897240
    Abstract: A laminating device and a laminating method are disclosed. The laminating device is used for laminating a flexible panel together with a curved cover plate. The curved cover plate is provided with a central area and an edge bending area located in a first direction in the central area. The laminating device comprises a movable mechanism, which is arranged opposite the curved cover plate in a second direction and comprises: a first movable base table and a second movable base table, which are arranged opposite each other in the first direction; and an elastic supporting member, which is provided with an elastic supporting portion, the elastic supporting portion covering parts of the first movable base table station and the second movable base table station that are close to the curved cover plate, and being used for fixing the flexible panel.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: February 13, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shaokui Liu, Wei Qing, Wenwei Mo, Qiang Tang, Xingguo Liu, Huiqiang Song, Ren Xiong
  • Patent number: 11878852
    Abstract: A packaging with a packaging arrangement and at least one product received therein, such as in particular a medical product, and a method for manufacturing the packaging are disclosed. The packaging arrangement has a first packaging element, which has a trough-shaped receiving space for receiving the product, wherein the receiving space is delimited by a receiving base and a peripheral wall, which is connected with the receiving base. The packaging arrangement has a second packaging element inserted into the receiving space, which element has a plastically deformable deformation region and a plug-in region which extends peripherally around the deformation region and spans the same, wherein the product is arranged between the deformation region and the receiving base and the deformation region is at least plastically deformed in sections complementarily to the product, by contacting the same. The product is elastically clamped between the receiving base and the deformation region.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: January 23, 2024
    Assignee: STERIPAC GMBH
    Inventor: Martin Hutzler
  • Patent number: 11559950
    Abstract: A set of sealing jaws incorporating an adjustable seal area to seal the vertical portion of a bottom gusseted style of package. An adjustable seal surface allows a packaging machine to run different film web widths without the need to change jaws. The sealing jaws to be converted to run bottom gusset packages to pillow packages without the requirement to change jaws.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: January 24, 2023
    Inventor: John Deterling
  • Patent number: 11545462
    Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 3, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Tomonori Nakamura, Toru Maeda
  • Patent number: 11508689
    Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: November 22, 2022
    Assignee: SHINKAWA LTD.
    Inventors: Tomonori Nakamura, Toru Maeda
  • Patent number: 11498356
    Abstract: The device for hot stamping a part of a vehicle body is provided. The device includes a strip including a carrier film and a decorative film; at least one motorized arm capable of moving; at least one head mounted movably in rotation on one end of the arm, the head comprising pressure means capable of applying pressure on the strip; and means for unwinding the strip in front of the head.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: November 15, 2022
    Assignee: COMPAGNIE PLASTIC OMNIUM
    Inventors: Gilles Moulin, Claire D'Achon
  • Patent number: 11331731
    Abstract: A metal plate shearing apparatus, a control method thereof, and a metal plate shearing method are disclosed. The metal plate shearing apparatus includes a lower pad, an upper pad installed on the lower pad to ascend and descend and configured to press and fix an upper surface of a metal plate of a cut target placed on the lower pad, a shear blade installed adjacent to one side surface of the upper pad to ascend and descend and configured to shear a cutting line of the metal plate by descending, and a heating device configured to locally heat the cutting line of the metal plate.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 17, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Youn Il Jung
  • Patent number: 11267680
    Abstract: Attachments for a clamping device can be used to increase the contact area between the jaws and the object to allow the clamping device to handle irregular objects, such as non-flat panels of metal, granite, ceramic, glass, quartz, or concrete plates. The attachments can include plate assemblies to be attached to the sides of the irregular objects. The attachments can include jaw plate assemblies to be attached to the sides of the jaws of the clamping device.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: March 8, 2022
    Inventor: Nhon Hoa Nguyen
  • Patent number: 11198262
    Abstract: An apparatus for picking, placing, and forming a composite charge over a complex geometry tool comprises a first frame, a second frame, and a plurality of dynamic mechanisms. The first frame is formed from rigid material and includes a first frame member that forms at least a rectangular perimeter. The second frame is formed from flexible material and includes a second frame member that forms at least a rectangular perimeter. Each dynamic mechanism is connected to the first frame and the second frame and located along the perimeters of the first frame and the second frame. Each dynamic mechanism includes a length-variable component positioned between the first frame and the second frame, with at least a portion of the dynamic mechanisms configured to vary a length of the length-variable component for the second frame member to conform to the shape of the complex geometry tool.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: December 14, 2021
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Christopher James Padovano, Blaise Francis Bergmann, Christopher John Morrow, Allison Lynne Horner, Benjamin Wayne Ferrell
  • Patent number: 10953503
    Abstract: A vehicle body part rack, being used for placing a vehicle body part during assembly or post-treatment of the vehicle body part. The rack includes a base plate and vehicle body part supports arranged on the base plate. Each support has a head, and a supporting rod connected to the head and the base plate. The supporting rod is movable with respect to the base plate and the rack has lateral supports which are able to hold the vehicle body part and to rotate it.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 23, 2021
    Assignee: Compagnie Plastic Omnium
    Inventors: Patrick Schmit, Tony Rapien
  • Patent number: 10170443
    Abstract: A debonding device includes a first member provided with a recess for receiving a carrier body, the carrier body including a first plate, a second plate, and plural semiconductor chips. The semiconductor chips are sandwiched between the first plate and the second plate, the first plate of the carrier body received in the recess being opposed to a bottom of the recess. A second member is configured to change a relative position with respect to the first member, wherein the second member holds the second plate of the carrier body received in the recess using a vacuum suction, and the first member is provided with an inlet to introduce gas into a gap between the first plate and the second plate of the carrier body received in the recess.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventor: Akihiro Horibe
  • Patent number: 9844907
    Abstract: A method for manufacturing a lining part (L), which is formed from a support part (10) and a decorative layer (20), the method having the steps of: moving together a first tool part (210) with a first shaping surface (210a), against which a support part (10) lies, and a second tool part (220) with a second shaping surface (220a), against which a decorative layer (20) lies, wherein a groove section (61) of the support part (10), forming a support part longitudinal groove (50), is situated in a tool depression which is constructed in the first shaping surface (210a), extending a positioner (250) mounted in the second tool part (220) into an extended position such that the positioner (250) positions an edge section (25) of the decorative layer (20) such that said edge section projects into a region (60) bounded by the support part longitudinal groove (50), extending a slider (270) adjacent to the extended positioner (250) such that an edge section of the slider (270) presses the edge section (25) of the decor
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: December 19, 2017
    Assignee: Faurecia Innenraum Systeme GmbH
    Inventors: Ulrich Sandmeyer, Harald Peter
  • Patent number: 9457435
    Abstract: A propeller blade, which can belong to a fan without covering by an external casing, includes two portions fitted into one another and of different materials, generally composite, to resist various stresses, heating coming from a rotor or impacts of solid bodies. An internal portion includes a blade core, a blade shank and possibly a foam lining, and a preform of an outside portion is assembled to it by surrounding it closely before being completely formed by receiving its resin, which is placed into polymerization. A method for producing the propeller blade guarantees good assembly of the portions without defects of form, damage or deformation of a fiber weave.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: October 4, 2016
    Assignees: SNECMA, SAFRAN
    Inventors: Richard Mathon, Olivier Foussard, Yann Marchal, Franck Bernard Leon Varin
  • Patent number: 9409361
    Abstract: A mold (10) according to the present invention is a mold for molding a surface of a laminate (60) when curing the laminate (60) obtained by laminating prepreg (62). The mold (10) has a planar plate shape and elastically deforms from the planar plate shape into a shape corresponding to a shape of the laminate (60), thereby being capable of coming tight into contact with the laminate (60). Thereby, a mold which is easy to handle can be provided.
    Type: Grant
    Filed: December 26, 2011
    Date of Patent: August 9, 2016
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Toshikazu Sana, Akihito Sakai, Akira Murai, Yasuhiro Takenaka, Kazuyoshi Kawano, Tomoya Takahashi
  • Patent number: 9016342
    Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 28, 2015
    Assignee: Apic Yamada Corporation
    Inventor: Kazuhiko Kobayashi
  • Patent number: 9010395
    Abstract: A device for laying up a dry preform having an elongated shape includes a punch that reproduces the elongated shape of the dry preform, a depositing assembly, and a mobile carrier that moves at least one of the punch and the depositing assembly. The depositing assembly deposits, onto the punch, a fibrous band including a small amount of binding agent to make up the dry preform having a cross-section with at least two non-coplanar wings. The depositing assembly also includes pressing devices that press the fibrous band, a channel that pre-shapes the fibrous band to have the cross-section, and a calibration device that applies a normal pressure to all surfaces of the dry preform that are opposite from the punch while cooling the pressed portion of the fibrous band to control a thickness of the dry preform having the cross-section.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: April 21, 2015
    Assignee: Airbus Operations S.A.S.
    Inventors: Philippe Blot, Christophe Marchand, Claude Le Bail, Simon Deseur, Jerome Soto
  • Patent number: 8985173
    Abstract: It is an object to provide a homogeneous semiconductor substrate in which defective bonding is reduced. Such a semiconductor substrate can be formed by the steps of: disposing a first substrate in a substrate bonding chamber which includes a substrate supporting base where a plurality of openings is provided, substrate supporting mechanisms provided in the plurality of openings, and raising and lowering mechanisms which raise and lower the substrate supporting mechanisms; disposing a second substrate over the first substrate so as not to be in contact with the first substrate; and bonding the first substrate to the second substrate by using the raising and lowering mechanisms to raise the substrate supporting mechanisms.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: March 24, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Takatsugu Omata, Tomoaki Moriwaka, Hideto Ohnuma
  • Patent number: 8967215
    Abstract: A labelling device includes a linearly displaceable piston operably connectable to a moving mechanism for moving the piston from a resting position to a labelling position. A label carrying mechanism is arranged at the distal end of the piston for carrying an adhesive label and affixing the adhesive label to an object via physical contact at the labelling position of the piston. A force-switching-state system is provided to maintain the piston in relation to the moving mechanism in an attracting force state and the piston moves with the moving mechanism. The physical contact creates an opposite repelling force from the object onto the label carrying mechanism causing separation of the displaceable piston from the moving mechanism. This separation causes a change of the force state of the displaceable piston from an attracting to a repelling force state, causing the linearly displaceable piston to move back to the resting position.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: March 3, 2015
    Assignee: Marel Limited
    Inventor: Steven Bates
  • Patent number: 8967222
    Abstract: Convey means for pitch-feeding the semiconductor cell to which the conductive tapes have been attached, lead wire processing means for forming-processing the lead wire, provisional pressure-bonding means which is provided at a part opposed to the semiconductor cell that is pitch-fed, holds the lead wires which are forming-processed, repeats provisional pressure-bonding of the lead wires to the conductive tapes provided on the upper surface and lower surface of the semiconductor cell that is pitch-fed, and alternately connects the upper surfaces and lower surfaces of the neighboring semiconductor cells, and main pressure-bonding means which is disposed on a downstream side of the provisional pressure-bonding means in a direction of conveyance of the semiconductor cell, and which mainly pressure-bonds, simultaneously, the paired upper and lower lead wires which have been provisionally pressure-bonded to the upper surface and lower surface of the semiconductor cell.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 3, 2015
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Mitsuhito Abe, Tomoyoshi Kawasaki
  • Patent number: 8944127
    Abstract: A portable impulse welding assembly operable by an operator with a main air regulator receiving pressurized air for decreasing or maintaining air pressure to a first preset limit. A splitter simultaneously divides a first regulated air into first and second portions and a rod air regulator provides a first valve air to a first air flow conduit and a second air flow conduit. A pair of pneumatic cylinders mounted in the housing, each pneumatic cylinder having a rod, the pneumatic cylinders selectively receive air from the first air flow conduit to extend each rod from each pneumatic cylinder or receive air from the second air flow conduit causing each rod to retract into each pneumatic cylinder and a controller to control seal times and cool times and a laser pointer to ensure sealing accuracy.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: February 3, 2015
    Assignee: Envirocon Systems, Inc.
    Inventors: Gregory L. DeJarnett, Mohammed Ali Ahmad
  • Patent number: 8925608
    Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: January 6, 2015
    Assignee: Besi Switzerland AG
    Inventor: Andreas Mayr
  • Patent number: 8919405
    Abstract: A manual and an automatic fastening device for fastening a bonding element to a surface by means of a light-curing adhesive is disclosed. The fastening devices apply the bonding element to the surface with a specific contact pressure, before the light is irradiated onto the bonding element for curing the adhesive. As the bonding element consists of transparent material, the adhesive is cured between the fastening element and the surface.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: December 30, 2014
    Assignee: Bollhoff Verbinduncstechnick GmbH
    Inventor: Franz Druke
  • Publication number: 20140345791
    Abstract: A laminating apparatus and method are disclosed. The laminating device includes a first jig, a second jig facing the first jig, an auxiliary film fixing unit and a driving unit. A partially curved cover window is seated on the first jig. An auxiliary film and a panel member are seated on the second jig so as to be flat. The driving unit linearly moves at least one of the first and second jigs.
    Type: Application
    Filed: March 11, 2014
    Publication date: November 27, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: Yang-Han SON, Kyung-Su LEE, Dai-Hyun HWANG
  • Patent number: 8869859
    Abstract: A dispensing and sealing system generally includes a film-feed assembly with a support mechanism for a supply of film and a film-drive mechanism to advance the film along a path, a dispenser with an outlet port for dispensing fluid into the film, and a transverse seal mechanism for forming a seal in the film transversely of the path. A calendering device and a movable structure for the support mechanism are also described.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: October 28, 2014
    Assignee: Sealed Air Corporation (US)
    Inventors: Michael Knaak, Scott Rote, Mark Kurth, Dan Johnson, Kyle Koning, Dan Somen
  • Patent number: 8863805
    Abstract: A pressing-on device for pressing fiber-reinforced thermoplastic materials onto a mold is described. The pressing-on device has a main body and a pressing-on layer provided on a surface of the main body. The pressing-on layer is implemented in this case using an inorganic material, preferably a ceramic material, and has a flexibility because of its structure which allows it to adapt itself to the contour of a mold. Increased heat resistance of the pressing-on device and improved properties of the processed fiber-reinforced thermoplastic material can be achieved.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: October 21, 2014
    Assignee: Airbus Operations GmbH
    Inventor: Niko Naumann
  • Patent number: 8844598
    Abstract: A fusion welding socket for coupling together double walled plastic conduits including an inner pipe, an outer pipe surrounding the inner pipe and an annular space arranged between the inner and outer pipes. The fusion welding socket includes a main body comprising a first end portion, a second end portion and an intermediate portion. The intermediate portion has at least one inner diameter which is smaller than the inner diameters of the first and second end portions. Three heating coils are embedded in the first end portion, the second end portion and the intermediate portion, respectively, for fusing together the first and second end portions with a respective outer pipe of a first and second conduit and the intermediate portion with a respective inner pipe of the first and second conduit. A passageway includes an annular space is arranged to connect the annular spaces of the first and second conduit after fusion.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: September 30, 2014
    Assignee: Kungsors Plast AB
    Inventor: Thomas Andersson
  • Patent number: 8840741
    Abstract: Process for providing a laminate product comprising a substrate and a printed film, the process comprising an embossing step synchronized with a decoration of the printed film and carried out continuously, through the passage of the laminate product between an engraved embossing cylinder, and a pressure counter-cylinder; the registration of the engraved cylinder, for keeping the synchronism between embossing and decoration, comprises suitable displacements of the engraved cylinder and is carried out with a temporary separation of the counter-cylinder from the engraved cylinder, or with a reduction in the embossing pressure existing between the engraved cylinder and the counter-cylinder.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: September 23, 2014
    Assignee: Rondolfo Comerio SRL
    Inventor: Carlo Comerio
  • Publication number: 20140272529
    Abstract: The disclosed embodiments relate to the manufacture of a battery cell. The battery cell includes a first set of layers including a cathode with an active coating, a separator, and an anode with an active coating. The separator may include a ceramic coating and a binder coating over the ceramic coating. During manufacturing of the battery cell, the layers are stacked, and the binder coating is used to laminate the first set of layers within the first sub-cell by applying at least one of pressure and temperature to the first set of layers. In addition, uniform pressure is applied to the cell stack to laminate the first and second sets of layers.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: Apple Inc.
    Inventors: Sheba Devan, Richard M. Mank, George V. Anastas, Jack B. Rector, III, Qingcheng Zeng, Shouwei Hao, Adnan N. Jafri
  • Patent number: 8826960
    Abstract: A system for applying labels to cable or conduit including at least one label and a label applicator. The label applicator including at least one guide roller, at least one tamping device comprising at least one tamping pad for applying at least one label onto the moving cable or conduit, and a guide shoe assembly. The guide shoe assembly comprises a guide shoe, the guide shoe comprises a rounding member, a plurality of springs for providing flexibility to the rounding member when the moving cable or conduit passes the at least one guide shoe, a support mount for supporting the at least one guide shoe, a plurality of pivots disposed between the rounding member and the rounding member support for adjusting the set of springs, and a fitted member for providing an anchor for the at least one guide shoe to connect with the support mount.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: September 9, 2014
    Assignee: Encore Wire Corporation
    Inventors: Mark Bennett, William Thomas Bigbee, Jr., Steve Griffin
  • Patent number: 8820381
    Abstract: A system for applying a tin-tie, from a supply of tin-ties releaseably adhered along the length of a liner, with the tin-tie length generally aligned along a length of packaging moving in a first direction includes a tamp applicator for extending and retracting along a second direction substantially transverse to the first direction. The tamp applicator includes a magnet for carrying the tin-tie after it is released from the liner by a peeler, an air assist for aid in releasing and positioning the tin-tie, and a recess and edge for positioning the tin-tie. Part of the tamp applicator carrying the released tin-tie is also moveable in the same first direction, allowing travel in the same first direction as the moving packaging material when putting the tin-tie on the moving packaging material. A spring biases the part to return in a third direction opposite the first direction.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: September 2, 2014
    Assignee: Plitek L.L.C.
    Inventors: Karl K. Hoffman, Tom Roberts, Steve Kaganovich, Clay Ladd, Arthur A. Sagy
  • Publication number: 20140238616
    Abstract: A press pad is provided for use in a laminate press. The pad comprises a woven fabric of heat resistant strands wherein at least a proportion of the weft comprises a core made up of a bundle of strands within a sheath of an elastomeric material and at least a proportion of the warp comprises metal strands. The strands forming the bundle are dose-packed prior to extrusion of the sheath around them. The transverse cross-sectional profile of the sheath is a regular geometric profile that is other than a circular profile prior to weaving of the fabric of the press pad. Preferably, the transverse cross-sectional profile of the sheath is a splined profile or a regular polygonal profile that is composed of straight lines or arcs.
    Type: Application
    Filed: August 7, 2012
    Publication date: August 28, 2014
    Applicant: MARATHON BELTING LIMITED
    Inventor: Melvyn Douglas
  • Patent number: 8794294
    Abstract: The invention relates to an insulated container for hot drinks or the like comprising an inner cup having a generally frusto-conical cup body and a generally frusto-conical outer shell. The cup is seated within the shell so that a contact path is disposed near the upper edge of the shell, along which contact path the outer surface of the cup body and inner surface of the shell are in contact. At least one bonding spot and/or bonding area for bonding said shell to said cup body is locally formed within said contact path.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: August 5, 2014
    Assignee: Seda S.p.A.
    Inventor: Gianfranco D'Amato
  • Patent number: 8776855
    Abstract: A device for processing flat objects (40) delivered successively in a delivery direction, in particular print shop products, and/to a continuously advanced material web (42). The device, which is to be used particularly for welding a material web, includes at least one rigid body (90) that can be pivoted about an axis of rotation (D) and at least one tool (10) having a processing-effective zone (12), the tool being attached to the body (90) and movable along an orbit (U) by rotating the body (90). The tool is attached to the body (90) pivotally or rotatably about a pivot axis (S). The pivot position of the tool can be adjusted as a function of the rotational position of the rigid body by means of a stationary control gate and a control element interacting with the control gate and connected to the tool.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: July 15, 2014
    Assignee: Ferag AG
    Inventors: Roman Dax, Thomas Luginbuhl
  • Patent number: 8752603
    Abstract: Apparatus for connecting at least two plates (1, 2) of which a supporting plate (1) comprises a higher strength than a supported plate (2) posed thereon. By means of a connecting element (5) rotated by a rotational feeder unit (11), the connecting element with a collar (6) presses the supported plate (2) onto the supporting plate (1). With a shaft (10) a friction welding connection to the supporting plate (1) is made. The rotational feeder unit (11) is provided with a measurement device with measures an axial force exerted by the rotational feeder unit as well as a respective feeding motion and which indicates, upon abutment of the shaft of the connecting element onto the supporting plate, the pressure increase encountered therein, which, thereby, advances the rotational feeder unit, the feeding motion of which is adjustable to at least three sequential connecting stages.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: June 17, 2014
    Assignee: EJOT GmbH & Co. KG
    Inventors: Eberhard Christ, Jörg Thiem, Marco Werkmeister
  • Publication number: 20140145032
    Abstract: Apparatus and methods provide for the construction of wing sections having multi-box wing spars. According to one aspect of the disclosure provided herein, an aircraft wing may be constructed by applying one or more layers of composite material onto a plurality of wing mandrels. The wing mandrels, when placed together, form the shape of the wing. After the layers of composite material are applied to each individual mandrel, the mandrels are abutted together. Thereafter, the mandrels are compressed using wing surface tooling applied to the plurality of wing mandrels. The composite material is thereafter cured. After curing, the wing surface tooling and mandrels are removed, resulting in a wing having multi-box wing spars and skin.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: The Boeing Company
    Inventor: The Boeing Company
  • Patent number: 8726965
    Abstract: The invention relates to a method for at least partially reworking or replacing a reinforcement element of a fibre composite structure. In a first method step, at least one fibre layer is arranged on a surface section of the reinforcement element and/or at least one replacement section of the reinforcement element of the same material and same layer structure is arranged on a surface reinforcement section of the fibre composite structure. In a second method step, at least a pressure mat adjusted to the contour of the reinforcement element is disposed above the at least one fibre layer and/or the at least one replacement section of the reinforcement element, wherein the at least one pressure mat is supported and fixed in a nominal position by a fixing frame adjusted to the contour of the reinforcement element. In a third method step, the at least one pressure mat is then acted upon by a pressure medium in order to press the same against the reinforcement element and the fixing frame.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: May 20, 2014
    Assignee: Airbus Operations GmbH
    Inventor: Hans Marquardt
  • Publication number: 20140130966
    Abstract: The invention relates to an electronic circuit (1) consisting of a substrate (10) having a surface on which at least one component (3) covered with a lid (22) is mounted. Said component comprises first connection means (15) to be connected to second connection means (70). In said circuit (1), at least one connection passage (50) is provided that extends through the lid in order to link the first connection means (15) to the outside of the lid, which then makes it possible to link the first means to the second connection means (70) (see FIG. 2). The invention can be used for the production of microsystems that require the encapsulation of some components.
    Type: Application
    Filed: December 8, 2011
    Publication date: May 15, 2014
    Applicant: KFM TECHNOLOGY
    Inventors: Sebastien Brault, Elisabeth Dufour-Gergam, Fabrice Verjus, Martiel Desgeorges
  • Patent number: 8715438
    Abstract: A computing device includes a touchpad having a plurality of internal diaphragms that allow the touchpad to sense downward force inputs. The diaphragms are evenly glued about their circumferential edge portions to an internal flat surface by way of a gimbal press. The gimbal press can include a force delivery component coupled to an upper plate having an internal depression, a lower plate having a ball bearing that accepts force from the upper plate via the internal depression, a flexible ring member, and a compliant annular component. Both plates have a plurality of interlocking features with grooves extending therethrough that accept the flexible ring member. Force is evenly distributed to the diaphragm via a gimbal effect at the ball bearing, and the flexible ring member centers the upper and lower plates with respect to each other while permitting some relative tilt and rotation between the plates.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: May 6, 2014
    Assignee: Apple Inc.
    Inventor: Patrick Kessler
  • Patent number: 8701733
    Abstract: Heat press platens for a shoe customization/decoration system and a method of using the same are disclosed. The platens may be quickly interchanged to allow the same equipment to be used to dye shoes of different sizes. The platens individually accommodate a pair of assembled shoes and are shaped to: reduce print sizes, maintain symmetry and flatness of the shoe, and accommodate a range of shoe sizes. The size and shape of the platens enable one shoe to be fitted on one side of a platen and another shoe to be fitted on the opposite side. The platens position the shoes so that they are mirror images of each other. This positioning allows a single print, including mirror images of the same design, to be applied to two shoes at the same time.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: April 22, 2014
    Assignee: NIKE, Inc.
    Inventor: Gregory R. Leedy
  • Patent number: 8695672
    Abstract: The sealing element for integration into a sealing tool for producing smooth stamping fields during the sealing of two plastic sheets has a base body. A first slot extends into the base body from a first narrow lateral surface, and a second slot, which is offset vertically from the first slot, extends into the base body from a second narrow lateral surface, in such a way that the two slots define a section of the base body which has substantially the shape of an S or reversed S. The first slot has a U-shape with a first leg of the first slot being longer than a second leg of the first slot, and the second slot has a U-shape with a first leg of the second slot being longer than a second leg of the second slot. Each of the two slots expands at its inner end to form a bore.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: April 15, 2014
    Assignee: Uhlmann Pac-Systeme GmbH & Co. KG
    Inventor: Wolfgang Krahl
  • Patent number: 8684059
    Abstract: A method and apparatus for tabbing a piece of folded material includes a fixture into which a folded material is manually inserted and retracted. A dispensing device automatically dispenses a length of adhesive tape that may be pinked on at least one edge, and a cutting device separates the length of pinked tape from its source. A lower platen slides below the inserted media and traps a piece of the adhesive tape between the lower platen and the media. An upper roller or sliding member moves over the opposite side of the media for folding the remaining portion of the adhesive tape over the opposite side of the media and causing good contact between the adhesive surfaces of both portions of the folded adhesive tape and the media, thereby completing the sealing action. The media then is retracted manually.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: April 1, 2014
    Inventor: Chris Vanden Broek
  • Patent number: 8684056
    Abstract: Systems and associated methods of printing using ink-jet technology and offset printing capabilities are provided. The method can comprise jetting an ink onto a printing blanket, where the ink comprises a carrier and a pigment colorant, and where the carrier substantially free of polymers. Additional steps include developing the ink to create a print image on the printing blanket; applying a layer of wetting fluid to a surface of a print medium, where the surface includes a coating comprising a polymer; heating the surface to a print-receptive temperature that is lower than the softening temperature of the polymer, causing softening of the polymer; and transferring the print image from the printing blanket to the surface.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: April 1, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Omer Gila, Napoleon J. Leoni
  • Patent number: 8656975
    Abstract: A weight applicator for a wheel of a tire-wheel assembly is disclosed. The weight applicator includes an arm portion and an applicator portion connected to the arm portion. The applicator includes a radially-extending flange portion. The radially-extending flange portion is connected to the arm portion. A first plunger portion is movably-connected to the radially-extending flange portion by one or more first radial arms. A method is also disclosed.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: February 25, 2014
    Assignee: Android Industries LLC
    Inventors: John Donnay, Dale Terry
  • Patent number: 8646506
    Abstract: An apparatus for manufacturing bodily exudates absorbent structures has a rotating drum to convey a first continuous sheet, a feeding mechanism, a second conveying mechanism to convey a second continuous sheet and a sealing mechanism to join the first and second continuous sheets. The rotating drum is formed on its peripheral surface with depressions, leaving a non-depressed peripheral surface segment. Each of the depressions is formed in a central region with a central through-hole extending through each depression from an outer surface to an inner surface of the rotating drum. Within the rotating drum, a suction mechanism is installed to provide a suction effect directed from the outer surface toward the inner surface of the rotating drum so that the first continuous sheet is formed with a first concave region having been deformed along each depression and a second concave region having been deformed toward the central through-hole.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: February 11, 2014
    Assignee: Unicharm Corporation
    Inventors: Kazuo Ukegawa, Akihide Ninomiya
  • Patent number: 8640758
    Abstract: A tracer wire applicator preferably includes a base frame, a wire spindle, a tape spindle and a pipe roller. The base frame preferably includes a base frame member, a support frame member and an upper frame member. One end of the upper frame member is removably secured to one end of the base frame member. One end of the support frame member is removably attached to the base frame member and the other end is attached to the upper frame member. The pipe roller is rotatably retained on the other end of the base frame member. The tape spindle extends from the base frame member to rotatably receive a roll of tape. A wire spindle extends from the base frame member to rotatably receive a wire reel. A wire guide tube is preferably retained by the upper frame member.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: February 4, 2014
    Inventor: John J. Grosskruetz
  • Publication number: 20140027050
    Abstract: In some embodiments, the instant invention is a kit having at least: a tray, having: a first cutout, a second cutout, and a third cutout; and a protective film for an electronic device, where a first alignment tab and a second alignment tab are attached to the protective film, where the at least one first alignment tab includes a first alignment portion that extends from an edge of the protective film, where the at least one second alignment tab includes a second alignment portion that extends from the edge of the protective film, where the first alignment portion of the first alignment tab matches a shape of the second cutout and where the second alignment portion of the second alignment tab matches a shape of the third cutout so that the first alignment tab and the second alignment tab are capable of aligning the protective film within the first cutout.
    Type: Application
    Filed: August 22, 2013
    Publication date: January 30, 2014
    Applicant: Tru Protection, Inc.
    Inventor: Keiko Napier
  • Patent number: 8590588
    Abstract: A system for forming a looped suture is provided. The system includes a suture supply assembly configured for supplying thread, a flipper gripping assembly configured for forming a loop in the thread, a carriage assembly configured for advancing the thread through the forming process, and a welding assembly configured for securing the loop in the thread.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: November 26, 2013
    Assignee: Covidien LP
    Inventors: Nicholas Maiorino, Timothy Kosa, Mark Buchter, Keith Kroeber, Richard Casey Hart
  • Patent number: 8579002
    Abstract: The invention relates to a device for manufacturing an OSB beam with a web and at least one flange. The starting material for the beam is wood strands of OSB type. The device comprises a feeder device for advancing the strands, a metering device for metering out the strands, a nozzle, through which the metered strands pass, and a receiving surface for receiving the strands. The feeder device, the metering device and the nozzle are adapted for applying strands to the receiving surface in the form of an elongated bead. The height of the bead is at every point of the cross-section substantially adapted to the web and flange of the beam being made. The invention also relates to a process for manufacturing an OSB beam and to a computer readable medium comprising a program.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: November 12, 2013
    Assignee: Newbeam Sweden AB
    Inventors: Alexander Nyberg, Per Nylund
  • Patent number: 8578993
    Abstract: A wafer bonding apparatus of the present invention includes a first sample base configured to hold a first substrate; a second sample base configured to hold a second substrate to oppose to the first substrate; a load transferring section coupled to an outer edge portion of the first sample base and configured to support the first sample base to a first stage; and a drive unit configured to perform pressure bonding on the first substrate and the second substrate by driving the second sample base to the first stage. In the wafer bonding apparatus, it is possible to prevent that a load which is larger than a load applied on the outer edge portion of the first substrate is applied to the center of the first substrate, and to apply uniform load the first substrate and the second substrate, when pressure bonding is performed on the first substrate and the second substrate.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: November 12, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventor: Satoshi Tawara