Heated Patents (Class 156/583.1)
  • Patent number: 10286577
    Abstract: A composite mandrel includes a generally elongated mandrel body comprising a resilient mandrel core and an elastomeric mandrel outer layer disposed outside the mandrel core. A method for fabricating a contoured stiffened composite panel is also disclosed.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: May 14, 2019
    Assignee: The Boeing Company
    Inventors: Brian G. Robins, Daniel M. Rotter, Todd J. Washburn, Panagiotis E. George
  • Patent number: 10029279
    Abstract: A method is provided for manufacturing an image on a substrate, wherein the image includes an indicia and a frame. The method includes covering at least a portion the substrate with a carrier comprising magnetically alignable flakes, aligning the magnetically alignable flakes with a magnetic field of a magnetic assembly comprising a metal plate with an opening, and solidifying the carrier. The frame is formed at an edge of the opening and the indicia is visible within the frame. The magnetic assembly includes two magnets disposed so that the North pole of one magnet and the South pole of another magnet are proximate to the metal plate at opposite sides of the opening.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: July 24, 2018
    Assignee: VIAVI SOLUTIONS INC.
    Inventor: Vladimir P. Raksha
  • Patent number: 9636790
    Abstract: There are provided a metal product having an internal space formed therein, allowing for improvements in the flow of a coolant in the internal space, such as a cooling channel and an increase in cooling efficiency, and a method of manufacturing thereof. The metal product includes a body part having a first space formed therein; a space formation member having a second space formed therein, mounted on the body part to be communicated with the first space; and a finishing part forming an exterior by covering the space formation member in a state in which the space formation member is mounted on the body part.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: May 2, 2017
    Assignee: INSSTEK, INC.
    Inventor: Jeong-Hun Suh
  • Patent number: 9543253
    Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: January 10, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
  • Patent number: 9525260
    Abstract: A production device 100 for a packaged electrode 20, to which a separator welding device is applied, includes joining heads 301 having joining tips 302 and 303 that join a pair of separators 30 to each other and holding units 304 that fasten the pair of separators. After the joining heads 301 are moved closer to each other with respect to the separators, and the separators are fastened by the holding units 304, the pair of separators is joined to each other by the joining tips 301. Meanwhile, after the joining heads 301 are separated from each other with respect to the separators, and the joining tips are separated from the pair of separators, the separators are released from fastening by the holding units 304.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: December 20, 2016
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Hiroshi Yuhara, Takahiro Yanagi, Manabu Yamashita
  • Patent number: 9452853
    Abstract: New and improved seal jaws and methods for creating a seal on a package containing a high-profile product therein are described herein. The seal jaws are configured to seal overlapping wrapping film segments together adjacent the product in a seal zone where the height of the product results in additional film width. The height of the product creates an inward pull that can prevent the additional film width from being taut, which can result in folds or wrinkles in a subsequently formed seal. Advantageously, the seal jaws described herein have a non-linear configuration that provides extra sealing surface area as compared to linear surfaces over the same lateral distance. The extra sealing surface is provided by an array of curvilinear peaks and valleys, where the peaks tension the overlapping film segments in the seal zone to substantially prevent the additional film width from forming folds in a subsequently formed seal.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: September 27, 2016
    Assignee: Kraft Foods Group Brands LLC
    Inventor: Paul E. Doll
  • Patent number: 9351435
    Abstract: A bonding apparatus for a display device includes a film bonding device configured to attach an anisotropic conductive film to a panel, and a pressure device configured to bond a driving chip and a flexible printed circuit to the panel. The pressure device includes a pressure head including a heat source, a pressure tip attached to a bottom side of the pressure head and the pressure tip being configured to press the flexible printed circuit to the panel, and a transfer unit attached to an upper side of the pressure head, the transfer unit being configured to transfer the pressure head. The heat source is located in the pressure head.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jong-Hwan Kim, Yong-Youl Cho
  • Patent number: 9302429
    Abstract: A sealing apparatus for sealing a travelling packaging film. The sealing apparatus includes a first actuator, a second actuator, a first seal member, a second seal member, a slide rail arrangement, and a linkage coupled to the slide rail arrangement and connecting each of the first and second actuators to the first and second seal member. The first and second sealing members are actuated toward and away from each other between a disengaged position and an engaged position for sealing the travelling packaging film.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: April 5, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Detlev D. Ansinn, John Meisner
  • Patent number: 9196599
    Abstract: A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: November 24, 2015
    Assignee: Dexerials Corporation
    Inventor: Takayuki Saito
  • Patent number: 9050757
    Abstract: An internally heated and pressurized system for fabricating a composite laminate structure and method for use thereof is disclosed. One of a plurality of thin, thermally conductive bond tools, prepreg fiber reinforced composite layers, and a pressure applying membrane are nested within a heated base, and then covered by a pressure sealed cover. The system is pressurized through the pressure sealed cover. The pressure causes the pressure applying membrane to force the prepreg fiber reinforced composite layers onto the upper surface of the bond tool. The heated base transfers heat to the composite layers via the bond tool, which heats and cures the composite layers together and to a shape determined by the upper surface of the bond tool. Each bond tool is formed with a generic lower surface for nesting within the heated base and an upper surface for forming composite layers into the shape of a specific part.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: June 9, 2015
    Assignee: Textron Innovations, Inc.
    Inventors: Richard Boone, Benjamin De Putter
  • Patent number: 9038690
    Abstract: A universal heat press machine includes an adjustable supporting frame having, a main body, an actuating handle assembly, and a heat pressing assembly. The heat press assembly includes a first pressing member attaching on the actuating handle assembly, and a second pressing member suspendedly extending from a lower portion of the main body to define an operational space. When the heat pressing assembly is in a heat press position, an imprinting surface of the work piece is arranged to rest on the second pressing member while other parts of the work piece is allowed to temporarily accommodate in the operational space. The first pressing member is pivotally moved to bias against the second pressing member and the imprinting surface of the work piece for imprinting the graphics on the imprinting surface.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: May 26, 2015
    Inventors: Eddie Hsiao, Richard Lowis Allen Burgard
  • Publication number: 20150140689
    Abstract: According to one embodiment, there is provided a substrate bonding method. The substrate bonding method includes disposing a first substrate and a second substrate to face each other. The substrate bonding method includes controlling the first substrate and the second substrate to have a temperature difference. The substrate bonding method includes, in a state where the first substrate and the second substrate are controlled to have the temperature difference, bonding the first substrate to the second substrate by bringing the first substrate into contact with the second substrate while deforming the first substrate so that a central portion of the first substrate is projected toward the second substrate. The central portion of the first substrate is on an inner side of a peripheral portion of the first substrate.
    Type: Application
    Filed: March 5, 2014
    Publication date: May 21, 2015
    Inventor: Mitsuyoshi ENDO
  • Publication number: 20150129135
    Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.
    Type: Application
    Filed: November 4, 2014
    Publication date: May 14, 2015
    Inventors: Hang Lim LEE, Jong Jin WEON, Soon Hyun KIM, Seung Dae SEOK
  • Publication number: 20150122425
    Abstract: A universal heat press machine includes an adjustable supporting frame having, a main body, an actuating handle assembly, and a heat pressing assembly. The heat press assembly includes a first pressing member attaching on the actuating handle assembly, and a second pressing member suspendedly extending from a lower portion of the main body to define an operational space. When the heat pressing assembly is in a heat press position, an imprinting surface of the work piece is arranged to rest on the second pressing member while other parts of the work piece is allowed to temporarily accommodate in the operational space. The first pressing member is pivotally moved to bias against the second pressing member and the imprinting surface of the work piece for imprinting the graphics on the imprinting surface.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Eddie Hsiao, Richard Lowis Allen Burgard
  • Publication number: 20150114550
    Abstract: A device for welding the bottom flange of a stiffener on the side of a skin. The stiffener and the skin are made of a composite comprising a thermoplastic polymer matrix. The device comprises a punch, an anvil and a press to make a clamping between the punch and the anvil. The punch comprises a part forming a pressure table with a cross-section width less than or equal to the width of the stiffener bottom flange and a heating element with width less than the width of the pressure table. The anvil comprises a cooling component and has a cross-section width smaller than the width of the skin. A method for implementing the device.
    Type: Application
    Filed: February 28, 2013
    Publication date: April 30, 2015
    Inventors: Didier Kurtz, Julie Vaudour
  • Patent number: 9010395
    Abstract: A device for laying up a dry preform having an elongated shape includes a punch that reproduces the elongated shape of the dry preform, a depositing assembly, and a mobile carrier that moves at least one of the punch and the depositing assembly. The depositing assembly deposits, onto the punch, a fibrous band including a small amount of binding agent to make up the dry preform having a cross-section with at least two non-coplanar wings. The depositing assembly also includes pressing devices that press the fibrous band, a channel that pre-shapes the fibrous band to have the cross-section, and a calibration device that applies a normal pressure to all surfaces of the dry preform that are opposite from the punch while cooling the pressed portion of the fibrous band to control a thickness of the dry preform having the cross-section.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: April 21, 2015
    Assignee: Airbus Operations S.A.S.
    Inventors: Philippe Blot, Christophe Marchand, Claude Le Bail, Simon Deseur, Jerome Soto
  • Patent number: 9005384
    Abstract: A surface of a laminate base body including a projection is caused to penetrate at least a film-shaped laminating body and surely laminated by a simple configuration, and a laminate thereof is formed at a uniform thickness without an occurrence of voids. A laminating device is provided with a heating unit configured to heat at least an insulating resin film; an upper plate and a lower plate configured to be capable of opening and closing, and configured to form a chamber that becomes sealed upon closing; a receiving member having an elasticity and disposed on the upper plate; an elastic membrane body disposed on the lower plate; a vacuuming unit configured to vacuum inside of the chamber; and a compressing unit configured to bloat the elastic membrane body.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Meiki Seisakusho
    Inventors: Tomoaki Hirose, Takayuki Yamamoto
  • Patent number: 9005385
    Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: April 14, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Norio Wada, Goro Furutani, Satoshi Ookawa
  • Patent number: 8978730
    Abstract: A portable laminator designed primarily for home use where the laminator includes a handle for carrying which may also act as a guide for articles being fed into the laminator. In alternate embodiments, the laminator includes a cover which may first position acts as a guide for material being fed into the laminator and in a second position acts as a cover for the laminators feed slot. In additional embodiments, the laminator includes a double walled housing to provide insulation from the heating elements.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: March 17, 2015
    Assignee: Fellowes, Inc.
    Inventors: Tai Hoon Kim Matlin, Jean Ellen Kiple, David John McCutcheon, Jimmy-Quang Viet Doan
  • Publication number: 20150064600
    Abstract: The present invention relates to a fuel cell assembly and method of manufacturing same, and a bonding part manufacturing method and device. For instance, in a resin frame, a depression part is subsidence formed from a lower-end face toward an upper-end face, and a housing hole is pass-through formed from a top surface of the depression part toward the upper-end face. For instance, the depression part, a cathode-side electrode and an electrolyte film are housed, and in such a circumstance, an anode-side electrode is housed in the housing hole. A portion of the resin frame permeates a gas diffusion layer which configures the anode-side electrode and is a porous body. Via the permeated site, the resin frame and the gas diffusion layer (anode-side electrode) are integrally bonded.
    Type: Application
    Filed: October 29, 2012
    Publication date: March 5, 2015
    Inventors: Masayuki Katsuno, Ryugo Fujitsuka, Kenji Takenaka, Gen Okiyama, Ryo Uozumi
  • Patent number: 8967222
    Abstract: Convey means for pitch-feeding the semiconductor cell to which the conductive tapes have been attached, lead wire processing means for forming-processing the lead wire, provisional pressure-bonding means which is provided at a part opposed to the semiconductor cell that is pitch-fed, holds the lead wires which are forming-processed, repeats provisional pressure-bonding of the lead wires to the conductive tapes provided on the upper surface and lower surface of the semiconductor cell that is pitch-fed, and alternately connects the upper surfaces and lower surfaces of the neighboring semiconductor cells, and main pressure-bonding means which is disposed on a downstream side of the provisional pressure-bonding means in a direction of conveyance of the semiconductor cell, and which mainly pressure-bonds, simultaneously, the paired upper and lower lead wires which have been provisionally pressure-bonded to the upper surface and lower surface of the semiconductor cell.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 3, 2015
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Mitsuhito Abe, Tomoyoshi Kawasaki
  • Publication number: 20150050778
    Abstract: Disclosed is a method for producing a semiconductor device in which solder joints are made between a semiconductor chip with bumps and a substrate with electrodes corresponding to the bumps through a thermosetting adhesive layer, the method including the successive steps of: (A) forming a thermosetting adhesive layer in advance on a surface including bumps of the semiconductor chip; (B) laying a surface on the thermosetting adhesive layer side of the semiconductor chip, on which the thermosetting adhesive layer is formed, and a substrate one upon another, followed by pre-bonding using a heat tool to obtain a pre-bonded laminate; and (C) interposing a protective film having a thermal conductivity of 100 W/mK or more between the heat tool and a surface on the semiconductor chip side of the pre-bonded laminate, melting a solder between the semiconductor chips and the substrate and simultaneously curing the thermosetting adhesive layer using the heat tool.
    Type: Application
    Filed: February 20, 2013
    Publication date: February 19, 2015
    Inventors: Noboru Asahi, Toshihisa Nonaka, Shoichi Niizeki
  • Patent number: 8951618
    Abstract: A hollow panel including a hollow central board or body and two external sheets forming a sandwich, the central body being made of wood fiber and glues and made in a mold, the mold having an uneven surface with oblique walls and truncated vertices where, the external sheets, made form the same material as the central body, are joined using the same glues, and the mold has a fixed peripheral frame, a thrust platform and a heating plate with a serrated plate to which another, similar plate is brought close such that the two serrated plates constitutes the mold, where the latter plate is rigidly secured to the upper hot plate of the press for forming the central board or body, and the teeth of the two plates are offset in a staggered pattern, and do not meet, to form the uneven surface with the desired thickness.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: February 10, 2015
    Inventor: Manuel López Sánchez
  • Publication number: 20150034250
    Abstract: The present invention is to provide a laminating apparatus which significantly improves the laminating efficiency of a workpiece such as a photovoltaic module. In order to significantly improve the laminating efficiency of a workpiece such as a photovoltaic module, at least one sub-laminating apparatus is disposed subsequent to a main laminating apparatus, a hot plate of the main laminating apparatus is formed in such a way that a heat-supplying section thereof configured to supply heat to the workpiece on the hot plate is made of a material having a thermal conductivity of not less than 110 (Wm?1K?1) and not more than 398 (Wm?1K?1), and a hot plate of the sub-laminating apparatus is formed in such a way that a heat-supplying section thereof configured to supply heat to the workpiece on the hot plate is made of a material having a thermal conductivity of not more than 20 (Wm?1K?1).
    Type: Application
    Filed: March 28, 2013
    Publication date: February 5, 2015
    Inventors: Toshihiro Masuda, Tadashi Nakao
  • Patent number: 8936061
    Abstract: A machine for forming foam cushions comprises a web of film comprising a pair of film panels positioned face to face and having first and second lengthwise edges, and first and second foam dispensing assemblies positioned to dispense foam between the film panels, each foam dispensing assembly comprising first and second valves that dispense first and second foam components, respectively, the valves positioned so that respective foam component streams exiting the valves intersect.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: January 20, 2015
    Assignee: Storopack, Inc.
    Inventors: Kurt William Allen, Raymond Cherfane, Jean-Marc Slovencik, Thomas George Eckel
  • Publication number: 20150007412
    Abstract: Apparatus and methods are disclosed for bonding first and second grommet portions positioned on opposite sides of a sheet by means of localized heat and pressure applied to the first and second grommet portions. Heat and pressure may be applied by first and second pedestals positioned facing the first and second grommet portions. A registration post may secure to the first pedestal and extend through apertures in the grommet portions and sheet. The second pedestal may define an aperture for receiving the registration post. The registration post may be resiliently mounted to the first pedestal and be depressible into the first pedestal. The first and second grommet portions may have a lower melting temperature than the sheet and may bond to one another through an aperture defined by the sheet.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 8, 2015
    Inventors: Eric P. Neuron, Kevin W. Dee, Michael C. Bui
  • Patent number: 8925608
    Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: January 6, 2015
    Assignee: Besi Switzerland AG
    Inventor: Andreas Mayr
  • Publication number: 20140374248
    Abstract: A method for the dry production of a membrane-electrode unit includes assembling a layered configuration including a centrally positioned membrane produced by extrusion and pre-dried at a temperature between 80° C. and 100° C. for 15 min to 30 min, a substrate-electrode unit on each side of the membrane having an electrode layer applied to a substrate, an optional frame around each substrate-electrode unit for fixing the substrate-electrode unit, and two separating films on outer sides. The configuration is pressed together between two laminating rollers so that a pressure connection is produced at least between the membrane and the electrode layers. A short production time is achieved because it is not necessary to keep the membrane moist at high temperatures under pressure. A membrane electrode unit and a roller configuration are also provided.
    Type: Application
    Filed: August 16, 2012
    Publication date: December 25, 2014
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Armin Datz, Klaus Dennerlein, Carola Kuehn, Andreas Reiner, Werner Straub
  • Publication number: 20140373996
    Abstract: A film sticking device includes a pressing part configured to press a film by contacting a surface of the film and pressing the film. A supporting part is coupled to the pressing part and supports the pressing part. A guiding part is configured to guide the supporting part and move the supporting part between a first position and a second position. The second position is separated from the first position. A body has one end coupled to the guiding part. The supporting part is positioned at the first position when a center part of the pressing part contacts the surface of the film.
    Type: Application
    Filed: November 4, 2013
    Publication date: December 25, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventor: DONG-SUL KIM
  • Publication number: 20140374017
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Application
    Filed: January 23, 2013
    Publication date: December 25, 2014
    Inventors: Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Takahiro Setaka, Shingo Ishida
  • Patent number: 8915278
    Abstract: A press apparatus for curing adhesive on inner adhesion surfaces of substantially continuous wood products (1) under synchronous compression heating. The apparatus includes at least two presses (2) having a mutual distance from each other fulfilling the precondition: L/(n?1), where L is the working length of each press and n is the number of presses in series.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: December 23, 2014
    Assignee: Raute Oyj
    Inventor: Hannu Sinko
  • Publication number: 20140345806
    Abstract: A device (20) for bonding or welding a membrane, including an undercarriage (30) for supporting the device on the membrane at least at one contact point, which is formed by a pressing element (40) for pressing the membrane onto a metal plate to be bonded or welded thereto, and at least at two further contact points, which are formed by castors (31, 32). A frame (42) extends upwards from the undercarriage (30), wherein the device (20) can be manoeuvred using the frame. The pressing element (40) includes a heating device (46), which is designed as an induction coil, by which the metal plate, which is provided with an adhesive or weldable coating, can be heated. An induction generator and a control and cooling device thereof are mounted in or on a housing (50), which is fixed to the frame (42) at a distance (A) above the undercarriage (30). The device (20), which is formed as one part, can be tilted for moving around a castor axis (28) and can then be lowered via the metal plate onto the membrane.
    Type: Application
    Filed: February 6, 2013
    Publication date: November 27, 2014
    Inventors: Daniel Gasser, Sven Sieber, Sonja Oesch
  • Patent number: 8894788
    Abstract: A method for producing a decorative element includes the steps of: (a) preparing a thermoplastic polyurethane (abbreviated TPU) film, at least one ornament, and a releasing film coated with a glue layer on a plane thereof; (b) disposing the plane of the releasing film coated with the glue layer facing the ornament; (c) arranging the ornament located between the TPU film and the releasing film to form a stacked array; and (d) hot pressing the stacked array.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: November 25, 2014
    Assignee: Jah Yih Enterprise Co., Ltd.
    Inventor: Chi-Shih Lee
  • Patent number: 8888945
    Abstract: The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: November 18, 2014
    Assignee: The Procter & Gamble Company
    Inventors: Gavin John Broad, Adal Tecleab, Jason Lee DeBruler
  • Publication number: 20140326411
    Abstract: A welding device includes a compressor configured to compress a welding part and its adjoining surfaces of thermoplastic resin articles (2a, 2b) in directions perpendicular to the axis of a core (1), and a heater, and is configured such that: the surface of the welding part of the thermoplastic resin articles is compressed with a predetermined pressure by the compressor, the compression of the thermoplastic resin articles is then continued to extend a compressed region along the axis of the core without changing a relative position between the compressor in the compressed region and the surface of the welding part of the thermoplastic resin articles, the welding part of the thermoplastic resin articles is heated and welded by the heater, and after the welding, the pressure applied by the compressor is lowered to stop the compression of the thermoplastic resin articles such that the thermoplastic resin articles fitted on the core can be taken out of the welding device.
    Type: Application
    Filed: February 13, 2013
    Publication date: November 6, 2014
    Inventor: Tadahiro Konita
  • Publication number: 20140326389
    Abstract: A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: Steven Donald Blanchard, Aydin Akdeniz, John Spalding, David M. Anderson, Michael W. Evens
  • Publication number: 20140326415
    Abstract: The invention relates to a roll device (300) that comprises: a roll (100) removably connectable to a support structure (200); —a heating element (7) seated within the roll (100); an electrical connector for supplying the heating element (7). The roll device is characterised in that the connector comprises: —a first contact (12) arranged in a bottom wall (8) of the roll (100); —a second contact (13) arranged in the support structure (200) and adapted for engaging the first contact (12) in pressing contact, wherein one between the first (12) and the second (13) contact is movable between a retracted position and a position extended towards the other contact and permanently stressed in the extended position.
    Type: Application
    Filed: November 30, 2011
    Publication date: November 6, 2014
    Applicant: AUTOMATIC LAMINATION TECHNOLOGIES S.r.l.
    Inventors: Dario Tamborini, Osvaldo Novello
  • Publication number: 20140326404
    Abstract: Provided are a laminating apparatus and a laminating method using the same. In an aspect, the laminating apparatus includes a stage, a heating bar, and a press part. In an aspect, the laminating may be performed in a state where the donor film is closely attached to the substrate to prevent defects of the donor film from occurring during the laminating, thereby improving reliability of the laminating apparatus.
    Type: Application
    Filed: September 6, 2013
    Publication date: November 6, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventor: Tae Min Kang
  • Publication number: 20140329341
    Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.
    Type: Application
    Filed: April 17, 2014
    Publication date: November 6, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Goro Furutani, Norio Wada, Satoshi Ookawa
  • Publication number: 20140318683
    Abstract: A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
    Type: Application
    Filed: July 14, 2014
    Publication date: October 30, 2014
    Inventors: HALE JOHNSON, GREGORY GEORGE, MICHAEL BRENNEN
  • Publication number: 20140305596
    Abstract: An apparatus for manufacturing fuel cell stack components integrally bond gas diffusion layers to both surfaces of a membrane-electrode assembly (MEA) basic material in which a membrane-electrode assembly has sub gaskets. The apparatus includes a frame, an upper die disposed on the frame to be movable in a vertical direction, and a lower die disposed on the frame, and configured to support the MEA basic material and the gas diffusion layers at a lower side of the upper die. Bonders are installed at each of the upper die and the lower die and configured to compress the MEA basic material and the gas diffusion layers at a high temperature and a high pressure. Steam injectors are disposed at the bonders and configured to inject steam to the MEA basic material and the gas diffusion layers. An ultra-pure water storage tank configured to stores ultra-pure water for generating the steam by the bonders and supplies the ultra-pure water to the bonders.
    Type: Application
    Filed: December 16, 2013
    Publication date: October 16, 2014
    Applicant: HYUNDAI MOTOR COMPANY
    Inventor: Sang Yeoul AHN
  • Patent number: 8851135
    Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: October 7, 2014
    Assignee: NIKE, Inc.
    Inventors: N. Scot Hull, Elizabeth Langvin
  • Patent number: 8851138
    Abstract: A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: October 7, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroki Maruo, Koji Motomura, Hideki Eifuku, Tadahiko Sakai
  • Publication number: 20140290869
    Abstract: A hot pressing apparatus includes a positioning template having a forming region for placing a workpiece, a hot pressing template, a plurality of positioning blocks, and a lifting mechanism. A plurality of holes is formed in the forming region along a periphery of the forming region. The positioning blocks are movably disposed outside the forming region along the periphery of the forming region for positioning the workpiece in the forming region. The hot pressing template is movable between a hot pressing position and a releasing position for hot pressing the workpiece located in the forming region cooperatively with the positioning template when moving to the hot pressing position. The lifting mechanism includes a plurality of pillars movably disposed in the holes respectively and a driving device for driving each pillar to extend out from the corresponding hole so as to lift the workpiece.
    Type: Application
    Filed: May 15, 2013
    Publication date: October 2, 2014
    Applicant: Wistron Corporation
    Inventor: Dong-Dong Fu
  • Patent number: 8840745
    Abstract: A method of printing foil images upon textiles is provided. Advantageously, a digital inkjet printer can be utilized to apply an adhesive for affixing a foil embellishment. The method of printing foil images upon textiles includes applying a pretreatment solution upon a textile. After the pretreatment solution has dried, a white underbase in the form of a fanciful design is printed upon the textile using a digital inkjet printer. A heavy color layer of color ink is then digitally inkjet printed upon the white underbase. Thereafter, the textile is removed from the inkjet printer and positioned upon a heat press table. Foil transfer paper is positioned upon the textile so as to cover the white underbase and heavy color layer. The heat press is activated so as to adhere the foil, but only to those regions where the white underbase and color ink has been printed. Once cool to the touch, the foil is slowly peeled from the textile so as to leave a fanciful foil design.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: September 23, 2014
    Inventor: Paul Green
  • Publication number: 20140262005
    Abstract: The invention relates to a method and an apparatus at least for partially laminating a component (1), in particular of a motor vehicle, having a film (2) which is cut to a width which is selected to be slightly greater than a region (1.1) to be laminated of the component (1), wherein the film (2) is heated on both sides and is arranged in an upper die (4), wherein the component (1) is provided with an adhesive (6) and is arranged in a lower die (5), wherein the adhesive (8) is heated to be activated and a tool formed by the upper die (4) and the lower die (5) is closed for a pressing operation.
    Type: Application
    Filed: August 16, 2012
    Publication date: September 18, 2014
    Applicant: JOHNSON CONTROLS INTERIORS GMBH & CO. KG
    Inventors: Etem Ibrahim Uysal, Werner Klusmeier
  • Publication number: 20140262050
    Abstract: A package bag sealing machine includes a first clamping unit and a second clamping unit respectively connected to a first bracket and a second bracket and movable relative to each other to clamp a package bag therebetween, a first sealing unit, a second sealing unit connected to the second bracket, and a first drive connecting the first sealing unit to the first bracket and controllable to move the first sealing unit toward the second sealing unit for sealing a package bag between the first sealing unit and the second sealing unit. After the first clamping unit and the second clamping unit clamp the package bag to be sealed, they are immovable, preventing stretching the package bag during the sealing operation and increasing the packaging yield.
    Type: Application
    Filed: August 26, 2013
    Publication date: September 18, 2014
    Applicant: CHAN LI MACHINERY CO., LTD.
    Inventor: CHI PIN HSU
  • Publication number: 20140224422
    Abstract: A system and a method for applying a heat transfer label to a substrate to minimize dye migration are provided. The system and the method are configured such that a substrate is arranged between a heated plate and the label, such that heat is applied through the substrate.
    Type: Application
    Filed: December 30, 2013
    Publication date: August 14, 2014
    Applicant: Illinois Tool Works Inc.
    Inventors: Joseph A. Tetrault, James E. Moore
  • Patent number: 8794294
    Abstract: The invention relates to an insulated container for hot drinks or the like comprising an inner cup having a generally frusto-conical cup body and a generally frusto-conical outer shell. The cup is seated within the shell so that a contact path is disposed near the upper edge of the shell, along which contact path the outer surface of the cup body and inner surface of the shell are in contact. At least one bonding spot and/or bonding area for bonding said shell to said cup body is locally formed within said contact path.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: August 5, 2014
    Assignee: Seda S.p.A.
    Inventor: Gianfranco D'Amato
  • Patent number: 8794287
    Abstract: Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit (101U) and a lower unit (101L), and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. The wafer bonding apparatus is provided with a top plate (111), a pressure profile control module (131), and a heater section arranged between the top plate and the pressure profile control module for heating. Shape change generated on the surface of the pressure profile control module causes change of the surface of the top plate.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: August 5, 2014
    Assignee: Nikon Corporation
    Inventor: Shigeto Izumi