Abstract: A press is described having an upper platen. The press includes a support arm adapted to selectively move the upper platen between an open position, a partially open position and a closed position with respect to a lower platen. An electromagnet is disposed proximate the support arm and configured to selectively secure the upper platen in the closed position. Another electromagnet, which may be disposed proximate a base member, is configured selectively to secure the upper platen in a partially open position.

Abstract: Embodiments of the invention are used to provide ways of tire tread molding and retreading with a double tread rubber body having a unitary structure that comprises two treads in order to remove the need for buffing an oxide layer typically associated with tread molding and curing. Embodiments of the double tread molding and retreading methods also remove the need for cementing the cured tread to prevent future oxidation buildup. Once the double tread is cured and cooled, it is cut along the centerline with a double tread separation apparatus to expose a soft non-oxidized inner rubber. The cutting is much less energy intensive when compared to buffing with an expendable wire brush. There is no risk of spots of oxidized rubber being missed as is the case with buffing. There is little or no dust created.

Abstract: A laminating apparatus having a thickness-detecting function is provided. Before the laminating operation is done, the thickness of the article to be laminated is detected by a thickness detecting mechanism of the laminating apparatus. According to the detected thickness, the temperature or the rotating speed of the heating roller of the laminating apparatus is dynamically adjusted.

Abstract: A focus ring surrounds an outer periphery of a substrate mounted on a mounting table having a temperature control mechanism and includes a contact surface which comes into contact with the mounting table and a heat transfer sheet formed on the contact surface. The heat transfer sheet contains an organic material and a heat transfer material mixed with the organic material, and has a film thickness larger than or equal to about 40 ?m and smaller than about 100 ?m.

Abstract: The present disclosure is directed generally towards systems and methods for manufacturing composite wood products. In some embodiments, the method includes performing an initial manufacturing step and performing a subsequent manufacturing step before residual heat from the initial manufacturing step completely dissipates. The initial manufacturing step includes combining veneers with an adhesive and heating and consolidating the veneers to form a core laminate. The one or more subsequent manufacturing steps each include applying one or more layers to the core laminate. The one or more layers each include a veneer component and an adhesive component. The core laminate and the one or more layers are sequentially heated and pressed to form a composite wood product. The disclosure also relates to systems for manufacturing composite wood products.

Abstract: A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.

Abstract: Two press cylinders are disposed at an equal interval at left and right having the opening-closing cylinder therebetween, so as to have the approximately same distance from the conveying reference plane as the opening-closing cylinder. The opening-closing cylinder comprises an opening-closing linear encoder, which detects a decreased amount of the entire thickness of the object-to-be-processed as a displacement of the ram, when the object-to-be-processed is hot-pressed. The respective press cylinders comprise pressure sensors for press cylinders detecting pressing pressures of the pressing plates as cylinder inner pressures.

Abstract: The invention relates to top seal driver assembly for sealing the top opening of a pouch comprising Motor means for driving a rocker bar mounted on a central drive shaft, the rocker bar being connected on opposite ends to an outer seal rod drive bar and to an inner seal rod drive bar, the outer seal rod drive bar being connected to outer seal drive rods, and the inner seal rod drive bar being connected to inner seal drive rods, the outer and inner seal drive rods being supported in a box frame with bearing means, wherein outside dovetail bars are mounted to the outer seal drive rod and inner dovetail bars are mounted to the inner seal drive rod, wherein seal bar assemblies are mounted to the dovetail bars, wherein the box frame contains the central drive shaft, the rocker bar, the outer and inner seal rod drive bars and the outer and inner seal drive rods.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations.

Abstract: A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually, even when, for example, the size or material of the boards changes. Also, A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually or jointly without adjusting the pressing positions of the press cylinders, even when, for example, the size or material of the boards changes, and further, being able to adapt to change of the material of the boards or the like.

Abstract: The present invention relates to a hot pressing tool and a hot pressing apparatus having the same. According to the present invention, a hot pressing head attaching an anisotropic conductive film (ACF) on a liquid crystal display (LCD) substrate and a heater block supplying heat to the hot pressing head have the same thermal expansion coefficient, and the heater block is provided with a hot pressing tool connected to a moving block by connection units. Also, there is provided a hot pressing apparatus, including the hot pressing tool, which is provided with a support capable of attaching the LCD substrate on the ACF and a transfer instrument. Thus, according to the present invention, the operation can continue with almost no deterioration of the oblateness of the hot pressing head. Also, since the hot pressing apparatus has the structure of connecting the heater block and the hot pressing head together simply by the combination bolts with no need for adjustment bolts, it can be easily manufactured.

Abstract: The present invention is related to a shock-absorbing packing material inflated with air and to an apparatus for manufacturing the shock-absorbing packing material. As polystyrene plastic typically used for a shock-absorbing material becomes difficult to use because of environmental pollution, a shock-absorbing means that are formed by compiling plastic films or sheets, bonding them using heat or high frequency waves, and then inflating it by injecting air between the films are often used. However, it was difficult to develop an apparatus for manufacturing these shock-absorbing means with substantially high economical efficiency. Accordingly, the invention provides an apparatus for manufacturing a shock-absorbing material with economical efficiency, and enhanced productivity without looseness or extension, as the plastic sheet or films rolled on a plurality of rolls are bonded by heat at a constant interval while unrolling them.

Abstract: A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.

Abstract: It is intended to provide a method of producing thermally fused synthetic resin members for medical use which makes it possible that, in the case of thermally fusing synthetic resin members for medical use, for example, a relatively soft thermoplastic tube constituting an AVF needle with another part being harder than the tube such as a needle base (hub) of a wing needle, or a part provided with a fitting connector being harder than the tube (for example, a blood circuit, an extension tube, an infusion set or the like), the connecting parts of the thermoplastic tube member and the other member harder than the thermoplastic tube member can be quickly and uniformly thermal-fused and the production process can be automatically and continuously performed while keeping a high productivity; and a production apparatus therefor.

Abstract: Device (1) for applying a strip (B) of a viscoelastic material to a receiving surface (S) in relative motion (R) with respect to the device, comprising a feed means and an application nozzle (1) at the end of which there is an outlet orifice (10). The outlet orifice comprises a front lip (11) and a rear lip (12). The rear lip (12) is connected to an applicator flap (2) by an elastic articulated joint (3) so that the applicator flap (2) applies pressure pressing the strip (B) onto the surface (S) when the device (1) is functioning.

Abstract: A substrate bonding apparatus comprises a platen and a press. The press is movable relative to the platen for pressing at least one substrate stack between the press and platen. In one embodiment, a consumable compliant member is disposed between the press and the platen. In another embodiment, the apparatus further comprises a substrate carrier adapted for holding and carrying more than one substrate stack in and out of the apparatus. A method for bonding substrates is also described.

Abstract: This invention relates to a novel thermoplastic profile roofing strip and an apparatus for welding the thermoplastic profile roofing strip to a thermoplastic roofing membrane.

Abstract: The Invention relates to a device for the production of a component from at least one first layer (1) and a second layer (2) with clamping frame elements (21,22), moving relatively towards each other to fix the layers in a given manner during the forming process outside the form range of the tool and a cutting device (300) arranged on the first clamping frame element, for cutting a projection of the second layer extending between the first and the second tool piece and method for carrying out the cutting process.

Abstract: A press is described having an upper platen and a lower platen. A support is adapted to close the upper platen with the lower platen by applying a force therebetween. A sensor is adapted to detect the force and a display is in communication with the sensor.

Abstract: A manufacturing method of a three-dimensional structure includes (a) placing a second porous sheet on top of a first porous sheet that has a predetermined external shape and at least part of which contains a first functional liquid, (b) bonding at least a range surrounded by a predetermined shape of the second porous sheet onto the first porous sheet, (c) processing the second porous sheet in the predetermined shape, and (d) after step (b), causing a second functional liquid to be contained in at least part of the range of the second porous sheet so that the first functional liquid and the second functional liquid are brought into contact through the first porous sheet and the second porous sheet.

Abstract: An apparatus for laminating a glass sheet assembly includes a first glass sheet arranged in an opposing parallel configuration with respect to a second glass sheet, with a heat sensitive layer of adhesive laminating film disposed between the first glass sheet and the second glass sheet, the glass sheet assembly having a leading edge and a trailing edge and being of a fixed length and width, the laminating film having a bonding temperature at which melting of the laminating film is initiated.

Abstract: A seaming system for forming a seam is disclosed, wherein the seam consists of at least two opposed sections of high-modulus, high-tenacity, low-elongation fabric sections joined by a tape. The system comprises a seamer head, and a seamer base that includes a topography configured to impart a predetermined pressure gradient to the adhesive layer, tape, and fabric sections of the seam. The resultant seam has a cross-section or thickness profile that generally corresponds to that of the applied pressure gradient. As such, the constructed seam more efficiently distributes stress imparted from any applied load.

Abstract: The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.

Abstract: An adhering apparatus having a pressurizing tool including a plurality of pressurizing surfaces and rotatably mounted on a base member, a supply reel which supplies a release tape adhered to an adhesive tape along the pressurizing surfaces of a periphery of the pressurizing tool, a cutter which is disposed to face one of the pressurizing surfaces and cuts only the adhesive tape into a predetermined length, and a backup tool supporting a lower surface of the substrate and disposed to face a pressurizing surface located downstream from the pressurizing surface facing the cutter. When the base member is driven downward in the vertical direction, the pressurizing surface facing the backup tool adheres the adhesive tape to the upper surface of the substrate.

Abstract: An efficient lamination presses can rapidly heat and precisely control the temperature of a laminate assembly to create final products with excellent structural and aesthetic properties. Specifically, an efficient lamination press can include a radiant heating assembly. The radiant heating assemblies can uniformly heat one or more platens using radiation. The platens in turn can comprise material having a high thermal conductivity, which can allow them to quickly transfer heat to a laminate assembly. The platens can further comprise one or more fluid channels that enable rapid cooling. The rapid heating and cooling capability can enable fast processing times for laminate panels at much lower energy levels than with conventional presses.

Abstract: The present invention realizes an automated system which automatically performs all processes including an inputting process, a bonding process, and a punching process using a robot in manufacturing an integrated part of an MEA and GDLs. Accordingly, with the automated system, it is possible to improve productivity and ensure consistent product quality.

Abstract: A hand-held electric sealer with a detachable sealing module includes a casing, a sealing module, and a press bar. The casing includes, among others, a front contact holder which is provided with an engagement hole. The sealing module includes, among others, a lower cover from underside of which extended an engagement piece. The engagement piece of the sealing module can be engaged with the engagement hole of the casing, such that the sealing module can be conveniently attached to, or detached from, the casing, and that replacement of a damaged sealing module can be readily achieved. In addition, for the sealing module dual heating wires may also be employed so as to obtain a desirable sealing effect to plastic bags.

Abstract: A method for applying a heat activated transfer adhesive includes preheating a first part for bonding to a second part using a heat activated transfer adhesive form removably adhered to a liner, picking up the heat activated transfer adhesive form using the first part by pressing the preheated first part against the heat activated transfer adhesive form to adhere the heat activated transfer adhesive form to the first part, removing the liner from the heat activated transfer adhesive form adhered to the first part, heating the heat activated transfer adhesive form adhered to the first part, and pressing the heated heat activated transfer adhesive form on the first part against a second part to bond the first part to the second part.

Abstract: A method and a device to be used in the process of manufacturing plates, such as fiberboards or the like boards, where the raw material in form of biomass particles, such as wood fibers or the like, applied with a thermosetting binder is spread onto a forming belt to form a mat, and where said mat by means of a hot press is compressed into the desired thickness of the finished plate and the thermosetting binder is hardened. According to the invention the thermosetting binder is applied to the dried biomass particles in an airborne process, where the intense and homogeneous contact of the biomass particles and the droplets of fluent binder are facilitated by the use of ultrasound generated by the use of compressed air, water steam or another gas.

Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: A present embodiment provides a method of fabricating a semiconductor device includes tentatively compressing a second electrode formed on a second semiconductor chip in a substrate to a first electrode on a first semiconductor chip, at least one of the first electrode and the second electrode being constituted with a metal protrusion, and fixedly compressing between the first electrode and the second electrode.

Abstract: Apparatus and method for applying thermal energy to a sealing member. Electrical current is applied to a heating assembly to generate thermal energy, and a heat conductor transfers the generated thermal energy to a seal member adjacent a housing. The heating assembly is configured to substantially prevent a magnetic field generated by the applied electrical current from extending to the housing.

Abstract: A laminating arrangement includes a laminating roller and a radiating element to radiate energy therefrom. A reflector has a main body and is configured so that energy radiated from the radiating element is reflected and concentrated to exit the reflector in a direction towards the laminating roller. A thermal connector has first and second ends, the first end being in thermal contact with the main body of the reflector. When the radiating element is switched on, and the temperature of the second end of the thermal connector and the temperature of the surface of the laminating roller are approximately equal and below an optimal laminating temperature, the temperature of the second end of the thermal connector rises at substantially the same rate as the surface of the laminating roller. A thermometer is positioned to measure the temperature of the thermal connector at or near the second end.

Abstract: Apparatus for bonding rubber O-Rings from cord stock, rubber extrusions and extruded tubing materials, consists of heated die-sets, holding fixtures, electronic module, assembly device, spring clamping and pneumatic clamping arrangement. The combined heated die-set and holding fixture are two separable heat conductive blocks having a common interface. Apertures are located across the interface having diameters or matching shapes of extrusions, these apertures are slightly less than the cord or extrusion dimensions, the rubber is axially mated in the open heated aperture, and will stay unlovable when the clamping device is closed. The electronic module controls both a heating and timing device for proper control of maintaining a constant temperature and accurate timing cycle.

Abstract: A laminating apparatus is composed of a thermo compression bonding section, a first bobbin holder and a second bobbin holder. The thermo compression bonding section pulls a laminating film having a member for forming a protective film out from a roll of the laminating film, which is wrapped around a core bobbin in a cylindrical shape, and overlaps the protective film on one surface of a card and thermally compresses the protective film against the one surface of the card so as to be bonded.

Abstract: A method of manufacturing a blank made from thermoplastic composite material, in which a pressure and temperature cycle is applied by pressing on top of a compacting plate that is itself on top of a stack of fibers including continuous fibers pre-impregnated with a thermoplastic resin, which stack has been previously placed on a board with the film enveloping the stack being brought into contact with fixing blocks arranged at the periphery of the board, and by heating the stack so as to reach at least the melting temperature of the resin while leaving the film infusible and smooth, and allowing the gas(es) present in the stack to escape through at least one opening left in the enveloping film and then through at least one emerging channel formed in the compacting plate and/or in the board and/or in the fixing blocks.

Abstract: A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.

Abstract: An exemplary hot-melting method includes the following steps. A hot-melting machine (20) is provided. The hot-melting machine includes a rotatable worktable (23), a heater (25), at least one cooler (26), and a plurality of carriers located on the worktable and being uniformly spaced apart. A first workpiece loaded on a first one of the carriers is cooled using the at least one cooler. Simultaneously, a second workpiece loaded on a second one of the carriers is heated using the heater.

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract: A tool for pressing a multilayer press packet, particularly for placing inside a press, preferably for inserting into the insertion opening of a multiplaten press. The multilayer press packet, in particular, has a number of multilayers that are separated from one another by at least one separating plate. The tool can be electrically heated. The tool forms a cohesive unit with a heating element arranged between two heat transfer plates and/or between a heat transfer plate and a cover plate. The tools have at least one electric connecting terminal corresponding to contact terminals on the press.

Abstract: A laminator assembly comprising a pair of rollers, the rollers defining a compression zone therebetween for compressing a substantially flat lamination pouch as the pouch is fed between the rollers and advanced through the compression zone for exit on the exit side of the rollers, a heat source being provided for heating the lamination pouch as the lamination pouch is compressed between the rollers, the laminator assembly further comprising two sets of blade members positioned on the exit side of the rollers and spaced from the compression-plane of the rollers, each set of blade members being arranged axially along a respective roller and in close proximity to the exterior surface of the respective roller for preventing the lamination pouch from passing between the roller and respective blade members.

Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: An apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets positioned closely before and after a junction portion are to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.

Abstract: A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed.

Abstract: A hand-held electric sealer with dual heads includes a seat, a sealing module, a press cover, a supporting casing, and a battery cover. The seat has a central engaging rod and a first replacement element. The sealing module can be attached to, or detached from, the seat. The press cover includes a central engaging piece, a heat insulation block, and a second replacement element. Through engagement of the central engaging piece with the central engaging rod, the press cover can be selectively swung to press the heat insulation block against the sealing module, or to press the second replacement element against the first replacement element. The first replacement element and the second replacement element can be substituted with an appropriate module element upon demand on various functions.

Abstract: A device forms a radial flange on a bottom opening of a conate member having a longitudinal axis. The device has a die for receiving the conate member with the bottom opening extending from an open end of the die, a seal-forming cone having at least two radially-extendable sections and being removably located in the open end of the die, inside the conate member, and a handle, axially movable in the cone to extend the movable sections.

Abstract: A laminating apparatus includes a roller, an electro-heating shaft, a power transmitting and resilient member and a power transmitting and securing member. The roller is in contact with a thin film, moves through the thin film to heat and laminate the thin film to a sheet material. The electro-heating shaft is wrapped by the roller, transforms electric energy into thermal energy to heat the thin film, and drives rotation of the roller to move through the thin film. The power transmitting and resilient member is in contact with an axial end surface of the electro-heating shaft in an axial direction of the electro-heating shaft for transmitting electricity from a power source to the electro-heating shaft. The power transmitting and securing member is coupled to the electro-heating shaft for compressing the power transmitting and resilient member therebetween, thereby continuously transmitting the electricity from the power source to the electro-heating shaft via the power transmitting and securing member.