Abstract: The invention comprises separating the strippings of a strip of paper and of a precut prepreg into strippings to be discarded and blanks to be kept using a suction roller that is tangent to the strip along an action line. In a downstream position, a device collects the blanks on said rectilinear path, and a device closer to the roller discharges the strippings. The paper runs through the device along said rectilinear path while maintaining the blanks thereon, and a strip temporary diversion device, capable of orthogonal movement relative to the strip, temporarily diverts the strip and brings it closer to the roller in order to facilitate the initial peeling of the strippings.

Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.

Abstract: A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

Abstract: A method for fabricating an air-filled cellular structure for use as a resilient cushion. The method includes providing a molding structure including a shelf substantially surrounding a depression, and a platform that fits within the depression and is selectively movable between a plurality of positions relative to the shelf, moving the platform to a preselected position relative to the shelf, wherein the preselected position corresponds to a substantially predetermined amount of air to be contained by the air-filled cellular structure, and using a vacuum device to draw air from within the depression.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: An incorrect label removal system is disclosed for removing unwanted labels from a web of labels in a labeling machine. The incorrect label removal system includes a label peel assembly positioned between two fixed points along the direction of travel of the web of labels. The label peel assembly provides a first orientation in which labels remain on the web as the web passes the label peel assembly, and selectively provides a second orientation in which labels are removed from the web. The label peel assembly provides that a length of the web between the two fixed points is substantially the same when the label peel assembly is in each of the first orientation and the second orientation.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.