Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

Abstract: The present invention relates to a hot melt adhesive composition, comprising based on the total weight of the hot melt adhesive composition: (a) more than 25 weight percent of at least one block copolymer, (b) from about 27 to about 45 weight percent of at least one plasticizer, (c) from about 18 to less than about 55 weight percent of a combination of at least two different resins; and (d) optionally up to 10% weight percent of at least one wax. The hot melt adhesive composition of the invention can be used for bonding bundles of plastic containers such as bottles into packs.

Abstract: A method of manufacturing a liquid crystal display panel includes preparing thin substrates for upper panel and lower panels, and first and second support substrates for the thin substrates, attaching the thin substrate for the upper panel to the first support substrate, and attaching the thin substrate for the lower panel to the second support substrate, forming the upper and lower panels by forming members for the display panel on surfaces of the respective thin substrates in a state where the thin substrates are attached to the first and second support substrates, respectively, bonding the upper and lower panels, and separating the first and second support substrates from the upper and lower panels, where at least one part of a border of a surface of each of the first and second support substrates, where the surface is attached to the upper or lower panel, is tapered.

Abstract: A display having high re-workability, a method for producing the display, and a transparent resin filler, are provided. A transparent resin filler (5), in which a value obtained on multiplying a hardness of an as-cured resin, expressed as Shore E, with a bonding strength, is not greater than 400, is used as a material of a transparent resin layer (4) to be charged between a picture image display panel (2) and a front side panel (3). In case an undesirable situation, such as mixing of foreign matter in the transparent resin layer (4), has occurred, a re-working member may be moved with ease through a space between the picture image display panel (2) and the front side panel (3) to separate picture image display panel (2) and the front side panel (3) from each other.

Abstract: It is an object of the present invention to provide a method that can separate two plates laminated via a pressure-sensitive adhesive sheet, smoothly, efficiently, and accurately without such force (load) that large strain (deformation) leading to breakage or cracking occurs being substantially applied to the plates. The method of separating plates according to the present invention is a method of separating two plates laminated via a double-sided pressure-sensitive adhesive sheet, comprising placing a cutting tool having a cutting edge angle of not more than 25° and a thickness of not more than 20 mm, on a side of a structure composed of a double-sided pressure-sensitive adhesive sheet and two plates, between the double-sided pressure-sensitive adhesive sheet and the plate, and applying force in a normal direction of the plate.

Abstract: A peeling mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a driver, two clamping members coupled to the driver and spaced from each other, and two cutting members respectively coupled to the clamping members oppositely to each other. Each cutting member can include a protruding end extending towards the other cutting member. The protruding end protrudes out of the clamping member. The driver can be configured to move the two clamping members towards each other.

Abstract: Techniques are disclosed for a cutting apparatus that can be used to cut a target layer within a display module, e.g., a liquid crystal display that includes a protective cover glass. The cutting apparatus includes a platform that supports a track. The cutting apparatus also includes a linear slide that is configured to both hold the display module in place and travel along the track, where the movement of the linear slide along the track is driven by a mass that is in free fall. The cutting apparatus further includes a cutting wire, where the cutting wire is positioned relative to the target layer and oscillates to cut the target layer as the linear slide moves along the track. Additional techniques are disclosed and directed toward a method for operating the cutting apparatus described above.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A film stripping mechanism, comprising: a base; a platform disposed on the base and having a substrate to be stripped of film placed thereon; a blade disposed above an upper surface of the platform and capable of contacting the substrate to be stripped of film placed on the platform, the platform and the blade being movable relative to each other so as to strip off a film on the substrate to be stripped of film; an automatic alcohol-spraying module contacting the blade for spraying outwards alcohol and allowing the alcohol to flow toward the substrate to be stripped of film along the blade. The film stripping mechanism can improve the yield rate of film stripping and the stripping efficiency, and reduce breakage rate of the substrates.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.

Abstract: A component supplying apparatus has a tape guide part for guiding a carrier tape, a blade for entering between a top tape and a base tape, a first tape press part for facing the carrier tape on upstream side of a top tape removing position, a first biasing part for biasing the first tape press part to have the carrier tape held between the tape guide part and the first tape press part and to attain positioning of the carrier tape in thickness direction thereof, a sprocket wheel for wedging the carrier tape into between the tape guide part and the first tape press part, and a second biasing part for pressing the carrier tape against the tape guide part by a second tape press part.

Abstract: Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member.

Abstract: An adhesive substance removing tool is provided with a cracking tool and a scrapping assembly which are removably coupled to a base. The cracking tool is used to crack the adhesive substance by forming breaking lines on the surface of the adhesive substance, and then the scrapping assembly is used to scrape off the adhesive substance by starting from the breaking lines. The combination of the cracking tool and the scraping assembly allows the user to remove adhesive substance easily and completely. Besides, the cutting assembly of the cracking tool is able to move freely both in straight-line or circular fashion, and the cracking tool can be prevented from rotating or disengaging once it is positioned in place on the base. Hence, convenience and safety of use can both be assured.

Abstract: The invention discloses a coil for a winding-up device adapted for winding up a cutting wire used for cutting through an adhesive bead of a bonded-on pane, having a coil body for winding up the cutting wire, the coil body being provided with at least one opening for securing one end of the cutting wire.

Abstract: A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

Abstract: A device for removing a thin outer layer from the surface of a cartridge or tubular container such as a caulk cartridge for removal of ink, contaminant, adhesive, or printed or stamped label from the outside of the cartridge. The apparatus includes cartridge hopper and a cartridge handling mandrel or plunger which automatically removes a cartridge from the hopper aligning same for insertion of the cartridge axially through the throat of a spinning ring which contains at least one and preferably a plurality of inwardly extending knifes. The spinning knife distal end trims or peels off the label, adhesive, ink, imperfections, or even a thin film from an outer layer of a selected thickness effectively reconditioning the cartridge for reuse to be filled with virgin material or to be used as uncontaminated re-ground material to be sold as scrap.

Abstract: A separation apparatus according to the present disclosure includes a first holding unit, a cutting unit, a measuring unit and a position adjusting unit. The first holding unit holds a first substrate of a superposed substrate formed by joining the first substrate and a second substrate. The cutting unit cuts a joining portion of the first substrate and the second substrate. The measuring unit measures a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface. The position adjusting unit adjusts a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: An ejection device and a method for lifting a chip (2) from a carrier material (1) having at least one needle (4), wherein the needle (4) includes at least one cutting edge (7) for cutting through the carrier material (1). A mounting device for inserting and fixing at least one needle (4) in an ejection device for lifting a chip from a carrier material, having a plate for aligning the plane of the needle tips and a removable attachment that has a recess, wherein the removable attachment can be mounted on the ejection device in such a way that the recess serves to introduce the fixing material onto the needle ends. A method for fixing the needles in an ejection device is used, wherein the at least one needle to be fixed in the ejection device is melted in.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: A tool and method for removing a film from a surface is provided, wherein the tool can include a frame, a handle operably coupled to the frame, a number of wheels operably coupled to the frame, a cylinder rotatably coupled to the frame, an arm rotatably coupled to the frame, and a number of separating devices operably coupled to the arm. In some embodiments, the wheels can rotate about one or more axes parallel to the surface. The cylinder, which collects the removed film, rotates about an axis that can also be parallel to the surface. The arm can rotate about an axis that can also be parallel to the surface.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: The apparatus and method disclosed is for removing labels from surfaces, especially from pharmaceutical vials. Each vial is brought into a travel path where it is moved forward by a linear driver. The vial is first pushed through a circular array of slitter blades to create a series of longitudinal slits in the label. The vial is next pushed through a circular array of scraper blades that remove the label segments between each pair of slits. The label segment residue is discarded through a vacuum system.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.

Abstract: A method for assisting in the removal of a pressure sensitive label from a slender glass vessel wherein said label is wrapped around the circumference of the vessel and extends along the length of the vessel includes positioning a planar cutting blade at two angles relative to the label, drawing the blade down along the length of the label, cutting the label into two opposite cut edges with one edge adhering to the vessel and the other cut edge being raised slightly away from the circumference of the vessel and forming a space between the two cut edges.

Abstract: A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: A tool and method for removing a film from a surface is provided, wherein the tool can include a frame, a handle operably coupled to the frame, a number of wheels operably coupled to the frame, a cylinder rotatably coupled to the frame, an arm rotatably coupled to the frame, and a number of separating devices operably coupled to the arm. In some embodiments, the wheels can rotate about one or more axes parallel to the surface. The cylinder, which collects the removed film, rotates about an axis that can also be parallel to the surface. The arm can rotate about an axis that can also be parallel to the surface.

Abstract: An improved semi-automatic Label Stripping Machine for detaching labels from a round container is disclosed. The container is placed between a rotatable idler and a rotatable platform. The container is rotated on its central vertical axis by rotating the platform. A plurality of peeler assemblies are brought in contact with the label and are moved down the outside surface of the container there by spirally striping off the label. The apparatus further comprises a guide that provides provide improved safety and a self-cleaning feature.

Abstract: The invention discloses a device for cutting through an adhesive bead of a vehicle pane, in particular a windshield, having a motor-driven winding-up device that comprises a coil for winding up a cutting wire in a working direction for cutting through the adhesive bead, the winding-up device being provided with a strain relief for the cutting wire which allows the cutting wire to be withdrawn from the winding-up device in a sense opposite to the working direction.

Abstract: An IC layers separator includes a bed; two sets of two opposite seats secured onto the bed; two guide bars each interconnecting the two opposite seats of either set; a carrier assembly secured onto the bed and including a lower vacuum device and an upper vacuum device including a ramp at one end; an IC layer assembly including an upper layer and a lower layer; and a blade assembly moveably mounted on the guide bars and including a pressing roller pressing the IC layer assembly on the ramp, a spring biased blade for separating the upper layer from the lower layer, and two opposite rolls for conveying the separated upper layer and the lower layer.

Abstract: A postage label dispensing system for dispensing adhesive-backed labels includes a conveyance system for displacing a supply of label material along a feed path wherein the label material includes a face material having an adhesive backing and a liner material detachably bonded to the adhesive backing. The adhesive backing defines a pair of longitudinal adhesive strips and a non-adhesive region disposed therebetween. The liner material has a longitudinal cut disposed adjacent to, and aligned with, the non-adhesive region to define a pair of liner strips. A peeler plow is disposed downstream of a bending means which induces a bend in the label material along an axis substantially parallel to the longitudinal cut, i.e., in an area corresponding to the non-adhesive region, which bend produces an opening between the face material and the liner strips.

Abstract: A tool and method for removing a film from a surface is provided, wherein the tool can include a frame, a handle operably coupled to the frame, a number of wheels operably coupled to the frame, a cylinder rotatably coupled to the frame, an arm rotatably coupled to the frame, and a number of separating devices operably coupled to the arm. In some embodiments, the wheels can rotate about one or more axes parallel to the surface. The cylinder, which collects the removed film, rotates about an axis that can also be parallel to the surface. The arm can rotate about an axis that can also be parallel to the surface.

Abstract: A device is provided for removal of a layer, such as a label, from a cylindrical surface of an object. The device includes a guide, a cutting instrument, and a base connecting the guide and the cutting instrument. The guide and the cutting instrument are separated by a distance defined by the base, and the cutting instrument is positioned to shave along the object's surface to remove the layer, when the surface of the object is rotated against the cutting instrument and against the guide.

Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.

Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

Abstract: Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with: a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer, the connection release means being made to work in a temperature range from 0 to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.

Abstract: A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.