Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

Abstract: A system for fracturing a plurality of wafer assemblies, one of the wafers of each assembly comprising a plane of weakness and each assembly comprising a peripheral lateral groove comprises: a cradle for keeping the assemblies of the plurality of assemblies spaced apart and parallel to one another, along a storage axis; a separation device for applying separating forces in the peripheral groove of an assembly arranged in a fracture zone of the separating device, the separating force aiming to separate the wafers of the assembly from one another so as to initiate its fracture at the plane of weakness; and a drive device configured to move along the storage axis of the cradle opposite the separating device so as to successively place an assembly of the cradle in the fracture zone of the separation device.

Abstract: A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.

Abstract: Examples include an apparatus for providing a point of attachment to a structural component, the apparatus including: a first grommet comprising: a head; and a shaft that extends from a first side of the head, where the shaft comprises a first attachment component opposite the head; a gasket bonded to a second side of the head that is opposite the first side, where the gasket, the head, and the shaft are aligned and a hole is formed through the gasket, the head, and the shaft; and a second grommet comprising a second attachment component that is configured to engage the first attachment component of the first grommet.

Abstract: An apparatus of separating a flexible panel from a glass substrate is provided. The apparatus includes a console, a movable object fixing table, a position catcher, a lifting platform, and a suction separator. The console respectively drives the movable object fixing table and the lifting platform to move to a first position and a second position according to a real-time position of a fixed object captured by the position catcher, and an adhesive element of the suction separator tightly attaches to the flexible panel of the fixed object, drives the lifting platform to move to a direction away from the movable object fixing table, and drives the movable object fixing table to move to a direction away from the suction separator to separate the flexible panel from the glass substrate of the fixed object and fix the flexible panel on the adhesive element.

Abstract: An apparatus for removing carpet including: a base; a hoist engaged with the base; a resilient line with first and second ends, wherein the first end is engaged with the hoist; a carpet gripping means removably engaged with the second end of the resilient line; and at least one friction surface engaged with a bottom of the base for holding the base in position. Further, a method for removing carpet comprising: the apparatus for removing carpet; moving the apparatus into position; engaging carpet to be removed with the carpet gripping means; and utilizing the hoist and resilient line to pull the carpet gripping means in order to remove the carpet.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: The method for removing a sealing film from a container includes use of a gripping device having a fixed lower jaw and a mobile upper jaw and comprises carrying out following steps: a first gripping step, in which the gripping device clamps the flap of film projecting from a rounded corner of the container; a step of partial detachment, in which the gripping device detaches only a portion of the film which is at the rounded corner; an adjusting step in which the mobile upper jaw is distanced from the fixed lower jaw and the gripping device is moved so as to capture, between the two jaws, a larger surface of film; a second gripping step in which the upper jaw lowers and locks against the lower jaw to grip the surface of film, and a complete detaching step, in which the gripping device performs complete detachment of the film.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.

Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.

Abstract: A method of producing a flat panel display including step 1-step 4, or step 1-step 5, where at least one of the optical elements after step 4 or step 5 can be reused as an optical element in step 1: step 1: adhering two optical elements to each other via an adhesive sheet or a curable resin layer, and applying an autoclave treatment to give an optical laminate step 2: checking the appearance of the optical laminate obtained in step 1 step 3: assembling a flat panel display using the optical laminate that passed the check in step 2 step 4: separating the two optical elements in an optical laminate that was rejected by the check in step 2 by relatively rotating them with a vertical line penetrating the opposing faces thereof as a rotation axis step 5: washing the optical element resulting from step 4.

Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

Abstract: Exfoliation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Abstract: Provided a thin plate glass laminate of a thin plate glass substrate and a support glass substrate, which suppresses inclusion of bubbles and occurrence of convex defects due to foreign matters, from which the thin plate glass substrate and the support glass substrate are easily separated, and which is excellent in heat resistance. A process for producing a display device using the thin plate glass laminate, and a silicone for release paper for the thin plate glass laminate are also provided. A thin plate glass laminate is formed by laminating a thin plate glass substrate and a support glass substrate using a silicone resin layer having releasability and non-adhesive properties.

Abstract: A coating film peeling apparatus for resin material includes: a peeling cylinder, a peeling roll installed therein with a space for a peeling process along an inner wall of the peeling cylinder, a resistance lid disposed to block a discharge port of the peeling cylinder, and a pressure adjustment part for adjusting an outflow rate and internal pressure of the peeling cylinder. The peeling cylinder is constituted by a polygonal-shaped angular columnar body having, as coating film pass-through holes, rows K of small holes and rows L of small holes and projection rings (angular embossments) provided alternately in multiple rows along a direction perpendicular to a rotating direction of the peeling roll.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: A device for separation of a stack in two distinct parts, including a first part, a second part and a zone of weakness between the first and second parts, and an insertion zone located at the periphery of the stack at or close to the zone of weakness, extending over all or part of the periphery of the stack. The device includes at least one separator capable of penetrating into the insertion zone along a penetration distance until coming into contact with the first part of the stack at at least one first contact point located at the periphery of the stack, and coming into contact with the second part of the stack at at least one second contact point located at the periphery of the stack. The device also includes drive means for making the separator penetrate into the insertion zone as far as the penetration distance and for applying a relative movement between the separator and the stack.

Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.

Abstract: A method of detaching two plates adhered via an adhesive sheet or a curable resin layer, comprising moving, relatively parallel to each other, said two plates to develop a shear stress causing rupture of said adhesive sheet or curable resin layer. According to the present invention, two plates bonded via an adhesive sheet or a curable resin layer can be detached by only moving the two plates relatively parallel to each other. Therefore, even when at least one of the two plates is thin and poor in flexibility, two plates can be detached from each other substantially without a force (load) which causes high distortion (deformation) producing a breakage or crack on the plates. Accordingly, for example, when two optical plates adhered via a transparent adhesive sheet need to be re-bonded, two optical plates can be detached from each other and adhered again. Thus, the production cost of equipment with a display function, which carries a flat-panel display, can be reduced.

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

Abstract: An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.

Abstract: A separating device for separating an electronic main body from a substrate bonded thereto comprises a platform, a conveying section, a dissolving section, a cleaning section, and a first partition plate. The conveying section is disposed on the platform for moving the electronic main body and the substrate forward. The dissolving section is disposed on the platform for spraying a solvent onto the bonded electronic main body and substrate. The cleaning section is also disposed on the platform for cleaning the electronic main body. The first partition plate is located between the dissolving section and the cleaning section and has at least one first slot, which allows only the electronic main body but not the substrate to pass therethrough, so that the electronic main body is separated from the substrate at the first partition plate. A method for separating the electronic main body and the substrate is also provided.