Delaminating Bending Means Patents (Class 156/764)
  • Patent number: 11130329
    Abstract: An apparatus is provided for peeling a liner away from a substrate. The apparatus comprises a first member rotatable about an axis. The apparatus also comprises a second member disposed on the first member and for generating a suction force to be applied to the liner to peel a portion of the liner away from the substrate when the suction force of the second member is applied to the liner and the first member is rotating about its axis. The apparatus further comprises a third member synchronized to rotation of the first member about its axis such that the third member clamps the peeled portion of the liner against the first member while the second member is applying suction force to the liner and the first member is rotating about its axis.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: September 28, 2021
    Assignee: The Boeing Company
    Inventors: Carl R. McIver, Brice A. Johnson, Michael R. Anderson
  • Patent number: 10555449
    Abstract: Disclosed is an apparatus for automatically supplying carrier tape, and more specifically, to an apparatus for automatically supplying a carrier tape and a method for automatically supplying carrier tape wherein carrier tape is enabled to be continuously and automatically supplied without stopping a process even if a structure or supply conditions of the carrier tape is changed. The apparatus for automatically supplying the carrier tape comprises an injection module comprising a height adjusting unit for enabling the continuous and automatic supply of one carrier tape in the middle of being supplied and one or more carrier tapes on standby, and a parts sensor for sensing parts of a carrier tape; and a pickup module for separating a cover tape form the carrier tape transferred from the injection module.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: February 4, 2020
    Inventor: Young Soo Hwang
  • Patent number: 9957126
    Abstract: A component supply device provided with a rail which transports a carrier tape, and a movable member which is provided above the rail and moves up and down, in which a gap above the carrier tape which passes a bottom portion of the movable member is blocked by the movable member.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: May 1, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Hiroyasu Ohashi, Hiroki Murase
  • Patent number: 9289970
    Abstract: A film member attached to the outer peripheral surface of a cylindrical plate is fixed by a peeling roller and a clamp of a peeling unit and peeled from the cylindrical plate by moving the peeling unit, and the intervals between each of the peeling units and the outer peripheral surface of the cylindrical plate are same so that the contact portions of the peeling rollers are variable.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: March 22, 2016
    Assignee: LG DISPLAY CO., LTD.
    Inventors: SangHo Seo, SungJin Kim
  • Patent number: 9033020
    Abstract: A labeling device comprising a guide frame, rotatably supporting a label roll formed by winding around a core a label holding band, which releasably holds a plurality of labels in series, and a peeling member which peels the printed label from the band by bending the band at an acute angle towards a slanting lower part in relation to the direction of movement of the band. The labeling device comprises a guide unit that is pivotally provided for nipping and holding a leading edge of the label holding band in front of the peeling member and is rotatable around the peeling member with the leading edge of the band so that the leading edge of the band is automatically brought to a feeding roller arranged on the slanting lower part of the peeling member in relation to the direction of the movement of the label holding band.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: May 19, 2015
    Assignees: Techno Medica Co., Ltd., Autonics Co., Ltd.
    Inventors: Toshikazu Matsumoto, Yoshimi Hirasawa, Yasushi Nakano, Mitsuyuki Suzuki, Kazuo Kuwahara, Masashi Hamano, Takeshi Yokochi
  • Publication number: 20150096689
    Abstract: A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.
    Type: Application
    Filed: December 22, 2011
    Publication date: April 9, 2015
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Jurgen Burggraf, Gerald Mittendorfer
  • Patent number: 8999108
    Abstract: In the separation of a cover tape 15e from a carrier tape 15 performed by a cover tape separating mechanism 50, a cover tape 15e, which is separated from a base tape 15a by a separating blade edge 51f, comes into contact with a concave conical surface 52c, so that one side portion of a cover tape 15e is bent toward the other side portion; and the bent cover tape 15e is pressed against a guide surface 32s from below while the carrier tape 15 is guided to a pick-up position. Accordingly, the cover tape 15e is folded on the base tape 15a in a flat shape.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: April 7, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8991464
    Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: March 31, 2015
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Yoshito Konno, Yutaka Yamada
  • Publication number: 20150083344
    Abstract: A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet.
    Type: Application
    Filed: September 22, 2014
    Publication date: March 26, 2015
    Applicant: TESEC Corporation
    Inventor: Takashi Kurakane
  • Publication number: 20150083040
    Abstract: A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.
    Type: Application
    Filed: November 28, 2014
    Publication date: March 26, 2015
    Inventor: Daichi SATO
  • Publication number: 20150053352
    Abstract: In various embodiments, an apparatus for separating a stacked arrangement including a first layer, a second layer and a release layer between the first layer and the second layer may be provided. The apparatus may include an attachment surface configured to suspend the stacked arrangement by attaching to the first layer. The apparatus may further include an actuating mechanism configured to form a curvature of the first layer by bending the attachment surface. The apparatus may also include a holder to hold an etchant for etching the release layer to separate the first layer from the second layer.
    Type: Application
    Filed: April 17, 2013
    Publication date: February 26, 2015
    Inventors: Soon Fatt Yoon, Dawei Xu, Chiew Yong Yeo
  • Patent number: 8955730
    Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: February 17, 2015
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8951387
    Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: February 10, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ji-Hyeon Kang, Hyun-Chul Lee, Won-Kyu Lim
  • Patent number: 8931674
    Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: January 13, 2015
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8925613
    Abstract: A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: January 6, 2015
    Assignee: Oki Data Corporation
    Inventor: Daichi Sato
  • Patent number: 8852391
    Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: October 7, 2014
    Assignee: Brewer Science Inc.
    Inventors: Jeremy W. McCutcheon, Robert D. Brown
  • Patent number: 8845859
    Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: September 30, 2014
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Michael John Ries, Jeffrey L. Libbert, Dale A. Witte
  • Patent number: 8833423
    Abstract: A film application apparatus removes a glue surface protective sheet from a separated film and applies the film to the panel. The film application apparatus includes a press stage that presses the film from above the film, a press unit that presses an end part of the glue surface protective sheet from below so as to bend and raise the end part of the glue surface protective sheet and remove the end part of the glue surface protective sheet from the film, thereby performing primary removal to the glue surface protective sheet, an application head that is configured to be rotatable around a spindle, and has a curved surface convex toward the glue surface protective sheet and holds the film with the glue surface protective sheet being primarily removed, and a removal tape that removes the entire glue surface protective sheet from the film held by the application head.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: September 16, 2014
    Assignee: NEC Engineering, Ltd.
    Inventors: Masao Chida, Syouji Mori
  • Patent number: 8828186
    Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: September 9, 2014
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Yoshito Konno, Yutaka Yamada
  • Patent number: 8820381
    Abstract: A system for applying a tin-tie, from a supply of tin-ties releaseably adhered along the length of a liner, with the tin-tie length generally aligned along a length of packaging moving in a first direction includes a tamp applicator for extending and retracting along a second direction substantially transverse to the first direction. The tamp applicator includes a magnet for carrying the tin-tie after it is released from the liner by a peeler, an air assist for aid in releasing and positioning the tin-tie, and a recess and edge for positioning the tin-tie. Part of the tamp applicator carrying the released tin-tie is also moveable in the same first direction, allowing travel in the same first direction as the moving packaging material when putting the tin-tie on the moving packaging material. A spring biases the part to return in a third direction opposite the first direction.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: September 2, 2014
    Assignee: Plitek L.L.C.
    Inventors: Karl K. Hoffman, Tom Roberts, Steve Kaganovich, Clay Ladd, Arthur A. Sagy
  • Publication number: 20140209250
    Abstract: In a detaching apparatus, a detachment starter bends one end part of a first plate-like body into a cylindrical or prismatic surface in a direction opposite to a second plate-like body, thereby forming a single and straight boundary line between an adhering region and a detached region. A separator increases a distance between a first holder holding the first plate-like body and a second holder holding the second plate-like body to separate the first and second plate-like bodies.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 31, 2014
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventors: Masafumi KAWAGOE, Kazuhiro SHOJI, Yayoi SHIBAFUJI, Mikio MASUICHI, Hiroyuki UENO, Miyoshi UENO, Kazutaka TANIGUCHI
  • Patent number: 8776857
    Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: July 15, 2014
    Assignee: Computype, Inc.
    Inventors: Richard Jackson, Kevin Nobbs
  • Patent number: 8764934
    Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: July 1, 2014
    Assignee: Brooks Automation, Inc.
    Inventors: Robert K. Neeper, Rhett L. Affleck, Roger Howard
  • Patent number: 8764935
    Abstract: In a structure that exfoliation is performed in the pitch sending of a carrier tape (15) by making a cover tape exfoliating mechanism (50) intervene between joining surfaces of a base tape (15a) and a cover tape (15e), in an exfoliation start position where an exfoliating knife tip (51f) of an acuminate shape, which is provided at a front end, starts to exfoliate the joining surface, a lower guide member (40), which guides the carrier tape (15) from below, is pushed up from the bottom side by a lever member (44), and when the carrier tape (15) is installed, the carrier tape (15) is pushed up together with the lower guide member (40) to make the exfoliating knife tip (51f) in the exfoliation start position to be aligned to the joining surfaces and enter between the joining surfaces.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: July 1, 2014
    Assignee: Panasonic Corporation
    Inventors: Yutaka Kinoshita, Kazuhide Nagao, Nobuhiro Nakai
  • Patent number: 8758552
    Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Steve Canale, David J. Zapp, Daniel E. Sanchez, Hung V. Phan, Hyong Y. Lee
  • Publication number: 20140158307
    Abstract: An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 12, 2014
    Applicant: ALTA DEVICES, INC,
    Inventors: Brian BURROWS, Brian BROWN, Thomas GMITTER, Gang HE
  • Patent number: 8715460
    Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: May 6, 2014
    Assignee: International Business Machines Corporation
    Inventors: John J. Bandy, Graham M. Bates, Jeffery A. Brigante
  • Patent number: 8715458
    Abstract: A method of operation of a micro device feeder system includes: adjusting a distance between a movable drive plate and a mounting plate for aligning a carrier tape carrying a micro device to a center line for pick-up of the micro device by external device handling equipment; and configuring a tape handling mechanism, having a sprocket assembly, to accommodate a predetermined width of the carrier tape.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: May 6, 2014
    Assignee: Data I/O Corporation
    Inventor: Rossen Atanassov Rachkov
  • Patent number: 8715459
    Abstract: A positioning mechanism, which determines the relative position of a carrier tape 15 in a tape feed direction by fitting alignment pins 37 to feed holes 15d in a lower member 31, and a cover tape separating mechanism 50, which is provided on an upper member 32 and exposes electronic components 16 stored in component pockets 15b by separating a cover tape 15e from a base tape 15, are provided at non-interference positions that do not interfere with each other when the upper member 32 is closed to the lower member 31. Accordingly, when the cover tape 15e is separated from the carrier tape 15, the carrier tape 15 is aligned with the guide section 30.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 6, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8708022
    Abstract: A label peeling unit having an installation body: a movable body movable while engaging with the installation body and stopping in a closed state or an open state in which the movable body is closed or open relative to the installation body; a label peeling body installed on the movable body and allowing backing paper of a continuous label body, which is conveyed by the paper sheet conveyance device, to be in contact with the label peeling body to bend the backing paper for peeling a part of a label off the backing paper; and a backing paper conveyance roller rotatably installed on the movable body and rotating while being in contact with a platen roller of the paper sheet conveyance device with the backing paper in between to thereby convey the backing paper and discharge it to the outside. The label peeling unit facilitates loading of paper sheets.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: April 29, 2014
    Assignee: Sato Holdings Kabushiki Kaisha
    Inventors: Shinichiro Hosono, Kenta Kano
  • Patent number: 8679289
    Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: March 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Chouhei Okuno, Masayuki Yamamoto
  • Patent number: 8678065
    Abstract: A carrier tape feeder is provided. The carrier tape feeder includes a unit for loading a carrier tape, a picking-up unit where chips are picked up, and a driving unit. The pick-up unit includes a knife portion, a folding-guiding portion, and an inversion-guiding portion. The knife portion separates a cover tape from a base tape in a first adhesive portion. The folding-guiding portion is spaced from one lateral side of the knife portion to induce folding of the cover tape separated by the knife portion in the lengthwise direction in a state in which the cover tape is partially attached to the base tape in a second adhesive portion. The inversion-guiding portion extends in an oblique direction from the knife portion and the folding-guiding portion toward the outside of the carrier tape to induce inversion of the upper and lower surfaces of the cover tape folded in the folding-guiding portion so as to be superimposed on the base tape.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: March 25, 2014
    Assignee: STS Co., Ltd.
    Inventors: Young Soo Hwang, Yong Sung Kim, Su Hong Park, Hee Jong Kim
  • Patent number: 8657994
    Abstract: An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: February 25, 2014
    Assignee: Alta Devices, Inc.
    Inventors: Brian Burrows, Brian Brown, Thomas Gmitter, Gang He
  • Patent number: 8646508
    Abstract: A label peeling machine is configured to one by one peel adhesive labels of a non-liner label having a number of adhesive labels stuck continuously so as to be overlapped while being shifted by a predetermined width. The non-liner label wound and held on a reel is placed on a carrier belt entrained about a first driven shaft, a second driven shaft, and a third driven shaft and is moved forward or backward. The label peeling machine includes a first sensor for causing the carrier belt to move backward, a second sensor for stopping the carrier belt, a peeling claw for engaging the non-liner label moving upward along the drive belt and peel the adhesive labels one by one, and a control apparatus configured to control a switch, the first sensor and the second sensor.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: February 11, 2014
    Assignee: Towa Seiko Co., Ltd.
    Inventor: Toshikazu Kawada
  • Publication number: 20140020847
    Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate.
    Type: Application
    Filed: April 11, 2011
    Publication date: January 23, 2014
    Inventors: J├╝rgen Burggraf, Daniel Burgstaller
  • Patent number: 8574398
    Abstract: An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck supports and holds a wafer that has an adhesive layer on its top surface. The contact roller rotates around a first axis and moves linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller rotates around a second axis, that is parallel to the first axis. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller has a surface that has a footprint of a circle when rolled along a flat surface.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: November 5, 2013
    Assignee: Suss Microtec Lithography, GmbH
    Inventor: Gregory George
  • Patent number: 8551291
    Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: October 8, 2013
    Assignee: Suss Microtec Lithography, GmbH
    Inventor: Gregory George
  • Patent number: 8528194
    Abstract: It is described an apparatus for removing a flexible film seal (12) from a tubular specimen container (3), comprising a vertical mounting shaft (5) upon which is mounted a holding member (6) for a head assembly (9) having a cavity (13) and pinch means (14, 15). There is provided driving means for causing coupling motion of said head assembly (9) and said specimen container (3) towards each other to receive the seal (12) into said cavity (13), then operating said pinch means for pinching the flexible film seal (12), and finally causing removing motions of said head assembly (9) and said specimen container (3) away from each other to remove the flexible film seal (12) from the head of the specimen container (3).
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: September 10, 2013
    Assignee: Inpeco Holding Ltd.
    Inventor: Gianandrea Pedrazzini
  • Patent number: 8524027
    Abstract: A label dispensing device is disclosed for dispensing labels from a web that has a web path extending through the label dispensing device. The label dispensing device includes a dispensing member and a transition member. The dispensing member is shaped to effectuate a flexure of the web and includes a peel edge disposed along a portion of the web path. The transition member has a web control surface disposed along a portion of the web path. The web control surface is downstream of the peel edge and is configured to engage the first side of the web, thereby reducing the flexure of the web effectuated by the dispensing member.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: September 3, 2013
    Assignee: Brady Worldwide, Inc.
    Inventors: Sohail Anwar, Peter Hartmann
  • Patent number: 8469076
    Abstract: The present invention relates to a polarizer film peeling machine and a polarizer film peeling method thereof. The polarizer film peeling machine includes an operation platform and a conveyor device having a translatable surface. The operation platform forms a slit at a site where a polarizer film is peeled off. The translatable surface of the conveyor device is located under the slit. In peeling off a polarizer film, a glass substrate from which the polarizer film is to be removed is set to slide on the a top surface of the operation platform to pass through the slit and the peeled-off polarizer film is guided through the slit to be laid flat on the translatable surface of the conveyor device and move with the translatable surface of the conveyor device.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: June 25, 2013
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventor: Xinhui Zhong
  • Patent number: 8470129
    Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: June 25, 2013
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventor: Xingang Wang
  • Patent number: 8464773
    Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: June 18, 2013
    Assignee: The Boeing Company
    Inventor: Thomas J. Hagman
  • Publication number: 20130126100
    Abstract: A sheet peeling device includes: a feeder that feeds a material sheet and a peeling unit that peels the adhesive sheet from the peeling sheet. The peeling unit includes: a peeling member having a bending edge for folding back the peeling sheet; and a following unit that forms an anti-bending area with irregularities at least on the adhesive sheet in the feeding direction. The peeling member includes a guide surface continuous to the bending edge and guides the material sheet; and a first irregularity formed on the guide surface in the feeding direction and is open on the bending edge. The following unit includes a guide member interposing the material sheet with the peeling member and having a second irregularity to fit to the first irregularity. The second irregularity includes a convex portion that extends to the bending edge in the feeding direction corresponding to the first irregularity.
    Type: Application
    Filed: June 30, 2011
    Publication date: May 23, 2013
    Applicant: LINTEC CORPORATION
    Inventor: Toshihiro Fujita
  • Patent number: 8366873
    Abstract: A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: February 5, 2013
    Assignee: SUSS MICROTEC LITHOGRAPHY, GmbH
    Inventor: Gregory George
  • Patent number: 8360129
    Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: January 29, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Kenichi Ebata, Yasunori Ito
  • Publication number: 20120312482
    Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.
    Type: Application
    Filed: August 17, 2012
    Publication date: December 13, 2012
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Yoshito KONNO, Yutaka YAMADA
  • Publication number: 20120247685
    Abstract: An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.
    Type: Application
    Filed: April 1, 2011
    Publication date: October 4, 2012
    Inventors: Brian BURROWS, Brian BROWN, Thomas GMITTER, Gang HE
  • Patent number: 8267143
    Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: September 18, 2012
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Gregory George, Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles
  • Patent number: 8245754
    Abstract: A peeling apparatus including a first holding section that holds a first object which is in the form of a flat plate, and a second holding section that holds a second object which is in the form of a flat plate and is affixed to the first object to be integral, the peeling apparatus being configured to be capable of peeling one of the first object and the second object off the other in a state in which the first holding section holds the first object and the second holding section holds the second object. The first holding section holds the first object by being brought into contact with a surface of the first object along a direction of a thickness thereof via at least two points.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: August 21, 2012
    Assignee: TDK Corporation
    Inventors: Minoru Fujita, Shigeki Ishiyama
  • Patent number: 8182649
    Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: May 22, 2012
    Assignee: Lintec Corporation
    Inventors: Kenichi Watanabe, Takeshi Segawa, Hironobu Fujimoto