Abstract: When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

Abstract: A substrate processing system includes: a modification layer forming device configured to form a modification layer within a first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; an interface processing device configured to process an interface where the first substrate and a second substrate are bonded in the peripheral portion; a periphery removing device configured to remove the peripheral portion starting from the modification layer; a position detection device configured to detect a position of the modification layer or a position of the interface; and a control device configured to control the modification layer forming device and the interface processing device. The control device controls the position of the interface based on the detected position of the modification layer, or controls the position of the modification layer based on the detected position of the interface.

Abstract: A manufacturing apparatus of a display device includes: a stage to support a work substrate covered by a work protective film; a separation module including a separation structure, and a pressure sensor to measure an intensity of a pressure applied to the separation structure; a driver to control a position of the separation module; and a controller to control the separation module and the driver.

Abstract: By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.

Abstract: A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

Abstract: A method of measuring adhesive strength between an element body and a porous protection layer that are included in a sensor element includes (a) a step of holding a portion of the element body where the porous protection layer is absent with an elastic force exerted by a holding jig, and placing a peeling jig at a position between the porous protection layer and the holding jig in the longitudinal direction such that the element body is allowed to move in the longitudinal direction while the porous protection layer is prevented from moving in the longitudinal direction toward the holding jig; and (b) a step of moving, after the step (a), the peeling jig pushes the porous protection layer in the longitudinal direction, and measuring the adhesive strength of the porous protection layer.

Abstract: A pad removal device includes a pad guide having a first end and a second end along a first direction, an actuator attached to the first end, and a control assembly coupled to the actuator. The control assembly is configured to cause the actuator to move the first end toward the second end along the first direction, and the pad guide is configured to extend in a second direction perpendicular to the first direction by an amount dependent on a distance between the first end and the second end.

Abstract: A method is provided. The method includes one or more of removing one or more existing ball bonds from an extracted die, reconditioning die pads of the extracted die to create a reconditioned die, securing the reconditioned die within a cavity of a new package base, providing a plurality of bond connections interconnecting the reconditioned die pads and package leads or downbonds of the new package base, applying an encapsulating compound over the reconditioned die and the plurality of bond connections to create an assembled package base, and securing a lid to the new package base. Reconditioning includes applying a plurality of metallic layers to the die pads of the extracted die, the extracted die including a fully functional semiconductor die removed from a previous package. The encapsulating compound is configured to exhibit low thermal expansion.

Abstract: An apparatus for separating a substrate and a method of separating a substrate by using the same are disclosed. In one aspect, the apparatus includes a stage and an adsorber facing the stage and comprising a plurality of vacuum pad portions. An upper surface of the stage includes a first region and a pair of second regions located on opposing sides of the first region, wherein the first region and the second regions are disposed on different planes, and wherein each of the second regions is inclined with respect to the first region.

Abstract: A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided.

Abstract: A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.

Abstract: The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.

Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.

Abstract: Provided is a semiconductor die pick-up apparatus including a stage, a suction opening, a cover that opens and closes a suction opening, and projections and primary holes arranged at a circumferential edge of the suction opening and project from a contact surface. When picking up a semiconductor die, in a state in which at least a portion of a contour of the semiconductor die sticks out from the projections toward the outer circumference of the stage, a retaining sheet at the portion sticking out from the primary holes is suctioned, a tip end of the cover is caused to advance upward, the cover is caused to slide while pushing the retaining sheet and the semiconductor die upward to open the suction opening sequentially, the opened suction opening is caused to suction the retaining sheet sequentially to separate the retaining sheet from the semiconductor die.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member.

Abstract: A method of peeling a protective tape, includes the steps of mounting a wafer on a stage, the wafer having the protective tape adhered thereto so that the protective tape overlaps only a portion of a notch of the wafer, attaching a peeling adhesive tape to the protective tape, projecting a lift pin from the stage so that the portion of the protective tape which overlaps the notch is raised by a top surface of the lift pin, and with the protective tape raised by the lift pin, pulling the peeling adhesive tape so as to peel the protective tape from the wafer. The top surface of the lift pin has a shape that allows the top surface to raise the portion of the protective tape which overlaps the notch.

Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

Abstract: A device (2) having at least one connecting element (24, 26) for fastening a component (4) to, respectively for detaching it from a component carrier (6) using adhesive bonds; a mechanical peeling device (8) being provided for breaking the adhesive bonds. Also a method for fastening a component (4) to, respectively for detaching it from a component carrier (6).

Abstract: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.

Abstract: The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.

Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: In one embodiment, an apparatus is provided for preparing a cassette spool. The apparatus includes: a supply reel for supplying and unrolling tape material on original backing paper; at least one cutting member for cutting unrolled tape material while on original backing paper; a cutting surface defined in a plane; a pivoting path member adapted to move from a first position aligned in the plane to a second position aligned at least partially out of the plane; at least one removing member for removing uncut unrolled tape material from original backing paper; and a cassette spool for rolling up unrolled cut tape material on original backing paper. In further embodiments, methods are provided for preparing a cassette spool with cut tape material on original backing paper.

Abstract: The invention comprises separating the strippings of a strip of paper and of a precut prepreg into strippings to be discarded and blanks to be kept using a suction roller that is tangent to the strip along an action line. In a downstream position, a device collects the blanks on said rectilinear path, and a device closer to the roller discharges the strippings. The paper runs through the device along said rectilinear path while maintaining the blanks thereon, and a strip temporary diversion device, capable of orthogonal movement relative to the strip, temporarily diverts the strip and brings it closer to the roller in order to facilitate the initial peeling of the strippings.

Abstract: A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.

Abstract: An apparatus and method for removing a temporary substrate from an optical disk is disclosed. A holding fixture (102) provides an optical disk supporting surface. A force imparting tool (118) imparts a force against an optical disk wherein a reaction force to the force imparting tool is provided by the supporting surface. The optical disk is flexed to break away and remove a temporary substrate of the optical disk.

Abstract: A method of peeling a protective tape, includes the steps of mounting a wafer on a stage, the wafer having the protective tape adhered thereto so that the protective tape overlaps only a portion of a notch of the wafer, attaching a peeling adhesive tape to the protective tape, projecting a lift pin from the stage so that the portion of the protective tape which overlaps the notch is raised by a top surface of the lift pin, and with the protective tape raised by the lift pin, pulling the peeling adhesive tape so as to peel the protective tape from the wafer. The top surface of the lift pin has a shape that allows the top surface to raise the portion of the protective tape which overlaps the notch.

Abstract: An apparatus for preparing a cassette spool. The apparatus includes: a supply reel for supplying and unrolling tape material on original backing paper; at least one cutting member for cutting unrolled tape material while on original backing paper; at least one removing member for removing uncut unrolled tape material from original backing paper; an identification member for identifying on unrolled original backing paper a start of unrolled cut tape material; and a cassette spool for rolling up unrolled cut tape material on original backing paper. In further embodiments, methods are provided for preparing a cassette spool with cut tape material on original backing paper.