Abstract: An outdoor unit includes a casing with an inlet in a back surface and an outlet in a front surface, a fan in the casing which draws air in the inlet and blows air out the outlet, a compressor in the casing, and a partition plate partitioning the interior into a machine room with the compressor and a blower room with the fan. A control board is installed horizontally on top of the partition plate across the machine room and the blower room, an electric component box covers the control board, a heat-generating component on the blower room side of the control board drives the compressor and the fan, and a cooler connects to the heat-generating component and includes fins exposed from the electric component box. A curved vertical separation surface is between the electronic component and the blower room, and between the electronic component and the back surface.

Abstract: A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

Abstract: Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material.

Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

Abstract: The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.

Abstract: Methods, systems, and device for thermal energy storage are provided. For example, some embodiments include a thermal energy storage device that may include: a first casing wall; a second casing wall; and/or multiple support structures located between the first casing wall and the second casing wall. The multiple support structures may provide continuous thermal paths and/or continuous mechanical paths between the first casing wall and the second casing wall. The thermal energy storage device may be fabricated utilizing an additive manufacturing technique, such as direct laser metal sintering. Some embodiments may be manufactured utilizing printed metals, such as an aluminum alloy. In some embodiments, a phase-change material is charged between the first casing wall and the second casing wall. The phase-change material may include paraffin.

Abstract: A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

Abstract: An environmental control system is provided. The environmental control system can include a heat absorption device and a heat rejection device positioned in containment areas and a reservoir. The containment areas can contain leaks that may occur in the environmental control system and direct the fluid into the reservoir. The reservoir can include an opening that can allow the environmental control system to operate as a low pressure system.

Abstract: A forced double-circuit air cooling system designed for using in a sealed cabinet structure. A first air circuit is formed by an air loop moved around each of local modules (3; 4) of a sealed compartment [2] with using a circulation fan (26) which is installed within a sealed air channel [28]. The first air circuit is formed within an internal air channel (18) of the sealed compartment [2]. Wherein the internal air channel is connected to a number of air heat exchangers [22]. A first pair [22.1] of said number of air heat exchangers is equipped with the circulation fan [26]. Wherein a second air circuit [25] contains straight air channels [23] arranged within the ventilated compartment [24] adjacent to the sealed compartment [2]. Each of said straight air channels [23] comprising a second pair [22.2] of air heat exchangers with a blast fan [27] between them.

Abstract: Systems, apparatuses, and methods for efficiently performing active thermal control during device testing are disclosed. A device testing system includes a device under test, a thermal structure on top of the device under test, and a controller configured to determine when to apply and remove thermal energy to the device under test through the thermal structure. The thermal structure includes a thermal transfer block that transfers thermal energy to and from the device under test below the thermal transfer block. The thermal structure also includes a coolant block above the thermal transfer block that removes thermal energy from the thermal transfer block. There is no heating element between the coolant block and the thermal transfer block. Rather, the thermal structure includes a heating element in a wall of the thermal transfer block. Therefore, an unobstructed thermal path exists from the device under test to the coolant block.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

Abstract: A method for designing startup critical tube diameter of pulsating heat pipe in vertical state, including the following steps: step 1. establishing a first model of working medium mass in pulsating heat pipe; step 2. establishing a second model of working medium mass in pulsating heat pipe, the second model including the vapor working medium mass model and the liquid working medium mass model in the pulsating heat pipe; step 3. according to the law of conservation of mass, combining the first model and the second model, and determining the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition; step 4.

Abstract: A substation contains a switchgear or controlgear, in particular at least one low voltage switchgear or controlgear configured for unmanned operation and maintenance. An inner room, where the switchgear or controlgear are located in, is hermetically enclosed by an outer housing. The inner room is locked against the outer housing by an inner, automatically operated door. A robot system is implemented such that the robot system's acting area is extended from the inner room, partly in the area outside the inner room, but inside the outer housing, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: A heat-wing includes: a sealed hollow chamber including two plates and a frame connecting the two plates; a capillary structure layer closely attached to an inner surface of the chamber; and a phase transition working medium sealed in the chamber. A portion of the frame or a portion of a periphery of one of the two plates serves as an evaporation area of the heat-wing, and the rest portion of the chamber serves as a condensation area of the heat-wing. The heat-wing has an increased vapor passage area, liquid working medium flow-back passage width and condenser heat transfer area and a reduced evaporator center-to-edge distance, and is hence capable of achieving a great improvement in heat transfer limit and heat flux density.

Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.

Abstract: Described herein are example riser modules for holding electrical components such as PCIe cards. The riser modules include a riser bracket and an opening to an interior space of the riser bracket. The riser modules also include an air duct movably coupled to the riser bracket. The air duct is movable between a plurality of positions relative to the riser bracket. The plurality of positions including at least an open position and a closed position.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

Abstract: The present embodiment comprises: a container, having a hollow part formed at the top part thereof and an inner space, in which the main ingredients of beer are filled, formed in the side thereof; and a cap assembly which opens and closes the hollow part and is locked by means of a multistage lock, and which accommodates therein an additive bag in which an additive is filled. Therein, the container may comprise a perforation part that perforates the additive bag, and a through-hole part through which pass water, and additive and beer, the embodiment having the benefit of enabling the multistage fermentation of beer by means of a simple structure.

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Abstract: An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.

Abstract: An electromagnetic coil assembly for a control rod driving mechanism, comprising coils and a yoke for embedding the coils, wherein damascene holes are disposed on the yoke, the coils are installed in the damascene holes, the yoke comprises first yokes and second yokes, and the damascene holes are disposed on the first yokes; the first yokes are connected with the second yokes, and a through hole for cooperating with a sealing shell assembly is disposed on the second yokes; and a thermal conductivity of the first yokes is stronger than a thermal conductivity of the second yokes. The method is the processing method of the assembly. The coil assembly provided in technical solution or the coil assembly obtained by the method can remarkably reduce the temperature inside the coil, thereby improving the reliability of the CRDM electromagnetic coil assembly and prolonging the service life of the CRDM electromagnetic coil assembly.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A substation for medium or high voltage includes: switchgear or controlgear with unmanned operation and maintenance; an inner room in which the switchgear or controlgear is located, the inner room being hermetically enclosed by an outer housing, the inner room being locked against the outer housing by an inner, automatically operated door; and a robot system, the robot system being implemented such that an acting area of the robot system is extended from the inner room, partly in an area outside the inner room, but within the substation internal space, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: An embodiment of the present disclosure provides a device for cooling a battery pack, the device including: a housing including flow passages extending in a first direction; a first sub-housing provided on the housing in the first direction; and a second sub-housing arranged opposite the first sub-housing in the first direction and provided on the housing, wherein the first sub-housing includes a first coupling hole communicating with one of the flow passages and a first guide hole communicating with at least one of the flow passages, the second sub-housing includes a second coupling hole communicating with one of the flow passages and a second guide hole communicating with at least one of the flow passages, and a path of a fluid flowing in the flow passages varies according to installation positions of coupling members inserted into the first and second coupling holes.

Abstract: A cold plate apparatus includes a top wall and a bottom wall that enclose a plenum for fluid flow; an inlet and an outlet each formed in one of the top wall or the bottom wall; a first active area within the plenum; a second active area within the plenum; and a partition that extends between the top wall and the bottom wall within the plenum and that separates the first active area from the second active area so that a portion of fluid flowing from the inlet to the outlet through the plenum flows through either the first active area or the second active area but not through both active areas.

Abstract: A cooling system for cooling a set of components on a circuit board includes a vapor chamber for distributing heat over a larger surface area, a fan in a housing configured to direct a first airflow in a first direction to a first heatsink and direct a second airflow in a second direction opposite the first direction to a second heatsink. The heatsinks can have different sizes and the fan can be located relative to a midpoint of the vapor chamber or the circuit board or positioned relative to a component on the circuit board.

Abstract: A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.

Abstract: An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.

Abstract: A system includes an enclosure with an air inlet end, an air outlet end, an upper wall, and a lower wall. The system also includes air movers positioned near the air outlet end, a first memory module positioned near the air inlet end at a first orientation, and a second memory module positioned near the air inlet end at a second orientation that is opposite the first orientation.

Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.

Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Abstract: A flexible display device is provided, which includes a first housing, a second housing, a hinge structure that connects the first housing and the second housing and supports a hinge motion of the first housing or the second housing, a heat source disposed in the first housing, a heat sink disposed in the second housing, and a heat-dissipation path structure disposed across the first housing, the hinge structure, and the second housing. The heat-dissipation path structure transfers heat generated by the heat source to the heat sink.

Abstract: A blower includes a moving blade, a motor, and a housing. The housing includes a holding portion located below the moving blade to hold the motor, and a peripheral wall portion having a cylindrical shape centered on the central axis and extending upward from a radially outer end portion of the holding portion. The peripheral wall portion includes a peripheral wall recess that is recessed downward from an upper end portion of the peripheral wall portion and connects a space radially inside of the peripheral wall portion and a space radially outside of the peripheral wall portion, and includes a first peripheral surface facing one circumferential direction that is opposite to a rotation direction of the moving blade. The first peripheral surface extends in one circumferential direction from the upper end of the peripheral wall recess toward the lower side.

Abstract: A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.

Abstract: A two-dimensional liquid cooling system for data centers. A horizontal assembly is positioned above the IT cluster and serves as the main cooling unit. A vertical unit is positioned besides several IT clusters and is connected to several horizontal units and can be used as a backup or for enhanced cooling performance for any of the clusters. The horizontal assembly includes a cooling module that has a cooling unit, a coolant module that receives chilled liquid from the cooling unit and provides cooling liquid to a distribution layer which includes a supply loop and a return loop. The vertical unit is coupled to a plurality of supply and return loops so as to provide cooling liquid to several clusters. The cooling system and entire data center are modularized in different configurations.

Abstract: Disclosed are layouts, arrangements, and configurations of room airflow, server racks and cooling delivery subsystems that support data centers having system architectures with segregated compute and storage point of deliveries (PoDs). A cooling row is arranged in the rear side of racks housing a PoD to supply the PoD with the cooling delivery subsystem, which includes a recirculating loop supplying cooling fluid to the PoD and returning warm fluid to the cooling source. Modular cooling units of the cooling row includes cooling coils used to cool the airflow leaving the racks. The cooling capacity of the cooling liquid supplied to the cooling delivery subsystem for a PoD may be independently adjusted and controlled in a feedback loop based on the temperature of the air of the PoD after it has been cooled by the cooling coils, such as the outlet air temperature from the cooling row housing the PoD.

Abstract: A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

Abstract: A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

Abstract: A waterproof stage lamp structure easy to disassemble and maintain and a waterproof stage lamp include an upper shell, a lower shell, a waterproof heat-conducting plate, an anti-loosening connecting piece, a main functional module, a front-end functional module, a heat dissipation module and guide positioning rods disposed on the waterproof heat-conducting plate. The main functional module and the heat dissipation module are matched with the guide positioning rods respectively, so that center axes of the center light holes of each module are concentric. A power supply of each module is closely connected to a signal interface and the lamp is internally quickly installed and maintained, and the power supply is automatically docked with or separated from the signal interface during installation or disassembly.

Abstract: A street lighting pole including at least one upright outer wall portion defining an enclosed space of the street lighting pole; a substantially vertically arranged divider (11) dividing at least part of the enclosed space into at least two substantially vertically arranged bays, the at least two bays including a first bay and a second bay; a space air inlet into the enclosed space arranged at a bottom of the upright outer wall portion; a space air outlet from the enclosed space arranged at a top of the upright outer wall portion; a respective individual air inlet for each of the at least two bays arranged at the bottom of the divider; and a respective individual air outlet for each of the at least two bays arranged at the top of the divider.

Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.

Abstract: An apparatus for treating a substrate includes a chamber having a treatment space in which the substrate is treated, a substrate support unit that supports the substrate in the treatment space, a gas supply unit that supplies a gas into the treatment space, an exhaust line connected to the chamber, and a pressure-reducing member that reduces pressure in the exhaust line and releases process by-products generated in the treatment space. The exhaust line includes a first line connected to the chamber, a second line equipped with the pressure-reducing member, and a filter tube that connects the first line and the second line, and the filter tube has a corrugated side surface.

Abstract: A cooling apparatus includes a cold plate including a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows, a radiator including fins to perform cooling, and a second coolant passage in which the coolant flows, and a pump connected to each of the first coolant passage and the second coolant passage to circulate the coolant. The radiator is provided on the cold plate. The pump is adjacent to the radiator.

Abstract: A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover.