Cooling Electrical Device Patents (Class 165/104.33)
  • Patent number: 11223079
    Abstract: The present invention relates to a battery pack. The present invention includes: a plurality of battery cells disposed in one direction; a heat transfer oil configured to contact surfaces of the battery cells; a frame configured to accommodate the battery cells and the heat transfer oil; a cooling plate configured to contact bottom surfaces of the battery cells through the frame and having cooling water flowing therein; and a battery management unit configured to manage heat generated from the battery cells by using at least one of a cell temperature of the battery cells, a temperature of the heat transfer oil, and a temperature of the cooling water.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG SDI CO., LTD.
    Inventor: Dukjung Kim
  • Patent number: 11224144
    Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: January 11, 2022
    Assignee: TMGCore, Inc.
    Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
  • Patent number: 11219142
    Abstract: An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 4, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Yung-Hsiang Lu
  • Patent number: 11208009
    Abstract: A vehicle includes an electrical apparatus comprising an electric circuit unit, a cooling unit that cools the electric circuit unit, a housing that accommodates the electric circuit unit and the cooling unit, a refrigerant introduction unit that supplies a refrigerant to the cooling unit; and a refrigerant discharge unit that discharges the refrigerant from the cooling unit. The refrigerant introduction unit and the refrigerant discharge unit are provided on opposite sides with the electric circuit unit being interposed therebetween in a horizontal direction. The housing is provided, on an inner side of an outer edge of the housing, with a connector connecting portion that is connected to a connector, and the connector connecting portion is provided below the cooling unit and closer to the refrigerant introduction unit or to the refrigerant discharge unit than the electric circuit unit in the horizontal direction.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 28, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takuro Tominaga, Takanori Suzuki
  • Patent number: 11209215
    Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: December 28, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Adrian Chiriac, Jorge Luis Rosales
  • Patent number: 11209210
    Abstract: The device includes a container (10) having a top (12) and a bottom (14). A receptacle (15) is formed in the container and joined to an orifice (22) at the bottom (14). A cooling medium (26) is contained within the receptacle and able to retain a cooling environment to cool the beverage. In one embodiment, a beverage container has an opening (72) that permits the emptying of the beverage from the container and a coolant capsule (73) within said container. The cooling capsule (73) contains a cooling medium and the capsule is dimensioned such that the capsule is larger than the opening (72) but has surface characteristics (77,78) which permit the beverage within the container to bypass the capsule (73) and to exit the opening.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: December 28, 2021
    Inventor: David Yoskowitz
  • Patent number: 11211649
    Abstract: A battery module includes a cooling plate including a housing, a first manifold coupled to one end of the housing, and a second manifold coupled to another end of the housing; and at least one battery pack arranged on the cooling plate, wherein the housing includes therein a plurality of flow paths and a plurality of hollows passing through the housing from the one end to the other end, and the plurality of flow paths and the plurality of hollows are arranged alternately and in parallel to each other.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: December 28, 2021
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hyun Kim, Janggun Ahn
  • Patent number: 11211191
    Abstract: This invention concerns a transformer radiator. The radiator includes an inlet manifold, an outlet manifold and a heat exchange fin. The find extends between and is connected to the inlet and outlet manifolds. The heat exchange fin defines at least one oil flow passage to convey transformer oil, which, in use, enters the radiator through the inlet manifold, to the outlet manifold. The heat exchange fin is further provided by a single component having a continuously undulating profile and the manifolds extend transversely to the turns of the undulating profile.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: December 28, 2021
    Inventor: Craig Robert McChlery
  • Patent number: 11212378
    Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: December 28, 2021
    Inventor: Eunseok Hong
  • Patent number: 11206748
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Patent number: 11206749
    Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: December 21, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Thomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Chan H. Yoo, Randon K. Richards
  • Patent number: 11202393
    Abstract: A modular cooling system includes a fluid pump in fluid communication with one or more cooling elements to cool electronics components; a heat exchanger in fluid communication with the fluid pump; a heat exchanger valve upstream of the heat exchanger; and a fluid supply valve positioned between a cooling fluid supply and the one or more cooling elements. When the heat exchanger valve and the fluid supply valve are in a first position, fluid is directed from the cooling fluid supply to the one or more cooling elements, bypassing the heat exchanger and the fluid pump. When the heat exchanger valve and the fluid supply valve are in a second position, fluid is cut off from the cooling fluid supply and a cooling fluid return and circulated through the heat exchanger and the fluid pump.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: December 14, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11202391
    Abstract: A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: December 14, 2021
    Assignee: Moxa Inc.
    Inventor: Chih-Hou Chien
  • Patent number: 11193718
    Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 7, 2021
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventors: Pai-Ling Kao, Dan-Jun Chen, Guo-Hui Li, Fu-Ming Zhong
  • Patent number: 11197393
    Abstract: A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: December 7, 2021
    Assignee: Seagate Technology LLC
    Inventors: Laurence A. Harvilchuck, Alex Carl Worrall
  • Patent number: 11184996
    Abstract: A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 23, 2021
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Scott D. Garner, Peter Dussinger, Jon Zuo, Daniel T. Reist
  • Patent number: 11171377
    Abstract: A motor vehicle high-voltage energy accumulator having a housing with battery modules mounted inside, wherein the housing has a bottom wall, a top wall, a front end wall, a rear end wall, a left side wall, and a right side wall. In each case, two oppositely arranged walls of the housing which are oriented in the longitudinal direction have load-path-forming supporting structure plates and cooling ducts through which cooling liquid flows. Here, the cooling ducts are either integrated directly into the supporting structure plate in the form of cavities or formed by the connection of a separate cooling structure plate to the supporting structure plate. The supporting structure plate and, where appropriate, the cooling structure plate increase the structural stability or the formation of cooling ducts.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: November 9, 2021
    Inventors: Philipp Kellner, Jens Bohlien, Lukas Kohler
  • Patent number: 11163344
    Abstract: A laptop with active door including a first body, a second body, a hinge connected between the first body and the second body, a linking assembly pivoted to the hinge and slidably disposed on the first body, a door movably disposed on the first body, a first linking rod, and a second linking rod is provided. The first linking rod has a first end and a second end opposite to each other, the first end is pivoted to the linking assembly, and the second end is pivoted the door. The second linking rod has a third end and a fourth end opposite to each other, the third end is pivoted to the first body, and the fourth end is pivoted to the first linking rod.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: November 2, 2021
    Assignee: Acer Incorporated
    Inventors: Yi-Ta Huang, Wu-Chen Lee, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 11166397
    Abstract: A power conversion device includes: a casing including a housing portion; a circuit board housed in the housing portion, the circuit board including an inverter circuit or an inverter control circuit configured to control the inverter circuit; a cooling fan configured to generate air flowing through the housing portion to cool the circuit board; a temperature sensor configured to sense a temperature inside or outside the casing; and a cooling fan control circuit configured to drive the cooling fan. The cooling fan control circuit is configured to, if the temperature sensed by the temperature sensor is higher than a predetermined temperature, turn on the cooling fan, and if the sensed temperature is equal to or below the predetermined temperature, control the cooling fan to turn off the cooling fan or make a speed of the flowing air lower than a speed when the cooling fan is in the on state.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 2, 2021
    Assignee: TOSHIBA MITSUBISHI—ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Nobuhiro Takahashi, Tatsuji Katayama
  • Patent number: 11162745
    Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: November 2, 2021
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
  • Patent number: 11157050
    Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: October 26, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Ernesto Ferrer Medina, Tahir Cader, Steven Dean
  • Patent number: 11150028
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: October 19, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
  • Patent number: 11147185
    Abstract: A heat sink includes a plurality of fins arrayed in a first direction, and a heat pipe having a first extension extending in the first direction. A second direction extends perpendicularly to the first direction, a third direction extends perpendicularly to the first direction and the second direction, and when the heat pipe is viewed in the third direction, the heat pipe has a second extension spaced from the first extension in the second direction and extending in the first direction, and a joint which interconnects the first extension and the second extension and which is curved. The fins include a plurality of first fins arrayed along the first extension and the second extension and a second fin disposed around a position of the joint.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 12, 2021
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Nobuyuki Sugawara, Keiichi Aoki
  • Patent number: 11144103
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a processor, a temperature sensor, a main board on which the processor and the temperature sensor are mounted, a main body including a first surface and a second surface, an input device disposed on the first surface and the main board disposed on the second surface, wherein the first surface and second surface define a hollow in which the main board is disposed, a display, height adjuster disposed between the first and second surfaces and including a connection terminal connected to the processor, an extendable bar connected to the connection terminal, and a spacer connected to the extension bar. The processor implements the method, including in response to receiving a detection signal from the temperature sensor, control actuation of the height adjuster to cause expansion or contraction of the hollow by movement of the first and second surfaces.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Byungwook Yoo
  • Patent number: 11145570
    Abstract: A closed loop liquid cooler and an electronic device using the same. The closed loop liquid cooler includes: a first liquid cooling module and a second liquid cooling module, where a cooling reflux at an output end of the first liquid cooling module is outputted to a cooling liquid input end of the second liquid cooling module; and a cooling reflux at an output end of the second liquid cooling module is outputted to a cooling liquid input end of the first liquid cooling module.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: October 12, 2021
    Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD
    Inventors: Zhongjiang Qu, Yaoyin Fan
  • Patent number: 11137809
    Abstract: A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 5, 2021
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Karthik Rao, Wei Huang, Xudong An, Manish Arora, Joseph L. Greathouse
  • Patent number: 11134587
    Abstract: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: September 28, 2021
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Klaus Olesen, Lars Paulsen
  • Patent number: 11121125
    Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 14, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
  • Patent number: 11122714
    Abstract: A power module includes a power source module and a metallic bottom heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a top surface and a bottom surface. At least a heat-generating component is disposed on the bottom surface. The metallic bottom heat-dissipation substrate has an upper surface and a lower surface opposite to each other. The upper surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the bottom surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The lower surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 14, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Da Jin, Shaojun Chen, Yahong Xiong
  • Patent number: 11112184
    Abstract: The invention relates to an evaporator (V) comprising an evaporator body (3) surrounded by an evaporator housing (5) having an inlet (1) for supply of liquid into the evaporator housing (5) and an outlet (6) for discharge of vapour generated, wherein the evaporator body (3) comprises a multitude of plates (7) arranged flat one on top of another, wherein there is a liquid distributor (2) for distributing the liquid between the multitude of plates (7) arranged between the inlet (1) and the evaporator body (3), wherein each of the plates (7) comprises, on a first surface, a liquid distributor structure (10) with distributor conduits (20, 21, 22), an evaporator area (11) and a gas collection structure (12). The invention further relates to a corresponding fuel cell arrangement.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: September 7, 2021
    Assignee: DIEHL AEROSPACE GMBH
    Inventors: David Tiemann, Jochen Schuerer, Gunther Kolb
  • Patent number: 11109516
    Abstract: A liquid-cooled server chassis includes: a case; one or more liquid-cooling modules, each liquid-cooling module including a housing, a gas outlet valve, and a liquid return valve, wherein the gas outlet valve and the liquid return valve are opened during operation of the liquid-cooling module, and the liquid-cooling module accommodates a single server and is filled with coolant during operation; a connector configured to connect the liquid-cooling module to a power source; and a circulation portion including an gas outlet pipe, a liquid return pipe, a vapor processing part, and a liquid collecting part.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: August 31, 2021
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD
    Inventors: Tangbo Jing, Xiaogang Sun, Binghua Zhang
  • Patent number: 11104458
    Abstract: The present invention relates to a cubesat space deployer, and more particularly, to a cubesat space deployer for separating an ultra-small satellite (cubesat) from a launch vehicle in a space orbit while protecting the ultra-small satellite from a launch environment.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: August 31, 2021
    Assignees: SpaceBey Inc., SaTReC (Satellite Technology Research Center)
    Inventor: Gyungmo Tahk
  • Patent number: 11109515
    Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: August 31, 2021
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
  • Patent number: 11083111
    Abstract: Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 3, 2021
    Assignee: BULL SAS
    Inventors: Jean-Christophe Bonnin, Elyès Zekri
  • Patent number: 11061441
    Abstract: In one example, a housing is described, which may include an outer cover and an electromagnet. The outer cover may include at least one slot and at least one slot cover to cover the at least one slot. The electromagnet may be fixedly disposed in the housing and aligned with the at least one slot cover to electromagnetically control a movement of the at least one slot cover.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: July 13, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei-Chung Chen, Kuan-Ting Wu
  • Patent number: 11058029
    Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: July 6, 2021
    Assignee: EXASCALER INC.
    Inventor: Motoaki Saito
  • Patent number: 11054872
    Abstract: An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: July 6, 2021
    Assignee: Wistron Corporation
    Inventors: Huan-Chun Wu, Chao-Yu Li, Chin-Jung Li, Chia-Jui Hsu
  • Patent number: 11051425
    Abstract: A communication system includes a receptacle assembly and a pluggable module. The receptacle assembly has a receptacle housing includes walls forming a module cavity with a communication connector at a back end thereof. The receptacle assembly has a liquid cooling assembly having a liquid cooling channel coupled to the receptacle housing and a fitting in flow communication with the liquid cooling channel. The pluggable module is receivable in the module cavity and has a pluggable body holding a module circuit board and a liquid cooling assembly coupled to the pluggable body. The liquid cooling assembly includes a liquid cooling channel in thermal communication with the pluggable body and a module fitting mated with the fitting of the receptacle assembly to couple the liquid cooling channel of the pluggable module in flow communication with the liquid cooling channel of the receptacle assembly.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 29, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alex Michael Sharf
  • Patent number: 11044829
    Abstract: The invention discloses a heat dissipation architecture. The heat dissipation architecture includes an electronic component, a flexible heat conductive film and a heat conductor. The flexible heat conductive film is disposed on the electronic component. The heat conductor includes a first portion and a second portion connected to the first portion. The first portion of the heat conductor is interposed in the flexible heat conductive film.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: June 22, 2021
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Chi-Jung Wu
  • Patent number: 11035621
    Abstract: One example aspect of the present disclosure is directed to a system for cooling a surface. The system can include a housing. The housing can include an evaporator portion. The housing can include at least one trifurcated heat exchange portion. The at least one trifurcated heat exchange portion can include a condenser portion coupled to the evaporator portion. The at least one trifurcated heat exchange portion can include a coolant portion substantially surrounded by the condenser portion. The at least one trifurcated heat exchange portion can include a phase change material portion substantially surrounding the condenser portion.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: June 15, 2021
    Assignee: GE Aviation Systems LLC
    Inventors: Stefano Lassini, Brian Rush, Daniel Erno, William Dwight Gerstler
  • Patent number: 11036264
    Abstract: Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Baosheng Zhang, Derek Kanas, Chan Park, Andrew Elsey
  • Patent number: 11038233
    Abstract: A battery cooling device for a vehicle is provided. The battery cooling device generates a continuous phase change of the refrigerant within an entire area of a refrigerant channel having a refrigerant flowing for cooling a battery module to maximize a cooling performance of all battery cells of the battery module, and enable even cooling of the battery cells.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: June 15, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Yoon Cheol Jeon
  • Patent number: 11036118
    Abstract: A heat dissipation module and a projection apparatus are provided. The heat dissipation module dissipates the heat generated by a plurality of heating elements, includes a heat pipe, a heat dissipation plate, a first and a second heat dissipation fins. The heat pipe includes a first portion of the heat pipe passes through the first heat dissipation fin and a second portion of the heat pipe passes through the second heat dissipation fin and a third portion connected with the first and the second portions. The third portion of the heat pipe and the heating elements are connected to the heat dissipation plate. The heat generated by the heating elements is dissipated by the heat dissipation plate, the first and the second heat dissipation fins through thermal conduction method and thermal convection method. The invention saves accommodating space in the projection apparatus and has an efficient heat dissipation effect.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: June 15, 2021
    Assignee: Coretronic Corporation
    Inventors: Wen-Yen Chung, Yi-Han Lai
  • Patent number: 11032949
    Abstract: An electronic rack includes an array of server shelves inserted into at least some of a plurality of standard slots of the electronic rack. Each server shelf contains one or more servers and each server includes one or more processors. At least some of the processors are mounted on cold plates for liquid cooling. The electronic rack further includes a liquid manifold shelf inserted into one of the standard slots. The liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port. The upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: June 8, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11026345
    Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 1, 2021
    Assignee: EXASCALER INC.
    Inventor: Motoaki Saito
  • Patent number: 11026343
    Abstract: A thermodynamic heat exchanger is an electronic device having one or more heat generating devices, a heat exchanging element, and one or more heat exhaust elements. The heat generating devices can be the active and passive electronics elements included within a power conversion circuit, such as a power adapter used to charge a cellular telephone or other type of consumer electronics device. The heat exchanging element is configured to accept radiated thermal energy from the heat generating devices and distribute the accepted thermal energy across an outer surface to evenly distribute hot spots corresponding to the individual heat generating devices. The heat exchanging element is also configured to minimize heat radiating from its outer surface, thereby blocking heat in the thickness of the thermally conductive material.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: June 1, 2021
    Assignee: Flextronics AP, LLC
    Inventors: Mark Telefus, Hongwei Du, Rowell Gapuz, Kevin Cui, Bahman Sharifipour, Laura Wen
  • Patent number: 11015615
    Abstract: Non-Volume displacement pumps used at nuclear power plants (NPP) in reactor coolant pump sets for the primary coolant circuit of the nuclear power system. The reactor coolant pump set comprising a vertical vane-type single-stage pump with bottom arrangement of the impeller, the pump shaft is connected to the electric motor shaft by a rigid coupling, the radial-axial bearing, installed in the electric motor upper chamber, is made of two main elements: a radial bearing made in the form of a rotor metallic bushing installed on the cylindrical part of the collar and an axial bearing consisting of two stator lever-type balance arm systems with cover plates of antifriction material and rotor cover plates of antifriction material. The radial-axial bearing is cooled by water from the NPP system, pressure head whereof is increased by the screw-type pump located on the upper butt of the radial-axial bearing collar.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 25, 2021
    Assignees: Joint Stock Company “Central Design Bureau of Machine Building”, Joint Stock Company “Science and Innovations” (“Science and Innovations”, JSC)
    Inventors: Vladimir Sergeevich Gerasimov, Andrey Vladimirovich Goronkov, Aleksandr Sergeevich Vasil'ev, Rodion Petrovich Kazantsev, Sergey Yur'evich Shchutskiy
  • Patent number: 10982684
    Abstract: The disclosure provides a centrifugal fan, including an enclosure, a spacer, and a fan blade rotor. The enclosure includes a top panel, a bottom panel, and a side wall connected between the bottom panel and the top panel. The top panel, the bottom panel, and the side wall together form a first air exhaust vent and a second air exhaust vent. The spacer is disposed in the enclosure, is connected between the bottom panel and the top panel, and spaces a first space in communication with the first air exhaust vent and a second space in communication with the second air exhaust vent in the enclosure. The spacer includes a first opening. The first opening is in communication with the first space and the second space. The fan blade rotor is rotatably disposed in the second space.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: April 20, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Patent number: 10982906
    Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: April 20, 2021
    Assignee: CELSIA TECHNOLOGIES TAIWAN, INC.
    Inventors: George A. Meyer, IV, Chien-Hung Sun
  • Patent number: 10969094
    Abstract: The invention relates to the technical field of stage lights, and in particular to a novel heat dissipation system, a stage light cap body and a waterproof stage light. The present invention discloses a heat dissipation system comprising a heat transfer substrate and a heat dispassion assembly positioned on one side of the heat transfer substrate, a first through hole being arranged on the heat transfer substrate and a displaceable unit used to open and close the first through hole being arranged on the heat dispassion assembly at a position corresponding to the first through hole. The heat dispassion system is simple in structure and convenient to use, and the light source assembly can be taken out for replacement or maintenance without completely removing the heat dispassion system and components alike on the bottom of the stage light cap body.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: April 6, 2021
    Assignee: GUANGZHOU HAOYANG ELECTRONIC CO., LTD.
    Inventor: Weikai Jiang