Abstract: This application discloses a heat dissipation structure for an optoelectronic module and an electronic device. The heat dissipation structure includes: an electronic chip; a plurality of optical engines, the plurality of optical engines being distributed along a periphery of the electronic chip; and a cold plate. The cold plate includes: a main cold plate for dissipating heat for the electronic chip; a secondary cold plate for dissipating heat for at least one of the plurality of optical engines; and a heat pipe assembly corresponding to the secondary cold plate. The heat pipe assembly includes at least one heat pipe, which has an evaporating end connected to the secondary cold plate and a condensing end connected to the main cold plate. The main cold plate is equipped with a flow channel for dissipating heat for the heat pipe assembly, and the secondary cold plate has a maintenance operation position.

Abstract: A cooling device includes a radiator, a tank, a circulation pipe, and a storage pool. The radiator dissipates heat of cooling medium. The tank stores the cooling medium. The circulation pipe allows the cooling medium to be conveyed from the radiator to the tank. The storage pool stores the cooling medium that has leaked from the tank. The tank includes a connector and a channel member. The connector connects the circulation pipe and the tank so that the circulation pipe communicates with an inside of the tank. The channel member guides the cooling medium leaking from the connector to the storage pool.

Abstract: A portable information handling system is assembled and disassembled by a keystone assembly that couples at an upper surface of the portable housing to overlap a keyboard assembly that covers processing components disposed in the portable housing. A motherboard couples to the portable housing under the keyboard assembly with openings aligned to insert over retaining nuts extending from the housing, the openings having a varied size so that the motherboard slides between released and engaged positions. A cooling fan couples to the motherboard adjacent to one side to retain the motherboard in the engaged position and is removed to allow the motherboard to slide to the released position.

Abstract: A heat-transfer system includes a cooling circuit configured to convey heated coolant from one or more cooling nodes to one or more heat-rejection devices, and to convey the cooled coolant from the one or more heat-rejection devices to the one or more cooling nodes. Each cooling node facilitates a transfer of heat to the coolant, the heat being from one or more heat-dissipation devices and a corresponding heat load on the respective cooling node. Each heat-rejection device facilitates heat transfer from the coolant to another medium. The heat-transfer system also has a selectively operable flow-control device configured to control a flow rate of the coolant through a segment of the coolant circuit. A control logic selectively operates the flow-control device responsive to an output from one or more sensors to tailor a cooling capacity available to each cooling node to the real-time heat load on the respective cooling node.

Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

Abstract: The present disclosure provides a battery pack control method, a system and a vehicle, wherein the vehicle includes a battery sensor, a heating module and a cooling module; when the vehicle is in a powered-off state, a battery sensor is firstly used to detect the current battery temperature value of the battery pack and the current state of the thermostatic control function of the battery pack; and when the current temperature value of the battery pack is out of a preset range and the thermostatic control function of the battery pack opens, the vehicle is waken up, and then the battery pack is thermostatic controlled, so that the temperature of the battery pack is maintained within the preset range, which facilitates the restarting and use of the vehicle.

Abstract: A heat exchanger core includes a core formed such that a pair of adjacent passages are folded on top of one another while being adjacent. At least one passage of the pair of adjacent passages has a pair of adjacent passage portions between which the other passage is not interposed in a direction in which the passages lie on top of one another. The core has a heat insulation layer between the pair of passage portions.

Abstract: The chiller system includes an internal circulation path, an external circulation path, and a control device. The internal circulation path is equipped with a refrigerant tank, an internal circulation pump, and a freezer. The external circulation path includes a feed path and a return path the feed path being equipped with an external circulation pump and a temperature sensor. A communication path that provides communication between the return path and the refrigerant tank is equipped with throttle means. The internal circulation path is equipped with an on-off control valve, with one end of the pressurizing path being connected to an upstream side of the on-off control valve in the internal circulation path and the other end being connected to an upstream side of the throttle part in the communication path. The control device controls operation of the on-off control valve based on a measurement result of the temperature sensor.

Abstract: This disclosure describes systems and methods for metal foam cooling of vehicle electronic. An example apparatus may include an electronic control unit (ECU) comprising an electronic component included within a housing. The example apparatus may also include a metal foam configured to dissipate heat produced by the electronic component and also configured to facilitate electromagnetic interference (EMI) shielding for the electronic component. The example apparatus may also include an interface between the ECU and the metal foam, wherein the interface provides a connection between the ECU and metal foam to facilitate heat dissipation from the electronic component to a location outside of the housing.

Abstract: A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Abstract: Provided is a heat pipe, which has a simple construction but an excellent heat transfer performance. A loop-type heat pipe (1) has a loop-shaped fluid moving route, in which an evaporation portion (2), a vapor-rich pipe portion (4), a condensation portion (3) and a liquid-rich pipe portion (5) are sequentially connected. A nozzle portion (6) and a diffuser portion (7) are formed in that loop-shaped fluid moving route. As a result, a difference is made between the forward fluid resistance and the backward fluid resistance of the loop-shaped fluid moving route, thereby to form a one-directional steam flow in the loop-shaped fluid moving route.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Efficiency of a battery module is achieved using an actively cooled high power electrical interface. The battery module comprises a plurality of battery cells, at least one busbar coupled to the battery cells, a connector electrically coupled to the at least one busbar, and at least one cooling component that is thermally coupled to the first connector. The battery cells may be arranged in two layers, each layer containing a plurality of battery cells connected by a busbar. The connector comprises a contact through which the battery module may be coupled to an external circuit. The at least one cooling component provided cooling for the battery cells and the connectors and may be placed on the surface of the battery module or between layers of battery cells.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more outlet reservoirs are associated with a stabilizing subsystem and a rack so that one or more outlet reservoirs can receive two-phase fluid that is outlet from a plurality of cold plates of a rack and so that a stabilizing subsystem can stabilize a quality factor of a two-phase fluid to a predetermined quality factor before heat is removed from a two-phase fluid and it is cycled to such cold plates.

Abstract: A battery pack including a battery pack housing, and a battery module disposed in the battery pack housing, Tire pack housing is sealed and flooded with a dielectric fluid. The battery module includes a module housing that is fluid permeable and includes a fluid passageway, and electrochemical cells disposed in the module housing in such a way that terminals of the cells are exposed to fluid disposed in the fluid passageway. The battery pack includes a thermal management system having an inlet plenum assembly disposed at a first end of the battery module, an outlet plenum assembly disposed at a second end of the battery module, and a fluid pump that directs fluid to the inlet plenum assembly via a fluid delivery line and receives fluid from the outlet plenum assembly via a fluid return line.

Abstract: A device and systems for cooling hardware components is disclosed. The smart cold plate (CP) device includes a first inlet port for supplying a first coolant path, a second inlet port for supplying a second coolant path, and a valve for selectively controlling a flow of a coolant between the first and second inlet ports and an internal port, the internal port connecting the first and second inlet ports to a CP. The device also includes an external port connected to the CP for removing the coolant from the smart CP device and a connector through which power is supplied to the valve. Various cooling systems incorporating the smart CP device are disclosed.

Abstract: A server rack, includes a separation chamber that has an input to receive a mixed two-phase fluid from a server chassis, a vapor output at a top portion of the separation chamber, and a liquid output at a bottom portion of the separation chamber. The server rack includes a condenser that is fluidly connected to the vapor output of the separation chamber to receive and condense the vapor to a liquid, and a main outlet that is fluidly connected to both the liquid output of the separation chamber and to a condenser output of the condenser. The main outlet of the server rack is fluidly connected to an external cooling system which supplies the liquid back to the server rack.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

Abstract: A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

Abstract: An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.

Abstract: An electric motor may include a stator assembly comprising a stator housing, and one or more rotors coupled to the stator by a rotor shaft assembly. The stator housing may include a cooling structure that has a plurality of cooling body portions and a plurality of cooling conduits defined by the plurality of cooling body portions. A method of forming a stator housing for an electric machine may include additively manufacturing a stator housing that includes a cooling structure defining a fluid domain, coupling a working fluid source to the stator housing and introducing a working fluid into the fluid domain defined by the cooling structure, and sealing the cooling structure with the working fluid contained within the fluid domain of the cooling structure.

Abstract: Embodiments may be directed to a codesigned shroud for a chassis comprising a plurality of components and a plurality of fans generating a plurality of airflows to cool the plurality of components. The codesigned shroud may have a plurality of walls defining a plurality of channels, wherein at least two walls of the plurality of walls define each channel of the plurality of channels. Each channel may be aligned with a direction of an airflow of the plurality of airflows. At least one channel includes a set of baffles oriented substantially perpendicular to the direction of an airflow in the channel. Each baffle may be formed with acoustically absorbent material to absorb acoustic energy that could affect performance of a component, wherein a first baffle of the set of baffles is offset from a second baffle of the set of baffles.

Abstract: A power supply control apparatus controls a temperature of a device having a cooling mechanism and a heat generating component. The power supply control apparatus includes a nonvolatile storage unit that stores information indicating a specific characteristic including a thermal resistance and a thermal capacity of the device for each current of the heat generating component, a current measurement unit configured to measure a current flowing through the heat generating component, a temperature measuring unit configured to measure a current temperature of the heat generating component, and a control unit configured to perform cooling control on the device. The control unit estimates a temperature rise value after a certain delay time based on the current, the temperature, and the information on the specific characteristic, and performs the cooling control on the device based on an estimated temperature after the delay time.

Abstract: A power conductor for conducting electricity between a power source and a load is disclosed. A conductive body connects between the power source and the load. A sealed chamber is provided in the interior of the conductive body and contains a working fluid for changing phase when heated. A circuit, a vehicle power distribution circuit, and a vehicle incorporating the same are also disclosed.

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

Abstract: In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main chamber; a first elongate chamber extending laterally from a first side of the main chamber; and a second elongate chamber extending laterally from a second, opposite side of the main chamber. The vapor chamber further includes a first capillary structure lining a first interior surface of the sealed enclosure, and a second capillary structure lining a second, opposite interior surface of the sealed enclosure. Distal portions of the first elongate chamber and the second elongate chamber are configured as reservoirs that store an excess volume of a working fluid in a liquid state when a heat source is in a first operating state, and release the excess volume of the working fluid towards the main chamber when the heat source is in a second operating state.

Abstract: A system is provided for collection, detection and containment of leaked liquid. The system may include a spout connected to a liquid cooling manifold for channeling liquid. The system may also include a collection tray positioned under the spout and configured to contain the liquid from the spout. The system may further include a leak detection rope having a first end coupled to the liquid cooling manifold, a middle portion extending along the spout, and a second end placed inside the collection tray for detection of liquid.

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.

Abstract: A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.

Abstract: An apparatus and system are provided for detecting coolant leaks from connections to rack-mounted devices and managing the leak by directing liquid away from sensitive electrical components. On each device, a pan is connected to liquid couplings found on the rear of the device. A sensor tape is attached to a vertical section of the rack, e.g., on the coolant supply lines or housing. The pan collects leakage from the couplings and directs the leakage to the sensor tape, which is connected to a control unit. Upon liquid contacting the sensor tape, the control unit signals the detection of a leak. To prevent false positives due to incidental leakage, e.g., mere drops leaked upon connection to the coolant system, the pan may include a texture in the pan surface that retains a small amount of fluid.

Abstract: Examples of hybrid cooling System for datacenters are disclosed. In an example, the hybrid cooling system includes a chiller plant to provide supply of coolant, an air-cooling unit (ACU), and a coolant distribution line. The coolant distribution line comprises a first portion, a second portion, and a third portion in series fluid communication. The ACU receives supply of the coolant from the chiller plant via the first portion. The hybrid cooling system further includes a coolant distribution unit (CDU) coupled to an electronic component in the data hall. The ACU and the CDU are in series fluid communication via the second portion of the coolant distribution line and the coolant egressing the ACU passes through the second portion to be fed back to the CDU. The hybrid cooling system includes a heat exchanger in series fluid communication with the CDU via the third portion of the coolant distribution line.

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: Temperature uniformity in a mounting surface of a mounting table is improved. A plasma processing apparatus includes a mounting table having thereon a mounting surface on which a work-piece serving as a plasma processing target is mounted; a coolant path formed within the mounting table along the mounting surface of the mounting table; an inlet path connected to the coolant path from a backside of the mounting surface of the mounting table and configured to introduce a coolant into the coolant path; and a thermal resistor provided in a region, facing a connection portion between the inlet path and the coolant path, of an inner wall of the coolant path.

Abstract: The disclosure provides an airflow regulation and control apparatus. A ventilation hole is formed in a windshield in a penetrating manner; a rectangular plate is mounted on the windshield; the rectangular plate is lifted by means of power provided by a lifting wing disposed thereon, and the height of the rectangular plate when moving upwards exceed the height of an upper edge of a main body portion of the windshield; when wind strength is low, the rectangular plate is located at a lower portion under the action of gravity and shields the ventilation hole; when the wind strength is increased, the lifting wing is blown by an airflow to generate upwards lifting force, and drives the rectangular plate to moved upwardly so as to shield an opening in an upper portion of the windshield and block the airflow.

Abstract: A turbine engine may include a compressor section of the turbine engine. The turbine engine may include a combustion section of the turbine engine. The combustion section may be downstream of the compressor section. The turbine engine may include a turbine section of the turbine engine. The turbine section may be downstream of the combustion section. The turbine engine may include a sensor for speed detection. The sensor may be disposed at an upstream segment of the turbine section. The sensor may include a cooling jacket. The cooling jacket may encase at least a portion of the sensor. A cooling fluid may be in fluid communication with the cooling jacket and an outer surface of the sensor. The cooling jacket may be shaped to direct cooling fluid around the sensor.

Abstract: A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.

Abstract: An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.

Abstract: In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.

Abstract: An outdoor unit of an air-conditioning apparatus includes: a housing; a heat exchanger provided in the housing; an electric component box provided in the housing; and a separator that partitions the inside of the housing into a first chamber and a second chamber. The separator is provided on a front surface of the heat exchanger. The first chamber and the second chamber are provided side by side in a lateral direction as viewed in a side-on view of the outdoor unit. The electric component box is provided on the front surface of the heat exchanger and above the separator. The outdoor unit includes a first positioning member and a second positioning member. The first positioning member is provided on the electric component box, and determines the position of the electric component box in a vertical direction and a front-rear direction relative to the heat exchanger.

Abstract: An radiator includes a radiator body. A first side of the radiator body defines an arc-shaped heat conducting surface. A second side of the radiator body defines a heat dissipating tooth area. The heat dissipating tooth area includes a middle heat dissipating tooth area and two trunk heat dissipating tooth areas symmetrically arranged on two sides of the middle heat dissipating tooth area. A plurality of first heat dissipating fins is arranged in the middle heat dissipating tooth area. Each of the trunk heat dissipating tooth areas includes a trunk and a plurality of second heat dissipating fins. Each trunk is obliquely arranged on the radiator body. The plurality of second heat dissipating fins is arranged on one side of a corresponding trunk away from the plurality of first heat dissipating fins.

Abstract: A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.

Abstract: In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.

Abstract: A packaging method of heat spreaders includes the following steps. Arrange a plurality of heat spreaders and a plurality of gaskets alternately to a container, wherein at least one of the gaskets is arranged between any immediately-adjacent two of the most adjacent heat spreaders. Remove all of the gaskets from the container at the same time. A packaging box suitable for this packaging method is also provided.

Abstract: A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

Abstract: A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, 10 prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using a non-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members.

Abstract: A transportable container is enabled with radio frequency identification (“RFID”) technologies to maintain automated inventory levels of those items that are inside the container. The inventory data is communicated via wireless methods, such as cellular or Wi-Fi, to a remote device such as enterprise resource planning (“ERP”) system. The ERP system may use the inventory data received from the remote device to automatically update appropriately and generate appropriate records (e.g., container inventory, restocking, invoicing, etc.). In some embodiments, automated RFID scans are triggered when the container is opened and subsequently closed. The container may include RF containment/screening to prevent inadvertent scanning of RFID tags outside of the container. The container may also include a location device to allow the location of the container to be readily determined.

Abstract: A traction battery assembly includes a thermal exchange device of a battery pack, and battery arrays disposed adjacent the thermal exchange device. A phase change material is secured to an area of the thermal exchange device. A method of managing thermal energy within a battery pack includes, among other things, positioning battery arrays against a thermal exchange device, and securing a phase change material to the thermal exchange device. The phase change material is configured to take on thermal energy from at least one of the battery arrays.

Abstract: A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.