Abstract: Temperature uniformity in a mounting surface of a mounting table is improved. A plasma processing apparatus includes a mounting table having thereon a mounting surface on which a work-piece serving as a plasma processing target is mounted; a coolant path formed within the mounting table along the mounting surface of the mounting table; an inlet path connected to the coolant path from a backside of the mounting surface of the mounting table and configured to introduce a coolant into the coolant path; and a thermal resistor provided in a region, facing a connection portion between the inlet path and the coolant path, of an inner wall of the coolant path.

Abstract: The disclosure provides an airflow regulation and control apparatus. A ventilation hole is formed in a windshield in a penetrating manner; a rectangular plate is mounted on the windshield; the rectangular plate is lifted by means of power provided by a lifting wing disposed thereon, and the height of the rectangular plate when moving upwards exceed the height of an upper edge of a main body portion of the windshield; when wind strength is low, the rectangular plate is located at a lower portion under the action of gravity and shields the ventilation hole; when the wind strength is increased, the lifting wing is blown by an airflow to generate upwards lifting force, and drives the rectangular plate to moved upwardly so as to shield an opening in an upper portion of the windshield and block the airflow.

Abstract: A turbine engine may include a compressor section of the turbine engine. The turbine engine may include a combustion section of the turbine engine. The combustion section may be downstream of the compressor section. The turbine engine may include a turbine section of the turbine engine. The turbine section may be downstream of the combustion section. The turbine engine may include a sensor for speed detection. The sensor may be disposed at an upstream segment of the turbine section. The sensor may include a cooling jacket. The cooling jacket may encase at least a portion of the sensor. A cooling fluid may be in fluid communication with the cooling jacket and an outer surface of the sensor. The cooling jacket may be shaped to direct cooling fluid around the sensor.

Abstract: A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.

Abstract: An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.

Abstract: In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.

Abstract: An outdoor unit of an air-conditioning apparatus includes: a housing; a heat exchanger provided in the housing; an electric component box provided in the housing; and a separator that partitions the inside of the housing into a first chamber and a second chamber. The separator is provided on a front surface of the heat exchanger. The first chamber and the second chamber are provided side by side in a lateral direction as viewed in a side-on view of the outdoor unit. The electric component box is provided on the front surface of the heat exchanger and above the separator. The outdoor unit includes a first positioning member and a second positioning member. The first positioning member is provided on the electric component box, and determines the position of the electric component box in a vertical direction and a front-rear direction relative to the heat exchanger.

Abstract: An radiator includes a radiator body. A first side of the radiator body defines an arc-shaped heat conducting surface. A second side of the radiator body defines a heat dissipating tooth area. The heat dissipating tooth area includes a middle heat dissipating tooth area and two trunk heat dissipating tooth areas symmetrically arranged on two sides of the middle heat dissipating tooth area. A plurality of first heat dissipating fins is arranged in the middle heat dissipating tooth area. Each of the trunk heat dissipating tooth areas includes a trunk and a plurality of second heat dissipating fins. Each trunk is obliquely arranged on the radiator body. The plurality of second heat dissipating fins is arranged on one side of a corresponding trunk away from the plurality of first heat dissipating fins.

Abstract: A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.

Abstract: In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.

Abstract: A packaging method of heat spreaders includes the following steps. Arrange a plurality of heat spreaders and a plurality of gaskets alternately to a container, wherein at least one of the gaskets is arranged between any immediately-adjacent two of the most adjacent heat spreaders. Remove all of the gaskets from the container at the same time. A packaging box suitable for this packaging method is also provided.

Abstract: A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.

Abstract: A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, 10 prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using a non-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members.

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

Abstract: A transportable container is enabled with radio frequency identification (“RFID”) technologies to maintain automated inventory levels of those items that are inside the container. The inventory data is communicated via wireless methods, such as cellular or Wi-Fi, to a remote device such as enterprise resource planning (“ERP”) system. The ERP system may use the inventory data received from the remote device to automatically update appropriately and generate appropriate records (e.g., container inventory, restocking, invoicing, etc.). In some embodiments, automated RFID scans are triggered when the container is opened and subsequently closed. The container may include RF containment/screening to prevent inadvertent scanning of RFID tags outside of the container. The container may also include a location device to allow the location of the container to be readily determined.

Abstract: A traction battery assembly includes a thermal exchange device of a battery pack, and battery arrays disposed adjacent the thermal exchange device. A phase change material is secured to an area of the thermal exchange device. A method of managing thermal energy within a battery pack includes, among other things, positioning battery arrays against a thermal exchange device, and securing a phase change material to the thermal exchange device. The phase change material is configured to take on thermal energy from at least one of the battery arrays.

Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.

Abstract: A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

Abstract: Disclosed is a heat dissipation device including a base, a plurality of heat pipes and a heat dissipation structure. The base includes a support plate, a plurality of through-pipe grooves are arranged in the support plate. Each heat pipe includes a heat absorption section and a heat transfer section connected to the heat absorption section, where the heat absorption section is arranged in the through-pipe grooves and at least one heat transfer section of the heat pipe is away from the support plate in the perpendicular direction to the support plate. The heat dissipation structure is arranged on the first surface of the support plate, and the heat transfer section of the plurality of heat pipes extends into the interior of the heat dissipation structure and thermally contacts the heat dissipation structure. The heat dissipation device of the present disclosure dissipates heat faster.

Abstract: A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.

Abstract: The present invention relates to a 3D bioprinter. The 3D bioprinter, according to the present invention, comprises: a case inside of which a work space is provided; a printing plate installed inside of the case so as slide in the forward, backward, left, and right directions; a first nozzle installed inside the case for dispensing a biomaterial in a solid state on the printing plate; a second nozzle installed inside the case for dispensing a biomaterial in a liquid state on the printing plate; and a control unit for controlling the dispensing by the first nozzle and the second nozzle, wherein the first nozzle and the second nozzle are used to print a single structure by stacking the biomaterial in the solid state and the biomaterial in the liquid state.

Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Abstract: Disclosed is a liquid crystal display device including: a liquid crystal display panel for displaying an image; a backlight unit for irradiating light toward a rear surface of the liquid crystal display panel; a cover bottom formed therein with a space in which the liquid crystal display panel and the backlight unit are installed; and a glass attached to a front surface of the liquid crystal display panel to protect the liquid crystal display panel, wherein the liquid crystal display panel and the backlight unit are spaced apart from each other so that air moves through a space between the liquid crystal display panel and the backlight unit. Accordingly, a sealed space is formed inside the liquid crystal display device, and the air inside the sealed space is circulated, so that thermal equilibrium is induced inside the sealed space.

Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Abstract: According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.

Abstract: A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.

Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.

Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

Abstract: As air inside a building (e.g., a data center or any building that generates heat) becomes heated, it rises and is received or captured by a heat containment and then expelled from the building. The hot air is not recycle, recirculated, or re-cooled. Hot air being expelled from the building creates a pressure differential in which the pressure at the hot side of the building (where the heat containment is located) is lower than the cool side of the building. To this end, a chilling unit is installed at an opening of a building to supply cooled air at a constant rate. The chilling unit does not have an internal controller. Rather, an air conditioning (AC) unit of the building acts as an external controller. The AC unit is be set to maintain a target temperature and only runs when the temperature inside the building is above the target temperature.

Abstract: The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.

Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port. The connector includes a heat sink that is configured to cool a module inserted into the connector port.

Abstract: An outdoor unit includes a casing with an inlet in a back surface and an outlet in a front surface, a fan in the casing which draws air in the inlet and blows air out the outlet, a compressor in the casing, and a partition plate partitioning the interior into a machine room with the compressor and a blower room with the fan. A control board is installed horizontally on top of the partition plate across the machine room and the blower room, an electric component box covers the control board, a heat-generating component on the blower room side of the control board drives the compressor and the fan, and a cooler connects to the heat-generating component and includes fins exposed from the electric component box. A curved vertical separation surface is between the electronic component and the blower room, and between the electronic component and the back surface.

Abstract: A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

Abstract: Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material.

Abstract: The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.

Abstract: Methods, systems, and device for thermal energy storage are provided. For example, some embodiments include a thermal energy storage device that may include: a first casing wall; a second casing wall; and/or multiple support structures located between the first casing wall and the second casing wall. The multiple support structures may provide continuous thermal paths and/or continuous mechanical paths between the first casing wall and the second casing wall. The thermal energy storage device may be fabricated utilizing an additive manufacturing technique, such as direct laser metal sintering. Some embodiments may be manufactured utilizing printed metals, such as an aluminum alloy. In some embodiments, a phase-change material is charged between the first casing wall and the second casing wall. The phase-change material may include paraffin.

Abstract: A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

Abstract: An environmental control system is provided. The environmental control system can include a heat absorption device and a heat rejection device positioned in containment areas and a reservoir. The containment areas can contain leaks that may occur in the environmental control system and direct the fluid into the reservoir. The reservoir can include an opening that can allow the environmental control system to operate as a low pressure system.

Abstract: A forced double-circuit air cooling system designed for using in a sealed cabinet structure. A first air circuit is formed by an air loop moved around each of local modules (3; 4) of a sealed compartment [2] with using a circulation fan (26) which is installed within a sealed air channel [28]. The first air circuit is formed within an internal air channel (18) of the sealed compartment [2]. Wherein the internal air channel is connected to a number of air heat exchangers [22]. A first pair [22.1] of said number of air heat exchangers is equipped with the circulation fan [26]. Wherein a second air circuit [25] contains straight air channels [23] arranged within the ventilated compartment [24] adjacent to the sealed compartment [2]. Each of said straight air channels [23] comprising a second pair [22.2] of air heat exchangers with a blast fan [27] between them.

Abstract: Systems, apparatuses, and methods for efficiently performing active thermal control during device testing are disclosed. A device testing system includes a device under test, a thermal structure on top of the device under test, and a controller configured to determine when to apply and remove thermal energy to the device under test through the thermal structure. The thermal structure includes a thermal transfer block that transfers thermal energy to and from the device under test below the thermal transfer block. The thermal structure also includes a coolant block above the thermal transfer block that removes thermal energy from the thermal transfer block. There is no heating element between the coolant block and the thermal transfer block. Rather, the thermal structure includes a heating element in a wall of the thermal transfer block. Therefore, an unobstructed thermal path exists from the device under test to the coolant block.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

Abstract: A method for designing startup critical tube diameter of pulsating heat pipe in vertical state, including the following steps: step 1. establishing a first model of working medium mass in pulsating heat pipe; step 2. establishing a second model of working medium mass in pulsating heat pipe, the second model including the vapor working medium mass model and the liquid working medium mass model in the pulsating heat pipe; step 3. according to the law of conservation of mass, combining the first model and the second model, and determining the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition; step 4.

Abstract: A substation contains a switchgear or controlgear, in particular at least one low voltage switchgear or controlgear configured for unmanned operation and maintenance. An inner room, where the switchgear or controlgear are located in, is hermetically enclosed by an outer housing. The inner room is locked against the outer housing by an inner, automatically operated door. A robot system is implemented such that the robot system's acting area is extended from the inner room, partly in the area outside the inner room, but inside the outer housing, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: A heat-wing includes: a sealed hollow chamber including two plates and a frame connecting the two plates; a capillary structure layer closely attached to an inner surface of the chamber; and a phase transition working medium sealed in the chamber. A portion of the frame or a portion of a periphery of one of the two plates serves as an evaporation area of the heat-wing, and the rest portion of the chamber serves as a condensation area of the heat-wing. The heat-wing has an increased vapor passage area, liquid working medium flow-back passage width and condenser heat transfer area and a reduced evaporator center-to-edge distance, and is hence capable of achieving a great improvement in heat transfer limit and heat flux density.

Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover.