Cooling Electrical Device Patents (Class 165/104.33)
  • Patent number: 10447116
    Abstract: An electric motor includes a stator having a tubular shape, a rotor rotatable around a rotary axis and having a rotary spindle, a first housing part disposed so as to partially house the rotary spindle, a second housing part disposed at the other end of the stator in the rotary axis direction, a third housing part at a side opposite to the first housing part in the rotary axis direction with respect to the second housing part, a plurality of ventilation parts formed so as to communicate with at least the stator, the second housing part, and the third housing part, and a plurality of fans for ventilating the plurality of ventilation parts, the plurality of fans being disposed in the third housing part on a plane perpendicular to the rotary axis so as not to overlap the rotary axis.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: October 15, 2019
    Assignee: FANUC CORPORATION
    Inventor: Yasuyuki Nakazawa
  • Patent number: 10443960
    Abstract: A heat dissipating apparatus has a phase change material evaporator, a condenser, a refrigerant output tube, and a refrigerant input tube. The evaporator has a base having an evaporation chamber, a refrigerant inlet and a refrigerant outlet, a reinforcement panel mounted in the evaporation chamber and dividing the evaporation chamber into two spaces, and multiple heat conduction fins separately arranged in the two spaces. An opening area of the refrigerant outlet is larger than an opening area of the refrigerant inlet. The evaporator, the refrigerant output tube, the condenser and the refrigerant input tube form a closed refrigerant circulation loop with a refrigerant filled therein. Gas pressure of a gas-phased refrigerant in the two spaces can be increased. With pressure difference between the refrigerant outlet and the refrigerant inlet, the gas-phased refrigerant can be accelerated to flow toward the refrigerant outlet and flowability of the refrigerant can be increased.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 15, 2019
    Assignee: Man Zai Industrial Co., Ltd.
    Inventors: Cheng-Chien Wan, Cheng-Feng Wan, Hao-Hui Lin, Tung-Hsin Liu, Wei-Che Hsiao, Hsiao-Ching Chen, Dhao-Jung Lin
  • Patent number: 10446734
    Abstract: A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: October 15, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Philip L. Hower
  • Patent number: 10446192
    Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: October 15, 2019
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Kenji Hirose, Kazuto Nakagawa, Shinya Tsuchida, Yasuhiro Ootori
  • Patent number: 10433465
    Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: October 1, 2019
    Assignee: Dell Products L.P.
    Inventors: Travis Christian North, David Michael Meyers, Shawn Paul Hoss, Austin Michael Shelnutt
  • Patent number: 10429907
    Abstract: A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: October 1, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Yuji Saito, Mohammad Shahed Ahamed, Makoto Takahashi, Akihiro Takamiya
  • Patent number: 10433462
    Abstract: There is disclosed a digital signage including a display panel, a housing having the display panel arranged in one surface, the housing comprising a closed inner space, a cooling unit provided in a predetermined portion of the housing, the cooling unit comprising a hole configured to suck and exhaust external air, a heat pipe comprising one end positioned in the inner space of the housing to be coupled to a back surface of the display and the other end positioned in the cooling unit, with a liquid flowing therein to move heat, and a driving circuit board coupled to a back surface of the heat pipe to control driving of the display panel, such that the digital signage having a slim design can exhaust the heat generated from a display panel and a driving circuit board effectively.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: October 1, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Donghee Yoon, Injae Chin, Dongjune Kim, Sungwook Han, Jiyong Lee
  • Patent number: 10433458
    Abstract: Cold plates are described herein. In one example, a cold plate can include a thermally conductive plastic forming a coolant channel that includes a heat spreader formed into the thermally conductive plastic and an exterior surface of the thermally conductive plastic with a coupling location to couple a heat pipe to the exterior surface of the thermally conductive plastic.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: October 1, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Tahir Cader, Harvey Lunsman
  • Patent number: 10426057
    Abstract: A system, according to one embodiment, includes: a first frame of an automated tape library, wherein an interior of the first frame includes one or more tape drives, an area for storing tape cartridges, and an accessor channel, and a first air conditioning unit coupled to the first frame. The first air conditioning unit is configured to cool the interior of the first frame. Moreover, one or more fans of the one or more tape drives are configured to generate air flow within the interior of the first frame. Other systems, computer-implemented methods, and computer program products are described in additional embodiments.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: September 24, 2019
    Assignee: International Business Machines Corporation
    Inventors: Leonard G. Jesionowski, Michael P. McIntosh, Shawn M. Nave
  • Patent number: 10414286
    Abstract: A hybrid power control unit for a vehicle according to the present disclosure includes: a capacitor module; first and second coolers disposed on opposite sides of the capacitor module, the coolers including flow paths extending along lengthwise directions of the capacitor module; a plurality of power modules each being installed between the branch flow paths of one of the first and the second coolers; a low DC-DC converter (LDC) module disposed on one of the first and second coolers to be in contact with a remaining one of the branch flow paths of the cooler having the LDC module; a gate board having a top surface being electrically connected to the power modules; and a control board having a top surface being electrically connected to the gate board and the LDC module.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: September 17, 2019
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Sang Chan Jeong
  • Patent number: 10418071
    Abstract: A data storage library system includes at least one data storage library, the at least one data storage library comprising at least one library frame, wherein the at least one library frame has at least one environmental conditioning unit configured to control one or more environmental conditions within the at least one library frame. The system also includes at least one access door for providing access to an interior portion of the at least one library frame, a library controller, and at least one louver, where the louver may be selectively moveable to control a communication pathway for external air to enter the at least one library frame. In one embodiment, the at least one louver may be controlled by the library controller to automatically open when it is detected that the one or more access doors are opened, and to close the louver when the one or more access doors are closed.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: September 17, 2019
    Assignee: International Business Machines Corporation
    Inventors: Ernest S. Gale, Icko E. T. Iben, Leonard G. Jesionowski, James M. Karp, Michael P. McIntosh, Shawn M. Nave, Lee C. Randall
  • Patent number: 10415858
    Abstract: An apparatus for air-conditioning of watercraft and the like including: an electronically controlled variable-r.p.m. compressor, a main gas/water condenser (5), at least one environmental heat-exchanger (3) with an electronically controlled fan (14), at least one electronically controlled expansion valve (8), and at least one first electronic control unit (4) programmed for calculating continuously a temperature deviation detected (DeltaT=T_ad?T_a), and as a function of the temperature deviation regulating in combination, the r.p.m. of the compressor (1), opening of the flow valve (8), and the r.p.m. of the fan of the heat-exchanger (3).
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: September 17, 2019
    Inventor: Maurizio Tropea
  • Patent number: 10412860
    Abstract: An apparatus includes an electrically-powered component, a hermitically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermitically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: September 10, 2019
    Assignee: Heatmine LLC
    Inventors: Wendi Goldsmith, James M. Kramer
  • Patent number: 10409340
    Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: September 10, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Patent number: 10403328
    Abstract: To provide enhanced operation of data storage devices and systems, various systems and apparatuses are provided herein. In a first example, a data storage assembly includes an enclosure configured to house at least one data storage device and a fan assembly configured to provide airflow within the enclosure to ventilate the at least one data storage device. A plurality of acoustic waves emanate into the data storage device from one or more fans of the fan assembly during operation. An acoustic attenuation device is positioned within the enclosure and configured to deflect at least a first portion of the plurality of acoustic waves away from the at least one data storage device and absorb a portion of acoustic wave energy of at least a second portion of the plurality of acoustic waves.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: September 3, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Thomas R. Albrecht, Darya Amin-Shahidi, Toshiki Hirano, Hussam Zebian
  • Patent number: 10401448
    Abstract: An apparatus includes: a getter material (310) disposed within a vacuum chamber (210) to absorb stray molecules within the vacuum chamber; a thermal mass (340) disposed adjacent the getter material and in thermal communication with the getter material; a cold station (312) disposed within the vacuum chamber above the thermal mass; and a convective cooling loop (310) connected between the thermal mass and the cold station and configured to convectively cool the thermal mass when the cold station is at a lower temperature than the thermal mass, and to thermally isolate the thermal mass from the cold station when the cold station is at a higher temperature than the thermal mass. The thermal mass may be water ice and may be thermally isolated from the walls of vacuum chamber by low loss support links (360, 362, 364) and/or thermal reflective shielding.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: September 3, 2019
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Philip Alexander Jonas, Matthew Voss, Philippe Abel Menteur
  • Patent number: 10393360
    Abstract: A luminaire including a housing made of thermally conductive material having a top, a bottom and two opposite sides connecting the top to the bottom, each side having plurality of external, vertically spaced, substantially parallel cooling fins that extend longitudinally and project laterally outwardly of the housing, preferably at a shallow downward and outward angle. The housing configuration provides a large surface area per unit of housing length to optimize heat dissipation. A configurable, cartridge-like LED bezel assembly—readily replaceable in the field—is supported on the bottom of the housing. A driver for the LED assembly—also readily replaceable in the field—is located within the housing.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: August 27, 2019
    Assignee: Hubbell Incorporated
    Inventors: Christopher Bailey, Adam Clark, Perry Romano
  • Patent number: 10398065
    Abstract: Approaches presented herein enable cooling a data center with a cooling system having a relatively high coolant temperature. This cooling system is controlled by a building management system and includes piping through which coolant flows, an air cooling unit in thermal contact with the coolant, and a chiller to cool the coolant to a temperature between 18 and 22 degrees Celsius as instructed by the building management system. The building management system uses a chiller controller to vary the chilling of coolant within a range of 18-22 degrees Celsius, thereby controlling the air temperature within the data center to within a required temperature range. Because the building management system maintains the coolant temperature to 18-22 degrees Celsius, the cooling system can be simplified by excluding typical cooling system components such as variable flow control valves and their controllers. This simplification decreases the need for maintenance and reduces operating cost.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Wally Karrat, Lin Heng Lee, Daniel Pare
  • Patent number: 10388589
    Abstract: The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: August 20, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tatsuya Kawase, Mikio Ishihara, Noboru Miyamoto, Yosuke Nakata, Yuji Imoto
  • Patent number: 10388810
    Abstract: A power electronics assembly includes a cooling chip having a first subassembly and a second subassembly. The cooling chip includes a first metallization layer and a second metallization layer on a portion of a first surface of the cooling chip, an inlet through a second surface of the cooling chip opposite to the first surface, an outlet through the second surface, and one or more micro-channels extending between and fluidly coupled to the inlet and the outlet. The first subassembly includes a light source coupled to a first electrode and the first metallization layer, which provides a second electrode. The light source is configured to receive an electrical signal and operable to produce light in response to the electrical signal. The second subassembly includes one or more wide band gap semiconductor photonic cores acting as an electric switch positioned to receive the light produced by the light source.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: August 20, 2019
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventor: Ercan M Dede
  • Patent number: 10389078
    Abstract: A cooling system for a rotorcraft laser system is provided. The cooling system includes at least one laser carrying component operatively coupling a laser turret and a laser generating assembly. The cooling system also includes at least one fuel line fluidly coupled to a fuel tank containing a fuel. The cooling system further includes a heat exchanger containing a portion of the laser carrying component and the fuel line to transfer heat therebetween to cool the laser carrying component.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: August 20, 2019
    Assignee: SIKORSKY AIRCRAFT CORPORATION
    Inventors: Alfred Russell Smiley, Panagiotis Koliais, Timothy Fred Lauder, Mark R. Alber
  • Patent number: 10386896
    Abstract: The present invention discloses a water cooling system for a computer, which includes a radiator, a cooling block in fluid communication with the radiator, and a liquid storage tank in fluid communication with the radiator and the cooling block. The radiator, the cooling block and the liquid storage tank are of an integrated structure. The water cooling system of the invention has an integrated structure which does not require user to assemble the components, thereby avoiding incidents such as liquid leakage. The water cooling system is provided with the liquid storage tank that is at least partially exposed outside a water cooling case, thereby increasing the amount of a cooling liquid, improving the heat dissipating efficiency, enabling a user to easily observe the amount of the cooling liquid, and improving the appearance of the water cooling case.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: August 20, 2019
    Assignee: Beijing Deepcool Industries Co., Ltd.
    Inventors: Weichao Li, Haibo Yu, Edward Xia, Lei Liu, Heng Li
  • Patent number: 10390458
    Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 20, 2019
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Lyle Rick Tufty, Gary Allan Reed, Sean Michael Archer, Rafael Alba
  • Patent number: 10374271
    Abstract: An exemplary battery cell support structure includes a thermal exchange plate, and a plurality of support fins providing a cavity to receive a battery cell assembly. The plurality of support fins extend directly from the thermal exchange plate. An exemplary method of supporting a battery cell within a battery pack includes positioning a battery cell assembly within a cavity provided by a plurality of support fins extending directly from a thermal exchange plate.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: August 6, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Eric Poirier, Benjamin A. Tabatowski-Bush
  • Patent number: 10375859
    Abstract: A ganged shielding cage assembly include a plurality of passageways that allows modules to be inserted into the assembly. Walls between the passageways have a heat transfer passages that extends between the front and back ends and allows for coolant to flow through the assembly. Because of the dimensions, heat can be transferred from an inserted module to the walls and then to the coolant flowing through the heat transfer passages.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: August 6, 2019
    Assignee: Molex, LLC
    Inventor: Christopher D. Wanha
  • Patent number: 10371457
    Abstract: A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 6, 2019
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Hong-Long Chen, Chun-Yi Lee
  • Patent number: 10368430
    Abstract: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: July 30, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chun-Ching Ho, Hsin-Hung Chen
  • Patent number: 10359035
    Abstract: An air agitator assembly for use with a heat-emitting object, where the air agitator assembly includes a perforated flexible plate confronting and spaced from a portion of the heat-emitting object to define an air space there between and at least one piezoelectric structure located on the perforated flexible plate and operably coupled to a power source.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: July 23, 2019
    Assignee: GE AVIATION SYSTEMS LLC
    Inventors: Michel Engelhardt, Shushanna Rebecca Cherian-Brutus
  • Patent number: 10362703
    Abstract: An electric motor inverter includes at least one DC-link capacitor that has contacting layers. The electric motor inverter also includes circuit breakers which are mounted on at least one substrate, and capacitor connecting plates which are attached with first sections to the contacting layers. Second sections of the capacitor connecting plates which are arranged opposite the first sections are attached to the at least one substrate.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: July 23, 2019
    Assignee: CPT Zwei GmbH
    Inventors: Christoph Blösch, Bjoern Toberer
  • Patent number: 10362713
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: July 23, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Patent number: 10356891
    Abstract: A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jung-Hoon Kim
  • Patent number: 10354938
    Abstract: A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing “short path cooling” technology. The “short path cooling” technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said “short path cooling” technology.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: July 16, 2019
    Assignee: Greentech LED
    Inventors: Frank Albert Bilan, Nhien Trang
  • Patent number: 10355503
    Abstract: A mobile device auxiliary battery is disclosed. The mobile device auxiliary battery can supply electric current to the mobile device. A processing device associated with the auxiliary battery may be wirelessly connected to the mobile device, such as with a Bluetooth interface, and thereby control operational aspects of the battery, including for example control over supplying power to the mobile device. The auxiliary battery may be part of a charging system or kit that includes a uniquely designed separate charger or part of a protective case. In yet another aspect, the protective case may include unitary bumper flexible bumper co-molded to the body of the case and a male connector extending from a nested portion that is adapted to tilt outward from the case to facilitate insertion of the corresponding female port on the mobile device into the connector and into the case.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: July 16, 2019
    Assignee: Incipio, LLC
    Inventors: Andy Fathollahi, Yu Ta Lin, Jin Woo Choi
  • Patent number: 10354356
    Abstract: Systems and methods are provided that may be implemented to electronically link together and cool multiple graphics boards (also known as graphics cards) within an information handling system chassis, such as notebook computer chassis. The multiple graphics boards may be positioned at different levels relative to each other, and may be mounted separate from the main board (e.g., motherboard) in order to achieve a reduced total projective printed circuit board (PCB) area for the combination of the multiple graphics boards and main board. The multiple graphics boards may be stacked on opposite sides of the same thermal cooling module to allow a common thermal cooling module to simultaneously cool a GPU of each of the multiple linked graphics boards, as well as one or more other processors (e.g., central processing units and/or chipsets) mounted to the main board of the system.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: July 16, 2019
    Assignee: Dell Products L.P.
    Inventors: Chih-Tsung Hu, Yu Sheng Chang
  • Patent number: 10349555
    Abstract: A system for immersion cooling computing system equipment includes a container, a volume of cooling liquid disposed in the container, a computing system equipment holder disposed in the volume of cooling liquid and a liquid-liquid heat exchanger attached to and supported by the computing system equipment holder. The liquid-liquid heat exchanger is disposed in the volume of cooling liquid.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: July 9, 2019
    Assignee: CGG SERVICES SAS
    Inventors: Edward Joseph Barragy, Cemil Ozyalcin
  • Patent number: 10349557
    Abstract: An electronics rack comprising a first cage, a first heat sink positioned at a rear and in thermal communication with the first cage, a second cage positioned above the first cage, and a second heat sink in thermal communication with the second cage. In another aspect, the present invention provides an electronics rack comprising a frame, a cage, a heat sink positioned at a rear of the frame, and a compliant thermal collector operatively positioned between the cage and the heat sink. The compliant thermal collector can comprise a heat pipe having a non-linear shape that facilitates flexing of the heat pipe to change the length of the thermal collector. The thermal collector advantageously includes a plurality of heat pipes and a contact bar coupling the plurality of heat pipes. Preferably, the rack further includes an adjusting mechanism (e.g., threaded rods) for adjusting a position of the contact bar.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: July 9, 2019
    Assignee: Thermal Corp.
    Inventors: Walter John Bilski, Jr., Sidrit Kosta
  • Patent number: 10345276
    Abstract: A passive pre-heater assembly includes a thermally conductive heat-spreading block and a plurality of passive pre-heaters in thermally conductive communication with the heat-spreading block. The plurality of the pre-heaters exchanges heat with the thermally conductive heat-spreading block. Each pre-heater includes a thermally conductive base in thermal communication with the heat-spreading block, and a plurality of thermally conductive fins is in thermal communication with the thermally conductive base. The plurality of fins of each pre-heater exchanges heat convectively with ambient air and conductively with the thermally conductive base of that pre-heater. A given one of the passive pre-heaters further comprises a tube in thermally conductive contact with the thermally conductive base of the given passive pre-heater. The thermally conductive heat-spreading block exchanges heat with a fluid passing through the tube of the given passive pre-heater.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: July 9, 2019
    Assignee: WATERS TECHNOLOGIES CORPORATION
    Inventors: Joshua A. Shreve, Kurt D. Joudrey
  • Patent number: 10342151
    Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: July 2, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
  • Patent number: 10338650
    Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: July 2, 2019
    Assignee: Dell Products L.P.
    Inventors: Cyril Adair Keilers, Shawn Paul Hoss, Christopher Michael Helberg
  • Patent number: 10334756
    Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: June 25, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan M. Dede, Jongwon Shin, Yanghe Liu, Jae Seung Lee
  • Patent number: 10331183
    Abstract: A computing device comprises an air moving device operable to produce an airflow that removes heat from one or more components that are arranged upstream from the air moving device. The airflow corresponds to an acoustic energy signature. The computing device further comprises one or more mechanical drives that are arranged downstream from the air moving device, and a baffle comprising a first surface and an opposing second surface. The baffle is disposed between the air moving device and the one or more mechanical drives. The baffle defines a plurality of perforations extending between the first surface and the second surface, and the plurality of perforations are dimensioned and arranged to mitigate one or more predefined components of the acoustic energy signature of the airflow while permitting a first portion of the airflow to pass through the baffle to remove heat from the one or more mechanical drives.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: June 25, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Eric M. Lotter, Hong T. Huynh, David L. Duell, Daniel B. Oliver
  • Patent number: 10330304
    Abstract: An ultraviolet LED array is provided. The ultraviolet LED array includes a heatsink. The heatsink includes (i) a base heatsink element, and (ii) a thick film layer applied to the base heatsink element. The ultraviolet LED array also includes a plurality of ultraviolet LED elements coupled directly to the thick film layer of the heatsink.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: June 25, 2019
    Assignee: Heraeus Noblelight America LLC
    Inventors: William E. Johnson, III, Darrin Leonhardt, Mahmood Gharagozloo
  • Patent number: 10331144
    Abstract: A computer-implemented method controls liquid cooling of a direct injection liquid-cooled (DL) rack information handling system (RIHS). The method includes receiving, at a liquid cooling control subsystem, an incoming cooling liquid supply flow rate corresponding to an incoming cooling liquid supply being supplied to the DL RIHS. A maximum flow rate cap is calculated for each of the LC nodes. The maximum flow rate cap is transmitted to a controller for each of the LC nodes. The controller triggers each of the LC nodes to adjust the associated flow rate for that LC node to correspond to the received maximum flow rate cap for that node.
    Type: Grant
    Filed: February 6, 2016
    Date of Patent: June 25, 2019
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Paul W. Vancil, John R. Stuewe, Charles Edward Smith
  • Patent number: 10334755
    Abstract: A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: June 25, 2019
    Assignee: IMEC VZW
    Inventors: Herman Oprins, Vladimir Cherman, Eric Beyne
  • Patent number: 10327360
    Abstract: A method of at least partially filling a gap between adjacent elements in a data center having a hot aisle and a cold aisle to decrease air leakage between the hot aisle and the cold aisle through the gap is provided. The method includes providing a gap filler having a compressible material and an outer layer having an outer surface and an inner surface. The inner surface defines a sealed inner space and the outer layer encapsulates the compressible material in a compressed state within the inner space. The method also includes placing the gap filler in the gap between the adjacent elements in the data center and at least partially releasing a seal within the outer layer to allow air to flow into the inner space of the outer layer to permit the compressible material to expand from the compressed state within the inner space of the outer layer to an expanded state within the inner space of the outer layer, thereby at least partially filling the gap between the adjacent elements in the data center.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: June 18, 2019
    Assignee: TECHNOGUARD INC.
    Inventors: Brian T. Fanning, Alfred B. Cook
  • Patent number: 10324505
    Abstract: A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: June 18, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chih-Chao Chen, Pei-Yu Chang, Chia-Hung Ma, Chih-Wei Jen
  • Patent number: 10326258
    Abstract: A ventilation device for electrical panels, comprising a box-like metallic base (10), which is placed on top of an electrical panel and which has at least one lower opening (11) through which flows an air or heat flow (F) coming from said electrical panel, and at least one sheet or laminar element (12), preferably made of plastic material, placed above said box-like metallic base (10); a flap (13) is obtained in at least one portion of said laminar element (12), so that at least one portion of the perimeter of said flap (13) is made in one piece with said laminar element (12) and constitutes a linear fold (16) of said laminar element (12), suitable to allow said flap (13) raising and lowering with respect to said laminar element (12) for opening and closing a corresponding upper opening (15) of the laminar element (12) which is defined by said flap (13).
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: June 18, 2019
    Assignee: EVERET DUKLAIR S.R.L.
    Inventors: Guido Dall'Agnol, Daniele Bonotto, Stefano Bonotto
  • Patent number: 10321612
    Abstract: A power conversion device includes a main board, an electromagnetic interference filter module, an auxiliary power module, a capacitor group, a main power unit, a control plate, an output bus bar and a fan. A first air channel is formed between the auxiliary power module and the electromagnetic interference filter module. A second air channel is formed between two rows of the capacitor group. A third air channel is formed between the two main power conversion modules of the main power unit. The control plate is perpendicularly installed on the main board. The output bus bar is perpendicularly installed on the main board, arranged in parallel with the control plate and located near the control plate. The fan is located near the main power unit and producing airflow to the first air channel, the second air channel and the third air channel.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 11, 2019
    Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
    Inventors: Dagang Liu, Junlai Huang, Xuanshun Qi, Kai Dong, Zhongwei Ke
  • Patent number: 10321613
    Abstract: A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: June 11, 2019
    Assignee: Atieva, Inc.
    Inventors: Yifan Tang, James Jan, Benson Tsai
  • Patent number: 10321602
    Abstract: An air agitator assembly for use with a heat-emitting object having a contour, the air agitator assembly including a perforated flexible structure having a thermally absorbing first side confronting and spaced from a portion of the heat-emitting object to define an air space there between and a second side opposite the first side and where at least a portion of the first side of the perforated flexible structure has a contour that matches a contour of a corresponding portion of the heat-emitting object.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 11, 2019
    Assignee: GE Aviation Systems LLC
    Inventors: Michel Engelhardt, Shushanna Rebecca Cherian-Brutus