Cooling Electrical Device Patents (Class 165/104.33)
  • Patent number: 10845560
    Abstract: A fiber distribution hub (FDH) provides an interface between an incoming fiber and a plurality of outgoing fibers. The FDH includes a cabinet, at least one door pivotably mounted to the cabinet, and a frame pivotably mounted within the cabinet. The doors wrap around the sides and the front of the cabinet to provide access to both the front and sides of the frame when the doors are open. The frame can pivot out of the cabinet through the open doors to enable access to the rear of the cabinet and the rear side of the frame. The frame includes a termination region and a splitter region. The frame can include a storage region and/or a pass-through region.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: November 24, 2020
    Assignee: CommScope Technologies LLC
    Inventors: James J. Solheid, Matthew Holmberg
  • Patent number: 10847441
    Abstract: A cooling system includes: a placement plate on which a plurality of components are disposed; and a liquid refrigerant flow path, which is formed on an opposite side of the placement plate with respect to the plurality of components, and is configured to allow a liquid refrigerant for cooling the plurality of components to flow therethrough. The path includes: a first heat-radiating portion disposed at a liquid refrigerant inlet portion around which fins are disposed such that distances from a flow-path inlet portion to the fins are gradually farther away from a flow-path side wall toward a center of the path; a second heat-radiating portion which includes fins having a curved shape; a third heat-radiating portion having no fins; a fourth heat-radiating portion having higher fin-mounting density than the first and the second heat-radiating portions, an inlet and an outlet through which the liquid refrigerant flows in and out.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: November 24, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yugo Asai, Masaru Shinozaki, Hiroyuki Ushifusa
  • Patent number: 10847439
    Abstract: Memory devices having heat spreaders are disclosed herein. In one embodiment, a memory device includes first memories coupled to a front side of a substrate, second memories coupled to a back side of the substrate, and a flexible heat spreader. The flexible heat spreader can include graphite and is coupled to back side surfaces of the first and second memories to dissipate heat generated by the first and second memories.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: November 24, 2020
    Assignee: Micron Technology, Inc.
    Inventor: George E. Pax
  • Patent number: 10840701
    Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: November 17, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: Kuen Yew Lam Yew Lam, Thiam Ping Oon, Jarrett Gardner, Chris R. Jacobsen
  • Patent number: 10842054
    Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 17, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Yueh-Chang Wu, Yi-Ta Hsu
  • Patent number: 10827656
    Abstract: An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: November 3, 2020
    Assignee: Manufacturing Resources International, Inc.
    Inventor: Tim Hubbard
  • Patent number: 10824210
    Abstract: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 3, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Wen-Hsien Lin, Chien-Liang Lin
  • Patent number: 10820448
    Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: October 27, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xiaowei Hui, Yuping Hong, Wei Chen
  • Patent number: 10813247
    Abstract: A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: October 20, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventor: Chia-Wei Chang
  • Patent number: 10806056
    Abstract: A cooling system for blades of a high performance computer thermally couples blade electronics to the computer's liquid cooling system through one or more heat pipes, without requiring a liquid conduit on, or liquid coupling to, the blade. Moreover, illustrative embodiments allow a blade to be installed in a high performance computer and engage the cooling system without making a liquid connection, and to disengage from the cooling system and be removed from the high performance computer without breaking a liquid connection.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: October 13, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Bret M. Cuda, Harvey J. Lunsman
  • Patent number: 10802555
    Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: October 13, 2020
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
  • Patent number: 10794637
    Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: October 6, 2020
    Assignee: GE Aviation Systems LLC
    Inventors: Judd Everett Swanson, Richard Eddins, Michel Engelhardt, Christopher Mouris Astefanous
  • Patent number: 10791650
    Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignees: KEIHIN CORPORATION, TOHOKU UNIVERSITY
    Inventors: Hajime Tsukui, Yusuke Nishimura, Takuya Ouchi, Shigenao Maruyama, Atsuki Komiya, Junnosuke Okajima
  • Patent number: 10791619
    Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: September 29, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Marc Armani, Jean-Lucien Mazeau
  • Patent number: 10785892
    Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 22, 2020
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Mu-Shu Fan, Shih-Chieh Kao, Che-Chia Chang
  • Patent number: 10777862
    Abstract: A battery cooling device for a vehicle is provided. The device repeats phase changes of a refrigerant to cool a battery due to heat of vaporization when a liquid-state refrigerant is vaporized by thermally coming in contact with a battery heat source. The vaporized refrigerant is changed back into a liquid state by thermally coming in contact with a separate coolant. The effect of cooling all battery cells is maximized throughout the entire refrigerant channel for cooling a battery and the battery cells are cooled uniformly.
    Type: Grant
    Filed: December 3, 2017
    Date of Patent: September 15, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Yoon Cheol Jeon, Min Wook Kim, Dal Kim
  • Patent number: 10775842
    Abstract: A portable electronic device including host body, display body, hinge and heat pipe assembly. The host body includes base and heat source disposed on base. Side of positioning structure is connected to first fixed part. First fixed part is fixed to base. Second fixed part is fixed to metal casing. Heat pipe assembly includes first heat pipe and second heat pipe. End part of first heat pipe has insertion hole. End part of second heat pipe is pivotally inserted into insertion hole of end part of first heat pipe. Another end part of first heat pipe is in thermal contact with heat source. Another end part of second heat pipe is in thermal contact with metal casing. Another side of positioning structure is fixed to end part of first heat pipe so as to keep pivot part and end part of first heat pipe coaxial.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 15, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Zen Peng, Chia-Chen Chen, Ting-Yuan Lin
  • Patent number: 10779437
    Abstract: The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 15, 2020
    Assignee: Pegatron Corporation
    Inventor: Hsiang-Chih Lee
  • Patent number: 10770372
    Abstract: A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: September 8, 2020
    Assignee: Altera Corporation
    Inventors: Ravi Gutala, Arif Rahman, Aravind Dasu, Thomas Sarvey, Devdatta Kulkarni
  • Patent number: 10770373
    Abstract: A radiator for a liquid cooling type cooling device includes a plurality of fin plates and connecting members integrally connecting all the fin plates. The fin plate includes a vertically elongated rectangular flat plate body and narrow portions integrated with both end portions of the plate body. All the fin plates are arranged at intervals in the thickness direction of the plate body. The connecting member is formed into a corrugated shape and includes flat plate portions each integrated with the narrow portion of the plate body and arcuate portions and each connecting the adjacent flat plate portions. The plate body, the narrow portion, and the flat plate portion are equal in thickness. Both side surfaces of the plate body, both side surfaces of the narrow portion, and both side surfaces of the flat plate portion are positioned on the same plane.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: September 8, 2020
    Assignee: SHOWA DENKO K.K.
    Inventor: Shinobu Tamura
  • Patent number: 10767939
    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: September 8, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer, Thomas Brunschwiler
  • Patent number: 10757831
    Abstract: A removable airflow control baffle may be dimensioned to be removably coupled to a receiving component that facilitates the flow of air through an enclosed container. Such an airflow control baffle may include (i) a support frame that is dimensioned to removably couple the airflow control baffle to the receiving component and (ii) an airflow control zone that is coupled to the support frame such that the airflow control zone affects airflow through an opening defined by the receiving component when the airflow control baffle is coupled to the receiving component.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: August 25, 2020
    Assignee: Facebook, Inc.
    Inventor: Jason David Adrian
  • Patent number: 10748837
    Abstract: A heatsink assembly including a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity are configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: August 18, 2020
    Assignee: ELTA SYSTEMS LTD.
    Inventor: Michael Kedem
  • Patent number: 10750637
    Abstract: A removable immersion cooling infrastructure module can have a form factor equivalent to that of one or more of the computing devices being cooled by immersion cooling, thereby enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner. Moreover, the quantity of immersion cooling infrastructure modules can be varied depending on need, since the immersion cooling infrastructure modules and computing devices can be interchangeable within the openings designed to house the computing devices. An immersion cooling infrastructure module can comprise a filter, a pump that can circulate the immersion cooling liquid through the filter, a power supply and a controller, with the module receiving power, and, optionally, communications and other like connectivity, from the same source as the computing devices.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: August 18, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Alissa, Nicholas Andrew Keehn
  • Patent number: 10747277
    Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Shantanu D Kulkarni, Gavin Sung
  • Patent number: 10741995
    Abstract: The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: August 11, 2020
    Assignee: JENOPTIK Optical Systems GmbH
    Inventors: Juergen Wolf, Annelies Hirsch
  • Patent number: 10739084
    Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: August 11, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Chang-Han Tsai
  • Patent number: 10732681
    Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: August 4, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, James Hao-An Chen Lin, Andrew William Hill, Han Li
  • Patent number: 10736235
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: August 4, 2020
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Patent number: 10729042
    Abstract: Provided is a display device. The display device includes a display panel and at least one cooler configured to dissipate heat of the display panel. The at least one cooler includes a vapor chamber including a high temperature heated by the display panel and a low temperature connected to the high temperature portion through a connection portion and spaced apart from the display panel, a fan spaced apart from the vapor chamber to blow air toward the vapor chamber, and an air guide configured to guide the air blown from the fan to the low temperature portion.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: July 28, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Myungwhun Chang, Donghyun Kim, Yanghyun Kim, Jonggon Shin, Jongjin Woo, Sangho Choi, Jinkyo Han
  • Patent number: 10721842
    Abstract: A cooling assembly for cooling a heat source includes a cold plate to absorb heat from the heat source. The cold plate defines a first groove. A thermally conductive clamp is removably secured to a liquid cooling tube. The thermally conductive clamp defines a second groove. A heat pipe includes a first end to fit within the first groove in the cold plate and a second end to fit within the second groove in the thermally conductive clamp. The heat pipe transfers heat absorbed by the cold plate to the liquid cooling tube via the thermally conductive clamp.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: July 21, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: Nabeel Fathi
  • Patent number: 10717401
    Abstract: An electrified vehicle includes a first electrical component, a second electrical component, and a terminal block assembly adapted to electrically couple the first electric component to the second electrical component. The terminal block assembly includes a housing, a bus bar, and a first seal adapted to seal the second electrical component from a wet environment of the first electrical component.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: July 21, 2020
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventor: Vincent T. Skalski
  • Patent number: 10721838
    Abstract: In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: July 21, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Rakesh Bhatia, Eric Michael Lotter
  • Patent number: 10714673
    Abstract: A transducer (140) having a mechanical impedance over an operative frequency range and having a desired power coupling (145) to a load over the operative frequency range comprises a piezoelectric device (141) having a frequency distribution of modes in the operative frequency range; and an overmould (143). The overmould (143) is arranged to surround at least part of the piezoelectric device (141); and the parameters of the overmould (143) are selected to provide a required impedance matching between the mechanical impedance of the transducer (140) and the mechanical impedance of the load. An alternative transducer comprises a mounting means for holding a discrete portion of at least a part of the periphery of the piezoelectric device wherein the parameters of the mounting means are selected to provide a required boundary condition for the periphery of the piezoelectric device whereby the desired power coupling between the transducer and the load is provided.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: July 14, 2020
    Assignee: Google LLC
    Inventors: James East, Neil John Harris
  • Patent number: 10699985
    Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Ho Chung, Soo Ho Noh, Jin Seok Park, Se Young Jang
  • Patent number: 10698049
    Abstract: An apparatus includes: a getter material disposed within a vacuum chamber to absorb stray molecules within the vacuum chamber; a thermal mass disposed adjacent the getter material and in thermal communication with the getter material; a cold station disposed within the vacuum chamber above the thermal mass; and a convective cooling loop connected between the thermal mass and the cold station and configured to convectively cool the thermal mass when the cold station is at a lower temperature than the thermal mass, and to thermally isolate the thermal mass from the cold station when the cold station is at a higher temperature than the thermal mass. The thermal mass may be water ice and may be thermally isolated from the walls of vacuum chamber by low loss support links and/or thermal reflective shielding.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: June 30, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Philip Alexander Jonas, Matthew Voss, Philippe Abel Menteur
  • Patent number: 10685905
    Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: June 16, 2020
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Feng Zhou, Ki Wook Jung, Ercan M. Dede
  • Patent number: 10684644
    Abstract: A clamshell electronic device is disclosed. The clamshell electronic device includes a first cover, a second cover and a pivoting element. The second cover system is provided to dispose a first input module or a second input module, wherein the first input module and the second input module have different heights. The pivoting element connects the first cover and the second cover to allow the first cover and the second cover to rotate with each other. When the second cover is disposed with the first input module or the second input module, the pivoting element can be adjusted to a first use state and a second use state.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: June 16, 2020
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Tsung-Min Chen, Ming-Cheng Yang
  • Patent number: 10681841
    Abstract: A water-cooling heat dissipation device suitable for computer includes a pump housing, an upper cover, a motor module and a heat exchange member. The pump housing forms a pump chamber. A side of the upper cover has at least one positioning portion. A side of the motor module has at least one assembly portion that is correspondingly disposed with respect to the positioning portion. A stator set is received in the interior of the motor module. The heat exchange member is correspondingly combined with the pump housing. The heat exchange member forms a heat exchange chamber, and the heat exchange chamber is in communication with the pump chamber.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 9, 2020
    Assignee: EVGA CORPORATION
    Inventor: Tai-Sheng Han
  • Patent number: 10677537
    Abstract: An evaporator includes multiple cold storage mechanisms for lowering a temperature of a cold storage material housed inside a cold storage container by heat exchange with a refrigerant. The multiple cold storage mechanisms include a first cold storage mechanism and a second cold storage mechanism higher in heat storage-and-radiation performance than the first cold storage mechanism.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: June 9, 2020
    Assignee: DENSO CORPORATION
    Inventors: Yuusuke Kitou, Jun Abei, Norihide Kawachi, Eiichi Torigoe, Shota Chatani
  • Patent number: 10680488
    Abstract: A drive device of the present invention includes: an electric motor including a cooling channel; a power conversion unit that converts electric power from a power supply and outputs electric power to be supplied to the electric motor; and a supporting member fixed to the electric motor with the power conversion unit mounted on the supporting member. The supporting member includes a cooling channel connected to the cooling channel of the electric motor.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: June 9, 2020
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Nobuaki Yokoyama, Hirofumi Shimizu
  • Patent number: 10677478
    Abstract: A heat radiation unit is disclosed. The heat radiation unit includes a heat radiation member thermally connected to a heat source, to radiate heat generated from the heat source, a refrigerant pipe thermally connected to the heat radiation member while being formed therein with a channel, through which refrigerant flows, a pipe jacket coupled to the heat radiation member, and formed with a receiving groove to receive a portion of the refrigerant pipe, and a cover bracket to press the portion of the refrigerant pipe received in the receiving groove of the pipe jacket in a downward direction of the receiving groove. An outdoor unit of an air conditioner is also disclosed. The outdoor unit includes a case to form an appearance of the outdoor unit, a heat source disposed in the case, and the heat radiation unit connected to the heat source, to radiate heat from the heat source.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: June 9, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Heewoong Park, Jeongseob Shin, Seungtaek Oh
  • Patent number: 10674628
    Abstract: This cooling module comprises a housing, which has an external support face comprising means for fastening power conversion modules on the external support face, and a heat transfer fluid network comprising branches extending in the housing in a network plane occupying an individual zone. Each branch comprises a supply collector, a discharge collector and several individual sub-branches. Each sub-branch is connected to the supply collector via an inlet end of the sub-branch in question, is connected to the discharge collector via an outlet end of the sub-branch in question, occupies an individual sub-zone comprised in the zone of the branch in question, and is deviated relative to the other sub-branches between the supply collector and the discharge collector. Each sub-branch forms a single channel that has an undulation with a regular pitch.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 2, 2020
    Assignee: MERSEN FRANCE SB SAS
    Inventors: Yannick Moison, Mickael Debeze, Jérome Giolat, Jean-Luc Dubelloy
  • Patent number: 10670650
    Abstract: New cooling assembly suitable for use in the testing of devices is disclosed. The new cooling assembly transfers heat that is in close proximity to, within vicinity of, and/or in surrounding area adjacent to a DUT (device under test) undergoing testing to a target location that is away from the DUT. Consequently, the DUT is cooled. By employing heat pipes coupled to plates in contact with the DUT, the new cooling assembly augments cooling capacity at the DUT's location and surrounding area. Yet, the use of an ambient air flow generated by a fan is sufficient to manage and dissipate the heat transferred to the target location. Also, the new cooling assembly is readily installable in DUT testing equipment because its design is quite flexible to adapt to various requirements and space constraints of DUT testing equipment for different DUT footprints or form factors.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: June 2, 2020
    Assignee: ADVANTEST CORPORATION
    Inventor: Roland Wolff
  • Patent number: 10665529
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 26, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
  • Patent number: 10653034
    Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 12, 2020
    Assignee: Apple Inc.
    Inventors: Eric R. Prather, Clark E. Waterfall, Reuben J. Williams, Vinh H. Diep
  • Patent number: 10643777
    Abstract: A cooling arrangement for a dry-type transformer. The arrangement includes blowing equipment configured to blow a gas flow, and an opening positionable in a clamping structure of the transformer. The opening is configured to allow the gas flow to pass from the blowing equipment towards a winding of the transformer, so that the winding is properly cooled. The opening comprises an electric protecting means for dielectric protection of the clamping structure. A transformer including such cooling arrangement is also disclosed.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 5, 2020
    Assignee: ABB SCHWEIZ AG
    Inventors: Antonio Nogués Barrieras, Carlos Roy Martín, Luis Sánchez, Rafael Murillo, Lorena Cebrián Lles, Carlos Mainar Joven
  • Patent number: 10642322
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 5, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10642672
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a plurality of information handling resources and a controller communicatively coupled to the plurality of information handling resources. The controller may be configured to monitor for the presence of a thermal escape event of the information handling system. The controller may also be configured to, responsive to detecting the presence of the thermal escape event, determine one or more affected information handling resources of the plurality of information handling resources, wherein the one or more affected information handling resources comprise information handling resources thermally affected by the thermal escape event. The controller may further be configured to determine for each of the one or more affected information handling resources a respective thermal excursion timeout period.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: May 5, 2020
    Assignee: Dell Products L.P.
    Inventors: Dinesh Kunnathur Ragupathi, Timothy M. Lambert, Syama Poluri
  • Patent number: 10634336
    Abstract: The present invention provides a replaceable water-cooled radiating device, comprising a water-cooling module and a light-emitting module, the water-cooling module is provided with a control circuit, and the control circuit is provided with at least one electrical connector. The light-emitting module is disposed on a top of the water-cooling module and is provided with a driving circuit, the driving circuit is provided with at least one light-emitting component and at least one electrical conductive component, and the electrical conductive component is electrically connected to the electrical connector. Thereby the light-emitting module is electrically connected to the electrical connector and the control circuit via the electrical conductive component to conductibly emit light, and the light-emitting module can be directly detachably mounted on the water-cooling module to achieve the efficacy of the water-cooling module mounted with the replaceable light-emitting module.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: April 28, 2020
    Assignee: EVGA CORPORATION
    Inventor: Tai-Sheng Han