Abstract: A temperature control and process for adjusting the temperature of a workstation and a work medium at a workstation to a predetermined temperature. The temperature control comprises a cooling vehicle such as a heat exchanger, a coolant temperature sensor and control, a source of fluid coolant such as a manifold, a recirculating pump, a flow line to circulate the coolant to the workstation with the flow line containing a flow regulator and a heater, a bypass valve for bypassing the flow regulator and heater, and a workstation temperature sensor and control. The workstation temperature control controls the operation of the heater and bypass valve so that the temperature of the coolant is below the desired temperature for the workstation, thus achieving a rapid transient response while avoiding overcooling. The coolant temperature control and workstation temperature control may be in a temperature control computer, thus providing a large number of different operating sequences.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A temperature adjustment apparatus for adjusting a temperature of an object to be temperature-controlled. The apparatus includes a first temperature adjustment mechanism for controlling the temperature of the object to be temperature-controlled, and a second temperature adjustment mechanism for controlling the temperature of the object to be temperature-controlled. The first and second temperature adjustment mechanisms have different temperature control responses, and control the temperature of the object to be temperature-controlled in cooperation with coarse adjustment and fine adjustment on the basis of a difference in response. Also, the first temperature adjustment mechanism and the second temperature adjustment mechanism are operatively connected so that the output of the first temperature adjustment mechanism controls the operation of the second temperature adjustment mechanism.

Abstract: A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.

Abstract: A temperature control system for multiple process components in a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and a circulation loop for a heat transfer fluid that is received from a process component. A heat exchanger within the remote temperature control module allows heat to be transferred from the heat transfer fluid to the cooling fluid, thereby providing cooling to the process component. A heat source may also be included within the remote temperature control module to provide heat to the heat transfer fluid and therefore to the process component.

Abstract: A combined refrigerator-oven (20) includes an enclosed chamber (28) having a top wall (22), a bottom wall (24), and vertical side walls (26). The refrigerator-oven (20) further includes a heating unit (50) and a refrigeration unit (70). A controller (118) is in communication with the heating unit (50) and the refrigeration unit (70). When a cooling mode is selected, the controller (118) activates the refrigeration unit (70) to deliver cool air (62) into the enclosed chamber (28). When a heating mode is selected, the controller (118) activates the heating unit (50) to produce heat (66) in the enclosed chamber (28).

Abstract: Rapid thermal cycling of substrates in low-pressure processing environments is achieved by movable temperature conditioners located outside the processing environments. The substrates are mounted on thermally conductive pedestals for processing in the low-pressure environment. The temperature conditioners are movable both into and out of thermal contact with the pedestals outside the low-pressure environment to regulate transfers of heat through the pedestals between the substrates and the temperature conditioners. A translatable cooler block with a high thermal mass and a large interface area with the pedestal can be used as a temperature conditioner for more rapidly withdrawing heat from the substrate.

Abstract: A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component.

Abstract: In a thermal regulating system, individual temperatures of a plurality of components are maintained within a predetermined temperature range. This thermal regulating system includes a refrigeration system having a refrigerant contained in a refrigerant line, a valve capable of being electronically controlled, a plurality of evaporators configured for thermal attachment to the components, and a supplemental heating system. The valve is configured to control superheat formation in the refrigeration system. Furthermore, the refrigeration system and the supplemental heating system are operable to maintain each of the plurality of components within the predetermined temperature range.

Abstract: Object of the present invention is to provide uniform heat distribution to a substrate undergoing heat treatment on top of a heat exchange plate. A heat exchange plate 1 is a flat, circular receptacle, has a cooling liquid inflow opening 11 on one end and outflow opening 13 on the other end, and cooling liquid flows on the inside. The surface of the plate 1 is divided, for example, into four zones having different heat capacities and heat transfer characteristics, and an independently controllable foil heater 21A, 23A, 25A, 27A is attached to each zone. Heater 21A covers a zone, which circumferentially surrounds a substrate placed on top of a plate, heater 23A covers a zone directly beneath a substrate, heater 25A covers a zone of the vicinity of the outflow opening 13, and heater 27A covers a zone of the vicinity of the inflow opening 11. Temperature sensors 31-33 are disposed on the inside of a plate at four locations of a second zone, which are apt to receive the affects of the first to fourth zones.

Abstract: The invention relates to an installation for utilizing surplus heat from a power transformer. A first pipe system (7) is connected to the cooling device of the transformer for circulation of a first, heat carrying fluid between the transformer and a heat pump (5) with the purpose of enabling emission of heat to an evaporator (10) included in the heat pump, which evaporator via a second pipe system (11) containing a second fluid communicates with a compressor (12), a condenser (13) and an expansion valve (14), a third pipe system (15) having a third, heat carrying fluid for transfer of heat to one or more consumption units (16) being connected to the condenser.

Abstract: The invention relates to an apparatus and methods for preventing condensation on the interior surfaces of sample tubes which are being exposed to temperature cycles, such as during a PCR amplification reaction. In particular, the invention relates to apparatus comprising a sample block comprising a plurality of sample wells for receiving sample tubes and heating elements disposed in the sample wells for heating at least a portion of the sides of sample tubes (e.g., at least the portion which forms the head space after a tube is filled with a PCR reaction mixture). In a preferred aspect, the sample block is part of a thermocycling device for performing PCR and the side-wall heater is used to enhance uniformity and speed of amplification reactions. For example, by decreasing or eliminating condensation, signal strength jumps in a real-time PCR assay can be minimized as can reaction non-homogeneity.

Abstract: A load lock and related method of handling a substrate involves placing a substrate onto a vertically movable poppet and moving the poppet between two vertically opposed subchambers such that in moving the poppet toward one of the subchambers, that subchamber is sealed to atmosphere. The two subchamber system allows one substrate to be placed into a buffer and another substrate to be cooled at the same time. Also, the system allows for a slow vacuum to be made on the substrate in a subchamber to avoid undesirably loading the substrate by the otherwise immediate drop in pressure.

Abstract: The present invention provides a connected chilling-hating system capable of saving delivering power during reduced load periods.

Abstract: A chuck body mounts a substrate within a vacuum chamber. Contiguous portions of the substrate and the chuck body form a heat-transfer interface. An intermediate sealing structure seals the chuck body to the substrate independently of any contact between the chuck body and the substrate and forms a separately pressurizable region within the vacuum chamber. A control system promotes flows of fluid through a periphery of the heat-transfer interface within the separately pressurizable region for controlling fluid pressures and related transfers of heat at the heat-transfer interface according to an overall aim of regulating the substrate temperature.

Abstract: A temperature control unit for independent control of a number of independent channels, as can exist with a cluster tool used for semiconductor fabrication, has high efficiency, long term life and reliability, and requires only a small floor area. To these ends, the unit employs a single high capacity refrigeration system and disposes a number of separate temperature control channels for the individual tools, with only some channels receiving refrigerant. Low temperature channels use high pressure, sub-cooled refrigerant for chilling the heat transfer fluid to selected levels controlled by proportional valves adjusting refrigerant flow through evaporator heat exchanger units which cool heat transfer fluid. Moderate temperature channels cool the heat transfer fluid for associated tools to an ambient temperature level.

Abstract: A combined refrigerator-oven (20) includes an enclosed chamber (28) having a top wall (22), a bottom wall (24), and vertical side walls (26). The refrigerator-oven (20) further includes a heating unit (50) and a refrigeration unit (70). A controller (118) is in communication with the heating unit (50) and the refrigeration unit (70). When a cooling mode is selected, the controller (118) activates the refrigeration unit (70) to deliver cool air (62) into the enclosed chamber (28). When a heating mode is selected, the controller (118) activates the heating unit (50) to produce heat (66) in the enclosed chamber (28).

Abstract: A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component.

Abstract: System and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and an electronic valve is utilized to control the flow of refrigerant through the refrigeration system. The temperature of the components is reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system.

Abstract: The present invention provides a system and method of removing heat from an MR imaging device while maintaining internal and external temperatures below maximum operating limits, thereby enabling higher power applications for faster imaging with improved image quality as well as, allowing longer scan times for interventional procedures. The system includes a vacuum chamber housing the gradient coils and a vacuum pump connected thereto to regulate the pressure and humidity within the chamber. A heat exchanger, coolant pump, and controller are provided to regulate the temperature of coolant designed to dissipate heat from the gradient coils in response to at least one temperature sensor.

Abstract: A multiloop temperature-control system has a hydraulic bus connected to a plurality of loops for the temperature-control medium and respective hydraulic modules connected to the hydraulic bus, and through the hydraulic bus, to these loops. Plug connectors join each hydraulic module with an electrical supply and control module and the supply and control modules in turn are connected by plug and jack connectors to an electrical bus.

Abstract: The present invention relates to a temperature controllable gas distributor which includes a cover having a first passage between its upper cover and lower cover, a second passage embedded along an edge portion of the upper cover, a first heater installed in the second passage, a support portion welded around the cover, and a distributing plate fixed at a lower portion of the support portion. The distributing plate includes a plurality of nozzles, and a third passage which is a passage of fluid is formed in the interior of the distributing plate 201. Second and third heaters are installed in the third passage. In the gas distribution apparatus according to the present invention, since it is possible to control the temperature of the cover and the distributing plate, namely, the entire portions contacting with gas, an abnormal reaction and liquefaction of a source gas can be prevented.

Abstract: The present invention relates to a hinge assembly for a door of a kimchi storage device which mounts a door opening and closing a storage chamber of the kimchi storage device on the upper surface of a body. There is provided an integral hinge assembly for a door of a kimchi storage device which can prevent the impact during door opening and closing operations and can prevent the damage of the door by interconnecting: a cover plate fixed to a body; a hinge housing in which there are inserted an elastic means, a support plate backing up the elastic means, a control plate controlling a springback force and a support member connected to the elastic means and supporting a force between the elastic means and a press member; a turn member connected with the press member and fixed to the door.

Abstract: A temperature control system for multiple process components in a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and a circulation loop for a heat transfer fluid that is received from a process component. A heat exchanger within the remote temperature control module allows heat to be transferred from the heat transfer fluid to the cooling fluid, thereby providing cooling to the process component. A heat source may also be included within the remote temperature control module to provide heat to the heat transfer fluid and therefore to the process component.

Abstract: A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.

Abstract: A thermal cycler for controlled heating and cooling of biological samples uses eight Thermoelectric Coolers (TECs), positioned between a metal sample plate and a heat sink (2). By altering the polarity of the applied current through the TEC, the temperature of the sample plate can be raised or lowered. When uniform heating and cooling of the sample plate is required, all eight TECs are connected in series and in the same polarity. To produce temperature gradients across the sample plate, the relative polarity of individual TECs is changed or they are bypassed altogether.

Abstract: A temperature control unit for independent control of a number of independent channels, as can exist with a cluster tool used for semiconductor fabrication, has high efficiency, long term life and reliability, and requires only a small floor area. To these ends, the unit employs a single high capacity refrigeration system and disposes a number of separate temperature control channels for the individual tools, with only some channels receiving refrigerant. Low temperature channels use high pressure, sub-cooled refrigerant for chilling the heat transfer fluid to selected levels controlled by proportional valves adjusting refrigerant flow through evaporator heat exchanger units which cool heat transfer fluid. Moderate temperature channels cool the heat transfer fluid for associated tools to an ambient temperature level.

Abstract: A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator.

Abstract: A temperature control and process for adjusting the temperature of a workstation and a work medium at a workstation to a predetermined temperature. The temperature control comprises a cooling vehicle such as a heat exchanger, a coolant temperature sensor and control, a source of fluid coolant such as a manifold, a recirculating pump, a flow line to circulate the coolant to the workstation with the flow line containing a flow regulator and a heater, a bypass valve for bypassing the flow regulator and heater, and a workstation temperature sensor and control. The workstation temperature control controls the operation of the heater and bypass valve so that the temperature of the coolant is below the desired temperature for the workstation, thus achieving a rapid transient response while avoiding overcooling. The coolant temperature control and workstation temperature control may be in a temperature control computer, thus providing a large number of different operating sequences.

Abstract: A temperature control and process for adjusting the temperature of a workstation and a work medium at a workstation to a predetermined temperature. The temperature control comprises a cooling vehicle such as a heat exchanger, a coolant temperature sensor and control, a source of fluid coolant such as a manifold, a recirculating pump, a flow line to circulate the coolant to the workstation with the flow line containing a flow regulator and a heater, a bypass valve for bypassing the flow regulator and heater, and a workstation temperature sensor and control. The workstation temperature control controls the operation of the heater and bypass valve so that the temperature of the coolant is below the desired temperature for the workstation, thus achieving a rapid transient response while avoiding overcooling. The coolant temperature control and workstation temperature control may be in a temperature control computer, thus providing a large number of different operating sequences.

Abstract: An extruder cylinder is heated by resistance heaters surrounding cooling coils around respective segments of the extruder cylinder which is subdivided into heating and heating or cooling zones therealong. The rate of flow of the heat-carrier oil in the coil or the rate of flow of a cooling medium in heat exchange therewith can be regulated to control the cooling effect of the heat-carrier oil which can continue to flow through the coil even during purely heating phases for temperature equalization over the zone.

Abstract: A temperature-control apparatus for a printing machine includes a closed, temperature-control fluid circuit including a pump with a suction and pressure side, a fluid feed line feeding temperature-control fluid from a fluid source to the suction side of the pump and a fluid return line on the suction side of the pump between the pump and the load. Temperature-control fluid from the source may be pumped by the pump through the circuit to the load and recycled to the suction side of the pump. A valve is provided in the return line to the source and is controlled by a temperature sensor that senses the temperature in the circuit and selectively directs fluid to the circuit or out of the circuit and back to the source dependent upon the sensed temperature.

Abstract: A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

Abstract: The present invention discloses a compound type kimchi storage device including an upper storage tank of an upper open/shut type and a lower storage tank of a front slide open/shut type as storage tanks for storing foods. The kimchi storage device for ripening and storing foods such as kimchi by selectively operating a compressor and a heater, includes: a casing composing an outward form of the device; at least one upper storage tank disposed at the inside of the casing for providing at least one upper storage chamber, an insulating material being filled between the casing and the storage tank; a door disposed at one side of the casing for opening and shutting the upper storage chamber; a drawer-type lower storage tank disposed below the upper storage tank for providing a lower storage chamber, a sidewall being positioned between the upper and lower storage tanks; and a driving chamber positioned adjacently to the lower storage tank, a compressor being installed in the driving chamber.

Abstract: A temperature control unit for independent control of a number of independent channels, as can exist with a cluster tool used for semiconductor fabrication, has high efficiency, long term life and reliability, and requires only a small floor area. To these ends, the unit employs a single high capacity refrigeration system and disposes a number of separate temperature control channels for the individual tools, with only some channels receiving refrigerant. Low temperature channels use high pressure, sub-cooled refrigerant for chilling the heat transfer fluid to selected levels controlled by proportional valves adjusting refrigerant flow through evaporator heat exchanger units which cool heat transfer fluid. Moderate temperature channels cool the heat transfer fluid for associated tools to an ambient temperature level.

Abstract: A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

Abstract: A device for controlling the temperatures in a cooling chamber for a microtome, in particular an ultramicrotome, comprises at least two different temperature control circuits for controlling the temperatures of the specimen and of the cutter. The control circuit for the temperature of the specimen (8) and the control circuit for the temperature of the cutter (9), as well as, if appropriate, the control circuit for the temperature of the chamber gas, have a common setting element (17), such that the control circuit can be programmed to an identical temperature as the set value.

Abstract: A temperature control unit for independent control of a number of independent channels, as can exist with a cluster tool used for semiconductor fabrication, has high efficiency, long term life and reliability, and requires only a small floor area. To these ends, the unit employs a single high capacity refrigeration system and disposes a number of separate temperature control channels for the individual tools, with only some channels receiving refrigerant. Low temperature channels use high pressure, sub-cooled refrigerant for chilling the heat transfer fluid to selected levels controlled by proportional valves adjusting refrigerant flow through evaporator heat exchanger units which cool heat transfer fluid. Moderate temperature channels cool the heat transfer fluid for associated tools to an ambient temperature level.

Abstract: In a thermal equalization system a machine tool carriage preferably of aluminum but which could be made of other lightweight materials, a drilling spindle housing is mounted on the carriage. At least one spindle housing is be mounted said carriage to service work pieces mounted on a tooling plate of the work table for said spindle. The chiller unit is used to provide coolant to the spindle to compensate for the heat generated by the spindle during drilling. When the spindle is not drilling, excessive cooling of the spindle can result. Accordingly, the instant invention also includes, a conductive rubber heating pad which is attached to the spindle structure to provide a heat source for the system to compensate for excessive cooling when the drill is not generating heat. The temperature control maintains the temperature between the spindle housing, carriage and work table thereby minimizing temperature expansion differentials between the drilling position and the worktable position.

Abstract: In a main controller for use in an air conditioner for controlling temperature/humidity of an intaken outside air, a controlling line setter (18) sets each of control lines (J.sub.1 -J.sub.5) on a psychrometric chart table (13), in which an aimed temperature/humidity line (Lo) is formed by connecting an upper limit state point (Ps) and a lower limit state point (Pw) of condition air from each of the outside air state points (G.sub.1 -G.sub.5) to the aimed temperature/humidity line (Lo). The controlling line (J.sub.1 -J.sub.5) is formed by connecting necessary lines selected from a main heating line (H.sub.L) showing the heating operation of a main heater (H), an adiabatic humidifying line (W.sub.L) showing the humidifying operation of an adiabatic humidifying device (W), a cooling line (C.sub.L) showing the cooling operation of a cooler (C) and an auxiliary heating line (RH.sub.

Abstract: The present invention generally provides a system for controlling the temperature of multiple components of a semiconductor processing device or fabrication facility. The system includes a common source of a heated or chilled fluid that is distributed to multiple process components for use in heating or cooling. The multiple process components may be part of the same chamber or process, serve different processes in the same or different cluster tool, serve a combination of stand-alone and cluster tools, or any combination of process components located in a common fabrication facility. Each process component includes a flow control valve that controls the temperature of each component.

Abstract: A kimchi storage device capable of fast fermenting kimchi, and once kimchi has been adequately fermented, of functioning as a cold storage therefor includes a main body provided with a refrigeration unit and a plurality of kimchi storage chambers, a heater and an evaporator installed on inner side walls in each of the kimchi storage chambers, at least one high and one low temperature sensors in each of the kimchi storage chambers and a control unit for controlling the evaporator and the heater in each of the kimchi storage chambers.

Abstract: A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

Abstract: A rethermalization system for heating refrigerated food on trays, maintaining the food in a refrigerated condition until heated, and heating some of the food to a desired temperature at a serving time while maintaining the rest of the food in a refrigerated condition. The system has a cart which docks inside a refrigerator. The cart has shelves on which trays of food reside. In the shelves there are heaters. The operator programs the system using an intricate series of commands at an operator interface. A first controller interprets the commands and sends the program to a second controller. The second controller controls the heating cycle of the heaters. A current sensor is provided to sense whether there is current to the heaters. The second controller polls the current sensor and compares the findings to what is called for in the program.

Abstract: Independent control of multiple samples which are in close proximity. All the samples in a sample container designed for rapid heat transfer and can be independently regulated to a set point using a temperature feedback control with the temperature monitored by a temperature sensitive element. This is implemented by heating each sample independently and at the same time a cooling device produces a substantial and continuous heat flow from the sample in order to permit an adequate rate of cooling when required. The rate of heat flow through the cooling device is partly determined by a thermal resistance which is included to control the pattern and maximum rate of heat flow to designed levels. By keeping the thermal mass of the temperature controlled components to a minimum it is also possible to change the temperature of the samples very rapidly.

Abstract: A thermal cycling module includes an array of thermoelectric devices ?36! divided into multiple zones ?A, B, C, D! independently controlled by corresponding variable power supplies ?56, 58, 60, 62!. The thermoelectric devices ?36! provide localized, precise, and rapid control of both heating and cooling, while fluid from one of several fluid supplies ?64, 66, 68! provides bulk heating or cooling via a fluid heat exchanger ?38!. Sensors ?46, 48, 50, 52! provide feedback of temperature or other process parameters to a controller ?54! which generates control signals for controlling the power supplies ?56, 58, 60, 62!, the fluid supplies ?64, 66, 68!, and fluid valves ?70, 72! which control fluid flow through the heat exchanger ?38!.

Abstract: An integrated refrigeration and rethermalization system for storage of prepared meals in a refrigerated state, rethermalization of the meals in accordance with a rethermalization program, and maintenance of the rethermalized meals at a desired serving temperature is disclosed. Refrigerated meals are placed on trays, supported by heater shelves, in a refrigeration-rethermalization cart having onboard refrigeration. Critical cooling elements of the onboard refrigerator are located within the food storage area of the cart for improved cooling air flow and maximum cooling efficiency. The heater shelves contain one or more heating elements designed to heat only selected food items located on the trays in accordance with preset time-temperature curves, or rethermalization programs.

Abstract: A rethermalization system for heating refrigerated food on trays, maintaining the food in a refrigerated condition until heated, and heating some of the food to a desired temperature at a serving time while maintaining the rest of the food in a refrigerated condition. The system has a cart which docks inside a refrigerator. The cart has shelves on which trays of food reside. In the shelves there are heaters. The operator programs the system using an intricate series of commands at an operator interface. A first controller interprets the commands and sends the program to a second controller. The second controller controls the heating cycle of the heaters. A current sensor is provided to sense whether there is current to the heaters. The second controller polls the current sensor and compares the findings to what is called for in the program.

Abstract: A refrigerator has a compartment for fermenting foods such as kimchi. The food is disposed within a container that is slidable into the compartment. The container includes an electrical connector projecting from a container wall and which becomes plugged into a recessed electrical connector disposed in a wall of the compartment in response to insertion of the container into the compartment. The container carries a heater and a temperature sensor which are electrically connectable, via the electrical connectors, to a controller disposed in the refrigerator housing.

Abstract: A temperature control and process for adjusting the temperature of a workstation and a work medium at a workstation to a predetermined temperature. The temperature control comprises a cooling vehicle such as a heat exchanger, a coolant temperature sensor and control, a source of fluid coolant such as a manifold, a recirculating pump, a flow line to circulate the coolant to the workstation with the flow line containing a flow regulator and a heater, a bypass valve for bypassing the flow regulator and heater, and a workstation temperature sensor and control. The workstation temperature control controls the operation of the heater and bypass valve so that the temperature of the coolant is below the desired temperature for the workstation, thus achieving a rapid transient response while avoiding overcooling. The coolant temperature control and workstation temperature control may be in a temperature control computer, thus providing a large number of different operating sequences.