Control Of Vapor Or Liquid Flow Between Evaporator And Condenser Sections (e.g., By Variable Restrictions, Check Valves, Etc.) Patents (Class 165/274)
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Patent number: 11898578Abstract: A heat-activated multiphase fluid-operated pump. A hot chamber receptive of externally applied heat converts a working fluid into vapor. A pressure-control valve allows vaporized working fluid to escape the hot chamber only when a target pressure is exceeded. A liquid-piston chamber receives the vaporized working fluid, which expands adiabatically to displace pumped liquid within the liquid-piston chamber in a pump stage, expelling it through an exit port having a unidirectional check valve. A condenser receives the displaced liquid and allowing it in a suction stage to return to the liquid-piston chamber through another unidirectional check valve. An injector valve coupled between the liquid-piston chamber and the hot chamber facilitates jets of condensed working fluid to replenish the hot chamber in successive brief spurts responsive to periodic pressure pulses in the liquid-piston chamber that temporarily exceed the pressure in the hot chamber.Type: GrantFiled: September 10, 2021Date of Patent: February 13, 2024Assignee: Hamfop Technologies LLCInventor: Mudasir Ahmad
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Patent number: 11879686Abstract: A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.Type: GrantFiled: July 8, 2022Date of Patent: January 23, 2024Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., PURDUE RESEARCH FOUNDATIONInventors: Shailesh N. Joshi, Srivathsan Sudhakar
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Patent number: 11477913Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid.Type: GrantFiled: January 7, 2021Date of Patent: October 18, 2022Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11363742Abstract: Apparatuses, systems, devices, and methods for variable temperature heat exchange switch are disclosed. An apparatus includes a heat exchanger coupled to an electronic component to dissipate heat from the electronic component. The apparatus includes a heat pipe connected to the heat exchanger and configured to dissipate heat. An apparatus includes a thermal-activated switch located at the connection between the heat exchanger and the heat pipe. The thermal-activated switch may be configured to allow heat transfer from the heat exchanger to the heat pipe in response to a temperature satisfying a threshold temperature.Type: GrantFiled: April 30, 2020Date of Patent: June 14, 2022Assignee: LENOVO (Singapore) PTE. LTD.Inventors: Bouziane Yebka, Philip Jakes, Tin-Lup Wong
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Patent number: 11317543Abstract: A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.Type: GrantFiled: December 1, 2020Date of Patent: April 26, 2022Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 10962304Abstract: A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a rotary separator in fluid receiving communication with the condenser. Gas exiting the rotary separator may recirculate back to the condenser and liquid exiting the rotary separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.Type: GrantFiled: April 5, 2019Date of Patent: March 30, 2021Assignee: HAMILTON SUNDSTRAND CORPORATIONInventors: Gary A. Adamson, Wei-Lin Cho
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Patent number: 10936031Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.Type: GrantFiled: April 13, 2018Date of Patent: March 2, 2021Assignee: Dell Products L.P.Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
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Patent number: 10704839Abstract: A two-phase heat transfer system including at least one two-phase evaporator, at least one condenser, a vapor conduit joining a vapor outlet of the two-phase evaporator to an inlet of the condenser, a liquid conduit joining an outlet of the condenser to a liquid inlet of the two-phase evaporator, and a thermally-actuated capillary flow valve. The thermally-actuated capillary flow valve having a valve inlet, a valve outlet, a thermal connection to a heat sink for cold biasing the capillary flow valve, a porous wick extending across the flow passageway of the capillary flow valve, and a heater thermally connected to the capillary flow valve, where actuation of the heater evaporates liquid in the porous wick to allow passage of vapor through the capillary flow valve.Type: GrantFiled: July 23, 2018Date of Patent: July 7, 2020Assignee: The Government of the United States of America, as represented by the Secretary of the NavyInventor: Triem T. Hoang
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Patent number: 10349561Abstract: A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.Type: GrantFiled: July 13, 2016Date of Patent: July 9, 2019Assignee: Google LLCInventors: Soheil Farshchian, Emad Samadiani
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Patent number: 10012115Abstract: An exhaust heat recovery system may a condenser having a working fluid introduced thereinto and recovering heat of the introduced working fluid, the introduced working fluid receiving heat of exhaust gas through a heat exchanger provided in an exhaust pipe, and a reservoir receiving the working fluid from the condenser, wherein the condenser and the reservoir are provided with a coolant channel through which a coolant for cooling the working fluid flows.Type: GrantFiled: October 1, 2015Date of Patent: July 3, 2018Assignee: Hyundai Motor CompanyInventors: You Sang Son, Chang Soo Kim
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Patent number: 9869495Abstract: This invention relates to a multi-cycle power generator. More specifically, the invention relates to a power generator having a heat pump cycle and at least a hot power gener-ating cycle, the cycles being configured relative to one another to transfer heat there between two or more times in a single cycle thereby to recover energy through the reuse of unused heat energy that is typically discarded in conventional ther-modynamic cycles. The multi-cycle power gener-ator includes a heat pump cycle and a hot power cycle, wherein at least a pair of heat exchangers of the hot power cycle are common with a pair of heat exchangers of the heat pump cycle. The multi-cycle power generator may further include a cool power generating cycle In combination with the heat pump and hot power generating cycles.Type: GrantFiled: August 1, 2014Date of Patent: January 16, 2018Inventor: Martin Gordon Gill
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Patent number: 9810483Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.Type: GrantFiled: May 17, 2012Date of Patent: November 7, 2017Assignee: Thermal Corp.Inventors: Walter John Bilski, Jerome E. Toth, John G. Thayer
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Patent number: 9713291Abstract: A thermosiphon system includes a condenser, an evaporator including a housing and a wick located in the housing, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line includes an outer tube and an inner tube nested within the outer tube. A first passage defined by the inner tube is positioned to carry a liquid phase of a working fluid from the condenser to the evaporator, and a second passage defined by a volume between the inner tube and the outer tube is positioned to carry a vapor phase of the working fluid from the evaporator to the condenser.Type: GrantFiled: October 10, 2016Date of Patent: July 18, 2017Assignee: Google Inc.Inventor: Jeremy Rice
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Patent number: 9146059Abstract: A capillary flow valve for use in a two phase heat transfer system such as a loop heat pipe, including an inlet port for receiving working fluid in a vapor-phase, an outlet port for outputting working fluid in a vapor-phase, and a porous wick material extending across the interior of the valve. Heating the wick evaporates liquid-phase working fluid from the wick and allows the vapor-phase working fluid to pass through the wick to the outlet port. Removing the heat allows liquid to condense in the wick, preventing flow of the vapor-phase working fluid through the wick to the outlet port.Type: GrantFiled: August 9, 2012Date of Patent: September 29, 2015Assignee: The United States of America, as represented by the Secretary of the NavyInventor: Triem T. Hoang
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Patent number: 9109843Abstract: Radiator systems utilizing controlling features for shutdown and restart for varying heat load applications.Type: GrantFiled: June 29, 2010Date of Patent: August 18, 2015Assignee: PARAGON SPACE DEVELOPMENT CORPORATIONInventor: Christine Schroeder Iacomini
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Patent number: 8910701Abstract: A thermal module for use on a spacecraft to control thermal loads coming from a heat source is disclosed. The thermal module includes a two-phase loop system and a heat rejection system. The two-phase loop system includes a thermal collector, a heat flow regulator, a by-pass line, and a condenser. The condenser and the heat rejection system are thermally coupled, such that the heat flow regulator redirects part of the thermal loads from the heat source to the condenser, from which the heat rejection system directs said thermal loads to a heat sink. The temperature of the heat source is regulated by bypassing another part of the thermal loads back to the thermal collector through the by-pass line in a proportional manner, to avoid overcooling the heat source. The heat rejection system is designed based on the hottest possible conditions for the spacecraft mission.Type: GrantFiled: December 3, 2008Date of Patent: December 16, 2014Assignee: Iberica del Espacio, S.A.Inventors: Alejandro Torres Sepúlveda, Donatas Mishkinis, José Luis Pastor Fernández
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Patent number: 8863740Abstract: A heat pipe comprises an evaporator section 5 having a radiation absorbing plate 6 a portion of an elongate tube 7, and a condenser section 10 at a distal end of the elongate tube 7 remote from the evaporator section 5. A flow control valve 20 is provided between the evaporator section 5 and the condenser section 10 to selectively interrupt communication between said sections when the temperature within the condenser section 10 exceeds a predetermined maximum. A temperature sensitive member, (coil of memory metal 34?, or discs 34?) acts between a support plate 26 and a seat 36 located on a valve pintle 30 to urge the valve head 22 towards the valve seat 24 when the temperature of the temperature sensitive member 34 exceeds a predetermined limit. A return spring 38 is provided to bias the valve head 22 away from the valve seat 24.Type: GrantFiled: April 7, 2008Date of Patent: October 21, 2014Assignee: Kingspan Holdings (IRL) LimitedInventors: Thomas Patrick Williamson, Boris Bauer, Paul Thomas McEntee
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Patent number: 8752616Abstract: A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.Type: GrantFiled: October 3, 2011Date of Patent: June 17, 2014Assignee: Alliant Techsystems Inc.Inventors: Edward J. Kroliczek, James Soekgeun Yun, David C. Bugby, David A. Wolf, Sr.
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Patent number: 8651172Abstract: A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.Type: GrantFiled: March 22, 2007Date of Patent: February 18, 2014Assignee: Raytheon CompanyInventors: William G. Wyatt, Richard M. Weber
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Patent number: 8607854Abstract: A fluid heat transfer device includes a multi-pipe arrangement for transporting fluids of temperature difference in counter flow directions on same end sides of a first transfer pipe and second transfer pipe having a parallel arrangement.Type: GrantFiled: November 19, 2008Date of Patent: December 17, 2013Inventor: Tai-Her Yang
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Patent number: 8567486Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.Type: GrantFiled: March 22, 2007Date of Patent: October 29, 2013Assignee: Alliant Techsystems Inc.Inventor: David A. Wolf, Sr.
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Patent number: 8381805Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.Type: GrantFiled: March 22, 2007Date of Patent: February 26, 2013Assignee: Alliant Techsystems Inc.Inventor: David A. Wolf, Sr.
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Patent number: 8336611Abstract: A heat source is cooled by employing heat pipes, magneto-hydrodynamic fluid pipes, and a heat sink. Heat is transmitted from evaporating ends of the heat pipes connected to the heat source to condensing ends of the heat pipes connected to the heat sink. The magneto-hydrodynamic fluid is circulated inside the magneto-hydrodynamic fluid pipes. Magnetic fields are generated using an array of magnets and an electric potential is created from a top surface to a bottom surface of each magneto-hydrodynamic fluid pipe using metal films. The magnetic fields and electric potential induce an electrically-conductive magneto-hydrodynamic fluid to circulate in the magneto-hydrodynamic fluid pipes thereby dissipating heat from the heat sink.Type: GrantFiled: August 11, 2009Date of Patent: December 25, 2012Assignee: Oracle America, Inc.Inventor: Chien Ouyang
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Patent number: 8316927Abstract: A waste heat recovery device includes a heat pipe in which a working fluid for transporting heat is enclosed, and a mode-switching valve for switching a heat recovery mode and a heat insulation mode. The heat pipe has a heating part for heating and evaporating the working fluid and a cooling part for cooling and condensing the evaporated working fluid. The heating part is made of a steel through which hydrogen gas permeates about at 500° C. and higher. In the heat recovery mode, the waste heat recovery device recovers heat of exhaust gas by using the heat pipe. Furthermore, in the heat insulation mode, a heat transport from the heating part to the cooling part is stopped.Type: GrantFiled: June 5, 2007Date of Patent: November 27, 2012Assignee: Denso CorporationInventors: Kimio Kohara, Seiji Inoue, Yuuki Mukoubara, Yasutoshi Yamanaka, Masashi Miyagawa
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Patent number: 8069906Abstract: An exhaust heat recovery apparatus includes an evaporation unit, a condensation unit, an evaporation-side communication part and a condensation-side communication part. The evaporation unit is disposed in a duct member through which an exhaust gas generated from an engine flows, and evaporates an operation fluid by heat of the exhaust gas. The condensation unit is disposed in a coolant passage through which a coolant flows, and condenses the operation fluid by radiating the heat to the coolant. The evaporation-side communication part connects the evaporation unit and the condensation unit for introducing evaporated operation fluid to the condensation unit. The condensation-side communication part connects the condensation unit and the evaporation unit for introducing condensed operation fluid to the evaporation unit. The condensation-side communication part is in contact with an outer surface of the duct member at least at a part.Type: GrantFiled: July 29, 2008Date of Patent: December 6, 2011Assignee: Denso CorporationInventors: Yuuki Mukoubara, Seiji Inoue, Kimio Kohara, Kenshirou Muramatsu, Yasutoshi Yamanaka
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Patent number: 8066055Abstract: A system including a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor is disclosed. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.Type: GrantFiled: April 17, 2009Date of Patent: November 29, 2011Assignee: Alliant Techsystems Inc.Inventors: Edward J. Kroliczek, James S. Yun, David C. Bugby, David A. Wolf, Sr.
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Patent number: 8047268Abstract: A heat transfer system includes a first loop and a second loop. The first loop includes a condenser having a vapor inlet and a liquid outlet, a vapor line in fluid communication with the vapor inlet of the condenser, a liquid line in fluid communication with the liquid outlet of the condenser, and primary evaporators fluidly coupled in series with the liquid line and in parallel with the vapor line. The second loop includes a reservoir, a secondary evaporator having a vapor outlet coupled to the vapor line and a fluid inlet coupled to the reservoir, and a sweepage line in fluid communication with the reservoir and the primary evaporators.Type: GrantFiled: May 17, 2006Date of Patent: November 1, 2011Assignee: Alliant Techsystems Inc.Inventors: Edward J. Kroliczek, Dmitry Khrustalev, Michael J. Morgan
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Patent number: 8033322Abstract: A space has inlet and outlet registers and outside and exhaust air ducts. The outside air duct is located adjacent to the inlet register. The exhaust air duct is located adjacent to the outlet register. The space has an outside air passageway through the outside air duct adjacent to the inlet register. The space has an exhaust air passageway through the exhaust air duct adjacent to the outlet register. A thermosyphon run around heat pipe assembly includes outside air coils and exhaust air coils. Vapor lines and liquid lines couple the coils. The outside air coils are positioned adjacent to the air inlet duct. The exhaust air coils are located adjacent to the air outlet duct. A control device, in the form of a modulating return damper, is located between the air ducts. An air filter is provided upstream of and adjacent to the outside air coils.Type: GrantFiled: November 7, 2008Date of Patent: October 11, 2011Inventor: Richard W. Trent
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Patent number: 8020613Abstract: A heat transfer controlling mechanism and a fuel cell system, which allow working fluid to flow in a predetermined direction in a loop-shaped flow path without a back flow, having a simple structure independent of the orientation during use, low power consumption, and efficient heat transfer and size reduction. The mechanism includes a vaporizing portion, a condensing portion, and a loop-shaped flow path connecting the vaporizing and the condensing portions so as to seal working fluid. The mechanism transports heat by vaporizing the fluid in the vaporizing portion and condensing the fluid in the condensing portion to control heat transfer. The mechanism further includes a gas passage suppressing portion on one side in the flow path, for allowing liquid, but not gas, to pass therethrough and a liquid passage suppressing portion on the other side in the flow path, for allowing gas, but not liquid, to pass therethrough.Type: GrantFiled: October 24, 2007Date of Patent: September 20, 2011Assignee: Canon Kabushiki KaishaInventor: Toru Nakakubo
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Patent number: 8003271Abstract: A heat exchanger that can mechanically automatically control a level of cooling water according to heat generation of the fuel cell. The heat exchanger includes a housing having a cooling water inlet and an outlet connected to a fuel cell stack, a moving plate which moves reciprocally in the housing and discharges cooling water filled in the housing to the stack when it moves in a one direction and when it receives a steam pressure from the stack it moves in an opposite direction, and an elastic member that applies a force to the moving plate in the one direction. The heat exchanger can automatically maintain the level of cooling water despite a difference in heat generated between a full and a partial load operation of the fuel cell obviating complicated electronics such as a thermo-sensor, a valve, or a controller. Also, under a partial load, the exposure of flow channels to superheated steam is avoided, thereby extending the lifetime of the fuel cell.Type: GrantFiled: September 5, 2006Date of Patent: August 23, 2011Assignee: Samsung SDI Co., Ltd.Inventors: Tae-won Song, Seung-jae Lee
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Patent number: 7946112Abstract: An exhaust heat recovery device includes an accommodating portion extending continuously without shrinking a section therein and adapted to allow exhaust gas of an internal combustion engine to pass therethrough, a catalyst disposed in the accommodating portion for cleaning the exhaust gas, an evaporator disposed adjacent to the catalyst on a downstream side of an exhaust gas flow in the accommodating portion, and a condenser for condensing the working medium by radiating heat of the working medium flowing thereinto from the evaporator so as to recover exhaust heat on the coolant side. The condenser is located to return the condensed working medium to the evaporator.Type: GrantFiled: June 7, 2007Date of Patent: May 24, 2011Assignee: Denso CorporationInventors: Masashi Miyagawa, Yasutoshi Yamanaka, Koichi Ban, Kimio Kohara
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Patent number: 7841208Abstract: A compression refrigeration system and evaporator having multiple circuits. Spray nozzles are provided for atomization and expansion of the refrigerant. The atomizing spray nozzles are interposed in each evaporator circuit and the nozzles are sized to distribute atomized refrigerant to the various evaporator circuits based on airflow rates across the associated circuit.Type: GrantFiled: August 9, 2007Date of Patent: November 30, 2010Assignee: Refrigerant Technologies, Inc. Arizona CorporationInventor: Randy Lefor
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Patent number: 7723760Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHPâ„¢) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: GrantFiled: October 31, 2007Date of Patent: May 25, 2010Assignee: University of CincinnatiInventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
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Publication number: 20100051254Abstract: A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed. The sealed container includes a heat receiving portion to which an element to be cooled is provided, and heat radiating portion. An amount of heat is supplied to the heat receiving portion when the element to be cooled is in a waiting state.Type: ApplicationFiled: August 27, 2009Publication date: March 4, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOSHI, Tetsuya Nagayasu, Shingo Hironaka, Kuraki Kitazaki, Yukio Sato
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Publication number: 20090236088Abstract: The present application provides improved heat exchangers for controlling the rate of flow through the heat exchanger. The heat exchanger includes an inlet coolant box, and an outlet coolant box, wherein the inlet coolant box and the outlet coolant box are separated by a partition, wherein the partition comprises a first diverting device and a second diverting device, and wherein the range of flow rates over which the first diverting device diverts fluid is different then the range of flow rates over which the second diverting device diverts fluid.Type: ApplicationFiled: March 24, 2008Publication date: September 24, 2009Applicant: General Electric CompanyInventors: Richard Mallory Davis, Karl Kurt Rocco Westphal
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Publication number: 20090200006Abstract: A system including a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor is disclosed. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.Type: ApplicationFiled: April 17, 2009Publication date: August 13, 2009Applicant: ALLIANT TECHSYSTEMS INC.Inventors: Edward J. Kroliczek, James Yun, David Bugby, David A. Wolf, Sr.
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Publication number: 20080236807Abstract: The present invention relates to a heat pipe for long distance and, in particular, to a heat pipe constituted by an evaporating unit for evaporating working fluid to form vapor, a condensing unit spaced at a long distant from the evaporating unit and discharging heat from a transferred vapor to the outside, and a transferring unit formed as a connecting tube of a general form having a single function connecting the evaporating unit and the condensing unit to transfer only the evaporated fluid vapor, wherein a working fluid supplier is formed in the evaporating unit in order to supplement the evaporated working fluid from the outside and a condensation liquid discharging unit is formed in the condensing unit in order to discharge condensation liquid generated by condensing the vapor to the outside.Type: ApplicationFiled: March 14, 2008Publication date: October 2, 2008Inventor: Hun Chol Kim
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Publication number: 20070199339Abstract: A cooling apparatus for cooling a heat-generating member includes a cooling flow path, a condenser, a coolant-returning flow path, a first check valve and a second check valve. The cooling flow path is thermally connected to the heat-generating member. The condenser is connected to a downstream portion of the cooling flow path and condenses a coolant contained in the cooling apparatus after the coolant is evaporated in the cooling flow path. The coolant-returning flow path returns the coolant condensed by the condenser to an upstream portion of the cooling flow path. The first check valve is disposed between the coolant-returning flow path and prevents the coolant from flowing in a reverse direction from the cooling flow path to the first coolant-returning flow path. The second check valve is disposed between the condenser and the coolant-returning flow path and prevents the coolant from flowing in a reverse direction from the first coolant-returning flow path to the condenser.Type: ApplicationFiled: February 7, 2007Publication date: August 30, 2007Inventors: Yuji Ishihara, Hitoshi Shimonosono, Keiko Shishido
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Patent number: 7246658Abstract: A heat exchanger extracts heat from a two-phase fluid coolant so that the coolant changes from a vapor state to a liquid state. Two valves have respective inlets which communicate with the coolant in the heat exchanger, and which are physically spaced from each other. Valve control structure responds to the presence of liquid at the inlet to either valve by opening that valve, so that the liquid coolant flows through the valve to a discharge section. A different feature involves a housing with a heat exchanger therein, the heat exchanger having a plurality of coolant conduits that are axially spaced. A flow of air travels axially within the housing, then flows transversely past the conduits to the other side thereof, and then resumes flowing axially on the other side of the conduits.Type: GrantFiled: October 31, 2003Date of Patent: July 24, 2007Assignee: Raytheon CompanyInventors: William Gerald Wyatt, James L. Haws, Richard M. Weber
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Patent number: 6913076Abstract: A high temperature heat pump comprising a low temperature heat exchanger to produce vapor of a first fluid from heat transferred from a second fluid to a mixture of liquid and vapor of the first fluid; a compressor to increase the pressure and temperature of the produced vapor; a high temperature heat exchanger to heat the second fluid to useful, high temperatures from the condensation of the first fluid; and an expander to lower the pressure and temperature of the first fluid producing a mixture of vapor and liquid.Type: GrantFiled: July 17, 2002Date of Patent: July 5, 2005Assignee: Energent CorporationInventor: Lance G. Hays
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Patent number: 6857466Abstract: This cooling apparatus can improve a radiation performance by increasing the boiling area and make it difficult to cause the burnout on boiling faces by filling the boiling faces with a refrigerant necessary for the boiling. In refrigerant chambers for reserving a refrigerant, there are inserted corrugated fins for increasing the boiling area. These corrugated fins are composed of lower corrugated fins arranged to correspond to the lower sides of the boiling faces for receiving the heat of a heating body, and upper corrugated fins arranged to correspond to the upper sides of the boiling faces, and these lower and upper corrugated fins and are individually held in thermal contact with the boiling faces of the refrigerant chambers. The lower corrugated fins and the upper corrugated fins are given a common fin pitch P and are individually inserted vertically in the individual refrigerant chambers to define the individual passages further into a plurality of small passage portions.Type: GrantFiled: February 8, 2001Date of Patent: February 22, 2005Assignee: Denso CorporationInventor: Hiroyuki Osakabe
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Publication number: 20040112583Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.Type: ApplicationFiled: October 29, 2003Publication date: June 17, 2004Inventors: Scott D. Garner, G. Yale Eastman
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Patent number: 6745830Abstract: A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.Type: GrantFiled: January 22, 2003Date of Patent: June 8, 2004Inventor: Khanh Dinh
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Patent number: 6675887Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.Type: GrantFiled: March 26, 2002Date of Patent: January 13, 2004Assignee: Thermal Corp.Inventors: Scott D. Garner, G. Yale Eastman
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Publication number: 20030196787Abstract: The present invention is directed towards a passive thermal regulator that is suitable for use in electronic devices, such as optical nodes and amplifiers. The thermal regulator regulates hot and cold temperatures surrounding temperature sensitive components. The thermal regulator includes a heat pipe filled with water, a plastic insulator, and a copper slug inserted into the insulator. The thermal regulator transfers heat to and from the temperature sensitive component by absorbing heat in the copper slug. When the temperature is excessively hot, the heat pipe absorbs the heat from the copper slug and conducts the heat to the dissipation end of the heat pipe. When the temperature is excessively cold, the water in the heat pipe freezes, thereby reducing conduction of the heat. The plastic insulator prohibits the heat absorbed by the copper slug from dissipating into the housing and surrounding air, thereby allowing the heat to transfer to the component.Type: ApplicationFiled: April 19, 2002Publication date: October 23, 2003Inventor: William G. Mahoney
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Publication number: 20030183381Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.Type: ApplicationFiled: March 26, 2002Publication date: October 2, 2003Inventors: Scott D. Garner, G. Yale Eastman
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Patent number: 6615912Abstract: The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser.Type: GrantFiled: June 20, 2001Date of Patent: September 9, 2003Assignee: Thermal Corp.Inventor: Scott D. Garner
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Publication number: 20030136555Abstract: A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.Type: ApplicationFiled: January 22, 2003Publication date: July 24, 2003Inventor: Khanh Dinh
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Patent number: 6591902Abstract: An air conditioning system has a plurality of heat pipes including an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes has a vapor leg and a liquid leg coupling the vapor coil and liquid coil for the flow of a working fluid there through. At least one back flow abater is in the liquid leg for controlling the back flow of the working fluid within the liquid leg.Type: GrantFiled: October 24, 2000Date of Patent: July 15, 2003Inventor: Richard W. Trent
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Patent number: 6578629Abstract: An air conditioning system comprising a plurality of heat pipes. Each of the heat pipes includes an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes also having an inlet leg and an outlet leg coupling an associated input coil and output coil for the flow of a working fluid there through. At least one valve for controlling the flow of the coolant within each heat pipes exists. A tube and shell heat exchanger transfers heat from a chiller fluid to an intermediate portion of the heat pipes.Type: GrantFiled: October 24, 2000Date of Patent: June 17, 2003Inventor: Richard W. Trent