Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.

Abstract: A heat pipe is disclosed includes a container, a container lid including a groove defined therein, a wick, and an end plug operably coupled to the wick. The end plug includes a pin extending therefrom. The groove of the container lid is configured to receive the pin.

Abstract: A heat dissipating plate includes a casing, a capillary structure layer, a support structure, and heat dissipating liquid. The casing includes a first substrate and a second substrate, which is disposed opposite to the first substrate to form a non-vacuum sealed cavity. The capillary structure layer is disposed in a first region of the non-vacuum sealed cavity and defines a first flow space. The support structure is disposed in a second region of the non-vacuum sealed cavity and defines a second flow space. The heat dissipating liquid is disposed in the non-vacuum sealed cavity, the liquid amount of which is more than 50% of the total capacity of the first flow space and the second flow space, and flows between the first flow space and the second flow space. The invention also provides a method for manufacturing the heat dissipation plate and an electronic device having the heat dissipation plate.

Abstract: A rotating heat pipe is used for temperature control of electric motors and generators and other rotating heat generating assemblies to ensure their proper operation. The heat pipe is integral with the shaft, and unlike conventional devices, incorporates a solid-liquid phase change material as the heat transfer/transport material. In addition, it comprises a scraped surface heat exchange mechanism at the heat dissipation region to allow for high cooling rates as required. This scraped surface mechanism is preferentially driven by a magnetic coupling to eliminate issues related to leaks of the heat transfer material.

Abstract: A heat pipe is provided having a hollow body defining an interior vapor space, evaporator and condenser regions, a wick structure lining an inner wall of the hollow body, and a working fluid disposed in the hollow body, wherein a path for the working fluid in liquid state extends from the condenser region toward the evaporator region or wherein the wick structure extends along a direction from a first end of the hollow body toward the second end, and wherein the wick structure includes first and second regions that extend along the path or direction and that each have wick particles defining respective pore sizes that are different from one another.

Abstract: Provided is a heat pipe which is installed in a cold region in a bottom heat posture in which a longitudinal direction of a container is substantially in parallel with a gravitational direction, is capable of preventing the container from deforming even when a working fluid has become frozen, and has excellent heat transport properties.

Abstract: A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

Abstract: A heat transfer system cycles between a first mode where a heat transfer fluid is directed to a first electrocaloric module and from the first electrocaloric module to a heat exchanger to a second electrocaloric module while one of the first and second electrocaloric modules is energized, and a second mode where the heat transfer fluid is directed to the second electrocaloric module and from the second electrocaloric module to the heat exchanger to the first electrocaloric module, while the other of the first and second electrocaloric modules is energized. The modes are repeatedly cycled in alternating order directing the heat transfer fluid to cause a temperature gradient in each of the first and second electrocaloric modules, and heat is rejected to the fluid from the heat exchanger or is absorbed by the heat exchanger from the fluid.

Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.

Abstract: Disclosed is a spacecraft including: a housing defining an exterior space, the housing having a first face and a second face; and first and second radiators carried by the first and second faces, the first and second radiators each having an inner main face, an outer main face, and side faces. The spacecraft includes a first auxiliary radiator and a first auxiliary heat transfer device thermally connecting the first auxiliary radiator to the inner main face of the second radiator, the first auxiliary radiator being arranged in a first portion of the exterior space defined by the outer main face of the first radiator and by first planes containing the side faces of the first radiator. The first auxiliary heat transfer device includes a heat conducting device. The first auxiliary radiator is composed solely of one or two radiating panels supporting the heat conducting device.

Abstract: Technique(s) to mitigate creep and/or cascade failure in high temperature heat pipe reactor cores may include gas loading each heat pipe such that when one or more heat pipes in the heat pipe array fail, the adjacent heat pipes can accommodate added heat load with little change in temperature.

Abstract: A cooling system includes an electrocaloric element (12) having a liquid crystal elastomer or a liquid form liquid crystal retained in an elastomeric polymer matrix. A pair of electrodes (14.16) is disposed on opposite surfaces of the electrocaloric element. A first thermal flow path (18) is disposed between the electrocaloric element and a heat sink (17). A second thermal flow path (22) is disposed between the electrocaloric element and a heat source (20). The system also includes a controller (24) configured to control electrical current to the electrodes and to selectively direct transfer of heat energy from the electrocaloric element to the heat sink along the first thermal flow path or from the heat source to the electrocaloric element along the second thermal flow path.

Abstract: A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.

Abstract: The advanced control heat transfer loop apparatus (1) for heat transfer and thermal control applications uses a two-phase fluid as a working media and comprises at least one evaporator (2) to be connected with a heat source and comprising primary capillary pump (4), a thermal stabilization-compensation chamber (3) being attached to the at least one evaporator (2), at least one condenser (24) to be connected with a heat sink, liquid lines (22) and vapor lines (23) connecting the at least one evaporator (2) and the at least one condenser (24), a remote compensation chamber (20), temperature sensors (27) for detecting the temperature of the remote compensation chamber (20) and at the thermal stabilization compensation chamber (3) attached to the at least one evaporator (2), at least one heating element (19) for heating the remote compensation chamber (20), and a controller (28).

Abstract: Examples are generally described that include a substrate, an electrocaloric effect material at least partially supported by the substrate, and a thermal diode at least partially supported by the electrocaloric effect material.

Abstract: A loop heat pipe system includes a loop heat pipe (LHP), a temperature sensor, a heater and a controller. The temperature sensor measures temperature of a working fluid portion of the LHP in which the working fluid has different phases depending on whether or not the LHP is in a disable status not to start up a heat transportation, in which a liquid phase of the working fluid does not exist in an evaporator of the LHP. The heater heats a heating target part of a vapor line. The controller, in order to start up the LHP, turns on the heater, monitors temperature of the heating target part using the temperature sensor, and turns off the heater when detecting a change in the monitored temperature, caused by condensation of a vapor phase of the working fluid.

Abstract: A heat transfer device for installation in a system having a heat generating element within the system away from which heat is to be transferred is described. The heat transfer device includes a heat pipe having a first portion, a second portion, and a working fluid contained within the heat pipe for transferring heat from the first portion to the second portion. The first portion is disposed in proximity with the heat generating element. The second portion is coupled to the first portion. At least part of the second portion is disposed outside the system to dissipate heat from the heat generating element and the second portion may be variably extended outside the system.

Abstract: A hydrogen generator and a fuel cell system including a fuel cell battery and the hydrogen generator. The hydrogen generator includes a cartridge, a housing with a cavity to removably contain the cartridge, and an initiation system. The cartridge includes a casing; a plurality of pellets including a hydrogen containing material; a plurality of solid heat transfer members in contact with but not penetrating the casing; a hydrogen outlet in the casing; and a hydrogen flow path from each pellet to the hydrogen outlet. A plurality of heating elements is disposed inside the housing. When the cartridge is in the cavity, each heating element is disposed so heat can be conducted from the heating element and through the casing and corresponding heat transfer member to initiate the release of hydrogen gas. The initiation system can selectively heat one or more pellets to release hydrogen gas as needed.

Abstract: The disclosure herein provides for heat dissipation switches and systems, as well as their use for dissipating excess heat from a heat source. Various aspects of a heat dissipation switch may include a thermally isolating material having a number of conductive element cavities. A number of thermally switched conductive elements may nest within the conductive element cavities either independently or as part of a thermally switched sheet. The material of the thermally switched conductive elements may be configured to deform in response to a temperature change through a threshold temperature or temperature range in order to create or interrupt heat flow paths from the heat source to a heat sink.

Abstract: A thermal module for use on a spacecraft to control thermal loads coming from a heat source is disclosed. The thermal module includes a two-phase loop system and a heat rejection system. The two-phase loop system includes a thermal collector, a heat flow regulator, a by-pass line, and a condenser. The condenser and the heat rejection system are thermally coupled, such that the heat flow regulator redirects part of the thermal loads from the heat source to the condenser, from which the heat rejection system directs said thermal loads to a heat sink. The temperature of the heat source is regulated by bypassing another part of the thermal loads back to the thermal collector through the by-pass line in a proportional manner, to avoid overcooling the heat source. The heat rejection system is designed based on the hottest possible conditions for the spacecraft mission.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: A device for cooling components, comprising a housing in which a cavity is formed, in which a phase-change material is accommodated, the housing having at least one surface, which is able to be brought into contact with the component to be cooled, and at least one heat-dissipating surface. The cavity accommodating the phase-change material is enclosed by at least one coil, and the phase-change material includes ferromagnetic or magnetizable particles. Furthermore a method for cooling a component using the device is described.

Abstract: A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Abstract: A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.

Abstract: A fluid heat transfer device includes a multi-pipe arrangement for transporting fluids of temperature difference in counter flow directions on same end sides of a first transfer pipe and second transfer pipe having a parallel arrangement.

Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.

Abstract: A method, apparatus, and computer program product for modeling heat radiated by a structure. The flow of a fluid over a surface of a model of the structure is simulated. The surface has a plurality of surface elements. Heat radiated by the plurality of surface elements in response to the fluid flowing over the surface of the model of the structure is identified. An effect of heat radiated by at least a portion of the plurality of surface elements on each other is identified. A model of the heat radiated by the structure is created using the heat radiated by the plurality of surface elements and the effect of the heat radiated by at least a portion of the plurality of surface elements on each other.

Abstract: A temperature control apparatus, for radiating heat from a side door to a vehicle interior, includes components which are provided inside each of the vehicle body and side door, respectively. A heat source is disposed within a peripheral edge part of an opening in a vehicle body. A heat pipe is provided in the side door. When the door opening is closed by the side door, the heat source and heat pipe come into contact, and are thermally connected by a heat transmission mechanism.

Abstract: An apparatus, a system and a method by which fuel gas to drive a heat source is heated are provided. The apparatus includes a first gas passage by which at least a portion of the fuel gas is transported from an inlet to an outlet, the outlet being fluidly coupled to the heat source, a plurality of heat pipes in thermal communication, at respective first ends thereof, with the portion of the fuel gas transported by the first gas passage, and a heating element, fluidly coupled to the heat source to receive exhaust of the heat source, through which respective second ends of the heat pipes extend to be in position to be heated by the exhaust.

Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.

Abstract: A heat source is cooled by employing heat pipes, magneto-hydrodynamic fluid pipes, and a heat sink. Heat is transmitted from evaporating ends of the heat pipes connected to the heat source to condensing ends of the heat pipes connected to the heat sink. The magneto-hydrodynamic fluid is circulated inside the magneto-hydrodynamic fluid pipes. Magnetic fields are generated using an array of magnets and an electric potential is created from a top surface to a bottom surface of each magneto-hydrodynamic fluid pipe using metal films. The magnetic fields and electric potential induce an electrically-conductive magneto-hydrodynamic fluid to circulate in the magneto-hydrodynamic fluid pipes thereby dissipating heat from the heat sink.

Abstract: A waste heat recovery device includes a heat pipe in which a working fluid for transporting heat is enclosed, and a mode-switching valve for switching a heat recovery mode and a heat insulation mode. The heat pipe has a heating part for heating and evaporating the working fluid and a cooling part for cooling and condensing the evaporated working fluid. The heating part is made of a steel through which hydrogen gas permeates about at 500° C. and higher. In the heat recovery mode, the waste heat recovery device recovers heat of exhaust gas by using the heat pipe. Furthermore, in the heat insulation mode, a heat transport from the heating part to the cooling part is stopped.

Abstract: A system including a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor is disclosed. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Abstract: A space has inlet and outlet registers and outside and exhaust air ducts. The outside air duct is located adjacent to the inlet register. The exhaust air duct is located adjacent to the outlet register. The space has an outside air passageway through the outside air duct adjacent to the inlet register. The space has an exhaust air passageway through the exhaust air duct adjacent to the outlet register. A thermosyphon run around heat pipe assembly includes outside air coils and exhaust air coils. Vapor lines and liquid lines couple the coils. The outside air coils are positioned adjacent to the air inlet duct. The exhaust air coils are located adjacent to the air outlet duct. A control device, in the form of a modulating return damper, is located between the air ducts. An air filter is provided upstream of and adjacent to the outside air coils.

Abstract: A heat transfer controlling mechanism and a fuel cell system, which allow working fluid to flow in a predetermined direction in a loop-shaped flow path without a back flow, having a simple structure independent of the orientation during use, low power consumption, and efficient heat transfer and size reduction. The mechanism includes a vaporizing portion, a condensing portion, and a loop-shaped flow path connecting the vaporizing and the condensing portions so as to seal working fluid. The mechanism transports heat by vaporizing the fluid in the vaporizing portion and condensing the fluid in the condensing portion to control heat transfer. The mechanism further includes a gas passage suppressing portion on one side in the flow path, for allowing liquid, but not gas, to pass therethrough and a liquid passage suppressing portion on the other side in the flow path, for allowing gas, but not liquid, to pass therethrough.

Abstract: A heat exchanger that can mechanically automatically control a level of cooling water according to heat generation of the fuel cell. The heat exchanger includes a housing having a cooling water inlet and an outlet connected to a fuel cell stack, a moving plate which moves reciprocally in the housing and discharges cooling water filled in the housing to the stack when it moves in a one direction and when it receives a steam pressure from the stack it moves in an opposite direction, and an elastic member that applies a force to the moving plate in the one direction. The heat exchanger can automatically maintain the level of cooling water despite a difference in heat generated between a full and a partial load operation of the fuel cell obviating complicated electronics such as a thermo-sensor, a valve, or a controller. Also, under a partial load, the exposure of flow channels to superheated steam is avoided, thereby extending the lifetime of the fuel cell.

Abstract: An exhaust heat recovery device includes an accommodating portion extending continuously without shrinking a section therein and adapted to allow exhaust gas of an internal combustion engine to pass therethrough, a catalyst disposed in the accommodating portion for cleaning the exhaust gas, an evaporator disposed adjacent to the catalyst on a downstream side of an exhaust gas flow in the accommodating portion, and a condenser for condensing the working medium by radiating heat of the working medium flowing thereinto from the evaporator so as to recover exhaust heat on the coolant side. The condenser is located to return the condensed working medium to the evaporator.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.

Abstract: A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has a heat insulated pipe-wall which partitions the diversion pipeline into an inside and an outside portions and reduces the heat conduction in the diversion direction of the diversion pipeline. The heat conductive pieces are fixed on the diversion pipeline, and have a heat dissipation direction from the inside portion to the outside portion of the diversion pipeline which crosses the diversion direction. Each two neighboring heat conductive pieces are separated with the heat insulated pipe-wall. The fan is assembled on the outside of the diversion pipeline and provides a cool air for the heat conductive pieces.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A device comprises equipment (501) with a heat source having a maximum thermal operation condition, a cold part (502) relative to the equipment and an element (503) capable of transmitting the heat from the equipment to the cold part. The element (503) is capable of causing the transmitted heat to be limited for thermal conditions above a specified threshold below said maximum condition.

Abstract: A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat.

Abstract: A microchannel device includes several mass transfer microchannels to receive a fluid media for processing at least one heat transfer microchannel in fluid communication with a heat transfer fluid defined by a thermally conductive wall, and at several thermally conductive fins each connected to the wall and extending therefrom to separate the mass transfer microchannels from one another. In one form, the device may optionally include another heat transfer microchannel and corresponding wall that is positioned opposite the first wall and has the fins and the mass transfer microchannels extending therebetween.

Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

Abstract: A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermally connected to the electronic component; and a heat transfer connector thermally connecting a second of the heat transfer device to the host device. The heat generated by the electronic component is discharged, or transferred, to the host device side through the heat transfer device and the heat transfer connector.

Abstract: A method of making an evaporator includes orienting a vapor barrier wall, orienting a liquid barrier wall, and positioning a wick between the vapor barrier wall and the liquid barrier wall. The vapor barrier wall is oriented such that a heat-absorbing surface of the vapor barrier wall defines at least a portion of an exterior surface of the evaporator. The exterior surface is configured to receive heat. The liquid barrier wall is oriented adjacent the vapor barrier wall. The liquid barrier wall has a surface configured to confine liquid. A vapor removal channel is defined at an interface between the wick and the vapor barrier wall. A liquid flow channel is defined between the liquid barrier wall and the primary wick.

Abstract: A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.

Abstract: A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.