Abstract: A cooling system for cooling heat loads on board an aircraft comprises a cold producing device, a first cold carrier fluid circuit, which is thermally coupled to the cold producing device and is connected to a first heat load in order to carry off heat from the first heat load, and a second cold carrier fluid circuit, which is connected to a second heat load in order to carry off heat from the second heat load. A coupling system of the cooling system is adapted to selectively thermally couple the first cold carrier fluid circuit to the second cold carrier fluid circuit or thermally uncouple it from the second cold carrier fluid circuit. In a method for operating such a cooling system for cooling heat loads on board an aircraft, the first cold carrier fluid circuit is selectively thermally coupled to the second cold carrier fluid circuit or thermally uncoupled from the second cold carrier fluid circuit by means of the coupling system.

Abstract: A device for cooling a heat-dissipating component, including an expansion chamber that is expandable between a first volume and a second volume. The expansion chamber adjusts its surface exposure to ambient air according to the operating conditions of the device.

Abstract: A cryostat comprises a cryogen vessel housed within an outer vacuum container (OVC), a thermal radiation shield being located between an external surface of the cryogen vessel and an internal surface of the OVC. A decouplable thermal link arrangement is provided between an external surface of the cryogen vessel and an internal surface of the thermal radiation shield, being decoupled by action of an applied magnetic field.

Abstract: A microchannel device includes several mass transfer microchannels to receive a fluid media for processing at least one heat transfer microchannel in fluid communication with a heat transfer fluid defined by a thermally conductive wall, and at several thermally conductive fins each connected to the wall and extending therefrom to separate the mass transfer microchannels from one another. In one form, the device may optionally include another heat transfer microchannel and corresponding wall that is positioned opposite the first wall and has the fins and the mass transfer microchannels extending therebetween.

Abstract: An analytical closed form solution to mean and variance in heat flow is obtained by solving the stochastic heat conduction equation incorporating randomness in the thermal conductivity. The method has a wide range of applications in quantifying the thermal state of the crust and in obtaining closed form expressions for subsurface heat flow structure along with its error bounds. The exact formulae employed can be used to better evaluate the thermal state for related oil and natural gas applications and also in tectonic studies and in studies related to the crystallization of minerals.

Abstract: A system and method is described generally for producing surface deformations on a surface of a body. The system and method relate to changing the convective heat transfer coefficient for a surface. The system includes a first surface being a surface of a body exposed to a fluid flow and at least one actuator affecting deformation of the first surface. The system also includes a control system providing control commands to the at least one actuator, the control commands configured to change deformations on the first surface in order to change the convective heat transfer coefficient of the first surface. Further, the system includes a sensor providing environmental characteristic information to the control system.

Abstract: The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated, or turned “on”, so as to establish a path of low thermal resistance between the heat source and the heat sink to facilitate the transfer of heat therebetween. The thermal switch can also be de-activated, or turned “off”, so as to establish a path of high thermal resistance between the heat source and the heat sink to minimize or totally prevent the transfer of heat between the heat source and heat sink. In certain embodiments, the thermal switch includes at least drop of a thermally conductive liquid that thermally couples the heat source to the heat sink whenever the switch is activated.

Abstract: A waste heat recovery system having a heat pipe provided with a heat switch function limiting an amount of heat transported to a condenser in accordance with the increase in the amount of heating of the evaporator, having the evaporator arranged at an exhaust pipe for carrying exhaust gas of the internal combustion engine, and having the condenser arranged in a cooling water passage for carrying cooling water of the internal combustion engine and using the heat pipe to transport waste heat of exhaust gas to cooling water, characterized in that an insulating part formed between the evaporator and condenser is provided with a wall part for preventing heat transmission from an external fluid.

Abstract: Described here are systems for regulating the temperature of a heating or cooling device without adjusting the input power. In general, the systems described here comprise a heating or cooling device and a controller. The heating or cooling device typically comprises a cold region and a hot region, there being a temperature difference between the two, and an input power. The controllers are configured to be placed in thermal contact with at least a portion of the cold region and at least a portion of the hot region, and are configured to create a path for heat exchange between the portions of the contacted hot and cold regions. The heat exchanged may be controlled and the temperature of the system may be user adjustable, or it may be automatically controlled.

Abstract: A cryogenic system includes a space formed between a cooling stage of a cryocooler unit and an element to be cooled, and a thermal joint placed in the space, wherein the thermal joint is composed of a substance that has a melting point higher than the cooling temperature of the element to be cooled and that is in a liquid or gaseous state at room temperature and atmospheric pressure. The cryogenic system can achieve reproducible and excellent thermal contact at a cooling stage without applying a large mechanical stress to a cryocooler unit structure.

Abstract: A laser located within a casing of an optoelectronic module is operated by heating the laser to an operating temperature at or above the maximum specified, operating temperature of the module casing using a heater device within the module, the laser having operating characteristics at its operating temperature that are sufficient for its required function. The heater device can be separated from the module casing by an insulating layer or by a thermal switch. The thermal switch can include a droplet of thermally conductive fluid displaceable between a first position where it provides a low thermal impedance path between the heater device and the module casing and a second position wherein a high thermal impedance path is provided between the heater device and the module casing.

Abstract: A thermal switch selectively couples a heat source to a pair of heat sinks. The thermal switch includes a shunt that is thermally coupled to the heat source. The shunt has a pair of posts. End portions of the posts are at least partially radially surrounded by respective cups. The cups in turn are thermally coupled to respective of the heat sinks. The cups are made of a material with a larger coefficient of thermal expansion than the material of the posts. Activation of one of the heat sinks causes the cup corresponding to that heat sink to contract, bringing it into contact with the corresponding post of the shunt. This opens a heat path through the switch from the heat source to the activated heat sink. Thermal isolation of the second cup is facilitated by an axial isolator of high thermal impedance, facilitating isolation of the inactive heat sink.

Abstract: A heat exchanger integrated into the transmission oil pan transfers heat from post-catalyst exhaust gases to the transmission oil. Inlet and outlet ducts route exhaust gas between the heat exchanger and an exhaust pipe located downstream of the catalyst. The exhaust pipe accommodates a control valve that diverts exhaust gas flow to the heat exchanger during the warm-up phase, or to the tailpipe during steady state operation. A control function is provided to monitor transmission oil temperature and engine operating conditions and to control actuation of the valve. The main input parameter to the control function is the transmission oil temperature.

Abstract: An enhanced heat transfer device with electrodes is provided, which is applied to a heat exchanger with a plurality of fluid channels and includes a plurality of electrodes mounted in the fluid channels of the heat exchanger; a plurality of sensor units mounted in the fluid channels of the heat exchanger for measuring mass flow rates of fluids in the fluid channels; and a power source for providing voltage to the electrodes. The power source is used to drive the electrodes to produce turbulence to fluids passing through the fluid channels according to measured mass flow rates from the sensor units, so as to facilitate uniform fluid flows in the plurality of fluid channels and reduce effect of thermal boundary layer in the fluid channels to thereby enhance heat transfer performance for the heat exchanger.

Abstract: A heating unit having a heat pipe structure includes a heater and a cooling pipe disposed in an inner space of a holding table. The holding table and the cooling pipe are thermally insulated by a heat-insulating member, so that it is possible to prevent direct heat transfer from the cooling pipe to the holding table. Therefore, it is possible to rapidly perform a cooling processing while keeping the evenness of the temperature distribution of the mounting face and the temperature distribution of the substrate mounted on the mounting face, and consequently to appropriately keep the evenness of the film thickness and the line width of a wiring layer formed on the substrate upon heat processing.

Abstract: A thermal panel (10) for passive temperature control includes a cell (28) having a transparent side (14) and a base side (24). The cell (28) has a heatable plate (12) contained therein. The heatable plate (12) is passively disposable between a warming position and a cooling position. The heatable plate (12) is heated by a plurality of light waves (34) when the plate (12) is passively disposed in the warming position. Further, the cell also has an insulating medium (30) contained therein. The insulating medium (30) shields the heatable plate (12) from the light waves (34) when the heatable plate (12) is in the cooling position.

Abstract: The present invention discloses a heat transfer changeover switch capable of effecting or cutting off positively heat transfer. The switch requires no contact or separation of a solid contact of a switch piece, is easily incorporated in a fine electronic device and generates no heat or vibration during a switch operation. The switch includes a heat pipe having a pipe for storing a heating medium therein disposed between a hot heat source and a cold heat source. A heating medium supplying/discharging device is provided for supplying/discharging the heating medium to and from the pipe. Heat transfer between the hot heat source and the cold heat source via the heat pipe is effected or cut off by using the heating medium supplying/discharging device that changes over between supply and discharge of the heating medium to and from the pipe.

Abstract: An enclosure for electronic equipment is constructed to orient a plurality of circuit boards in series of parallel slots with air-flow channels therebetween. Cooling air is delivered at constant pressure to inlet ends of each of the channels. Each channel is provided with a thermally sensitive air-flow restrictor at its outlet end. Each air-flow channel is thus provided with independent air temperature control. As a result, each circuit board slot can be utilized for a board with varying heat generating and air resistance characteristics. Each board is cooled properly irrespective of its power usage or shape. Additionally, the enclosures can be relocated to different environments having a wide range of ambient temperatures without adversely effecting the operational characteristics of components on the circuit boards.

Abstract: A cryogenic thermal switch operates based on the principle of differential coefficients of thermal expansion of differing materials. A small gap is either closed or opened, dependant upon the relative dimensions of two pieces of differing materials. As the temperature of the pieces is raised, the piece having the greater coefficient of thermal expansion (CTE) increases its dimensions at a greater rate, causing a gap to open up. Conversely, when the temperature of the pieces is lowered, the piece having the greater CTE shrinks proportionally faster, thereby closing the gap. The present invention makes use of a reliable flat-faced geometry for the two sides of the gap.

Abstract: The invention provides a thermal switch, including a frame made of electrically insulating material, defining the perimeter of a cell fillable with liquid crystal (LC); first and second plate-shaped electrodes, each having an inside surface and an outside surface and being attached along the periphery of the inside surface on opposite sides of the frame, defining surfaces of the cell; first and second covers made of electrically insulating material, each attached to the outside surface of one electrode, the inside surface of at least a portion of each of the electrodes being treated to obtain anchoring of the orientation of LC molecules in a direction parallel to the plane of the electrode, resulting in improved performance of the switch.

Abstract: For cooling and/or heating a machine casing, a method and an arrangement is disclosed in which the machine casing is provided with cooling channels in which pipes are received. Between the pipes and the walls of the cooling channels, a cavity remains through which a cooling medium is circulated. A liquid heat exchange medium is circulated through the pipes. In order to vary the heat energy exchanged per time unit between the pipes and the machine casing, the kind of the medium circulating in the cavities is changed, or its composition is changed, or the flow velocity of the heat exchange medium is varied, or any desired combination of the above measures is realized. Thus, the heat flow, i.e. the exchange of heat energy per time unit, can easily be influenced by the provision of cavities between machine casing and heating or cooling medium by controlling its limiting heat exchange factors, i.e. thermal conductivity and heat transfer resistance.

Abstract: A compact vacuum insulation panel comprising a chamber enclosed by two sheets of metal, glass-like spaces disposed in the chamber between the sidewalls, and a high-grade vacuum in the chamber includes apparatus and methods for enabling and disabling, or turning "on" and "off" the thermal insulating capability of the panel. One type of enabling and disabling apparatus and method includes a metal hydride for releasing hydrogen gas into the chamber in response to heat, and a hydrogen grate between the metal hydride and the chamber for selectively preventing and allowing return of the hydrogen gas to the metal hydride. Another type of enabling and disabling apparatus and method includes a variable emissivity coating on the sheets of metal in which the emissivity is controllably variable by heat or electricity.

Abstract: A radiating section opening/closing apparatus in an apparatus including a housing having a radiating section while enclosing a heat generating section has at least one heat transmitting section fixed onto the heat generating section for transmitting the heat generated from the heat generating section, at least one expansion section for receiving the heat from the heat transmitting section and expanding/contracting at a specific temperature, at least one radiating section opening/closing section displaced by the expansion/contraction of the expansion section for opening/closing the radiating section, and at least one elastic member contracting/expanding while the expansion section expands/contracts for restoring the radiating section opening/closing section to an original position thereof. Thus, intrusion of foreign matters to the interior of the apparatus is blocked while externally discharging the heated air within the apparatus.

Abstract: A compact vacuum insulation panel comprising a chamber enclosed by two sheets of metal, glass-like spaces disposed in the chamber between the sidewalls, and a high-grade vacuum in the chamber includes apparatus and methods for enabling and disabling, or turning "on" and "off" the thermal insulating capability of the panel. One type of enabling and disabling apparatus and method includes a metal hydride for releasing hydrogen gas into the chamber in response to heat, and a hydrogen grate between the metal hydride and the chamber for selectively preventing and allowing return of the hydrogen gas to the metal hydride. Another type of enabling and disabling apparatus and method includes a variable emissivity coating on the sheets of metal in which the emissivity is controllably variable by heat or electricity.