Porous Patents (Class 165/907)
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Patent number: 6405792Abstract: The disclosure is for an easily assembled heat exchanger using an internal porous metal pad. The heat exchanger is constructed of two halves attached at their heat transfer surfaces. Each half includes a pan shaped casing, a pad of sintered porous metal, a manifold block with channels, and a lid. The porous pad is mounted between the heat transfer surface of the casing and the manifold. The lid includes input and output fluid holes which are connected to sets of alternating channels in the manifold block, so that adjacent channels are isolated from each other and are connected to only either the input or the output holes so that the fluid must flow through the pad. An alternative embodiment has the casings of the two halves formed as a single part.Type: GrantFiled: July 24, 2001Date of Patent: June 18, 2002Assignee: Thermal Corp.Inventors: John H. Rosenfeld, Mark T. North
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Patent number: 6378605Abstract: The heat exchanger includes a fin and tube assembly with increased heat transfer surface area positioned within a hollow chamber of a housing to provide effective heat transfer between a gas flowing within the hollow chamber and a fluid flowing in the fin and tube assembly. A fan is included to force a gas, such as air, to flow through the hollow chamber and through the fin and tube assembly. The fin and tube assembly comprises fluid conduits to direct the fluid through the heat exchanger, to prevent mixing with the gas, and to provide a heat transfer surface or pathway between the fluid and the gas. A heat transfer element is provided in the fin and tube assembly to provide extended heat transfer surfaces for the fluid conduits. The heat transfer element is corrugated to form fins between alternating ridges and grooves that define flow channels for directing the gas flow.Type: GrantFiled: December 2, 1999Date of Patent: April 30, 2002Assignee: Midwest Research InstituteInventors: Charles F. Kutscher, Keith Gawlik
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Patent number: 6330907Abstract: An evaporator includes a container, a wick provided in contact with an inner peripheral surface of said container and formed such that (1) if the number of pores per unit volume is fixed, the diameter of pores is varied, or (2) if the diameters of pores are formed substantially uniformly, the number of pores is varied, a sump having said wick as its inner wall surface and connected to a liquid pipe for supplying a liquid-phase working fluid, and a vapor channel formed in a contact surface of said container with respect to said wick so as to guide a gas-phase working fluid into a vapor pipe connected to an end portion of said container.Type: GrantFiled: September 10, 1999Date of Patent: December 18, 2001Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Tetsurou Ogushi, Masaaki Murakami, Akira Yao, Takeshi Okamoto, Hiromitsu Masumoto, Hisaaki Yamakage
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Publication number: 20010045270Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks having intervening gaps that fill the width and at least a portion of the length between the fins. The foam block may be a continuous single block within the space between two adjacent fins along the length of the fins or may be an array of short-length blocks having intervening gaps along the length of the fins.Type: ApplicationFiled: June 1, 2001Publication date: November 29, 2001Inventors: Mohinder Singh Bhatti, Shrikant M. Joshi, Russell S. Johnson
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Publication number: 20010032720Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.Type: ApplicationFiled: March 13, 2001Publication date: October 25, 2001Inventors: Gary Lynn Eesley, Donald T. Morelli, Mohinder Singh Bhatti
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Patent number: 6257322Abstract: In a heat-exchange unit 1a constituting a chief portion of an indirect heat exchanger 1, the streams of hot medium that flow through many small flow passages 20 in the flat tubes 2 in the upstream heat-exchange set 5, meet together in the tubular headers 4 for each of the flat tubes 2 and, then, flow again into many small flow passages 20 in the flat tubes 2 in the downstream heat-exchange set 6. Even in case some of the small flow passages 20 are clogged or constricted, all the small flow passages 20 from the upstream common header 71 to the downstream common header 72 do not become incapable of exchanging heat and do not lose the function for exchanging heat, and most of the area of the upstream side and of the downstream side can be normally used.Type: GrantFiled: July 25, 2000Date of Patent: July 10, 2001Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Keiji Toh, Hidehito Kubo
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Publication number: 20010004013Abstract: A tube is provided with elastically deformable tube deforming sections (tube curved sections), and a fin is provided with the quality of spring so that the fin deforms in accordance to changes of dimension between the tubes. Accordingly, it is possible to weaken (absorb) stress by the tube deforming sections (tube curved sections), and to prevent the fin from separating from the tube even when the tube deforming section (tube curved section) deforms.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Inventors: Shingo Morishima, Tadayoshi Terao, Toshihiro Mafune
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Patent number: 6241008Abstract: In a capillary evaporator for use in a capillary pumped loop, in which capillary action in a porous wick 7 causes cold liquid to be drawn across the wick and vaporized by a heat input structure 6 and in particular fin 8 of that structure so that the vapour passes around a loop and rejects heat at a condenser in order to cool equipment in the vicinity of the evaporator, the vapour generated in the wick 7 from the liquid/vapor interface (meniscus) 11 is subject to a lower pressure drop than hitherto by virtue of a spacer 14 of greater permeability and thermal conductivity than the wick 7 without the necessity for the meniscus 11 to recede from the fin 8 which would cause an undesirable temperature drop of the meniscus, thereby improving the capacity of the evaporator to pump liquid/vapor around the loop and thus transport heat.Type: GrantFiled: April 16, 1997Date of Patent: June 5, 2001Assignee: Matra Marconi Space UK, Ltd.Inventor: Neil William Dunbar
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Patent number: 6131650Abstract: The apparatus is an easily assembled, fluid cooled, single phase heat sink. The heat sink is constructed of only four simple parts, a pan shaped casing, a simple thermally conductive porous pad, a manifold block with channels, and a lid. The lid includes input and output fluid holes which are interconnected to sets of alternating channels in the manifold block, so that adjacent channels are isolated from each other and are connected to only either the input or the output holes. Thus, the only access between the adjacent input and output channels is through the porous pad which is sandwiched between the manifold block and the bottom of the casing. Fluid flow through the porous pad thereby cools the entire bottom of the casing which is held in heat transfer relationship with a heat source.Type: GrantFiled: July 20, 1999Date of Patent: October 17, 2000Assignee: Thermal Corp.Inventors: Mark T. North, John H. Rosenfeld, David L. Muth, Brian D. Fritsch, C. Scott Schaeffer
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Patent number: 6119457Abstract: A heat exchange apparatus has heat exchangers comprising porous material of improved heat exchange efficiency provided in an exhaust passage, and a ceramic engine provided with a supercharger comparing a steam turbine driven by the steam generated in the heat exchanger apparatus. The heat exchange apparatus comprises a high temperature heat exchanger having a steam passage provided in an exhaust gas passage through which an exhaust gas passes whereby steam is heated, and a low temperature heat exchanger provided in the portion of the exhaust gas passage on the downstream side of the high temperature heat exchanger which has a water passage for heating water by the exhaust gas. The ceramic engine has a steam turbine type supercharger provided with a steam turbine driven by the steam from the high temperature heat exchanges, a compressor, and a condenser which separates a fluid discharged from the steam turbine into water and low temperature steam.Type: GrantFiled: April 13, 1998Date of Patent: September 19, 2000Assignee: Isuzu Ceramics Research Institute Co., Ltd.Inventor: Hideo Kawamura
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Patent number: 6089020Abstract: This heat recovering apparatus for a cogeneration system with an engine comprises a turbocharger driven by an exhaust gas, an energy recovering turbine provided on the downstream side of the turbocharger, and a heat exchanger provided on the downstream side of the energy recovering turbine. The energy recovering turbine comprises a gas turbine driven by an exhaust gas, and a steam turbine driven by steam occurring in the heat exchanger. The heat exchanger comprises a casing joined to an exhaust gas passage, oxidation resisting ceramic pipes, in which the water and steam flow, provided in the casing, and oxidation resisting ceramic porous members, through which an exhaust gas can pass, provided in the portions of the interior of the casing which are on the outer sides of the ceramic pipes.Type: GrantFiled: July 30, 1997Date of Patent: July 18, 2000Assignee: Isuzu Ceramics Research Institute Co., Ltd.Inventor: Hideo Kawamura
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Patent number: 6082354Abstract: A solar collector plate (1) comprises a dark-colored absorber plate (2) facing the sun, parallel wall sheets (4) arranged perpendicularly to the rear side of the absorber sheet (2), fixed thereto and also fixed to a support sheet (3) arranged parallel to the absorber sheet (2), whereby cavity channels (5) are provided between said sheets (2, 3, 4) for flowing cooling liquid (6) which is intended to transport heat away from the absorber sheet (2). In order to provide a good thermal contact between the liquid (6) and the absorber sheet (2) at a low rate of liquid flow in the cavity channels, the cavity channels (5) are filled with particles (7), which particles lift the cooling liquid (6) to contact with the absorber sheet (2) by means of a capillary effect.Type: GrantFiled: April 18, 1997Date of Patent: July 4, 2000Inventor: John Rekstad
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Patent number: 5960861Abstract: A cold plate for use in a thermal management system and a method of thermal management which comprises an inlet channel having coolant fluid disposed therein at a substantially uniform pressure throughout the inlet channel and an outlet channel having coolant fluid disposed therein at a substantially uniform pressure lower than the pressure in the inlet channel throughout the outlet channel. The cold plate includes a highly thermally-conductive metallic porous matrix filling the fluid passage, preferably of aluminum. The porous matrix is preferably from about two percent to about 15 percent percent solid.Type: GrantFiled: April 5, 1995Date of Patent: October 5, 1999Assignees: Raytheon Company, Southern Methodist Univ.Inventors: Donald C. Price, Richard M. Weber, Gary J. Schwartz, Joseph McDaniel, Jose' L. Lage
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Patent number: 5960863Abstract: The present invention relates to a dissipating device that uses a high-efficiency radiator for natural convection heat dissipation for a CPU (central processing unit) or an IC (integrated circuit) die with low cost. The radiator is formed by screen plates punched to form many tilted rhombus cells constructed by many wave-shaped mesh wires having a flat rectangular cross-section. The screen plates are made of good heat-conductive metal material. A plurality of the screen plates are overlapped in various orientations so that the heat dissipating effect can be improved, radiating heat through natural convection.Type: GrantFiled: January 7, 1998Date of Patent: October 5, 1999Inventor: Hsu Mei Hua
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Patent number: 5950719Abstract: A fluid-circulation heat exchanger including a porous body, made of thermally conductive material, in contact with at least one portion of a part to be cooled. The fluid flows through this porous body. The porous body has pores which generate directional changes of the fluid. These pores are large enough for the head loss of the fluid to be as small as possible on passage through the porous body. Application, in particular, to electron tubes.Type: GrantFiled: August 15, 1996Date of Patent: September 14, 1999Assignee: Thomson Tubes ElectroniquesInventors: Alexis Dubrovin, Philippe Denis, Jean-Jacques Pelletier, Jean-Claude Lixon
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Patent number: 5847927Abstract: An electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.Type: GrantFiled: January 27, 1997Date of Patent: December 8, 1998Assignee: Raytheon CompanyInventors: Charles P. Minning, Douglas W. Wolfe, John H. Schroeder
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Patent number: 5806586Abstract: A device is disclosed for distributing a two-phase refrigerating medium mass flow in a plate evaporator (12). The evaporator has a distribution channel (14) at the inlet side which may receive a refrigerating medium mass flow coming from an expansion valve (10) and several mutually spaced exchanger channels (16) which branch off from the distribution channel (14) in a substantially perpendicular direction. In order to ensure a uniform distribution of the refrigerant medium mass flow (28') among the exchanger channels (16), a porous body (38) is arranged in the distribution channel (14) between the refrigerating medium inlet (26) and the branch-off points of the exchanger channels (16). The porous body (38) is advantageously arranged in an outer throttle insert (32) which extends over at least part of the length of the distribution channel and in whose wall are located additional throttle openings (34) that lead to the exchanger channels (16).Type: GrantFiled: December 29, 1995Date of Patent: September 15, 1998Assignee: Ernst Flitsch GmbH & Co.Inventors: Josef Osthues, Manfred Petz, Bernd Zeitvogel
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Patent number: 5727622Abstract: A heat radiating element is made essentially of a porous heat conducting material, the porosity being such so as to allow penetration them through of a cooling fluid.Type: GrantFiled: October 15, 1996Date of Patent: March 17, 1998Assignee: Elisra Gan Ltd.Inventors: Alex Gurevich, Ilya Khurin, Yuval Bromberg
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Patent number: 5704417Abstract: A fluid heat exchange apparatus is disclosed that can be used as an absorber in an absorption cooling system. The compact absorber design uses an accordion fin assembly to direct solution downward through the absorber on a plurality of alternatively angled fins. The alternatively angled fins cause the solution to collect at each level against a thermally conductive surface. Each fin includes a plurality of house-shaped perforations that allow the solution to spill over onto the next level fin. The house-shaped perforations also allow the vapor to flow upward in effective counterflow with the solution.Type: GrantFiled: August 23, 1996Date of Patent: January 6, 1998Assignee: Gas Research InstituteInventors: Richard N. Christensen, Srinivas Garimella, Yong Tae Kang, Michael Garrabrant
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Patent number: 5603377Abstract: A heat pipe includes: a pipe barrel; and a large number of fins disposed on the peripheral surface of the pipe barrel at least on either a heat collecting section side or a radiating section side, each of the fins is attached to the pipe barrel on a plane perpendicular to the axis of the pipe barrel, and each of the fins is composed of a metal plate and net-like material adhered to both surfaces of the metal plate.A heat exchanger of gas-liquid contacting plate type includes: a plurality of heat transfer plates, disposed vertically at certain intervals, defining air flow passages therebetween which allow air to rise, and each of the plates has a heat medium flowing passage thereinside for allowing a heat medium to flow therethrough while the side surfaces of each of the heat transfer plates, which define the air flow passages, are adhered with nets for allowing a liquid to flow downward along the nets and plates.Type: GrantFiled: June 21, 1996Date of Patent: February 18, 1997Assignees: The Kansai Electric Power Co., Inc., Mitsubishi Jukogyo Kabushiki KaishaInventors: Masumi Fujii, Taiichiro Suda, Yoshitsugu Hotta, Koichi Kitamura, Yukihiro Jinno, Tomio Mimura, Shigeru Shimojo, Masaki Iijima, Shigeaki Mitsuoka
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Patent number: 5572404Abstract: A heat transfer module, comprises: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy that is absorbed in the microscopic voids in the compliant body. Further, the heat transfer module also includes a seal ring in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.Type: GrantFiled: September 21, 1995Date of Patent: November 5, 1996Assignee: Unisys CorporationInventors: Wilbur T. Layton, Ronald A. Norell, James A. Roecker
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Patent number: 5561590Abstract: A sub-assembly for transferring heat between a heat generating unit and heat receiving unit which are separated by a gap, comprises: a compliant body having microscopic voids therethrough; a liquid metal alloy that is absorbed in the microscopic voids in the compliant body; a seal ring which surrounds the compliant body; and, a retaining member which is attached to the compliant body and the seal ring, and which holds the compliant body spaced apart from the seal ring. This sub-assembly is placed in the gap between the two units and compressed to the point where liquid metal alloy is squeezed out of the compliant body. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.Type: GrantFiled: September 21, 1995Date of Patent: October 1, 1996Assignee: Unisys CorporationInventors: Ronald A. Norell, Wilbur T. Layton, James A. Roecker
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Patent number: 5540277Abstract: The invention relates to a method for improving heat and mass transfers to and/or through a wall, and if need be, to such a method applied to a permeable wall. The invention also concerns a wall and conductive material pair having improved heat and mass transfer characteristics. The method of the invention is useful for all techniques requiring both heat transfer and flow of gaseous phase to or through a wall.Type: GrantFiled: June 10, 1993Date of Patent: July 30, 1996Assignee: Societe Nationale Elf AquitaineInventors: Jean-Paul Gourlia, Isidore Jacubowiez
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Patent number: 5454426Abstract: A method and apparatus are disclosed for minimizing the increase of entropy of an adiabatic enthalpizer by means of a thermal sweep insulation system which surrounds at least a portion of the adiabatic enthalpizer and through which the working fluid for the adiabatic enthalpizer passes whereby the fluid both causes the thermal sweep insulation system to operate and the fluid is pre-enthalpized. Examples of adiabatic enthalpizers include but are not limited to compressors, expanders, devices to heat and expand a gas, Roots blowers, ammonia absorption chambers, etc.Type: GrantFiled: September 20, 1993Date of Patent: October 3, 1995Inventor: Thomas S. Moseley
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Patent number: 5404272Abstract: A carrier for a printed circuit board or card on which electronic components are mounted, the carrier making it possible to disperse an increased quantity of heat given off by the components in the direction of an energy dissipating frame with which the carrier is in contact. The carrier comprises two flat parallel metal plates of identical perimeter defining between them a space which is entirely closed along the perimeter, the space containing a porous metallic material in contact with the plates, and being partially filled by a liquid which evaporates at the working temperature of the carrier.Type: GrantFiled: February 14, 1994Date of Patent: April 4, 1995Assignee: TranscalInventors: Michel Lebailly, Jean-Claude Taverdet
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Patent number: 5390729Abstract: Cooling liquid flowing through cooling-liquid passages cools in heat-transmission manner an inner layer on an inner surface of an impermeable intermediate layer and is directed through a piping to an interface between the intermediate and outer layers, whereby the porous outer layer is cooled by latent heat generated by evaporation of the cooling liquid infiltrated into the porous outer layer.Type: GrantFiled: August 26, 1993Date of Patent: February 21, 1995Assignee: Ishikawajima-Harima Jukogyo Kabushiki KaishaInventors: Akira Sakurai, Masahiro Shiotsu, Toshikazu Yano, Masao Ochi, Toshihiro Sugawara
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Patent number: 5379610Abstract: Cooling liquid flowing through cooling-liquid passages cools in heat-transmission manner an inner layer on an inner surface of an impermeable intermediate layer and is directed through a piping to an interface between the intermediate and outer layers, whereby the porous outer layer is cooled by latent heat generated by evaporation of the cooling liquid infiltrated into the porous outer layer.Type: GrantFiled: August 26, 1993Date of Patent: January 10, 1995Assignee: Ishikawajima-Harima Jukogyo Kabushiki KaishaInventors: Akira Sakurai, Masahiro Shiotsu, Toshikazu Yano, Masao Ochi, Toshihiro Sugawara
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Patent number: 5363645Abstract: An enclosure containing hot gases cooled by transpiration includes means for applying a cooling fluid, said means comprising a hydraulic calibration sheath applied on the outside face of a porous wall that forms the inside portion of the enclosure, said sheath being made of a material that is proof to the cooling liquid and that is perforated by a multiplicity of microperforations having a distribution density that varies progressively over various different portions of said wall so as to provide greater perforation density wherever the heat flow to be cooled reaching the porous wall is high, and a cooling fluid feed volume formed between the sheath secured to the porous wall and an outer sealing envelope so as to apply a pre-determined flow rate per unit of area to said sheath in various different zones of the wall of the enclosure, spacers being interposed between the hydraulic calibration sheath and the outer sealing envelope.Type: GrantFiled: May 14, 1993Date of Patent: November 15, 1994Assignee: Societe Europeenne de PropulsionInventor: Marc Pellet
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Patent number: 5329996Abstract: The invention is a cooling structure for a high power density surface. Fluid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a fluid layer which also includes multiple fluid holes, so that each hole is surrounded by interconnected channels. The holes are connected to a manifold to collect or supply the pumped fluid. The channels which surround each hole are connected to another manifold attached to the structure, and the proximity of the channels to the holes assures that fluid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.Type: GrantFiled: November 24, 1993Date of Patent: July 19, 1994Assignee: Thermacore, Inc.Inventor: John H. Rosenfeld
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Patent number: 5322116Abstract: A high temperature fluid-to-fluid heat exchanger is described wherein heat is transferred from a higher temperature fluid flow core region to a lower temperature fluid flow annulus. The wall separating the high and low temperature fluid flow regions is comprised of a material having high thermal absorptivity, conductivity and emissivity to provide a high rate of heat transfer between the two regions. A porous ceramic foam material occupies a substantial portion of the annular lower temperature fluid flow region, and is positioned to receive radiated heat from the wall. The porosity of the ceramic foam material is sufficient to permit a predetermined relatively unrestricted flow rate of fluid through the lower temperature fluid flow region.Type: GrantFiled: August 16, 1993Date of Patent: June 21, 1994Assignee: Synthetica Technologies, Inc.Inventors: Terry R. Galloway, Anthony J. G. Bowles
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Patent number: 5323294Abstract: An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.Type: GrantFiled: March 31, 1993Date of Patent: June 21, 1994Assignee: Unisys CorporationInventors: Wilbur T. Layton, Blanquita O. Morange, Angela M. Torres
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Patent number: 5303768Abstract: An improved capillary pumped loop evaporator includes circumferential grooves formed in the outer heat exchanger portion of the evaporator. The grooves open to the interface existing between the heat exchanger and a centrally positioned tubular wick. Axially extending vapor channels are formed in the wick and also open onto the interface. The circumferential grooves continuously communicate with the interface and provide a vapor escape to the vapor channels which direct vapor passage from the evaporator. By shortening the vapor path from the interface, a thinner vapor barrier is possible at the interface which results in more efficient heat transfer.Type: GrantFiled: February 17, 1993Date of Patent: April 19, 1994Assignee: Grumman Aerospace CorporationInventors: Joseph P. Alario, Fred Edelstein, Robert L. Kosson, Maria Liandris
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Patent number: 5271087Abstract: A device for heating flowing media in a handpiece, particularly air or water for use in dentistry procedures, includes a structural unit for controllably heating a flowing medium disposed in a housing in a sealed manner such that an annular flow passage is formed between an interior wall of the housing and the structural unit. The structural unit includes a PTC resistor having end faces disposed between and in thermal and electrical contact with a pair of porous sintered metal heat exchanger elements at a non-zero angle to the direction of medium flow. Connectors on the opposing ends of the unit contact the sintered heat exchanger elements to flow connect the structural unit in a medium flow line and to electrically connect the PTC resistor to a heating control circuit.Type: GrantFiled: July 21, 1992Date of Patent: December 14, 1993Assignee: Kaltenbach & Voight GmbH & Co.Inventor: Gerhard Schmid
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Patent number: 5267611Abstract: The invention is a cooling structure for a high power density surface. Liquid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a liquid delivery layer which also includes multiple liquid outlet holes, so that each outlet hole is surrounded by interconnected channels. The outlet holes are connected to a manifold to collect the pumped liquid. The input channels which surround each outlet hole are fed from manifolds at the edges of the panels, and the proximity of input channels to the outlet holes assures that liquid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.Type: GrantFiled: January 8, 1993Date of Patent: December 7, 1993Assignee: Thermacore, Inc.Inventor: John H. Rosenfeld
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Patent number: 5261602Abstract: A partial oxidation process and a novel burner are provided for simultaneously introducing two or three separate feedstreams into a free-flow partial oxidation gas generator for the production of synthesis gas and fuel gas, or reducing gas. The reactant feedstreams include a liquid hydrocarbonaceous fuel or a pumpable slurry of solid carbonaceous fuel, and a free-oxygen containing gas e.g. air or oxygen. The burner comprises a central conduit and a plurality of spaced concentric coaxial conduits with down-flowing annular passages. A flat annular-shaped disc or cup-shaped porous ceramic or porous metal cooling means of uniform composition, wall thickness and porosity with the various pores interconnecting is attached to the downstream tip of the burner. A controlled amount of liquid coolant under pressure is passed successively through the porous inside surface, porous core and porous outside surface of the cooling means is vaporized. The tip of the burner is thereby cooled.Type: GrantFiled: December 23, 1991Date of Patent: November 16, 1993Assignee: Texaco Inc.Inventors: Albert Brent, Robert J. Stellaccio, Mitri S. Najjar, Jerrold S. Kassman
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Patent number: 5231968Abstract: A method and apparatus for preheating combustion fluids such as air, fuel or fuel-air mixtures upstream of a combustion chamber (12) in an internal combustion engine (10). The apparatus generally includes a heat exchanger (18) and an assembly (30) for heating the heat exchanger. The improvement involves the use of reticulated foam metal as the heat exchanger (18) to provide a very high heating surface area (19) for thoroughly heating the fluids as the fluids pass through the reticulated foam metal.Type: GrantFiled: July 27, 1992Date of Patent: August 3, 1993Inventor: Donald Siefkes
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Patent number: 5225964Abstract: A plurality of heat sinks assembled to form a rack in a lightweight housing accommodate printed circuit cards between the heat sinks and circulate cooling oil through the heat sinks to drain the test heat from the boards quickly. Each heat sink uses a porous metal foamed core, configured in zigzag shape, to provide a tortuous path for the fluid flow which extends into lateral fins comprising the side plates of the porous metal foam for receiving the cards or ground plates therefore. These plates are clamped against the fins for close contact to the cooling fluid thereby shortening the heat flow path. Brazed on aluminum top and bottom cover plates make a fluid tight connection with the porous foamed metal. The brazed on top and bottom plates are also configured in the zigzag pattern of the porous foamed metal.Type: GrantFiled: October 31, 1991Date of Patent: July 6, 1993Assignee: Rockwell International CorporationInventor: Les E. Nemes
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Patent number: 5205353Abstract: A heat exchanging member, more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which comprises packed parts including:a) randomly packed elementary parts, such as grains, fibers or scales, orb) parts packed in an ordered fashion, such as gauze or plates, with the exception of individual wires.In a preferred embodiment the heat exchanging material is made up of sintering bronze.Type: GrantFiled: February 18, 1992Date of Patent: April 27, 1993Assignee: Akzo N.V.Inventors: Henricus P. Willemsen, Carolina A. M. C. Dirix, Theodorus G. J. Te Boekhorst
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Patent number: 5184675Abstract: A thermal energy transfer apparatus and a method of making such apparatus by helically wrapping multiple layers of spaced apart thermally conductive wires on a fluid conducting pipe to provide an open mesh-like configuration with exposed surface areas to transfer heat or cold to the surrounding atmosphere from fluid passed through the pipe. The wire is secured by welding or other suitable means to prevent it from becoming unwrapped. The mesh-like configuration can also be made by concentrically wrapping thermally conductive screen around the pipe and securing it in the wrapped configuration.Type: GrantFiled: October 15, 1991Date of Patent: February 9, 1993Inventor: Ernest A. Gardner
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Patent number: 5180001Abstract: A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers of the heat transfer unit permit liquid to pass through the heat transfer unit so as to conduct heat. A semiconductor element (IC chip) is mounted on the mounting sheet, and to a base. The resulting assembly is immersed in a liquid. Preferably, the planes of the mesh layers are generally perpendicular to the mounting sheet and the semiconductor element and the material of the mounting sheet chosen to have a thermal expansion coefficient between that of the semiconductor element and the heat transfer unit to reduce thermal stresses. The wires of the mesh layers are preferably of copper as this is inexpensive and provides satisfactory heat conduction.Type: GrantFiled: August 2, 1990Date of Patent: January 19, 1993Assignee: Hitachi, Ltd.Inventors: Ryoji Okada, Motohiro Sato, Toshihiro Yamada, Heikichi Kuwabara
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Patent number: 5152147Abstract: A refrigerator having a pressurizing device, a coldness generating device for generating coldness by expanding a portion of operating fluid which has been pressurized by the pressurizing device and a fluid passage through which the operating fluid is, via a device to be cooled, again circulated to the pressurizing device after the residual portion of the operating fluid has been cooled by the coldness generating device. A regenerator type heat exchanger is disposed in the fluid passage through which the operating fluid passes, and a switch device switches the flow of the operating fluid in the fluid passage to the reverse direction at a predetermined time period.Type: GrantFiled: October 31, 1990Date of Patent: October 6, 1992Assignee: Hitachi, Ltd.Inventors: Norihide Saho, Takeo Nemoto, Hisanao Ogata, Susumu Harada, Kozo Matsumoto, Teruhiro Takizawa
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Patent number: 5145001Abstract: The present invention is directed to a compact heat exchanger having a permeable heat transfer element and an impervious heat transfer element. Fluid passes through the permeable element through passages which are substantially normal to the interface between the permeable and impervious elements. The fluid passes into channels which are provided at or near the interface between the permeable heat transfer element and the impervious element. Heat is transferred between the fluid and the permeable heat transfer element by convection as the fluid flows through the permeable element. Heat is transferred between the impervious element and the permeable element by conduction. The permeable element can be formed from one or more plates which bound one or more passages through which the fluid flows or can be formed from various porous material such as sintered powders, rods and metal foams.Type: GrantFiled: April 23, 1991Date of Patent: September 8, 1992Assignee: Creare Inc.Inventor: Javier A. Valenzuela
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Patent number: 5141720Abstract: A catalyst bed for conducting exothermal reactions between gases and/or other fluids is disclosed. The catalyst bed includes at least two cooling elements arranged in parallel relationship with each other. A space is thereby defined between the two cooling elements, and one opening at each opposite end of the cooling elements is also defined by the arrangement of cooling elements. The space created is adapted to receive a catalyst mass through either of the openings. The cooling elements cool the gases and/or other fluids, as well as the catalyst mass to keep the reaction temperature low enough to maintain a desired state of equilibrium.Type: GrantFiled: January 10, 1991Date of Patent: August 25, 1992Assignee: A. Ahlstrom OsakeyhtioInventors: Rolf Malmstrom, Stig Petersson
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Patent number: 5138832Abstract: The invention is directed to a solar thermal propulsion engine which comprises:(a) an ogive solar collection cavity with inner and outer walls having therebetween a heat exchange medium which can pass and heat a propellant fluid, and having its highest temperature deep within the cavity, and (b) a nozzle attached to and communicating with the heat exchange medium through which the heated propellant fluid can be passed to create thrust. In addition, this invention is directed to a solar thermal propulsion engine which comprises. (a) a heat exchanger having a geometry such that it has inner and outer walls having therebetween an open cell foam heat exchange medium through which a propellant can pass with tubulence, wherein solar radiation can heat the inner wall and the open foam heat exchange medium to, in turn, heat the propellant, and (b) a nozzle attached to and communicating with the open cell foam heat exchange medium through which the heated propellant fluid can be passed to creat thrust.Type: GrantFiled: September 18, 1990Date of Patent: August 18, 1992Assignee: Hercules IncorporatedInventor: John B. Pande
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Patent number: 5123982Abstract: A method for constructing a cooled optic wherein one or more cavities are milled, drilled or formed using casting or ultrasound laser machining techniques in a single crystal base and filled with porous material having high thermal conductivity at cryogenic temperatures. A non-machined strain-free single crystal can be bonded to the base to produce superior optics. During operation of the cooled optic, N.sub.2 is pumped through the porous material at a sub-cooled cryogenic inlet temperature and with sufficient system pressure to prevent the fluid bulk temperature from reaching saturation.Type: GrantFiled: June 29, 1990Date of Patent: June 23, 1992Assignee: The United States of American as represented by the United States Department of EnergyInventor: Tuncer M. Kuzay
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Patent number: 5076469Abstract: A device for applying or spraying viscous materials, preferably molten thermoplastic materials, has a discharge nozzle, which is supplied through separate lines with viscous material and heated gas. The supplied gas is conducted to the discharge nozzle by way of a heat exchanger, which contains a sintered metal insert thermally coupled to a heating device.Type: GrantFiled: April 21, 1988Date of Patent: December 31, 1991Assignee: Nordson CorporationInventors: Harald Pleuse, Peter E. Muller
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Patent number: 5071627Abstract: A reactor system and process for conducting exothermic or endothermic chemical reactions achieves greater kinetic efficiency through transfer of heat between adjacent feed temperature modification and reaction zones.Type: GrantFiled: December 4, 1989Date of Patent: December 10, 1991Assignee: Mobil Oil Corp.Inventors: Jonathan E. Child, Byung C. Choi, Francis P. Ragonese
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Patent number: 5029633Abstract: An improvement to a cooling pond is disclosed which utilizes metallic heat pipes to transmit heat from the cooling pond to the ambient air environment.Type: GrantFiled: April 7, 1989Date of Patent: July 9, 1991Assignee: Mann Technology Limited PartnershipInventor: David O. Mann
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Patent number: 5007238Abstract: The invention is directed to an arrangement by which harmful or noxious substances such as NOx or SOx may be evaporated from a gas heated pump system. The deletion of the substances is provided by heating a portion of the exhaust system in which the substances would collect. The heating evaporates the substances before they can be emitted to the atmosphere.Type: GrantFiled: June 23, 1989Date of Patent: April 16, 1991Assignee: Aisin Seiki Kabushiki KaishaInventor: Hideo Seko
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Patent number: 4981172Abstract: A device for heat transfer or for heat dissipation from an object to a fluid, especially air is disclosed. The device is coated at least in part with shavings, metal wires or coarse metal powder made of thermally conductive material and sintered. The object may also consist fully or at least in part of the sintered materials.Type: GrantFiled: August 18, 1989Date of Patent: January 1, 1991Assignee: Schwaebische Huettenwerke GmbHInventor: Hans A. Haerle