Component Mounting Pads, Spacers And Holders Patents (Class 174/138G)
  • Patent number: 6147305
    Abstract: In an insulated mounting structure, a housing has a plurality of housing brackets and a platform for supporting the housing has a plurality of platform brackets. Each housing bracket is provided at a coupling portion of the housing and each having a notch. Each of the platform brackets is provided at a coupling portion of the platform corresponding to the housing bracket, each platform bracket having a screw hole for passing a mounting bolt. An insulating spacer is positioned on each of the platform brackets in a state of fitting into the notch of each of the housing brackets. The insulating spacer has a cylindrical member made of hard material inserted into the through hole of the insulating spacer to allow the mounting bolt to be tightened in a state of passing through the cylindrical member.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: November 14, 2000
    Assignee: NEC Corporation
    Inventors: Tomoyuki Honma, Oji Mori
  • Patent number: 6147310
    Abstract: A holder (200) for holding an electronic component (100), which can be inserted into and removed from the holder (200), is formed to be both electrically and thermally insulative. The holder (200) is formed from an insulative body molded to form a cavity (205) into which the electronic component (100) can be inserted. The insulative body includes sidewalls (210) formed to partially enclose the electronic component (100) when it is inserted into the holder (200) and a bottom surface (250) formed perpendicularly with the sidewalls (210). The bottom surface (250) defines at least two apertures (225) through which terminals (110) of the electronic component (100) can extend.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: November 14, 2000
    Assignee: Scientific-Atlanta, Inc.
    Inventor: William G. Mahoney
  • Patent number: 6124552
    Abstract: Disclosed is a device for mounting a planar electrical component, such as a computer motherboard, to a chassis. In one embodiment, the device includes a spacer including a coiled wall configured to be positioned between the board and the chassis, and an elongated clip coupled to the spacer. The elongated clip including an upper fastener extending in a first direction from the spacer. The upper fastener is configured to removably clamp onto the board and secure the board to the spacer. The elongated clip further comprises a lower fastener extending in a second direction from the spacer. The lower fastener is configured to removably clamp onto the chassis and secure the chassis to the spacer.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: September 26, 2000
    Assignee: Micron Electronics, Inc.
    Inventor: Craig L. Boe
  • Patent number: 6069322
    Abstract: The present invention is a universal fixture for holding printed circuit boards with different sizes and shapes during stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing older or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: May 30, 2000
    Assignee: MCMS, Inc.
    Inventor: Curtis C. Thompson
  • Patent number: 6045397
    Abstract: The present invention provides a crack-free electrical connection structure between electrical components and a circuit board in a connector device by soldering electrical wires to through-holes of the circuit board. Retention members (40) formed integrally with the connector device have slots (36) and channels (58, 62) intersecting inside the slots (36). Projections (54) are located at an exit of each channel (58). Ends of electrical wires (90) are stripped to expose core conductors (92) and they are bent in a generally L-shape to be disposed in the respective channels (58, 62) of slots 36. The projections (54) keep the exposed core conductors (92) in position, thereby simplifying electrical connection with through-holes in the circuit board.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: April 4, 2000
    Assignees: The Whitaker Corporation, Nisshinbo Industries, Inc.
    Inventors: Moritaka Iwamura, Tetsuya Sagawa
  • Patent number: 6043435
    Abstract: The invention relates to a conductive portion device (300) having a plurality of independent conductive portions and attached to an attaching base member (360). The device includes a film (310) and a plurality of conductive materials (321, 322 and 323) to be attached to the film (310), which constitute the respective independent conductive portions, and the device further has holes (302a to 302d) corresponding to protrusions (362a to 362d) formed on the attaching base member (360).
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: March 28, 2000
    Assignee: Tokai Kogyo Kabushiki Kaisha
    Inventors: Takayuki Yamaguchi, Katsura Sugiura
  • Patent number: 6038140
    Abstract: A circuit board standoff including a body for disposition between first and second boards so as to maintain a predetermined minimum spacing between substantially parallel facing inner surfaces thereof; the body having at one end a first abutment surface for engaging an inner surface portion of the first board and at an opposite end a second abutment surface for engaging an inner surface portion of the second board. A longitudinal axis of the body is aligned with the first abutment surface and the second abutment surface. Extending from the first abutment surface is a first latch shaped and arranged to project through an opening in the first board and into latching engagement therewith and extending from the second abutment surface is a second latch shaped and arranged to project through an opening in the second board and into latching engagement therewith.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: March 14, 2000
    Inventor: Hector D. Petri
  • Patent number: 6028765
    Abstract: A pen-based portable computer, or pen-tablet computer, for use with a vehicular docking station that allows for the exchange or replacement of components thereof without the need for returning the computer to the manufacturer, is provided with exterior, removable grips that not only provide a gripping function, but also provide shock-absorption and protection exteriorly of the computer-housing. Each grip may be selectively removed from attachment to the computer-housing, in order to allow access to the interior of the housing for repair and maintenance. Four such removable grips are provided, where each grip is provided with an actuable lever for removably locking the grip to a portion of the computer housing, with each actuable lever being capable of movement away from such locking engagement in order to allow removal thereof from the housing.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: February 22, 2000
    Assignee: Xplore Technologies, Inc.
    Inventors: Danny Swindler, Brian Groh
  • Patent number: 6013133
    Abstract: An electronic component holder has a recess portion opening outward in at least one of its edges and having dimensions corresponding to the dimensions of an electronic component chip to constitute an electronic component holding portion. At least one pair of inner side surfaces opposed to each other of the recess portion are each composed of an elastic material.
    Type: Grant
    Filed: April 19, 1994
    Date of Patent: January 11, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroyoshi Takashima, Norio Sakai
  • Patent number: 6002588
    Abstract: A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibrations, and the isolation mechanism further provides a thermal path from the component to the enclosure. An elastomeric article which supports the component may be attached to the interior of the enclosure, the elastomeric article being loaded with thermally conductive fillers (fibers or non-directional particulates molded within the elastomer material). Alternatively, a wire rope which supports the component may be attached to the interior of the enclosure, the wire rope having at least one support strand and at least one heat transfer strand that has a higher thermal conductivity than the support strand.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: December 14, 1999
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Francis W. Hughto-Delzer
  • Patent number: 5989067
    Abstract: A protective device for use with a lamp holder for a high-voltage dual-pin lamp, such as a halogen lamp, includes a wall that surrounds the lower portion of an installed bi-pin lamp so as to prevent contact of the installer's fingers with the high-voltage pins. The protective device may also include a transverse rib that prevents the insertion of a low-voltage bi-pin lamp into a high-voltage lamp holder.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: November 23, 1999
    Assignee: Lightolier
    Inventors: David Morgan, Michael O'Boyle
  • Patent number: 5979037
    Abstract: A mounting assembly and method for locating and assembling parts with a tight press fit uses an intentional design interference between two mating parts. Because of the interference fit, material is "crushed" or compressed when one mating part, such as a button frame, is forced upon the other mating part, such as a cabinet, and a tight fit is created. The interference fit is provided between first and second bosses and first and second mating holes, respectively, on opposite sides of each of the first and second bosses along a respective first axis, but not along a second axis that extends between the first and second bosses. Thus, a greater design tolerance is permitted in a direction between the first and second bosses and between the first and second mating holes, respectively. A third assembly part, such as a light guide, can be sandwiched between the first and second mating parts.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: November 9, 1999
    Assignees: Sony Corporation, Sony Electronics, Inc.
    Inventor: Michael Andrew Lopez
  • Patent number: 5963432
    Abstract: A standoff for mounting two or more printed circuit boards to a chassis in which one keyhole cut printed circuit board may be slidably mounted on the keyhole mount of the standoff and a second printed circuit board may be mounted on the top portion of the standoff spaced away from the first printed circuit board. The second printed circuit board may be affixed to the standoff by either a screw mount, snap lock mount, adhesive, bolt and nut, clamp or other method.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: October 5, 1999
    Assignee: Datex-Ohmeda, Inc.
    Inventor: Christopher Thomas Crowley
  • Patent number: 5949020
    Abstract: A clip (100) for securing a cable (202) and shield (216) to a surface (209) of a printed wiring board (208) includes a retainer (102) and a shield clip (112). The retainer includes a first side wall (104) and a second side wall (106) joined by a base (105). The side walls and base define a channel (108) sized to retain the cable. The shield clip extends from the retainer and is spaced from the retainer to retain a wall of the shield between the retainer and the shield clip. The retainer further includes a flange (110) for mounting to the surface of the printed wiring board.
    Type: Grant
    Filed: June 26, 1997
    Date of Patent: September 7, 1999
    Assignee: Motorola, Inc.
    Inventors: Jay R. Mitchell, Matthew R. Michieli
  • Patent number: 5936846
    Abstract: There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased.
    Type: Grant
    Filed: January 16, 1997
    Date of Patent: August 10, 1999
    Assignee: Ford Global Technologies
    Inventors: Vivek Amir Jairazbhoy, Richard Keith McMillan, II, Yi-Hsin Pao
  • Patent number: 5926371
    Abstract: A heat transfer apparatus is presented accommodating elevational disparity of an upper surface of a semiconductor device with respect to the component side of a PCB without adversely affecting system reliability. The heat transfer apparatus includes a thermally conductive cap structure positioned between the semiconductor device and an ambient and thermally coupled to the semiconductor device. One embodiment includes one or more spacers which maintain a space between the cap structure and the semiconductor device. A chip mounted to the substrate of a ceramic BGA package is mechanically isolated from the cap structure by the spacers, preventing chip damage due to shock and vibration. A backing plate on a side of the PCB opposite the semiconductor device provides PCB structural support and additional heat transfer. Several fasteners attach the backing plate to the cap structure.
    Type: Grant
    Filed: April 25, 1997
    Date of Patent: July 20, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Thomas P. Dolbear
  • Patent number: 5917709
    Abstract: A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: June 29, 1999
    Assignee: Eastman Kodak Company
    Inventors: Dean A. Johnson, William R. Laubengayer, Stephen G. Richardson
  • Patent number: 5909008
    Abstract: A mechanism for removably mounting instruments with a cylindrical outer case to a flat panel over an opening with a peripheral wall extending perpendicularly from the rear side of the panel and two or more gripping assemblies mounted adjacent to the wall. Outwardly extending flange members mounted on the outer case at one end of the instrument are cooperatively and removably engaged within the gripping assemblies. The gripping assemblies in an alternate embodiment are removably mounted through slots in the panel. A user can mount and unmount the instruments from the rear without requiring the use of any tools.
    Type: Grant
    Filed: January 29, 1996
    Date of Patent: June 1, 1999
    Inventor: Pedro R. Pelaez
  • Patent number: 5903439
    Abstract: A mezzanine connector assembly includes connectors engageable to a mating connector assembly such as a motherboard. It includes a circuit card having a surface on which a connector is mounted as well as a mezzanine card having a surface on which another connector is mounted. A mounting member is attached for connection between the cards in order to establish relative positions of the card surfaces. The distance between the card surfaces is set at least in part by the distance between end portions of the mounting member. The distance between the card surfaces is independent of the thickness of the cards so that a variation of the thickness of the cards will not result in a variation of the distance between the card surfaces.
    Type: Grant
    Filed: May 18, 1998
    Date of Patent: May 11, 1999
    Assignee: Unisys Corporation
    Inventor: Vladimir K. Tamarkin
  • Patent number: 5901047
    Abstract: The disclosed invention relates to the employment of a spacer element for mounting, aligning and spacing a computer chip relative to a PCB. The spacer element is formed and dimensioned to engage the chip in a manner to assure that the pins of the chip are properly aligned relative to openings in the PCB and to assure that the chip is centered and maintained parallel to the PCB and each of its pins maintained equal distance from the underneath side of the PCB during the wave soldering process for electrically connecting the chip and PCB.
    Type: Grant
    Filed: June 20, 1996
    Date of Patent: May 4, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel D. Gonsalves, Paul D. Welch, Lance E. Terry, Leonardo Sandman, Kia-Pin A. May
  • Patent number: 5898575
    Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: April 27, 1999
    Assignee: LSI Logic Corporation
    Inventors: Emily Hawthorne, John McCormick
  • Patent number: 5892178
    Abstract: A support fixture for supporting a face plate and CCA board as they are secured together has a base plate and a pair of end supports or blocks projecting upwardly from opposite ends of the base plate to support opposite ends of the face plate. A center support also projects upwardly from the base plate at a location spaced centrally between the two end supports for supporting a central region of the face plate. The end supports have rectangular recesses at the same height as the center support for receiving the opposite ends of the face plate. The height of the recesses and center support is selected to be greater than the height of any LED projecting from the CCA board through openings in the face plate, such that any such LED is spaced above the base plate.
    Type: Grant
    Filed: March 20, 1997
    Date of Patent: April 6, 1999
    Assignee: Qualcomm Incorporated
    Inventor: Theodore Robert Reyes
  • Patent number: 5886878
    Abstract: The present application describes a through-hole component insulator and assembly process which has the advantages of preventing solder from contacting the metal case of a through-hole component without an addition step or additional material from the standard fabrication process for a printed circuit board. The printed circuit board of the present invention includes a printed ink spacer disposed beneath the through-hole component wherein the printed ink spacer is included with a standard silk-screen artwork layer in the printed circuit board design stage. The printed ink spacer raises the through-hole component from the printed circuit board surface to prevent solder from contacting the metal case of the through-hole component during the printed circuit board soldering stage. Using a silk-screen artwork layer which includes at least one printed ink spacer in the artwork, the printed ink spacer is deposited during deposition of a standard printed design on the printed circuit board fabrication.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: March 23, 1999
    Assignee: Dell USA, L.P.
    Inventors: Gita P. Khadem, Darrell J. Slupek
  • Patent number: 5883789
    Abstract: A system for mounting a hybrid electronic component to a PC board is disclosed. The system includes a set of brackets for mutually engaging a first surface of the PC board and a cover surface of the hybrid electronic component, wherein the cover surface has an arcuate shape when in a vacuum environment. The brackets are designed with legs having lengths and thicknesses for providing clearance between the cover surface of the hybrid and the first surface of the PC board for use when the hybrid electronic component is in a vacuum environment.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: March 16, 1999
    Assignee: United Technologies Corporation
    Inventor: James R. O'Coin
  • Patent number: 5847923
    Abstract: An interface card positioning device including a positioning plate screwably fixed on a computer housing. The positioning plate cooperates with an adjusting screw and a sleeve fitted on the adjusting screw to hold the interface card firmly in position. Thus, cards such as VGA cards, network cards, IDE cards, sound cards, and IO cards may be firmly positioned after installation, and possible loosening or poor electrical contact due to transportation or prolonged use may be avoided.
    Type: Grant
    Filed: June 13, 1997
    Date of Patent: December 8, 1998
    Inventor: Guiy Shing Lee
  • Patent number: 5825633
    Abstract: A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: October 20, 1998
    Assignee: Motorola, Inc.
    Inventors: C. Gregory Bujalski, Jeffrey M. Petsinger, Daniel T. Rooney
  • Patent number: 5801923
    Abstract: A multichip module is attached to a printed wire circuit board using three conductive mounting feet that are vapor phase soldered to conductive feet on the module's substrate and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: September 1, 1998
    Assignee: Honeywell Inc.
    Inventor: Randolph G. Nichols
  • Patent number: 5801335
    Abstract: A first electrical insulation substrate having a pin and a second electrical insulation substrate having a hole formed therethrough for receiving the pin is provided. The pin is designed to control and limit the flow of the pin material to an upper portion of the pin during a cold forming process to avoid cracking the pin. This is accomplished by making a lower portion of the pin resistant to flow and the upper portion of the pin susceptible to flow. The lower portion of the pin may have a greater cross sectional area than the upper portion thus making the lower portion resistant to flow and the upper portion of the pin susceptible to flow.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: September 1, 1998
    Assignee: General Motors Corporation
    Inventors: Stacy Ann Brussalis, Joseph Howard Gladd, Aaron Dillon Monroe
  • Patent number: 5798171
    Abstract: An electronic assembly containing an active circuit, an insulating layer and a heat sink. The insulating layer comprises an unfilled thermoplastic sheet having adhesive layers on opposite sides of the sheet. The adhesives are filled with thermally conductive material while the film is unfilled. The properties of the insulating layer are such that the thermal impedance is low while dielectric strength is high. These improved films reduce costs, improve thermal and electrical properties. The layers of the invention are particularly useful for single or multiple layer printed circuit boards having surface mount components in conjunction with a sheet like aluminum heat sink.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: August 25, 1998
    Assignee: Sheldahl, Inc.
    Inventor: Bruce David Olson
  • Patent number: 5792994
    Abstract: A device for mounting a component such as a shielding case on a printed circuit board includes a base, at least one leg, and at least a first resilient wall rising from the base. The leg extends from the base and is, for example, soldered to the printed circuit board. The first wall has either a hole engaged with a projection formed in the shielding case, or a projection engaged with a hole formed in the shielding case. The first wall detachably engages the shielding case to hold the shielding case in place. The device may have additional walls, i.e., a second wall that opposes the first wall and a third wall that is in the same plane as the first wall rises. The first and second walls hold the wall of the shielding case therebetween in sandwiched relation, the shielding case being inserted into the printed circuit board from the component side of the printed circuit board.
    Type: Grant
    Filed: August 7, 1996
    Date of Patent: August 11, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masamitsu Akahane
  • Patent number: 5792991
    Abstract: A device for forming an environmental seal around an object includes:(a) a split housing having a chamber that can surround the object;(b) an inflatable bladder for inflating around the object and within the chamber;the housing having a window breaking through its split so that the bladder seals to a seal outside the chamber.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: August 11, 1998
    Assignee: N.V. Raychem S.A.
    Inventor: Jean-Marie Etienne Nolf
  • Patent number: 5790381
    Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners, or have package alignment tabs to combine several IC packages into an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: August 4, 1998
    Assignee: Mitsubishi Semiconductor America, Inc.
    Inventors: Nour Eddine Derouiche, Scott Jewler
  • Patent number: 5789712
    Abstract: A holder for a toroid coil has a planar top surface for engagement by a vacuum pickup and four side walls extending to a mounting plane and defining a toroid containing space therewithin. Wire wrap posts extend from one side of the holder and wire pass through openings enable the wire to hold the coil in place while permitting the solder connection location to lie outside the holder in view for inspection.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: August 4, 1998
    Assignee: Power Trends, Inc.
    Inventors: John Brett Barry, G. Russell Ashdown
  • Patent number: 5786989
    Abstract: A mounting structure for mounting a printed circuit board on a frame of an electronic device. The mounting structure comprises a body, a lead, and a threaded portion. The threaded portion is formed on the body, and receives a screw. The printed circuit board is secured to a frame of an electronic device using the mounting structure. Specifically, the mounting structure is secured to the frame using the screw. The lead is soldered to lands on a mounting surface of the printed circuit board by a process for mounting electronic parts (e.g. an IC or LSI package) on the mounting surface of the electronic device.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: July 28, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Shin Kawabe
  • Patent number: 5775418
    Abstract: An arrangement for mounting a heat sink to a mounting board. The arrangement includes a heat sink and a locking member. The heat sink has a bottom surface and a passageway extending therein from an entrance opening on the bottom surface in a direction normal thereto and terminating with a closed end at its inner end. The passageway has an entrance region tapering toward the closed end and an inner region defined by generally parallel side wall portions. The side wall portions defining the entrance region including an engagement surface facing the closed end of the passageway. The locking member is T-shaped with the member crossing the stem of the T adapted for snug fit engagement with the generally parallel walls of the passageway's inner region. Moreover, the crossing member has an engagement member at each of it's ends that extend toward the base of the stem. The engagement members interlock with the engagement surface when the locking member is inserted into the passageway of the heat sink.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: July 7, 1998
    Assignee: Digital Equipment Corporation
    Inventors: Kevin Lonergan, Karl Cunha, John Kosatschkow, Ralph Michael Tusler
  • Patent number: 5766740
    Abstract: An electronic assembly containing an active circuit, an insulating layer and a heat sink. The insulating layer comprises an unfilled thermoplastic sheet having adhesive layers on opposite sides of the sheet. The adhesives are filled with thermally conductive material while the film is unfilled. The properties of the insulating layer are such that the thermal impedance is low while dielectric strength is high. These improved films reduce costs, improve thermal and electrical properties. The layers of the invention are particularly useful for single or multiple layer printed circuit boards having surface mount components in conjunction with a sheet like aluminum heat sink.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: June 16, 1998
    Assignee: Sheldahl, Inc.
    Inventor: Bruce David Olson
  • Patent number: 5754412
    Abstract: A standoff connector for fastening two plates in spaced relation, including a body and a stud for insertion into the body. The body has a base and a trunk projecting upward from the base, and also has a central opening for receiving the stud, with a sleeve carried in the central opening with a plurality of spaced resilient fingers having upper ends fixed in the trunk and lower ends spaced from the trunk for outward radial movement, the lower ends of the fingers having inwardly directed tips for gripping the stud. The stud has a shaft for positioning in the body opening and a handle at one end for rotating the stud, with a shaft having a major diameter adjacent the other end and a minor diameter between the major diameter and the handle for receiving the tips of the body sleeve, with the body and stud having interengaging elements for limiting rotation of the stud in the body.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: May 19, 1998
    Assignee: Hartwell Corporation
    Inventor: Timothy J. Clavin
  • Patent number: 5750936
    Abstract: A printed wiring board (PWB) is attached to a PWB holder with mounting hardware which includes a washer having a first annular surface with a first external diameter for insertion into a mounting hole in the PWB and a second annular surface with a larger second external diameter. The two external diameters form an annular shoulder on an exterior side of the washer that extends between the first and second external diameters for soldering the washer to the PWB. The washer includes a resilient flange interior to its opening. A screw for mounting the PWB is inserted through the opening and has a screw head larger than a diameter of the opening and a second end with an external diameter smaller than the diameter of the opening, but larger than an internal diameter of the flange, so that the screw is held by the washer when the second end is forcibly inserted through the resiliently flanged opening.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: May 12, 1998
    Assignee: Harris Corporation
    Inventors: William E. Wheatley, Robert James Wilson, Jr.
  • Patent number: 5750935
    Abstract: The present invention provides for use with a circuit board having an aperture formed therein for receiving an electrical component therethrough, an electrical component assembling device. The electrical component device, in a preferred embodiment, includes a body member configured to receive the electrical component and at least partially extend through the aperture. A first clip is coupled to the body member and includes a first pressure bearing member for exerting a force against the circuit board to thereby secure the body member to the circuit board. The device further includes a second clip coupled to the body member. The second clip also includes a second pressure bearing member for exerting a force against the electrical component to thereby secure the electrical component to the body member. Thus, the first and second clips act in concert to hold the electrical component and the body member secure with respect to the circuit board.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: May 12, 1998
    Assignee: Lucent Technologies Inc.
    Inventor: David L. Stevens
  • Patent number: 5715146
    Abstract: An apparatus securing at least first and second generally flat, rectangular I/O expansion boards in seated electrical connection with a mother board mounted in a computer card cage, wherein each expansion board has opposite first and second longitudinal edge portions and opposite first and second lateral edge portions and an electrical connector portion provided at the first lateral edge portion and wherein the electrical connector portion of each expansion board is matingly seated in an associated electrical connection portion of the mother board, and wherein the distance between the first and second lateral edge portions of the first expansion board is different from the distance between the first and second lateral edge portions of the second expansion board comprising a bracket assembly fixedly mounted with respect to said card cage and having a first surface portion disposed next adjacent to said second lateral edge portion of said first expansion board and a second surface portion disposed next adjacent
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: February 3, 1998
    Assignee: Hewlett-Packard Company
    Inventor: John Pete Hoppal
  • Patent number: 5671124
    Abstract: A circuit board locating device for fastening a circuit board to a frame, having two pairs of symmetrical flat legs at four sides inserted through a cross slot in a frame, a screw hole at the top connected to a circuit board by a screw, four pairs of side boards respectively raised from two opposite lateral sides of each leg and stopped at the top side of the frame, four horizontal bottom plates respectively outwardly extend from the legs at the bottom and stopped at the bottom side of the frame, and two inward projecting portions respectively raised from two opposite legs and stopped against the periphery of the screw to hold it in the screw hole.
    Type: Grant
    Filed: February 8, 1996
    Date of Patent: September 23, 1997
    Inventor: Hsin Chien Ho
  • Patent number: 5652055
    Abstract: The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: July 29, 1997
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: David R. King, Gary C. Adler, Joseph E. Korleski, Michelle M. H. Waters
  • Patent number: 5644106
    Abstract: A plastic holder for a thermistor includes a base portion having opposite ends and a thermistor support surface. Endwalls extend outwardly from the support surface for receiving a thermistor therebetween. Outwardly extending abutments on the base portion adjacent its opposite ends inhibit displacement of the holder from a pocket on a spring clip. One of the endwalls has an oppositely extending extension wall with a recess in its outer end for receiving an electrical lead. A thermistor retainer projection extends outwardly from the base portion perpendicular to the support surface intermediate its opposite ends.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: July 1, 1997
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Paul J. Gajeski, G. Lynnette Marks
  • Patent number: 5623395
    Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners that allow several packages to be attached to each other to produce an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: April 22, 1997
    Assignee: Mitsubishi Semiconductor America, Inc.
    Inventors: Nour E. Derouiche, Scott Jewler
  • Patent number: 5621619
    Abstract: A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: April 15, 1997
    Assignee: CTS Corporation
    Inventors: Lewis L. Seffernick, Neal F. Thomas
  • Patent number: 5618129
    Abstract: An apparatus configured to facilitate mounting a first device to a second device where the first device has a plurality of first apertures and the second device has a plurality of second apertures. The apparatus includes a base member and a plurality of post members affixed to the base member at a plurality of attachment loci. Each post member is substantially in register with a first aperture and with a second aperture when the first device, the second device, and the apparatus are in a mounting orientation. Each post member includes a tab member and a mounting aperture which traverses the post member. For each post member and for each first aperture, the tab member is configured to flex from an initial position to pass through the first aperture when the post member is urged into the first aperture. The tab member returns to the initial position when the post member passes a predetermined distance into the first aperture to captively retain the first device intermediate the tab member and the base member.
    Type: Grant
    Filed: March 13, 1995
    Date of Patent: April 8, 1997
    Assignee: Paragon Electric Company, Inc.
    Inventor: Edwin L. Skarivoda
  • Patent number: 5608611
    Abstract: An electronic module includes a Printed Circuit Board (PCB) which contains a plurality of circuit elements. The electronic module is electrically connected to other electrical components in a vehicle by a connector. The PCB is contained within an electrically conductive housing which includes a box and a cover. A ground trace printed on the PCB extends to a mounting hole in the PCB and provides a ground path for the circuit elements. An electrically conductive metal ferrule which elevates the PCB above the box and the cover above the PCB, extends through the mounting hole in the PCB and contacts the cover and box when the cover is fitted onto the box. A mounting bolt extends through the cover inside the ferrule through the box and into a nut mounted into a metal portion of the vehicle.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: March 4, 1997
    Assignee: United Technologies Automotive, Inc./Ford Motor Company
    Inventors: Robert G. Szudarek, Yew T. Yeow, Arnold D. Nielsen, Roger Cook
  • Patent number: 5566047
    Abstract: Disclosed is an AC electrical apparatus including a vibrating device and a mounting structure supporting the device. In the improvement, a resilient insulator is interposed between the device and the mounting structure so that vibrations are isolated from the mounting structure. In a highly preferred embodiment, the insulator has a disc-like component between a standoff spacer and the mounting structure. Another such component is between the mounting structure and the head of the bolt which attaching the device to the structure. And a tube-like component of the insulator is between the bolt and such structure.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 15, 1996
    Assignee: Ruud Lighting, Inc.
    Inventors: Michael J. Kahn, Donald Wandler
  • Patent number: 5555485
    Abstract: A device and method for insulating a dry film capacitor includes a pair of electrically non-conductive discs having knurled protrusions extending therefrom. The dry film capacitor includes a core for receivingly engaging the protrusions to thereby secure the discs to the capacitor. The discs are dimensioned such that the discs when placed on the interior surface of a ballast can serve as supports for the capacitor by raising the capacitor away from contact with the ballast can. In connecting the discs to the capacitor, the protrusions are twistingly pushed into the core of the capacitor.
    Type: Grant
    Filed: November 29, 1994
    Date of Patent: September 10, 1996
    Assignee: Philips Electronics North America Corporation
    Inventor: Caryl L. Wallace
  • Patent number: 5548081
    Abstract: A duct for connecting an electrical device insulated with gas with a terminal location located in atmospheric air, the duct has a gas filled bushing insulator, at least one tubular field control electrode located inside the bushing insulator, at least one insulating tube having an end facing a potential-guiding region of the duct, the at least one field control electrode being formed by a conducting portion on the end of the at least one insulating tube, a bushing conductor around which the at least one insulating tube is arranged coaxially, the insulating tube having a ground potential-side end, and a holder which holds the insulating tube at the ground potential-side end outside a region loaded with high field intensity.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: August 20, 1996
    Assignee: Kommandidgesellschaft Ritz Messwandler GmbH & Co.
    Inventor: Peter Rost