Component Mounting Pads, Spacers And Holders Patents (Class 174/138G)
  • Patent number: 4591951
    Abstract: An electronic component contained in a metal case is attached with an insulation mold at a sealing part and lead wires of the electronic component element are passing through holes on the insulator base, and the end parts of the lead wires are bent in recesses on the insulator base, thereby constituting surface mounting type electronic component.
    Type: Grant
    Filed: July 24, 1984
    Date of Patent: May 27, 1986
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shigeyoshi Iwamoto, Yoshifumi Saeki, Takashi Kuribayashi, Shinichiro Ishitsuka, Nobukuni Ogino
  • Patent number: 4587377
    Abstract: An electrically insulating fastener having three pre-assembled elements. A nut with a tubular body and an integral spring flange has a disc-shaped spacer attached to the flange. The spacer has a central opening with a cylindrical collar formed around it. A flexible and resilient rubber sleeve is fitted over the collar. The nut, spacer, and sleeve form a unitary fastener which can be used with a headed threaded fastener to make electrical connections through heat sinks of various thicknesses.
    Type: Grant
    Filed: September 21, 1984
    Date of Patent: May 6, 1986
    Assignee: Illinois Tool Works Inc.
    Inventor: William G. Rodseth
  • Patent number: 4578612
    Abstract: A shock isolator for a fragile crystal device (20) includes a headed vacuum molded Teflon sheath (10) having rib springs (12) molded on the surface (11) for absorbing the shock of impact with nearby components. An integral spacer (14) is provided and coupled to the shock isolator proper by a living hinge (15). A plurality of keyhole-shaped slots (18) are provided in the spacer for engagement with the crystal leads (22) when the spacer is folded under into its operative position.
    Type: Grant
    Filed: September 14, 1984
    Date of Patent: March 25, 1986
    Assignee: Motorola, Inc.
    Inventor: Charles W. Mooney
  • Patent number: 4577259
    Abstract: Apparatus and method for retaining an electronic device having an encapsulated body portion of a generally uniform cross section by means of a socket assembly having a plurality of deformable ribs extending medially therein. The electronic device, in particular an LED is inserted into the cavity for frictional retention therein by deformably engaging the ribs of the socket assembly. Critical height spacing of the LED is retained yet the deformable ribs allow for thermal expansion and contraction of the device body and leads without placing undue stress on its lead/die interface.
    Type: Grant
    Filed: May 9, 1983
    Date of Patent: March 18, 1986
    Assignee: Motorola, Inc.
    Inventors: Leonard Latasiewicz, Felix B. Melikian, Bay E. Estes, III
  • Patent number: 4574879
    Abstract: A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.
    Type: Grant
    Filed: February 29, 1984
    Date of Patent: March 11, 1986
    Assignee: The Bergquist Company
    Inventors: David C. DeGree, Herbert J. Fick, Bruce H. Juenger
  • Patent number: 4554614
    Abstract: A supporting plate having a network of conductors, on which supporting plate a number of circuit components are placed which are interconnected in the network of conductors in an electric circuit. In a place of the circuit which is sensitive to moisture, a board opening is provided in which a member of a minimum moisture-absorbing material is fitted. The connections of the surrounding circuit components extend in an aperture of the member and are electrically interconnected there. The stability of the circuit is considerably improved thereby in particular in the case in which the circuit is an oscillator circuit.
    Type: Grant
    Filed: May 27, 1983
    Date of Patent: November 19, 1985
    Assignee: U.S. Philips Corporation
    Inventor: Hendricus M. van der Wijst
  • Patent number: 4495515
    Abstract: A mounting washer arrangement for a new type power transistor package comprises two interlocking washers. A first mounting washer part of heat sinking material fits under the transistor body; a second mounting washer part of electrically insulating material interlocks with the first mounting washer part and fits under a terminal lug of the transistor. Together the two mounting washer parts provide economical heat sinking and electrical insulation. The interlocking arrangement prevents cracking and twisting of the two mounting washer parts when the transistor is firmly secured by torquing anchoring screws to the chassis.
    Type: Grant
    Filed: July 26, 1982
    Date of Patent: January 22, 1985
    Assignee: AT&T Bell Laboratories
    Inventor: Gani Pamiello
  • Patent number: 4480289
    Abstract: A mount is provided for electrolytic capacitors, the mount being in the form of a ring having an internal shoulder portion. On the opposite end of the mount from the end on which the shoulder portion is located is a groove containing a compressible O-ring. When the capacitor is inserted in the mount with its terminals extending downwardly to the surface of a circuit board, the top edge of the capacitor can rest on the shoulder of the ring mount. Screws are inserted from the opposite side of the circuit board and engage the terminals. Upon being tightened, the capacitor can is drawn downwards bringing the end of the capacitor can into firm engagement with the ring mount and causing it to compress the O-ring so as to provide a seal between the O-ring and the surface of the circuit board.
    Type: Grant
    Filed: September 29, 1983
    Date of Patent: October 30, 1984
    Assignee: Hewlett-Packard Company
    Inventor: John W. Huffman
  • Patent number: 4417297
    Abstract: In a printed circuit board wherein chip components are mounted in aligned holes provided through two printed substrates stacked over one another, spacer members are interposed between the printed substrates so as to define spaces therebetween around the holes. Since the printed substrates and chip components are movable relative one another due to such spaces, thermal stresses in the joints between the chip components and the printed substrates can be relieved.
    Type: Grant
    Filed: July 2, 1981
    Date of Patent: November 22, 1983
    Assignee: Alps Electric Co., Ltd.
    Inventors: Kohei Oyama, Hiroyuki Yokouchi
  • Patent number: 4417095
    Abstract: A support member for electronic devices, particularly for mounting devices on a printed circuit board, has a flat central web portion, side members extending down along each side of the central web portion, the side members connected to the web portion by inclined webs. Each side member has a plurality of slots extending down from its top edge, with an aperture at the bottom of each slot. A transverse rib extends upward at each end, with a resilient latch. The leads of an electronic device are guided by the upper surfaces of the inclined webs and the inner surfaces of the slots into the apertures and are correctly positioned for insertion in a printed circuit board. The device is held down by the latches. A protective cover can be positioned over the device, protrusions on the cover snapping into recesses in the transverse webs.
    Type: Grant
    Filed: October 23, 1981
    Date of Patent: November 22, 1983
    Assignee: Northern Telecom Limited
    Inventor: Roger A. Beun
  • Patent number: 4410928
    Abstract: A connector fixing device having a mounting mold disposed between a connector and a board in which the connector can be fixed by fixing the mounting mold on a relative element.
    Type: Grant
    Filed: May 1, 1981
    Date of Patent: October 18, 1983
    Assignee: Clarion Co., Ltd.
    Inventor: Mitsuo Aramaki
  • Patent number: 4395585
    Abstract: A multiple use component spacer having a component platform defining an aperture, having a plurality of lead grasping portions each having forked resilient portions defining a lead receiving slot for firm engagement with the leads of a range of packages without requiring the use of adhesives, having a plurality of lead abutment portions on its circumference, and having a plurality of feet on at least one surface.
    Type: Grant
    Filed: November 19, 1981
    Date of Patent: July 26, 1983
    Assignee: Motorola Inc.
    Inventor: Erwin R. Polcyn
  • Patent number: 4385341
    Abstract: To prevent breakage of flexible conductors of a flat cable soldered to the printed circuit on a printed circuit board, a strain relief member is provided through which the conductors pass, prior to passing through the board to the printed circuit. The relief member has a longitudinal groove extending part way through the member and apertures extending from the bottom of the groove to the bottom surface of the relief member. Bared conductors pass through the apertures and through the board to be soldered to the printed circuit. The end of the insulated portion of the cable is positioned in the groove. The relief member is held in firm contact with the printed circuit board during soldering. Use of the relief member moves the flexing position of the cable away from the end of the "wicking" of the solder up the conductors during soldering.
    Type: Grant
    Filed: March 19, 1981
    Date of Patent: May 24, 1983
    Assignee: Northern Telecom Limited
    Inventor: Henry A. Main
  • Patent number: 4367371
    Abstract: An insulating cover formed of a synthetic resin material to be placed, as necessary, over an electronic part which has been automatically mounted on a printed circuit substrate. The insulating cover can be installed on the part easily and with proper fit, has good insulating properties and provides dust and sound proofing functions. The cover cannot be freely slipped off of the part by vibration and the like.
    Type: Grant
    Filed: April 17, 1981
    Date of Patent: January 4, 1983
    Assignee: Shinagawa Shoko Co., Ltd.
    Inventor: Toshinobu Nakamura
  • Patent number: 4362904
    Abstract: A printed circuit board component mounting support and spacer having a base with an essentially rectangular face and at least four essentially rectangular feet extending out from the rectangular planar surface of the base. Extending upwards from the base from the long edges thereof are two essentially rectangular sides to cradle an electrical component. The base has two slots extending inward from the short edges thereof a predetermined distance. The slots terminate in an edge of a predetermined configuration and are wide enough to permit the passage of component electrical leads therebetween.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: December 7, 1982
    Assignee: Reliance Electric Company
    Inventors: Richard E. Schneider, Stephen L. Majesky
  • Patent number: 4340774
    Abstract: A method of and arrangement for mounting an electric component, which comprises a holding socket having contact legs, on a circuit board. The holding socket is placed in a desirable position by inserting the contact legs into corresponding apertures of the circuit board, and is preliminarily fixed with respect to the circuit board by the use of a device in the shape of an apertured, non-conductive plate which is applied on the protruding contact legs on the opposite side of the circuit board. The plate retains the socket by friction forces which are present between one or more of the contact legs and the edges of pertaining apertures in the plate. Thereafter the wiring of the protruding legs is performed.
    Type: Grant
    Filed: March 10, 1978
    Date of Patent: July 20, 1982
    Inventors: Soren G. Nilsson, Leif R. Carneborn
  • Patent number: 4254301
    Abstract: A printed circuit board component mounting support and spacer having a base 20 with a square face 42, 44, 46, 48 and at least four rectangular feet 32, 34, 36, 38 extending out from the square planar surface of base 20. Extending upwards from base 20 are four projections 10, 12, 14, 16 to cradle an electrical component 8. The base 20 has a hole 60 through which the component leads are inserted before inserting the component leads through the appropriate holes in the board. Between each pair of fingers 10, 12 and 14, 16 adjacent the extremities of hole 60 are upwardly projecting nibs 52, 54, 56, 58 to contact the bottom of the component to provide a cooling space and pivot point for minimal transverse movement.
    Type: Grant
    Filed: March 19, 1979
    Date of Patent: March 3, 1981
    Assignee: Xerox Corporation
    Inventor: Louis J. Serino
  • Patent number: 4219756
    Abstract: A mounting structure for use with an electronic timepiece comprises a quartz crystal unit disposed within an opening formed in a circuit board and arranged so that the major lengthwise axis of the crystal unit lies parallel with the major plane of the circuit board. A connector formed of heat-deformable material connects the crystal unit to the circuit board and has a cup-shaped portion at one end which is clamped over and supports an end portion of the crystal unit, and a mounting stud at the other end which is inserted through a hole in the circuit board and secured thereto by heat-deforming the end tip of the stud which projects beyond the circuit board to form an enlarged head.
    Type: Grant
    Filed: May 19, 1978
    Date of Patent: August 26, 1980
    Assignee: Kabushiki Kaisha Daini Seikosha
    Inventors: Isamu Nishida, Tadashi Otani, Kenji Yajima
  • Patent number: 4219172
    Abstract: A holder comprises a leading portion adapted to retain in position thereon an electronic/electric part, a base portion adapted to be secured to a distributing base panel and a shank portion serving to interconnect the leading portion with the base portion and having a hole pierced therethrough for guiding the lead wire of the electronic/electric part to the lower side of the base portion. The holder permits a given electronic/electric part which is set in position on the leading portion to be securely retained at a distance from the distributing base panel, with the base portion fastened to the base panel and the lead wire of the part passed through the hole and connected to the prescribed point of connection on the base panel.
    Type: Grant
    Filed: June 26, 1978
    Date of Patent: August 26, 1980
    Assignee: Nifco, Inc.
    Inventor: Hiroo Murayama
  • Patent number: 4211890
    Abstract: An electronic circuit board has protrusions of rubber-like material on the surface opposite to the surface on which the printed circuit is provided with terminal contact points located at positions in correspondence with the individual terminal contact points or with the individual groups of the terminal contact points, each of the groups being composed of the terminal contact points aligned in a row.
    Type: Grant
    Filed: May 17, 1978
    Date of Patent: July 8, 1980
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Ryoichi Sado, Koichi Nei
  • Patent number: 4197945
    Abstract: An apparatus to removably enclose and thereby protect electrical connector ins attached to circuit boards. The pin protector has parallel flanges and a hinge to provide for the opening of an enclosing section to allow it to be placed about the pins. The memory properties of the hinge force the enclosing section to remain securely positioned. The pin protector is formed from an extrusible material and thus can be manufactured in any length without requiring the mold to be changed.
    Type: Grant
    Filed: September 30, 1976
    Date of Patent: April 15, 1980
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Theodore R. Sherwood
  • Patent number: 4165142
    Abstract: There is disclosed a clip for securing in mated relationship two-part connectors where one connector part is mounted to a panel. The clip is designed having an upper section which curves to fit over the top of the mated connector housing. The lower section of the clip, which is hinged to the upper section, contains a pair of tabs extending from the side edges. The tabs are folded backward to form slots which operate to hold the clip secure against the panel. The hinge is arranged to provide an additional slot so that the clip can secure connectors having differing heights.
    Type: Grant
    Filed: May 18, 1978
    Date of Patent: August 21, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Edwin W. Grabau
  • Patent number: 4157856
    Abstract: There is disclosed a flexible unitary retaining clip for use with two part electrical connectors. The clip locks around the mated connector by the snap action of folded sections and is released by externally directed outward pressure on a top section. The clip is designed with two mounting positions to accommodate different connector hood sizes.
    Type: Grant
    Filed: May 10, 1978
    Date of Patent: June 12, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: George J. Shevchuk
  • Patent number: 4026412
    Abstract: Hybrid microelectronic packages contain microelectronic components for the protection and connection thereof. For protection of the microelectronic packages during storage and shipment, they are positioned within a carrier which encloses the body of the package and restrains the package leads for complete protection. Preferably the carrier has electrical access to the leads so that testing of the package can take place when the completed package is protected within the carrier.
    Type: Grant
    Filed: September 26, 1974
    Date of Patent: May 31, 1977
    Inventor: Richard D. Henson
  • Patent number: 3962719
    Abstract: Disclosed is a semiconductor mounting pad employing slots into which the leads projecting from a header may be inserted without passing the entire lead through the pad. Apparatus for assembling the mounting pads on standard enclosure devices is also disclosed.
    Type: Grant
    Filed: December 5, 1974
    Date of Patent: June 8, 1976
    Assignee: Plastronics, Inc.
    Inventor: Wayne K. Pfaff