By Heat Pipe Patents (Class 174/15.2)
  • Patent number: 10463077
    Abstract: A cartridge for an e-vaping device includes a reservoir configured to hold a pre-vapor formulation and a channel structure that includes a channel surface with one or more open-microchannels. An open-microchannel in the channel structure may be in fluid communication with the reservoir and may transport pre-vapor formulation from the reservoir to a heating element based on capillary action of the pre-vapor formulation through the open-microchannels. The heating element may vaporize the pre-vapor formulation drawn through one or more open-microchannels. The cartridge may be independent of fibrous dispensing interfaces, including one or more wicks. Fabrication of such a cartridge may be simplified, faster, cheaper, some combination thereof, or the like relative to fabrication of a cartridge that includes a fibrous or soft dispensing interface to draw pre-vapor formulation from a reservoir to a heating element.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: November 5, 2019
    Assignee: Altria Client Services LLC
    Inventors: Raymond Lau, Ali Rostami, Eric A. Hawes
  • Patent number: 10401926
    Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite cable to a lid housing portion that rejects the thermal energy to the external environment. The graphite cable has plural graphite elements vertically stacked with adhesive and exposed at each end as plural coupling points that each independently couple to a thermal device in the main and lid housing portions, such as a heat sink or vapor chamber.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: September 3, 2019
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
  • Patent number: 10358945
    Abstract: An improved heat engine includes at least one heat pipe containing a working fluid flowing in a thermal cycle between vapor phase at an evaporator end and liquid phase at a condenser end. The heat pipe may have an improved capillary structure configuration with a continuous or stepwise gradient in pore size along the capillary flow direction. The heat engine may have an improved generator assembly configuration that includes an expander (e.g. rotary/turbine or reciprocating piston machine) and generator along with magnetic bearings, magnetic couplings, and/or magnetic gearing. The expander-generator may be wholly or partially sealed within the heat pipe. A heat engine system (e.g. individual heat engine or array of heat engines in series and/or in parallel) for converting thermal energy to useful work (including heat engines operating from a common heat source) is also disclosed. The system can be installed in a vehicle or facility to generate electricity.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: July 23, 2019
    Assignee: Elwha LLC
    Inventors: Jordin T. Kare, Nathan P. Myhrvold, Robert C. Petroski, Lowell L. Wood, Jr.
  • Patent number: 10219411
    Abstract: The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: February 26, 2019
    Assignee: MSI COMPUTER (SHENZHEN) CO., LTD.
    Inventors: Hung Chang, Min-Lang Chen
  • Patent number: 10156239
    Abstract: The inverter-integrated electrical compressor is provided with an inverter-accommodating case (2) partitioned by a partitioning wall (3) and a low-pressure refrigerant channel inside a housing, an inverter device (1) being incorporated within the inverter-accommodating case (2); wherein the inverter device (1) is provided with a plurality of high-voltage electric components (5, 6) constituting a filter circuit, a plurality of semiconductor switching elements (7), and a control substrate (8) on which an inverter circuit and a control circuit are mounted; and the plurality of semiconductor switching elements (7) are installed in a fixed manner on the side surfaces (17) of a heat-radiating block (16) provided perpendicularly relative to the partitioning wall (3).
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: December 18, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
    Inventors: Takashi Nakagami, Koji Nakano, Keiji Nagasaka, Hiroyuki Kamitani, Makoto Hattori
  • Patent number: 10152100
    Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: December 11, 2018
    Assignee: Intel Corporation
    Inventors: Michael Ahrens, George H. Daskalakis, Steven J. Lofland, David Pidwerbecki, Bo Qiu, James C. Raupp, Stacy L. Yee
  • Patent number: 9404982
    Abstract: A circuit arrangement including a plurality of amplifier stages to amplify an electrical RF signal for a magnetic resonance tomography device is provided. The plurality of amplifier stages is arranged on at least one circuit board. A circuit board of the at least one circuit board surrounds a cooling pipe.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: August 2, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: Adam Albrecht
  • Patent number: 9392725
    Abstract: An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: July 12, 2016
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Andrew O. Stringer, Bryan Christopher Baraclough, Scott Edwin Hinnershitz
  • Patent number: 9370090
    Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 14, 2016
    Assignee: General Electric Company
    Inventors: Shakti Singh Chauhan, Stuart Connolly, Binoy Milan Shah, Brian Hoden, Joo Han Kim
  • Patent number: 9036344
    Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: May 19, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jing Chen, Chien-Lung Chen
  • Patent number: 9036350
    Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: May 19, 2015
    Assignee: CONTROL TECHNIQUES LTD
    Inventors: Roger Neil Jackson, Rhys Marc Owen, Gareth Huw Jones
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8953335
    Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 10, 2015
    Assignee: Keihin Corporation
    Inventors: Hidefumi Abe, Toshiro Mayumi, Seiichiro Abe
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8929071
    Abstract: A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: January 6, 2015
    Assignee: General Electric Company
    Inventors: Richard Alfred Beaupre, Ljubisa Dragoljub Stevanovic, Daniel Jason Erno, Charles Gerard Woychik
  • Patent number: 8908373
    Abstract: A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: December 9, 2014
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Chenpin Hsu
  • Patent number: 8897016
    Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: November 25, 2014
    Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson
  • Patent number: 8879261
    Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: November 4, 2014
    Assignee: Icepipe Corporation
    Inventor: Sang-Cheol Lee
  • Patent number: 8792226
    Abstract: A heat transfer system includes an electrical distribution cabinet extending about at least one current-carrying conductor. The heat transfer system also includes at least one electrically-insulating and thermally-conducting device coupled to the at least one current-carrying conductor. The heat transfer system further includes at least one heat pipe coupled to the at least one electrically-insulating and thermally-conducting device. The heat pipe is also thermally coupled to at least a portion of the electrical distribution cabinet.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: July 29, 2014
    Assignee: General Electric Company
    Inventors: Sandeep Dhar, Peter James Greenwood, Janaki Gadiyaram, Manish Prasad
  • Patent number: 8780560
    Abstract: There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: July 15, 2014
    Assignee: Fujitsu Limited
    Inventors: Susumu Ogata, Hiroki Uchida, Seiji Hibino, Takeshi Shioga, Takahiro Kimura
  • Patent number: 8767390
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: July 1, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichiro Takeguchi, Yasuyuki Horii, Shingo Koide
  • Patent number: 8760855
    Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jeremy Charles Howes, David Levett
  • Patent number: 8743541
    Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: June 3, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiko Hata, Yasuyuki Horii
  • Patent number: 8743547
    Abstract: An electronic device having a heat dissipating component is provided. The electronic device includes a circuit board, a heat pipe which is disposed on a first side of the circuit board, a heat generating device which is disposed on a second side of the circuit board opposite to the first side, a heat sink placed which is disposed on a surface of the heat generating device and absorbs heat of the heat generating device, and a connecting member which penetrates through the circuit board and thermoconductively connects the heat pipe and the heat sink.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: June 3, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hee-dong Kim
  • Patent number: 8717745
    Abstract: The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two heat pipes (11) inside said switchgear, putting a first end (11A) of the first heat pipe (11) in the hot portion of the hot portions (10A, 10C) of the circuit breaker (10) and a second end (11B) of the first heat pipe (11) in a portion that is cooler (10A) of the hot portions (10A, 10C). The other heat pipe (11) is put between the cooler of the hot portions (10A) and a cooler part of the circuit breaker (10). A particular application is provided for medium-voltage, high-current circuit breakers.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: May 6, 2014
    Assignee: Alstom Technology Ltd
    Inventors: Denis Frigiere, Didier Rodrigues, Jean-Marc Willieme, Frank Jacquier
  • Patent number: 8699227
    Abstract: The present invention relates to a device for transfer of heat energy in a well logging tool, where a variable heat flow from a chamber for electronics via a thermovalve is transmitted into a heat sink consisting of cooled metal, thereby establishing an approximately constant temperature in the chamber for electronics. The device comprises an electronics modular unit and a heat sink modular unit, which modular units are connected via an intermediate section, where a heat-regulating thermovalve provides heat conduction between a conical piston and a conical piston seat, for transferring heat energy.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: April 15, 2014
    Assignee: Norwegian Well Solutions AS
    Inventor: Thomas Hovik
  • Patent number: 8644021
    Abstract: A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: February 4, 2014
    Assignee: Inventec Corporation
    Inventors: Chien-An Chen, Yi-Ling Chen
  • Patent number: 8619420
    Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: December 31, 2013
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Gregory Tice
  • Patent number: 8598702
    Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: December 3, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Hoon Kwak, Kwang Soo Kim, Young Ki Lee
  • Patent number: 8593805
    Abstract: A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 26, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Rung-An Chen
  • Patent number: 8582298
    Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: November 12, 2013
    Assignee: Xyber Technologies
    Inventors: Mario Facusse, David Scott Kosch
  • Publication number: 20130277082
    Abstract: Described embodiments include a device, a method, and a system. A described device includes a closed-cycle heat transfer device. The device includes a hollow member configured to be thermally coupled with and to be disposed substantially parallel to a length of a live transmission line of an overhead power transmission system. The power transmission system is configured to transport electric power from one place to another. The device includes a working fluid contained within the hollow member and tuned to transport heat received from the live transmission line to a heat removal structure. The device includes the heat removal structure configured to dissipate the transported heat.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Inventors: Roderick A. Hyde, Jordin T. Kare, Thomas A. Weaver, Lowell L. Wood, JR.
  • Patent number: 8526186
    Abstract: An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader having an inner open window is on the bottomside of the TSV die. Bonding features are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top of the heat spreader that allows a top die to be bonded thereto.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: September 3, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Satoshi Yokoya, Margaret Rose Simmons-Matthews
  • Patent number: 8488323
    Abstract: An electronic device has a ventilation system with an inlet section that receives inlet air that travels past components of the computing device to be cooled and exits at an outlet section. The air carries heat away from the components. A liquid heat transfer system captures heat generated by the components and transfers the captured heat to the inlet section of the ventilation system to warm the inlet air before it travels past the components to be cooled.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: July 16, 2013
    Assignee: Microsoft Corporation
    Inventors: Eric C. Peterson, Christian L. Belady
  • Patent number: 8488312
    Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: July 16, 2013
    Assignee: ADC Telecommunications, Inc.
    Inventors: Michael J. Nelson, Kevin Thompson
  • Patent number: 8481852
    Abstract: A method, system, and structure are provided for implementing a flex circuit cable and connector with a dual shielded air plenum. A flex circuit cable is provided with a connector. The flex circuit cable includes a stack of three spaced flex cable members with a plurality of gasket separators that are configured to form a pair of air plenums between the inner flex cable member and the respective outer flex cable members carrying cooling air coupled to the connector. The respective outer flex cable members together with the gasket separators provide a shielding function.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: July 9, 2013
    Assignee: International Business Machines Corporation
    Inventors: Ross T. Fredericksen, Don A. Gilliland
  • Patent number: 8471661
    Abstract: A coil includes electrically conductive winding wire wound in turns around a core in one or more layers. The surface of the winding wire is provided with at least one groove in the direction of the longitudinal axis of the winding wire, and at least one cooling tube which enables coolant circulation is positioned in the groove of the winding wire, being at least partly embedded therein. The groove is formed on the surface of the winding wire of an outermost winding wire layer relative to the core and opens away from the core The cooling tube in the groove is placed around the outermost winding wire layer and covers the outermost winding wire layer at least partly.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: June 25, 2013
    Assignee: ABB Oy
    Inventors: Pertti Sevakivi, Markku Talja
  • Patent number: 8405992
    Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: March 26, 2013
    Assignee: ABB Research Ltd.
    Inventors: Berk Yesin, Bruno Agostini, Christoph Haederli, Chunlei Liu, Francesco Agostini, Hamit Duran, Slavo Kicin
  • Patent number: 8405997
    Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: March 26, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Nobuto Fujiwara
  • Patent number: 8397798
    Abstract: A two-phase heat transfer system includes an evaporator, a condenser, a vapor line, and a liquid return line. The evaporator includes a liquid inlet, a vapor outlet, and a capillary wick having a first surface adjacent the liquid inlet and a second surface adjacent the vapor outlet. The condenser includes a vapor inlet and a liquid outlet. The vapor line provides fluid communication between the vapor outlet and the vapor inlet. The liquid return line provides fluid communication between the liquid outlet and the liquid inlet. The wick is substantially free of back-conduction of energy from the second surface to the first surface due to an increase in a conduction path from the second surface to the first surface and due to suppression of nucleation of a working fluid from the second surface to the first surface to promote liquid superheat tolerance in the wick.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: March 19, 2013
    Assignee: Alliant Techsystems Inc.
    Inventors: Edward J. Kroliczek, Kimberly R. Wrenn, David A. Wolf, Sr.
  • Patent number: 8395889
    Abstract: According to one embodiment, a cooling unit includes a heat dissipating mechanism, a fan, and a movable cover. The heat dissipating mechanism is housed in a housing of an electronic device. The fan is housed in the housing, and generates an air flow that collides against the heat dissipating mechanism. The movable cover includes a sheet and a knob. The sheet serves as an openable and closable cover to cover an opening on a chamber formed between the fan and the heat dissipating mechanism from the outside. The knob is located on the sheet and protrudes outward.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: March 12, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiko Hata, Shinji Hiratomo
  • Patent number: 8385067
    Abstract: A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: February 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Amilcar Arvelo, Jason R. Eagle, Eric A. Eckberg, Gary F. Goth, Katie L. Pizzolato, Scott A. Shurson
  • Patent number: 8320130
    Abstract: An exemplary heat dissipation device includes a base plate, a bracket engaged with the base plate, and a heat radiator mounted on the base plate and the bracket. The bracket includes two parallel arms. The bracket defines an opening between the arms. Each of the arms extends downwardly two clasps. Each clasp of each arm comprises a blocking part and a connecting part connecting the blocking part. The base plate is received into the opening of the bracket and sandwiched and secured by the blocking parts of the clasps and the arms of the bracket.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: November 27, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Jian Yang
  • Patent number: 8305761
    Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: November 6, 2012
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson, Jr.
  • Patent number: 8254112
    Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: August 28, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian Yang, Jing Zhang
  • Patent number: 8247698
    Abstract: An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: August 21, 2012
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Hung-Nien Chiu, Shu-Cheng Yang
  • Patent number: 8248785
    Abstract: An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: August 21, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zhi-Bin Guan
  • Patent number: 8243449
    Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: August 14, 2012
    Assignee: Sony Corporation
    Inventors: Kazunao Oniki, Takashi Yajima
  • Patent number: 8243450
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: August 14, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichiro Takeguchi, Yasuyuki Horii, Shingo Koide