Abstract: An electronic apparatus includes: a chassis; a substrate housed in the chassis and with a processing device mounted thereon; a speaker device housed in the chassis and having a speaker unit and a speaker box; and a cooling device housed in the chassis and used to cool the processing device. The substrate is placed vertically along the vertical direction of the chassis. The cooling device includes: a fan having air intake ports provided on upper and lower surfaces, exhaust ports provided on side surfaces, and an impeller, and being placed horizontally in the chassis with a rotating shaft of the impeller placed along the vertical direction of the chassis; a fin placed facing the exhaust port of the fan and placed horizontally in the chassis; and a heat pipe with a first end connected to the processing device and a second end connected to the fin.

Abstract: A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin set is installed on the main vapor chamber, the auxiliary heat dissipation fin set is connected to the auxiliary vapor chamber, and the auxiliary vapor chamber is arranged between the main heat dissipation fin set and the auxiliary heat dissipation fin set.

Abstract: A heat spreading element is provided. The heat spreading element includes compressible pyrolytic graphite sheets and rigid pyrolytic graphite sheets interleaved with the compressible pyrolytic graphite sheets.

Abstract: A storage device includes a printed circuit board (PCB) with attached semiconductor chips, each including a memory, and with at least one wire coupling the plural semiconductor chips, and a breathable case surrounding a top portion and a bottom portion of the printed circuit board. The breathable case includes a first layer disposed on a second layer which is exposed to the printed circuit board. The second layer has smaller pores than the first layer.

Abstract: An apparatus with a bus bar, a heat-pipe, and device, which has a metal structure, a metal element, and a transistor. The metal structure may include first and second surfaces, that are flat and opposite facing. The metal element may include first and second surfaces that are flat and opposite facing. The transistor may include first and second terminals between which electrical current is transmitted when the transistor is activated. The first and second terminals may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first and second surfaces of the first and second terminals, respectively, may be sintered to the first and second surfaces, respectively, of the metal structure and the metal element, respectively. The heat-pipe is thermally connected to the bus bar. The second surface of the metal structure is electrically and thermally connected to the bus bar.

Abstract: The heat sink with opposed elements providing a temperature gradient has first and second thermally conductive elements disposed diametrically opposite each other on opposite sides of a chamber filled with a thermally conductive phase change material (PCM). The first and second thermally conductive elements ascend vertically from a thermoconductive base of the PCM chamber, which is adapted for mounting on the case of a heat source, such as an electronic component that generates heat or has heat applied thereto from its surroundings during operation. The first thermally conductive element is maintained hotter than the second thermally conductive element to provide a temperature gradient across the PCM chamber. The PCM melts as heat is absorbed. Convection currents are induced in the melting PCM that facilitate heat absorption from the heat source while maintaining the heat sink at a relatively low temperature by dissipation of heat through the second thermally conductive element.

Abstract: A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and at least one heat pipe that is in thermal contact with the heat sink, wherein the at least one heat pipe comprises a thermal contact area that is configured for thermal contact with a heat generating component, and the at least one heat pipe is configured in a shape that provides mechanical spring properties. Such a heat generating component may comprise a pluggable module. Also disclosed is a receptacle assembly comprising a frame having an interior cavity configured for accommodating a heat generating component and having an opening for receiving the heat generating component, characterized in that it comprises a cooling device. Disclosed is also a system comprising a receptacle assembly, and a printed board assembly (PBA) comprising a receptacle assembly.

Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.

Abstract: This scroll compressor comprises: a shaft that is capable of rotating about an axis; a motor that rotatably drives the shaft; a compressor body that is driven by the rotation of the shaft; a housing that covers the motor and the compressor body and that has a bottom surface facing the motor from the axial direction; an intake port that guides a refrigerant into the housing; and heat-dissipating fins that are formed on the bottom surface, that extend in the direction in which the refrigerant flows, and that are divided in the flow direction.

Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.

Abstract: The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.

Abstract: A UAV heatsink assembly including two heat pipes, a first and second heat pipes including transfer and end portions, the end portions thermally connected to first and second metallic heat transfer elements, and a third metallic heat transfer element thermally connected to opposite ends of the heat pipes. A CPU thermally connected to the third metallic heat transfer element with first and second electrically insulating thermoplastic elements into which the respective first and second metallic components fit where the first and second electrically insulating thermoplastic elements are not between an outside ambient environment and the first and second metallic components. The heat pipes each include a wick structure and an embedded liquid providing thermal transport therein while at least some of the embedded liquids are above a threshold temperature between ?40° C. and 70° C. such that the UAV is at least operable above ?40° C. degrees and below 70° C.

Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.

Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a first condenser and a second condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the first condenser and second condenser, a first vapor pipe configured to connect the evaporator and the first condenser; and a second vapor pipe configured to connect the evaporator and the second condenser. The liquid pipe includes a first liquid pipe having a first flow path and connected to the first condenser, a second liquid pipe having a second flow path and connected to the second condenser, and a third liquid pipe having a third flow path connecting to the first flow path and the second flow path and connected to the evaporator.

Abstract: A system and method for an electric pole part apparatus, includes an electric interruption unit; a heat sink; and a heat pipe arrangement; wherein the heat pipe arrangement comprises a plurality of heat pipes enclosed at least partially by an outer housing; wherein a first end of the heat pipe arrangement is connected to the heat sink; and wherein a second end of the heat pipe arrangement is connected to the electric interruption unit.

Abstract: Embodiments described herein generally relate a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core, a composite material pattern, and a surface coating pattern. The inner core is surrounded by an outer core having a thickness and an outer surface. The composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The surface coating pattern is on the outer surface and is changeable between a low emissivity state and a high emissivity state based on a surface temperature of the emitter device. In the low emissivity state, the emitter device transmits an omni-directional radiation and, in the high emissivity state, the emitter device transmits a focused radiation via the composite material pattern.

Abstract: A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Abstract: An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.

Abstract: Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Abstract: Embodiments described herein generally relate to a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core surrounded by an outer core having a thickness and an outer surface. A composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The composite material pattern in combination with an optimized emissivity surface coating/paint profile directs a heat from the inner core to an object other than the emitter device.

Abstract: A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.

Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

Abstract: A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.

Abstract: A heat pipe includes an insulating hollow body located inside an outer conductor. The insulating hollow body insulates a portion of the heat pipe on an outer conductor side and a portion of the heat pipe on an inner conductor side from each other. The heat pipe has a plurality of sections each connecting a corresponding one of a plurality of connection conductors to the insulating hollow body. The heat pipe further includes a communication path connecting portions of the heat pipe to each other to cause the plurality of sections to be in communication with each other. Each of the portions is connected to a corresponding one of the plurality of connection conductors.

Abstract: A cooling assembly according to various aspects of the present disclosure includes a housing, an electronic component, a dielectric coolant, and a cover. The housing includes an interior compartment having a basin region in which the electronic component and the coolant are disposed. The coolant undergoes phase change between a liquid state and a gas state. The coolant is in direct contact with the electronic component in the liquid state. The cover component extends transversely through the interior compartment and is coupled to the body. The cover component is disposed in a direction with respect to the basin region. The cover component at least partially defines a port in fluid communication with the basin region. The cover component is configured to permit flow therethrough of the dielectric coolant in the gas state in at least the direction.

Abstract: A refrigeration cycle apparatus includes a refrigerant circuit through which refrigerant circulates, a control box in which equipment for controlling the refrigeration cycle apparatus is accommodated, and a refrigerator for cooling a heat emitting body exposed from an opening of the control box. The heat emitting body is the equipment accommodated in the control box. The refrigerator includes a cooling body in contact with the heat emitting body, and a refrigerant pipe through which the refrigerant circulating through the refrigerant circuit passes to cool the cooling body. The refrigerant pipe is in contact with the cooling body. The pipe contact surface is different from the heating-body contact surface. The cooling body has a recessed portion at which the cooling body and the heat emitting body are not in contact with each other. The recessed portion is formed in the heating-body contact surface and spaced from the control box.

Abstract: A display apparatus comprises a display panel; a heat sink plate coupled to a bottom surface of the display panel and having a coupling member that extends in a semicircular shape at one end and protrudes in a direction toward the bottom surface of the display panel; and a guide panel having a connection member at one end that is coupled to the coupling member in a rotation or sliding manner and connected to a bottom surface a printed circuit board (PCB) connected to the display panel, wherein the printed circuit board is detachably coupled to a bottom surface of the heat sink plate.

Abstract: A heat sink 41 is provided on a lower edge side, for example, of a display panel 21 with a heat radiation surface being on a display surface side of the display panel 21. A heat source, such as a light source 22, which generates heat owing to display operation using the display panel 21 is mounted on a mounting face opposite to the heat radiation surface. A cover 31 that covers the heat sink 41 is provided on the display surface side of the display panel 21. Air holes 311 and 312 are formed on a top face 31t and a bottom face 31b, respectively, of the cover 31. Air taken in through the air holes 312 on the bottom face 31b of the cover 31 cools the heat sink 41, and the air heated by the heat of the heat sink 41 is dissipated outside through the air holes 311 on the top face 31t. Heat generated inside the display device is efficiently dissipated with a small ventilation resistance without generation of noise.

Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: In the invention described, magnetic field characteristics of randomly placed magnetized particles are exploited by using the magnetic field fluctuations produced by the particles as measured by a sensor. The magnetized particles generate a complex magnetic field near the surface of an integrated circuit chip on a bank card or identification card that can be used as a “fingerprint.” The positioning and orientation of the magnetized particles is an uncontrolled process, and thus the interaction between the sensor and the particles is complex. The randomness of the magnetic field magnitude and direction near the surface of the material containing the magnetic particles can be used to obtain a unique identifier for an item such as an integrated circuit chip on a bank card or identification card carrying the PUF.

Abstract: A cartridge for an e-vaping device includes a reservoir configured to hold a pre-vapor formulation and a channel structure that includes a channel surface with one or more open-microchannels. An open-microchannel in the channel structure may be in fluid communication with the reservoir and may transport pre-vapor formulation from the reservoir to a heating element based on capillary action of the pre-vapor formulation through the open-microchannels. The heating element may vaporize the pre-vapor formulation drawn through one or more open-microchannels. The cartridge may be independent of fibrous dispensing interfaces, including one or more wicks. Fabrication of such a cartridge may be simplified, faster, cheaper, some combination thereof, or the like relative to fabrication of a cartridge that includes a fibrous or soft dispensing interface to draw pre-vapor formulation from a reservoir to a heating element.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite cable to a lid housing portion that rejects the thermal energy to the external environment. The graphite cable has plural graphite elements vertically stacked with adhesive and exposed at each end as plural coupling points that each independently couple to a thermal device in the main and lid housing portions, such as a heat sink or vapor chamber.

Abstract: An improved heat engine includes at least one heat pipe containing a working fluid flowing in a thermal cycle between vapor phase at an evaporator end and liquid phase at a condenser end. The heat pipe may have an improved capillary structure configuration with a continuous or stepwise gradient in pore size along the capillary flow direction. The heat engine may have an improved generator assembly configuration that includes an expander (e.g. rotary/turbine or reciprocating piston machine) and generator along with magnetic bearings, magnetic couplings, and/or magnetic gearing. The expander-generator may be wholly or partially sealed within the heat pipe. A heat engine system (e.g. individual heat engine or array of heat engines in series and/or in parallel) for converting thermal energy to useful work (including heat engines operating from a common heat source) is also disclosed. The system can be installed in a vehicle or facility to generate electricity.

Abstract: The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.

Abstract: The inverter-integrated electrical compressor is provided with an inverter-accommodating case (2) partitioned by a partitioning wall (3) and a low-pressure refrigerant channel inside a housing, an inverter device (1) being incorporated within the inverter-accommodating case (2); wherein the inverter device (1) is provided with a plurality of high-voltage electric components (5, 6) constituting a filter circuit, a plurality of semiconductor switching elements (7), and a control substrate (8) on which an inverter circuit and a control circuit are mounted; and the plurality of semiconductor switching elements (7) are installed in a fixed manner on the side surfaces (17) of a heat-radiating block (16) provided perpendicularly relative to the partitioning wall (3).

Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.

Abstract: A circuit arrangement including a plurality of amplifier stages to amplify an electrical RF signal for a magnetic resonance tomography device is provided. The plurality of amplifier stages is arranged on at least one circuit board. A circuit board of the at least one circuit board surrounds a cooling pipe.

Abstract: An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.