With Cooling Or Fluid Feeding, Circulating Or Distributing Patents (Class 174/15.1)
  • Patent number: 10317485
    Abstract: An MRI system for imaging a subject is provided. The MRI system includes a magnet assembly that includes a gradient coil having a hollow conducting wire. The hollow conducting wire includes a body defining a passageway, and one or more conductors disposed within the body around the passageway.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: June 11, 2019
    Assignee: General Electric Company
    Inventor: Derek Allan Seeber
  • Patent number: 10279653
    Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: May 7, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yusuke Takagi, Takahiro Shimura, Takashi Kuboki, Akira Matsushita
  • Patent number: 10284053
    Abstract: An electric motor includes a stator having an outer peripheral surface including a plurality of projections and a housing having an inner peripheral surface including a plurality of recesses and holding the stator in a state of respective fits of the projections with the recesses. The housing is internally formed with a cooling channel, which includes a plurality of main channels each formed in an inter-recess region defined between circumferentially adjacent recesses and a connection channel axially shifted from a recess and extending across the recess to connect main channels adjacent across the recess. The electric motor is capable of effectively cooling a stator without upsizing.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: May 7, 2019
    Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Seiji Saiki, Hideki Yoshihara
  • Patent number: 10180200
    Abstract: A method of installing an electrically-heatable subsea flowline includes launching the flowline with at least one electric power cable attached in piggybacked relation. After landing the flowline with the piggybacked cable on the seabed, a free end portion of the, or each, cable having a length greater than the water depth is released from the flowline. This allows a free end of the, or each, cable to be recovered to the surface to be spliced to one or more power supply conductors. After lowering the, or each, cable and the, or each, connected conductor beneath the surface, the free end portion of at least one cable is reattached to the flowline on the seabed in piggybacked relation. To perform the method, a subsea flowline assembly includes subsea-releasable fastenings spaced along the cable and the flowline to attach at least an end portion of the cable releasably to the flowline.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: January 15, 2019
    Assignee: Subsea 7 Norway AS
    Inventor: Eskil Hoyvik
  • Patent number: 10143113
    Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: November 27, 2018
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, James Don Curlee, Richard Steven Mills
  • Patent number: 10051734
    Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 14, 2018
    Assignee: IBIDEN CO., LTD.
    Inventor: Katsutoshi Kitagawa
  • Patent number: 10003153
    Abstract: A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: June 19, 2018
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih-Ming Lai, Yung-Shun Kao, Chung-Wei Chiang
  • Patent number: 9950628
    Abstract: A power-electronics system includes a plurality of power modules each having a power stage and defining a side pocket. The power stages are stacked in an array such that the side pockets are interleaved with the power stages. A dummy module defines a first coolant pocket and is disposed within the array such that the first coolant pocket cooperates with one of the side pockets to define a coolant chamber.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: April 24, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner, Edward Chan-Jiun Jih
  • Patent number: 9872415
    Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: January 16, 2018
    Assignee: Dell Products, L.P.
    Inventors: David L. Moss, Edmond I. Bailey
  • Patent number: 9823140
    Abstract: A sensor abnormality determining apparatus is applied to an inverter that includes: a power element; a cooling water circulation path for cooling the power element; a temperature sensor that detects a temperature of the power element; and a water temperature sensor that detects a temperature of the cooling water circulating in the cooling water circulation path. The sensor abnormality determining apparatus includes: an abnormality determining section and a determination temperature setting section. The abnormality determining section determines the temperature sensor is abnormal when a temperature difference between the detected power element temperature and the detected water temperature is larger than a prescribed determination temperature difference.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: November 21, 2017
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Hatsuki Morinaga
  • Patent number: 9691536
    Abstract: A static apparatus is provided in which a partial discharge, if occurred in a winding end portion, is unlikely to lead to insulation breakdown. The windings and core of a static apparatus are housed in a tank filled with coolant. The winding is fixed by upper and lower parts supporting winding. A continuous coolant duct is formed in a section embracing the winding and the upper and lower parts supporting winding. A coolant duct from the wiring, extending through the upper or lower parts supporting winding and connected with the coolant space is configured in a structure in which toroidal ducts in multiple tiers are connected in a vertical direction of the winding. Connecting holes of one toroidal duct and of its next toroidal duct are staggered with respect to each other and spaced at intervals which are longer than the width of the toroidal ducts.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: June 27, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Naoya Miyamoto, Akira Yamagishi, Hiroshi Miyao
  • Patent number: 9591742
    Abstract: There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: March 7, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kei Murayama, Mitsutoshi Higashi, Koji Nagai, Hideaki Sakaguchi
  • Patent number: 9437359
    Abstract: A reinforcement-free tank for an electromagnetic apparatus, as may be immersed in a fluid is provided. The tank may include a pair of mutually-opposite side walls. Each side wall may have at least one curved segment defining a vertically-curving profile between a top edge and a bottom edge of a side wall. A pair of mutually-opposite end walls. Each end wall may have a substantially vertically-extending semi-cylindrical shape defining a vertically-straight profile between a top edge and a bottom edge of an end wall. A plurality of vertically-extending joining members. Each joining member may be configured to provide a transition between the vertically-curving profile of a side wall and the vertically-straight profile of a corresponding end wall. The walls can withstand vacuum and overpressure conditions which can develop in the tank, without a reinforcing member connected to the walls.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: September 6, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: William Fernando Quintero Restrepo
  • Patent number: 9433092
    Abstract: A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the layout area; disposing a welding material area on the padstack to partially cover the padstack and be located at one end of the padstack; disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack; and forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area. The layout method for a printed circuit board and the printed circuit board may avoid that the outlet of the wiring is formed through the side of the welding material area to leave a blank area on the padstack.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: August 30, 2016
    Assignee: EverDisplay Optronics (Shanghai) Limited
    Inventor: Dongfang Feng
  • Patent number: 9433134
    Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: August 30, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Tokihito Suwa
  • Patent number: 9240750
    Abstract: Power conversion sub-blocks are combined to be configured as a power conversion block. The power conversion sub-blocks include power conversion modules including cooler base sections on which semiconductor elements are mounted and cooler fin sections provided on the rear surface side of semiconductor element mounting surfaces in the cooler base sections and cooler attachment members to which cooler fin sections are attached back to back, the cooler attachment members being configured to be capable of separating an opened section where the cooler fin sections are present and external air circulates and a closed section where the semiconductor elements are present and circulating cooling air to the cooler fin sections.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: January 19, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hidetoshi Kitanaka
  • Patent number: 9196431
    Abstract: An encapsulated switchgear that includes a housing defining, an insulating space, and an electrical active part arranged in the insulating space, the insulating space with an insulation medium. The switchgear is characterized in that the insulation medium with a dielectric compound having a boiling point of above ?5° C.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: November 24, 2015
    Assignee: ABB Technology AG
    Inventors: Maik Hyrenbach, Ole Granhaug, Max-Steffen Claessens, Per Skarby
  • Patent number: 9107293
    Abstract: Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: August 11, 2015
    Assignee: Raytheon Company
    Inventors: Bruce C. Fitz-Patrick, Gary A. Clayton, Byron E. Short, Jr.
  • Patent number: 9036351
    Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: May 19, 2015
    Assignee: Xyber Technologies, LLC
    Inventor: Mario Facusse
  • Patent number: 9036344
    Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: May 19, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jing Chen, Chien-Lung Chen
  • Patent number: 9036350
    Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: May 19, 2015
    Assignee: CONTROL TECHNIQUES LTD
    Inventors: Roger Neil Jackson, Rhys Marc Owen, Gareth Huw Jones
  • Patent number: 9030822
    Abstract: A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: May 12, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Yu Qin, Reshma Rathod, Richard J. Hampo
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8982555
    Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: March 17, 2015
    Assignee: Intel Corporation
    Inventors: Yoshifumi Nishi, Mark MacDonald
  • Patent number: 8953335
    Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 10, 2015
    Assignee: Keihin Corporation
    Inventors: Hidefumi Abe, Toshiro Mayumi, Seiichiro Abe
  • Patent number: 8953325
    Abstract: An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 10, 2015
    Assignee: SerComm Corporation
    Inventors: Yi-Fei Yu, Yuan-Heng Huang
  • Patent number: 8922992
    Abstract: An electrical equipment chassis includes a frame open to a first side and an opposite second side and a power board located near a mid-plane of the chassis coupling power supply modules to first networking modules and a second networking module. A first region open to the first side can receive first power supply modules. A second region open to the first side is adjacent to the first region and can receive the first networking modules and the second networking module oriented with a first orientation. A third region open to the second side can receive fan trays with fans and third networking modules. The third networking modules are oriented orthogonal to the first orientation. The power board at least partially separates the first and third regions and only partially separates the second and third regions. The chassis permits air flow from the first side to the second side.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: December 30, 2014
    Assignee: Dell Products L.P.
    Inventors: Haresh K. Shah, Saikrishna M. Kotha
  • Patent number: 8897010
    Abstract: A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: November 25, 2014
    Assignee: General Electric Company
    Inventor: Mark Eugene Shepard
  • Patent number: 8885345
    Abstract: An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 11, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shun-Siang Tu
  • Patent number: 8872022
    Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 28, 2014
    Assignee: Elwha LLC
    Inventors: Roderick A. Hyde, Jordin T. Kare, Nathan P. Myhrvold, David B. Tuckerman, Lowell L. Wood, Jr.
  • Patent number: 8867210
    Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: October 21, 2014
    Assignee: Deere & Company
    Inventors: Gregory K. Harmelink, Christopher J. Schmit
  • Patent number: 8861202
    Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: October 14, 2014
    Assignee: GM Global Technology Operations LLC
    Inventor: Mathew L. Nassoiy
  • Patent number: 8848347
    Abstract: An assembly may include at least one duct and at least one distribution box, wherein the distribution box is mounted on the duct in fluid-tight engagement therewith for enclosing a distribution chamber therewith. Also, a method of mounting a distribution box to a duct, at a distribution point that is spaced-apart from duct ends, may include positioning a distribution point duct section in the distribution box, and hermetically sealing a distribution chamber, defined within the distribution box, from an environment of the distribution box.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: September 30, 2014
    Assignee: Draka Comteq B.V.
    Inventors: Mijndert Doorn, Jianming Zeng, Kees Van Trigt
  • Patent number: 8847069
    Abstract: A high voltage electric cable including a cable core, a cooling pipe for cooling the cable core including a polymer and adapted for carrying a cooling fluid, and a cable covering enclosing the cable core and the cooling pipe. The electric cable further includes a heat conducting element surrounding the cable core, and being arranged in thermal contact with the cable core and the cooling pipe.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: September 30, 2014
    Assignee: ABB Technology AG
    Inventor: Robert Emme
  • Patent number: 8824144
    Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 2, 2014
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Keiji Toh, Shogo Mori, Hideyasu Obara, Nobuhiro Wakabayashi, Shintaro Nakagawa, Shinobu Yamauchi
  • Patent number: 8817472
    Abstract: An apparatus for cooling a semiconductor element is provided. The apparatus can include an electron emitter configured to emit electrons such that at least some of the emitted electrons become attached to air particulates and an air accelerator configured to generate an electric field that accelerates the air particulates toward the air accelerator to create an air flow over at least a portion of the semiconductor element. The air flow carries heat away from the at least a portion of the semiconductor element.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: August 26, 2014
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Milind S. Bhagavat
  • Patent number: 8817471
    Abstract: A system for suppressing an overheat condition in an electrical housing includes an electrical housing that defines a housing area including one or more electrical devices; a suppression fluid container containing a suppression fluid; a valve configured to regulate the flow of the suppression fluid from the suppression fluid container to the housing area; at least one sensor configured to sense at least one of temperature and smoke; and a controller communicatively connected to the at least one sensor and the valve, the controller configured to receive signals from the at least one sensor indicating an overheat condition in the housing area; and in response to the received signals indicating the overheat condition in the housing area, control the valve to allow the suppression fluid to flow from the suppression fluid container into the housing area, in order to suppress the overheat condition in the housing area.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: August 26, 2014
    Assignee: Cooper Technologies Company
    Inventor: Kyle Steven Barna
  • Patent number: 8806749
    Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: August 19, 2014
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Madhusudan K. Iyengar, Robert E. Simons, Prabjit Singh
  • Patent number: 8807444
    Abstract: An air conditioning equipment having an in-room unit connected to one end of the refrigerant pipes and an out-room unit connected to the other end of the refrigerant pipes. The air conditioning equipment includes signal coupling portions which are respectively disposed at both end parts of the refrigerant pipes. Each of the signal coupling portions couples an alternating current (AC) control signal to the refrigerant pipes and exhibits a predetermined impedance with respect to an AC electric signal. The configuration of the air conditioning equipment brings forth the advantages that the electrical insulation devices used in the prior art are dispensed with, and the signal transmissions between the in-room unit and the out-room unit can be performed by a simple apparatus configuration.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: August 19, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toshiyasu Higuma, Noriyuki Kushiro, Yoshiaki Koizumi
  • Patent number: 8809679
    Abstract: A heat sink and method for gaseous cooling of superconducting power devices. Heat sink is formed of a solid material of high thermal conductivity and attached to the area needed to be cooled. Two channels are connected to the heat sink to allow an inlet and an outlet for cryogenic gaseous coolant. Inside the hollow heat sink are fins to increase metal surface in contact with the coolant. The coolant enters through the inlet tube, passes through the finned area inside the heat sink and exits through the outlet tube.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: August 19, 2014
    Assignee: The Florida State University Research Foundation, Inc.
    Inventors: Danny G. Crook, Lukas Graber, Sastry Pamidi
  • Patent number: 8807204
    Abstract: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 19, 2014
    Assignee: International Business Machines Corporation
    Inventors: Michael S. June, Chunjian Ni, Dana S. Royer, Mark E. Steinke
  • Patent number: 8780557
    Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: July 15, 2014
    Assignee: Deere & Company
    Inventors: Jeffrey Scott Duppong, David Michael Loken, Erich Joel Drees
  • Patent number: 8780556
    Abstract: A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: July 15, 2014
    Assignee: Lochheed Martin Corporation
    Inventor: John Ditri
  • Patent number: 8760855
    Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jeremy Charles Howes, David Levett
  • Patent number: 8743541
    Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: June 3, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiko Hata, Yasuyuki Horii
  • Publication number: 20140144665
    Abstract: A line arrangement for transmitting high-power electrical energy and a pressurized fluid, comprising a hose having a hose interior, an electrical conductor, at least one hose-terminating element having a hose-terminating element interior and at least one electrically conductive conductor-terminating element, characterized in that the electrical conductor is at least partially accommodated in the hose interior, that a fluid channel is formed in the hose interior, that the conductor-terminating element is arranged on the electrical conductor at a free end and is fastened in the hose-terminating element interior at a distance from the hose-terminating element, and that insulation means, which circumferentially enclose the electrical conductor and the conductor-terminating element, are provided at least in the transition region between the electrical conductor and the conductor-terminating element.
    Type: Application
    Filed: August 31, 2011
    Publication date: May 29, 2014
    Inventor: Gerhard Schlögl
  • Patent number: 8737071
    Abstract: A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: May 27, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mingliang Hao, Jun Zhao
  • Patent number: 8733119
    Abstract: An air conditioning equipment having an in-room unit connected to one end of the refrigerant pipes and an out-room unit connected to the other end of the refrigerant pipes. The air conditioning equipment includes signal coupling portions which are respectively disposed at both end parts of the refrigerant pipes. Each of the signal coupling portions couples an alternating current (AC) control signal to the refrigerant pipes and exhibits a predetermined impedance with respect to an AC electric signal. The configuration of the air conditioning equipment brings forth the advantages that the electrical insulation devices used in the prior art are dispensed with, and the signal transmissions between the in-room unit and the out-room unit can be performed by a simple apparatus configuration.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: May 27, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toshiyasu Higuma, Noriyuki Kushiro, Yoshiaki Koizumi
  • Patent number: 8730672
    Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.
    Type: Grant
    Filed: November 6, 2011
    Date of Patent: May 20, 2014
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Frank Ebersberger, Peter Beckedahl, Hartmut Kulas