Abstract: Systems and methods for cooling a data center are disclosed. In at least one embodiment, a radiator is associated with one or more racks of a datacenter and has a first portion to function as an air-to-liquid heat exchanger having a primary cooling loop to absorb first heat away from the one or more racks and has a second portion to function as a liquid-to-liquid heat exchanger to enable at least one secondary cooling loop to exchange second heat with the primary cooling loop.

Abstract: An operation panel for a machine tool includes: a blower device that includes a plurality of blade sections and a center axis section, the plurality of blade sections rotating around a center axis, the center axis section having a circular columnar shape around the center axis and being disposed on a radial-directional inside about the center axis relative to the plurality of blade sections the blower device sucking air in an axial direction about the center axis and blowing out the air in the axial direction about the center axis an opposed wall that is disposed on an air suction side of the blower device and that is disposed so as to face the blower device in the axial direction about the center axis; and an intermediate member that is provided between the opposed wall and the center axis section in the axial direction about the center axis.

Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Abstract: A circuit for cooling is disclosed. The circuit uses a pulse generator in combination with a conductor. A cooling effect of the circuit on the conductor can be used and can be used in conjunction with a Carnot or Stirling engine. A resultant energy applied to a load is larger than the energy supplied by the pulse generator due to the absorption of external energy by the conductor.

Abstract: A plug-in pump installation structure of a cooling distribution unit is disclosed. A pump seat is disposed in a machine case and has a fixed joint. A plug-in pump has a pump main body and a moveable joint. The plug-in pump is plugged or removed relative to the pump seat through the moveable joint and the fixed joint being connected or released. One distal end of each rotary arm of a handgrip has a latching hook. The rotary arms are pivotally connected at opposite sides of the pump main body. When the handgrip is folded on the machine case, the latching hook abuts against a protrusion disposed on a block piece of the machine case, when the handgrip is rotated to be away from the machine case, the latching hooks of the rotary arm is released from the abutted protrusion.

Abstract: Embodiments included herein are directed towards an apparatus and method for manufacturing an electrical cooling apparatus. The method may include forming a first entirely solid metal plate to generate an enclosure. The method may also include affixing a bottom metal plate to the first entirely solid metal plate, the bottom metal plate may define a channel system. The bottom metal plate may include one or more inlet openings into the channel system, where the one or more inlet openings are configured to allow coolant to enter or exit the channel system.

Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Abstract: A temperature-dependent switch with a housing, which comprises a cover part having an upper side and a lower part having a raised peripheral wall, the upper section of which is bent onto the upper side of the cover part and thereby holds the cover part on the lower part, wherein two contact surfaces are provided outside at the housing and a switching mechanism is arranged in the housing, wherein the switching mechanism is configured to switch, depending on its temperature, between a closed state, in which the switching mechanism establishes an electrically conductive connection between the two contact surfaces, and an open state, in which the switching mechanism interrupts the electrically conductive connection between the two contact surfaces. A sealing ring is arranged on the upper side of the cover part, which sealing ring is in sealing contact with the bent upper section of the wall.

Abstract: A system including a heat exchanger section for re-cooling a heated liquid coolant, a spray cooling section for cooling an electronic equipment; mean for separating said heat exchanger or pump section from said spray cooling section; means for transferring heat generated by the electronic equipment to at least liquid coolant; means for spraying the liquid coolant along the heat transferring means to transfer heat from the electronic equipment to the liquid coolant; wherein the heat transferring means is in an essentially vertical position so that the liquid coolant generally flows downward and is drained by gravity; means for collecting the liquid coolant; means for suctioning the collected liquid coolant; means for pumping the dielectric liquid coolant from the sprayed liquid coolant collecting means and through the liquid coolant spraying means; and means for housing the system.

Abstract: Inverters for direct current (DC) to alternating current (AC) conversion may comprise switching elements which produce harmonic overtones. Inductive elements may be added into the inverters, such as to attenuate effects of harmonic overtones. Methods and systems for a casing suitable for reduced potting over its inductive elements is described. One or more heat dispersing elements may be disposed in the casing. Related systems and methods are also described.

Abstract: A circuit for generating electrical energy is disclosed. The circuit uses a pulse generator in combination with an etalon. The etalon can be a tube can have material therein, such as solid material or fluid passing therethrough. A thyristor or other negative resistance can be in series with the etalon to increase a change of voltage with respect to time. A resultant energy applied to a load is larger than the energy supplied by the pulse generator due to the absorption of external energy by the etalon.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor chamber for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.

Abstract: A propulsion system for an aircraft can include an electric power source and an electric propulsion assembly having an electric motor and a propulsor. The propulsor can be powered by the electric motor. An electric power bus can electrically connect the electric power source to the electric propulsion assembly. The electric power source can be configured to provide electrical power to the electric power bus. An inverter converter controller can be positioned along the electric power bus and can be electrically connected to the electric power source at a location downstream of the electric power source and upstream of the electric propulsion assembly.

Abstract: A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

Abstract: A general purpose enclosure is provided. A general purpose enclosure for housing an internal unit and providing complete protection against an ingress of dust and water, comprising a first housing and a second housing. A plurality of cooling fins and one or more pressure ports along an exterior surface of the first housing and the second housing. One or more pressure ports comprising a pneumatic valve, pressure sensor cap and a vent membrane such that pressure venting, and pressure testing may be performed by the one or more pressure ports. A method of assembling a general purpose enclosure to an internal unit, comprising applying the first housing and the second housing to the internal unit such that the first housing and the second housing encompass the internal unit and fastening the first housing to the second house.

Abstract: An integrated water-cooling pump includes a main body, which includes a water block, a bottom plate, a water inlet, a water outlet, a cavity, a first inlet pipe, a fixed plate, a water nozzle, and a first sealing ring. The bottom plate is welded to a bottom of the water block. The bottom plate has an internal hollow structure. A bottom of an inner wall of the bottom plate is fixedly connected with heat sinks. An upper surface of the bottom plate is symmetrically provided with two water inlets. A middle of the upper surface of the bottom plate is provided with the water outlet. The water block is provided with the cavity inside near the bottom plate. The bottom plate is communicated with the cavity through two water inlets. The upper surface of the bottom plate is fixedly connected with a bottom of the first inlet pipe.

Abstract: A thermal management system includes an open-circuit refrigeration system having an open-circuit refrigerant fluid flow path. The open-circuit refrigeration system includes a receiver configured to store a refrigerant fluid, an evaporator configured to receive the refrigerant fluid at an evaporator inlet and to extract heat from a heat load that contacts the evaporator, and provide refrigerant vapor at an evaporator outlet. The open-circuit refrigeration system also includes a vapor pump device having a vapor pump inlet that receives the refrigerant vapor and having a vapor pump outlet that outputs compressed refrigerant vapor to an exhaust line coupled to the vapor pump outlet, with the receiver, the evaporator, the vapor pump device, and the exhaust line connected in the open-circuit refrigerant fluid flow path.

Abstract: A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.

Abstract: In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liquid and a second set of fluid connectors to distribute coolant to a cooling device and a cooling device coupled to the coolant distribution device. The cooling device includes an elongated chassis, a cooling plate integrated, contained, and/or prefabricated within the elongated chassis of the cooling device, and a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate. The cooling device further includes fluid connectors to receive the cooling liquid from a coolant distribution device and a blocking channel disposed between the cooling plate and the fluid connectors, the blocking channel to mate with a blocking plate of the coolant distribution device.

Abstract: The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Abstract: There is disclosed a system and method for transferring waste heat from integrated circuits. In an embodiment, the system comprises: a self-contained enclosure having integrated circuits therein, the self-contained enclosure further including: a first fluid circuit configured for removing waste heat from the integrated circuits; an inlet for connection from an external water tank and an outlet for connection to the external water tank, that when connected with the external water tank forms a second fluid circuit; a heat exchanger operatively connected to the first fluid circuit and the second fluid circuit, and configured to transfer thermal energy therebetween; and a control for regulating a temperature gradient and a flow rate in each of the first and second fluid circuits, such that both a desired integrated circuit operating temperature and a desired water tank temperature is achieved.

Abstract: A power electronics unit for an electric motor of a motor vehicle drive, having a plate-like cooling element, at least one semiconductor module and a module holder which consists of plastic and secures the at least one semiconductor module relative to the cooling element. The module holder is fixed to the cooling element via an interlocking snap connection.

Abstract: A power inductor includes a magnetic core, a conductor coiled around the core; an end cover secured to the core, a tube configured to convey fluid, and a fluid flow guide supported on the end cover. The flow guide has a receiving portion disposed under an end of the tube to receive the fluid and a distribution portion in fluid communication with the receiving portion. The distribution portion is configured to supply the fluid onto the conductor and the core and includes a plurality of guide walls.

Abstract: A two-pass heat exchanger with calibrated bypass is disclosed for cooling heat-generating substrates and/or for heating a heat transfer fluid. The heat exchanger has first and second outer plate walls and an intermediate plate wall located between and spaced from the outer plate walls in the thickness dimension of the heat exchanger, and with inlet and outlet ports at the same end. An input flow passage is defined between the first outer plate wall and the intermediate plate wall, and a return flow passage is defined between the second outer plate wall and the intermediate plate wall. The first and second fluid flow passages are in a U-flow, stacked arrangement. At least one bypass opening extends through the intermediate plate wall between the input and return flow passages, and configured to permit a portion of the heat transfer fluid to bypass portions of the input and return flow passages.

Abstract: An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.

Abstract: A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

Abstract: A cold plate assembly for cooling an electronic device includes a manifold, a comb insert, and a first vaned plate. The manifold is formed to define a cavity therein. The comb insert is located in the cavity includes channels defined by walls for receiving a fluid from passages in the manifold and transferring heat to the fluid. The first vaned plate includes a first panel and first channel vanes extending away from the first panel. The first vaned plate is removably coupled with the comb insert such that first channel vanes are located within the channels to guide the fluid. Each first channel vane extends from a wall toward a neighboring wall at an angle to direct the fluid to impinge upon the neighboring wall with increased velocity so as to increase the heat transfer between the neighboring wall and the fluid.

Abstract: In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.

Abstract: A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.

Abstract: An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.

Abstract: A circuit for generating electrical energy is disclosed. The circuit uses a pulse generator in combination with a conductor. Waste heat can be converted to usable energy due to a cooling effect of the circuit on the conductor. A resultant energy applied to a load is larger than the energy supplied by the pulse generator due to the absorption of external energy by the conductor.

Abstract: In one embodiment, an apparatus includes a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system, and a hinge member for connecting the fan tray to a front panel of the modular electronic system with the fans positioned in front of the modules. The fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules.

Abstract: A circuit for cooling is disclosed. The circuit uses a pulse generator in combination with a conductor. A cooling effect of the circuit on the conductor can be used and can be used in conjunction with a Carnot or Stirling engine. A resultant energy applied to a load is larger than the energy supplied by the pulse generator due to the absorption of external energy by the conductor.

Abstract: A cooler includes a base on the upper surface of which semiconductor elements are mounted; a housing which is superimposed on the rear surface side of the base and between which and the base a refrigerant flow path is formed; screws which are disposed in the outer peripheral portion of an overlap region between the base and the housing and which fasten and fix the base to the housing; O-rings which seal the outer peripheral portion of the refrigerant flow path; and joining members which are disposed in a joining surface portion of the housing, which is inside the outer peripheral portion of the refrigerant flow path and makes contact with the base, and which bite into the base and housing in an unpenetrated state. The joining strength between the housing and the base is reinforced by the joining members whose joint interfaces are not exposed to the outside.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: The invention relates to a cooler or cooler body which in particular is adapted for cooling electronic structural units or assemblies.

Abstract: The present disclosure provides a micro water pump, including: a pump body having a cavity, an inlet communicating with the cavity, and an outlet communicating with the cavity; a drive mechanism installed on the pump body for driving liquid from the inlet into the cavity and discharging from the outlet. The pump body includes a base, an upper cover engaging with the base for forming the cavity, and a barrier member. The upper cover includes a fixed wall located in the cavity. The barrier member protrudes from the fixed wall for preventing the drive mechanism from colliding and rubbing with the fixed wall during rotation. By virtue of the configuration, improved heat-dissipation performance is performed.

Abstract: A potting box for assembling a transformer comprises an inner wall and an outer wall. The inner wall is sleeved in the outer wall. A bottom plate connected to a bottom portion of the inner wall and a bottom portion of the outer wall to form a potting space for accommodating a first winding and a second winding. An inner side of the outer wall comprises a first support portion for supporting the first winding and an outer side of the inner wall comprises a second support portion for supporting the second winding. An iron core of the transformer penetrates through an inner side of the inner wall.

Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.

Abstract: Provided is a brace apparatus for a transformer tank and a method for determining the length thereof. The brace apparatus is mounted on a transformer tank so as to reinforce the transformer tank. The brace apparatus has a brace main body forming the exterior thereof, and in order to block the occurrence of resonance in an inner space of the brace main body, the length of the brace main body is set to be at a value at which resonance does not occur in the inner space, or a partition plate is provided to the brace main body so as to block the occurrence of resonance. In present invention, the length of the brace apparatus may be set by means of a simple configuration, thereby enabling the prevention of noise from occurring due to resonance.

Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

Abstract: A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

Abstract: Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Abstract: Provided is a washing machine having a printed circuit board (PCB) assembly. The washing machine includes a cabinet forming an external appearance thereof, a top cover coupled to an upper side of the cabinet, and a PCB assembly provided in the cabinet and configured to control the washing machine, wherein the PCB assemble includes a frame in which a PCB is accommodated and a cover covering the PCB, and the cover includes a heat dissipation path configured to dissipate heat of the PCB and a water inflow preventer configured to prevent water from being introduced into the heat dissipation path.

Abstract: A general purpose enclosure is provided. A general purpose enclosure for housing an internal unit and providing complete protection against an ingress of dust and water, comprising a first housing and a second housing. A plurality of cooling fins and one or more pressure ports along an exterior surface of the first housing and the second housing. One or more pressure ports comprising a pneumatic valve, pressure sensor cap and a vent membrane such that pressure venting, and pressure testing may be performed by the one or more pressure ports. A method of assembling a general purpose enclosure to an internal unit, comprising applying the first housing and the second housing to the internal unit such that the first housing and the second housing encompass the internal unit and fastening the first housing to the second house.

Abstract: Aircraft turbine engines are controlled by complex electronic devices such as FADEC and PSS units. These devices can be adversely impacted by the engine environment including the condensing of evaporated water. Aspects of the present disclosure include unique heat exchangers to control the temperature of these electronic devices to assure their proper operation.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An alternating current neutral and ground inductive electromagnetic rectification unit includes a first and second reactor connectable to a neutral and a ground of an existing circuit respectively. The first redactor includes a first pair of inductive coils, each coil disposed interior to a nonconductive tube. The second redactor includes a second pair of inductive coils, each coil also disposed interior to a nonconductive tube. The first pair of inductive coils are connected together in parallel, and also connected at opposing extremes terminating the neutral. The second pair of inductive coils are also connected in parallel, at opposing extremes of the ground. The first and second redactors are surrounded by an insulating matrix set within the housing. Once connected to the ground and neutral, the first and second redactors establish a magnetic field that redacts harmonic interference emerging on the neutral thereby increasing efficiency and power factor across the circuit.