With Cooling Or Fluid Feeding, Circulating Or Distributing Patents (Class 174/15.1)
  • Patent number: 11116113
    Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 7, 2021
    Assignee: Google LLC
    Inventors: Jerry Chiu, Abolfazl Sadeghpour, Gregory P. Imwalle
  • Patent number: 11071232
    Abstract: A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: July 20, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Kento Ohga, Keita Hirai
  • Patent number: 11031175
    Abstract: A transformer with integrated cooling is disclosed. The transformer comprises a primary winding and a secondary winding, and a coolant line partly or completely embedded in at least one of the primary or secondary windings. The coolant line is supplied with coolant from a supply device. The coolant line has a plurality of exit holes that are arranged to lead in a direction of at least one of the primary or secondary winding, so as to supply it with coolant.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: June 8, 2021
    Assignee: DEERE & COMPANY
    Inventors: Nicolai Tarasinski, Volker Kegel, Dennis Kremer
  • Patent number: 11032941
    Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 8, 2021
    Assignee: Intel Corporation
    Inventors: Minh Le, Thomas Boyd, Bijoyraj Sahu, Evan Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores, Craig Jahne
  • Patent number: 11006547
    Abstract: A data center immersion cooling system is described. The system comprises: an immersion tank; a heat exchanger to extract heat from heated coolant and transform heated coolant into cooled coolant; a coolant supply line to supply the cooled coolant from the heat exchanger to the immersion tank; and a coolant return line to return the heated coolant from the immersion tank to the heat exchanger, wherein the immersion tank further comprises: a plurality of equipment compartments that accommodate electronic devices; and a heated coolant reservoir disposed around the plurality of equipment compartments, wherein the cooled coolant enters the equipment compartments from the bottom, wherein the heated coolant in the equipment compartments exits the equipment compartments at the top, and is collected into the heated coolant reservoir, and wherein the heated coolant in the heated coolant reservoir is returned to the heat exchanger via the coolant return line.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 11, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10980153
    Abstract: A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: April 13, 2021
    Assignee: GE Aviation Systems LLC
    Inventors: Nader Dariavach, Michel Engelhardt
  • Patent number: 10925188
    Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 16, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Nicholas Keehn, Robert Jason Lankston, Husam Alissa
  • Patent number: 10916818
    Abstract: A battery system can include an evaporation chamber and condenser. One or more battery cells can be immersed in a fluid where the battery cells and the fluid are housed in the evaporation chamber. The condenser can be fluid connected to the evaporation chamber through one or more vapor channels and one or more liquid channels. When the battery cells charge and discharge, heat dissipated by the battery cells is absorbed by the fluid, causing the fluid to change from liquid to vapor. The vapor travels through the one or more vapor channels into the condenser where the vapor changes back to liquid and returns to the evaporation chamber through the one or more liquid channels. The thermal management solution is a self-sensing and self-regulating system.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: February 9, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10905029
    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: January 26, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
  • Patent number: 10861632
    Abstract: An air cooling system, method, apparatus and kit applied to lower transformer operating temperatures, such as governed by a tank or container of oil, allowing transformer components to run more efficiently at a lower temperature level, e.g., down from the hot level operating temperatures typical in stressed conventional devices. By lowering the operational levels to within or below the nominal operational temperature ranges for the equipment, and recovering heat generated during operation, several advantages are obtained.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: December 8, 2020
    Inventor: Marvin W. Ward
  • Patent number: 10852789
    Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: December 1, 2020
    Assignee: Google LLC
    Inventors: Shawn Emory Bender, Jorge Padilla
  • Patent number: 10820446
    Abstract: A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank. A plenum, positioned adjacent the bottom of the tank, is adapted to dispense the dielectric fluid substantially uniformly upwardly through each appliance slot.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: October 27, 2020
    Assignee: Midas Green Technologies, LLC
    Inventors: Christopher L. Boyd, James P. Koen, David Christopher Laguna, Thomas R. Turner, Kenneth D. Swinden, Mario Conti Garcia, John Charles Tribou
  • Patent number: 10761577
    Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 1, 2020
    Assignee: Google LLC
    Inventors: Shawn Emory Bender, Jorge Padilla
  • Patent number: 10757842
    Abstract: An electrical power conversion apparatus is provided which includes a semiconductor module and a plurality of cooling pipes. Each of the cooling pipes has an electrical conductivity and a cooling medium flow path formed therein. Each of the cooling pipes is equipped with a flow path extension forming portion which protrudes above a module body in at least one of height-wise directions and in which a portion of the cooling medium flow path is formed. The flow path extension forming portion overlaps at least either of the power terminals or the control terminals in a stacking direction of the cooling pipes. This enhances the efficiency in decreasing the inductance of the power terminals and/or the control terminals, improves the productivity of the electrical power conversion apparatus, and enables the size of the electrical power conversion apparatus to be reduced.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: August 25, 2020
    Assignee: DENSO CORPORATION
    Inventor: Kazuya Takeuchi
  • Patent number: 10749394
    Abstract: The invention relates to an electrical conductor which is made up substantially of one or even several metal conductors which are sheathed by a graphene layer. Particularly in the case of the electrical conductor transporting an alternating current, the current in the conductor is forced radially outwards and therefore flows in the graphene layer. Since graphene has a substantially better conductivity than the materials customary in this application, such as copper for example, relatively low losses are accordingly produced and substantially higher degrees of efficiency can be achieved. The electrical conductor constructed in this way is used in a stator and/or rotor winding of an electrical machine, so that it has a significantly elevated power-to-weight ratio.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: August 18, 2020
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Mykhaylo Filipenko, Paul Beasley
  • Patent number: 10681842
    Abstract: Devices, systems, methods, and computer-implemented methods to facilitate transmitting microwave signals to one or more cryogenic stages of a cryogenic refrigerator are provided. According to an embodiment, a device can comprise a monolithic signal carrier device comprising a thermal barrier disposed within a ground layer and a signal layer. The device can further comprise a thermal decoupling device coupled at the thermal barrier to the ground layer and the signal layer.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sean Hart, Nicholas Torleiv Bronn, Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10524383
    Abstract: An inverter device includes a heat generator, a cooler, and a cooler-side housing that covers the cooler and includes an opening that exposes a side of the cooler closer to the heat generator, and a circumferential rib that comes into contact with the cooler is provided in a vicinity of a peripheral edge of the opening of the cooler-side housing.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: December 31, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Tomokazu Yoshikawa
  • Patent number: 10497547
    Abstract: A temperature control device includes: a circulating cooling/heating unit cooling and heating a circulating fluid and circulating the circulating fluid relative to a chamber; a controller adjusting a temperature of the circulating fluid to adjust the temperature of the chamber to a temperature setpoint, and a housing for housing the circulating cooling/heating unit and the controller, the housing defining therein a circulation chamber in which the circulating cooling/heating unit is disposed and a control chamber in which the controller is disposed. These chambers are on the same level. A reservoir for storing the circulating fluid, a pump for circulating the circulating fluid, a heat exchanger for cooling the circulating fluid, and a heater for heating the circulating fluid are disposed in the circulation chamber. An inverter for controlling a drive of the pump and an SSR for switching ON/OFF of the heater are disposed in the control chamber.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: December 3, 2019
    Assignee: KELK Ltd.
    Inventor: Daisuke Goto
  • Patent number: 10317485
    Abstract: An MRI system for imaging a subject is provided. The MRI system includes a magnet assembly that includes a gradient coil having a hollow conducting wire. The hollow conducting wire includes a body defining a passageway, and one or more conductors disposed within the body around the passageway.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: June 11, 2019
    Assignee: General Electric Company
    Inventor: Derek Allan Seeber
  • Patent number: 10284053
    Abstract: An electric motor includes a stator having an outer peripheral surface including a plurality of projections and a housing having an inner peripheral surface including a plurality of recesses and holding the stator in a state of respective fits of the projections with the recesses. The housing is internally formed with a cooling channel, which includes a plurality of main channels each formed in an inter-recess region defined between circumferentially adjacent recesses and a connection channel axially shifted from a recess and extending across the recess to connect main channels adjacent across the recess. The electric motor is capable of effectively cooling a stator without upsizing.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: May 7, 2019
    Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Seiji Saiki, Hideki Yoshihara
  • Patent number: 10279653
    Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: May 7, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yusuke Takagi, Takahiro Shimura, Takashi Kuboki, Akira Matsushita
  • Patent number: 10180200
    Abstract: A method of installing an electrically-heatable subsea flowline includes launching the flowline with at least one electric power cable attached in piggybacked relation. After landing the flowline with the piggybacked cable on the seabed, a free end portion of the, or each, cable having a length greater than the water depth is released from the flowline. This allows a free end of the, or each, cable to be recovered to the surface to be spliced to one or more power supply conductors. After lowering the, or each, cable and the, or each, connected conductor beneath the surface, the free end portion of at least one cable is reattached to the flowline on the seabed in piggybacked relation. To perform the method, a subsea flowline assembly includes subsea-releasable fastenings spaced along the cable and the flowline to attach at least an end portion of the cable releasably to the flowline.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: January 15, 2019
    Assignee: Subsea 7 Norway AS
    Inventor: Eskil Hoyvik
  • Patent number: 10143113
    Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: November 27, 2018
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, James Don Curlee, Richard Steven Mills
  • Patent number: 10051734
    Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 14, 2018
    Assignee: IBIDEN CO., LTD.
    Inventor: Katsutoshi Kitagawa
  • Patent number: 10003153
    Abstract: A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: June 19, 2018
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih-Ming Lai, Yung-Shun Kao, Chung-Wei Chiang
  • Patent number: 9950628
    Abstract: A power-electronics system includes a plurality of power modules each having a power stage and defining a side pocket. The power stages are stacked in an array such that the side pockets are interleaved with the power stages. A dummy module defines a first coolant pocket and is disposed within the array such that the first coolant pocket cooperates with one of the side pockets to define a coolant chamber.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: April 24, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner, Edward Chan-Jiun Jih
  • Patent number: 9872415
    Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: January 16, 2018
    Assignee: Dell Products, L.P.
    Inventors: David L. Moss, Edmond I. Bailey
  • Patent number: 9823140
    Abstract: A sensor abnormality determining apparatus is applied to an inverter that includes: a power element; a cooling water circulation path for cooling the power element; a temperature sensor that detects a temperature of the power element; and a water temperature sensor that detects a temperature of the cooling water circulating in the cooling water circulation path. The sensor abnormality determining apparatus includes: an abnormality determining section and a determination temperature setting section. The abnormality determining section determines the temperature sensor is abnormal when a temperature difference between the detected power element temperature and the detected water temperature is larger than a prescribed determination temperature difference.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: November 21, 2017
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Hatsuki Morinaga
  • Patent number: 9691536
    Abstract: A static apparatus is provided in which a partial discharge, if occurred in a winding end portion, is unlikely to lead to insulation breakdown. The windings and core of a static apparatus are housed in a tank filled with coolant. The winding is fixed by upper and lower parts supporting winding. A continuous coolant duct is formed in a section embracing the winding and the upper and lower parts supporting winding. A coolant duct from the wiring, extending through the upper or lower parts supporting winding and connected with the coolant space is configured in a structure in which toroidal ducts in multiple tiers are connected in a vertical direction of the winding. Connecting holes of one toroidal duct and of its next toroidal duct are staggered with respect to each other and spaced at intervals which are longer than the width of the toroidal ducts.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: June 27, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Naoya Miyamoto, Akira Yamagishi, Hiroshi Miyao
  • Patent number: 9591742
    Abstract: There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: March 7, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kei Murayama, Mitsutoshi Higashi, Koji Nagai, Hideaki Sakaguchi
  • Patent number: 9437359
    Abstract: A reinforcement-free tank for an electromagnetic apparatus, as may be immersed in a fluid is provided. The tank may include a pair of mutually-opposite side walls. Each side wall may have at least one curved segment defining a vertically-curving profile between a top edge and a bottom edge of a side wall. A pair of mutually-opposite end walls. Each end wall may have a substantially vertically-extending semi-cylindrical shape defining a vertically-straight profile between a top edge and a bottom edge of an end wall. A plurality of vertically-extending joining members. Each joining member may be configured to provide a transition between the vertically-curving profile of a side wall and the vertically-straight profile of a corresponding end wall. The walls can withstand vacuum and overpressure conditions which can develop in the tank, without a reinforcing member connected to the walls.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: September 6, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: William Fernando Quintero Restrepo
  • Patent number: 9433092
    Abstract: A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the layout area; disposing a welding material area on the padstack to partially cover the padstack and be located at one end of the padstack; disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack; and forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area. The layout method for a printed circuit board and the printed circuit board may avoid that the outlet of the wiring is formed through the side of the welding material area to leave a blank area on the padstack.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: August 30, 2016
    Assignee: EverDisplay Optronics (Shanghai) Limited
    Inventor: Dongfang Feng
  • Patent number: 9433134
    Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: August 30, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Tokihito Suwa
  • Patent number: 9240750
    Abstract: Power conversion sub-blocks are combined to be configured as a power conversion block. The power conversion sub-blocks include power conversion modules including cooler base sections on which semiconductor elements are mounted and cooler fin sections provided on the rear surface side of semiconductor element mounting surfaces in the cooler base sections and cooler attachment members to which cooler fin sections are attached back to back, the cooler attachment members being configured to be capable of separating an opened section where the cooler fin sections are present and external air circulates and a closed section where the semiconductor elements are present and circulating cooling air to the cooler fin sections.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: January 19, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hidetoshi Kitanaka
  • Patent number: 9196431
    Abstract: An encapsulated switchgear that includes a housing defining, an insulating space, and an electrical active part arranged in the insulating space, the insulating space with an insulation medium. The switchgear is characterized in that the insulation medium with a dielectric compound having a boiling point of above ?5° C.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: November 24, 2015
    Assignee: ABB Technology AG
    Inventors: Maik Hyrenbach, Ole Granhaug, Max-Steffen Claessens, Per Skarby
  • Patent number: 9107293
    Abstract: Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: August 11, 2015
    Assignee: Raytheon Company
    Inventors: Bruce C. Fitz-Patrick, Gary A. Clayton, Byron E. Short, Jr.
  • Patent number: 9036344
    Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: May 19, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jing Chen, Chien-Lung Chen
  • Patent number: 9036351
    Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: May 19, 2015
    Assignee: Xyber Technologies, LLC
    Inventor: Mario Facusse
  • Patent number: 9036350
    Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: May 19, 2015
    Assignee: CONTROL TECHNIQUES LTD
    Inventors: Roger Neil Jackson, Rhys Marc Owen, Gareth Huw Jones
  • Patent number: 9030822
    Abstract: A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: May 12, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Yu Qin, Reshma Rathod, Richard J. Hampo
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8982555
    Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: March 17, 2015
    Assignee: Intel Corporation
    Inventors: Yoshifumi Nishi, Mark MacDonald
  • Patent number: 8953325
    Abstract: An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 10, 2015
    Assignee: SerComm Corporation
    Inventors: Yi-Fei Yu, Yuan-Heng Huang
  • Patent number: 8953335
    Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 10, 2015
    Assignee: Keihin Corporation
    Inventors: Hidefumi Abe, Toshiro Mayumi, Seiichiro Abe
  • Patent number: 8922992
    Abstract: An electrical equipment chassis includes a frame open to a first side and an opposite second side and a power board located near a mid-plane of the chassis coupling power supply modules to first networking modules and a second networking module. A first region open to the first side can receive first power supply modules. A second region open to the first side is adjacent to the first region and can receive the first networking modules and the second networking module oriented with a first orientation. A third region open to the second side can receive fan trays with fans and third networking modules. The third networking modules are oriented orthogonal to the first orientation. The power board at least partially separates the first and third regions and only partially separates the second and third regions. The chassis permits air flow from the first side to the second side.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: December 30, 2014
    Assignee: Dell Products L.P.
    Inventors: Haresh K. Shah, Saikrishna M. Kotha
  • Patent number: 8897010
    Abstract: A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: November 25, 2014
    Assignee: General Electric Company
    Inventor: Mark Eugene Shepard
  • Patent number: 8885345
    Abstract: An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 11, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shun-Siang Tu
  • Patent number: 8872022
    Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 28, 2014
    Assignee: Elwha LLC
    Inventors: Roderick A. Hyde, Jordin T. Kare, Nathan P. Myhrvold, David B. Tuckerman, Lowell L. Wood, Jr.
  • Patent number: 8867210
    Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: October 21, 2014
    Assignee: Deere & Company
    Inventors: Gregory K. Harmelink, Christopher J. Schmit