Abstract: A computer system includes a processor for processing data, a storage unit for storing data, and a liquid cooling thermal module for dissipating heat generated by the processor. The thermal module has a liquid coolant carrying pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.

Abstract: A heat transfer apparatus includes a heat source having a heat source maximum operating temperature; and a heat sink comprising a closed chamber having a chamber first end wall, a chamber second end wall and a circumferential chamber side wall interconnecting said chamber first end wall and said chamber second end wall, said walls defining a chamber interior space, at least one of said chamber first end wall and said chamber second end wall being a heat transfer wall, a heat transfer material retained within said chamber, and at least one impeller having an axis of impeller rotation and an impeller radius mounted within said chamber adjacent to said heat source to rotate about the axis of impeller rotation for moving the heat transfer material over said heat transfer wall and propelling said heat transfer material to a location thermally remote from said heat source for heat dissipation, wherein said chamber interior space extends perpendicular to the axis of impeller rotation a radial thermal spacing distanc

Abstract: A vapor-liquid separating type heat pipe device includes a heat sink member mountable on a heat source, tubular outer and inner bodies, a heat transfer fluid, a top vapor passage, and a bottom liquid passage. The outer body has an outer peripheral wall defining an inner chamber. The inner body is disposed in the inner chamber, and has an inner peripheral wall defining thereinside an evaporating space and cooperating with the outer peripheral wall to define a condensing space therebetween. The fluid is introduced into the inner chamber. The vapor passage is provided between and is in fluid communication with the evaporating and condensing spaces. The liquid passage is provided between and is in fluid communication with the condensing space and the heat sink member. The vapor and liquid passages are located proximate to the top and bottom ends of the inner and outer bodies, respectively.

Abstract: A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate is hermetically coupled with the lower plate along its edge to form a void therebetween. The wick plate is provided between the upper plate and the lower plate and is maintained in position relative to the lower plate by surface tension of the liquid-phase coolant. The liquid-phase coolant transfers heat by circulating between a vaporization part, where the heat source is located, to a condensing part. Here, the wick plate includes a plurality of holes and a plurality of planar wicks and makes the liquid-phase coolant flow from the condensing part to the vaporization part by capillary force between itself and the lower plate.

Abstract: A heat dissipating module is disclosed, which comprises a plurality of fins having same or different shapes, a plurality of heat dissipating tubes, and a seat. The fins are stacked one next to another, each fin having a plurality of upper penetrating holes and a plurality of lower grooves or holes. The seat is formed of solid metal with a plurality of slots, each slot corresponding to the lower groove of the fin and having two upper sides extended with two shaping sheets. When the two shaping sheets are pressed and bent, they form a round hole with the slot for receiving a heat dissipating tube. This invention will result in improved heat dissipation.

Abstract: A tower-type heat pipe (10) includes a metal plate (20), a heat pipe with a container (30) and a wick (32), and a cover (40). The heat pipe is vertically mounted on the metal plate. A solder (50) is used to soldering an outer wall of the container with the metal plate and a top of the container with the cover. An air gap (27) is defined in the metal plate and located between the solder and the wick along a flowing path of the solder in order to prevent the solder from flowing into an inside of the container to contaminate the wick.

Abstract: A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.

Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

Abstract: Representative embodiments provide for a circuit device cooling apparatus having a first heat pipe which includes a first heat pipe condenser, and a second heat pipe which includes a second heat pipe condenser. A heat sink is attached to the first heat pipe condenser and the second heat pipe condenser. Another representative embodiment provides for a method of removing heat from a first circuit device and a second circuit device. The method includes providing a heat dissipating member, and connecting the first circuit device to the heat dissipating member with a first heat pipe. the method further includes connecting the second circuit device to the heat dissipating member with a second heat pipe, and providing compliance between the first heat pipe and the second heat pipe.

Abstract: An end surface structure having a pipe member, a first lid and a second lid is disclosed. The pipe member has two opposing open ends. The first and second lids each has an interlocking member to frictionally fit the first and second lids with the pipe member at the open ends. Each of the first and second lids further has a flange extending outwardly and radially from the interlocking member. The thickness of the flanges is larger than the interior periphery of the open ends but no larger than the exterior periphery of the heat pipe. When the first and second lids are fitted with the heat pipe at the open ends, a welding process is performed to permanently connect the heat pipe with the first and second lids.

Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.

Abstract: An electronic apparatus comprises a housing having an outer plate, and a circuit board housed removably in the housing. A fixing part is provided on the outer plate of the housing. The fixing part has a holder piece located inside of the housing farther than the outer plate. A bracket is fixed to the circuit board. The bracket has a fitting piece. The fitting piece is held between the outer plate and the holder piece, when the circuit board is housed in the housing.

Abstract: A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates.

Abstract: A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick.

Abstract: A composite wick structure of a heat pipe includes wick structure fabricated from a woven mesh and sintered powder. The woven mesh is attached to an internal sidewall of a tubular member, while the sintered powder is coated on at least one side of the internal sidewall. By the better capillary force provided by the sintered powder, the liquid-phase working fluid can reflow to the bottom of the heat pipe quickly to enhance the heat transmission efficiency. Further, the problems of poor capillary effect of the woven mesh and the problems caused by usage of an axial rod during the process of applying sintered powder can be resolved.

Abstract: It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature bum, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.

Abstract: A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.

Abstract: A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

Abstract: A radiator assembly comprises a radiator and a plurality of heat guiding tubes with a bent part respectively. The radiator is provided with a plurality of heat dissipation plates, a plurality of joining parts and a plurality of piercing parts. The heat guiding tubes are joined to the piercing parts with the joining parts being fixedly attached with the bent part respectively. Heat conduction between the heat guiding tubes and the radiator can be enhanced greatly and effectively.

Abstract: A microcapillary pumped loop (CPL) for chip level temperature control includes two mating substrates which define an evaporator, a condenser, and a reservoir for a liquid. A first substrate includes a vapor line which couples vapor from the evaporator to the condenser, and a liquid line which couples liquid from the condenser back to the evaporator. A wicking structure for the evaporator is formed by etching in the second substrate. The wicking structure couples the evaporator to the reservoir and to the liquid line. The condenser includes a plurality of grooves formed in the second substrate which couples liquid from the condenser to the liquid line.

Abstract: An end surface structure of a heat pipe having a large gauge used to be contacted with a heat source for dissipation is provided. The heat pipe includes a pipe member, a lid, a base and a wick structure. The hollow tubular pipe member has two opposing open ends. The lid is closely covered on one open end. The base provides an interlocking member including a flange fitly embracing the pipe member to receive the other open end of the pipe member thereinside. The wick structure is attached on an inner wall of the pipe member and an inside surface of the base. Moreover, the thickness of the flange is not larger than the thickness of pipe member at the open end received in the interlocking member. When the base is fitted with the pipe member at the open end, a welding process is performed to permanently connect them together. In the welding process, the flange of the interlocking member is enforced to be liquefied first and is liquefied more than the pipe member at the open end.

Abstract: A design concept for a tower PC having an air grille formed on one side in a region of the power supply to achieve much more efficient cooling in the region of the power supply.

Abstract: A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis and the thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Abstract: A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Abstract: A processor retainer assembly prevents inadvertent removal of a processor from a circuit board socket by forces exerted on an information handling system that are translated from a heat sink to the processor by the coupling of thermal grease between the heat sink and the processor. A retention frame couples to a motherboard around the processor socket to support movement of the processor retainer between open and closed positions. A securing device hinge rotationally couples the processor retainer to the retention frame and a securing device latch locks the processor retainer in the closed position to restrict movement of the processor from the socket. A heat sink contacts the processor through an opening in the processor retainer. Heat sink supports extending from the retention frame engage the heat sink so that a single processor retainer assembly retains the processor in the socket and the heat sink proximate to the processor.

Abstract: A cooling apparatus for electronic drawers utilizing a passive fluid cooling loop in conjunction with an air cooled drawer cover. The air cooled cover provides an increased surface area from which to transfer heat to cooling air flowing through the drawer. The increased cooling surface uses available space within the drawer, which may be other than immediately adjacent to a high power device within the drawer. The passive fluid cooling loop provides heat transfer from the high power device to the air cooled cover assembly, allowing placement of the air cooled cover assembly other than immediately adjacent to the high power device. The cooling apparatus is easily disengaged from the electronics drawer, providing access to devices within the drawer.

Abstract: A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.

Abstract: A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.

Abstract: A retaining apparatus for securely fastening a heat sink to a CPU includes a press plate part, a hold bar part, and a retaining bar part. The retaining apparatus is installed by engaging hook legs of the hold bar and retaining bar parts with a CPU base. In this configuration, the press plate of the retaining apparatus presses against and secures the heat sink.

Abstract: According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.

Abstract: The present invention relates to aheat-dissipating device, which comprises an upper part and a lower part. The upper part further includes an inner joining face and an outer face opposite the inner joining face and the lower part further includes a concave surface which is engaged with the inner joining face of the upper part to form an air-tight chamber with a suitable quantity of circulating liquid being filled therein. The concave surface of the lower part further includes a plurality of capillary trenches and at least one basin, wherein each capillary trench connects the basin and further grid-like trenches are formed inside the basin in order to enhance vaporizing efficiency of the circulating liquid.

Abstract: A heat sink with fins comprising: a base plate made of a heat conductive material; a plurality of heat dissipating fins which are positioned in heat-dissipating-fin mounting portions formed on one surface of said base plate and are jointed to said base plate by mechanical crimping; and at least one heat pipe which is positioned in a heat-pipe mounting portion formed on an opposite surface of said base plate, portions in the vicinity of said heat pipe being crimped to joint said heat pipe to said base plate.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: An electronic device has a first case which houses a part of a liquid cooling system and mounted components, and a second case which houses the other part of the liquid cooling system. In one example, the second case houses and a display unit. In an all-in-one computer example, the second case may serve as the access lid. In the electronic device, the liquid cooling system has a pump which feeds cooling liquids a heat block which receives heat from an electronic component, a pipe which transfers heat from the liquid to a heat sink, and a tube which connects these parts with one another. The first case has a first board mounted with the electronic component over a part of the liquid cooling system. Methods of manufacturing electronic devices with such cooling systems also are disclosed.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: A heat dissipation device includes a base (10), fins (40), two plates (30), a post (50), a pair of heat pipes (20) and a fan (60). The fins are spaced from each other and defines a plurality of air passages therebetween. The plates are positioned at opposite sides of the fins. The post is perpendicularly engaged in central positions of the fins and the base. The post is coplanar with the base at lowest surfaces. The heat pipes have central segments (22) engaged in the base and end segments (24) sandwiched between the plates and the fins. The fan is positioned to the plates and in communication with the air passages.

Abstract: An apparatus including a heat pipe having an evaporator portion and a condenser portion, the evaporator portion to be thermally coupled to a heat generating component; and an actuation membrane unit to generate air movement in a direction of the condenser portion of the heat pipe.

Abstract: A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks are mounted on opposite surfaces of a printed circuit board (PCB) of the VGA card, respectively, and connected together by a heatpipe. Due to the use of two heatsinks to collectively cool a chipset, cooling efficiency is higher as opposed to using a single heatsink. In particular, a binding portion between a heatsink contacting the chipset of the VGA card and the heatpipe is always positioned at a lower level than a binding portion between the other, opposite heatsink and the heatpipe, thereby further enhancing the heat conduction performance of the heatpipe.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

Abstract: A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assembly, located within the defined space, has a relatively high thermal conductivity, compared to other thermally conductive materials, and transfers heat from the circuit board component to the support plane or carrier tray associated with the circuit board. The heat pipe assembly has an input portion that contacts the circuit board component and an output portion that contacts the support plane. The heat pipe assembly also has a compliant portion having a lower stiffness relative to the stiffness of either the input portion or the output portion.