Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

Abstract: An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: A cooking appliance includes a cabinet defining an external surface of the cooking appliance, a cavity that is provided in the cabinet and that defines a cooking space, a heater module provided at an upper part of the cabinet, the heater module including an encapsulation part that is configured to pass through the cavity, and a module bracket configured to fix the heater module to the cavity.

Abstract: An electrical unit includes a housing member, a cover configured to at least partially cover the housing member, a primary circuit board disposed in the housing, and one or more secondary circuit boards connected to the primary circuit board. A primary circuit board may include a plurality of connection sections. A secondary circuit board may be connected to a respective pair of connection sections of the plurality of connection sections, such as via a respective pair of interconnection headers. A secondary circuit board may include a connector that may extend into a corresponding connector portion of the cover. Each of the one or more secondary circuit boards may include at least one of circuitry and electrical components for a respective vehicle function of a plurality of vehicle functions.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: A vacuum interrupter (1) includes a tubular insulating case (3, 4) extending along a longitudinal axis (AA), two conducting caps (51, 52) each securely fixed at an open end of the tubular insulating case (3, 4) at a sealing area (7) to form a tightly sealed chamber (2). The vacuum interrupter is characterized in that the tubular insulating case (3, 4) is shaped so as to enclose the conducting caps (51, 52) and extend beyond the caps (51, 52) along its longitudinal axis (AA).

Abstract: A microelectronic device comprises a first substrate (110) having a first electrically conductive path (111) therein and a second substrate (120) above the first substrate and having a second electrically conductive path (121) therein, wherein the first electrically conductive path and the second electrically conductive path are electrically connected to each other and form a portion of a current loop (131) of an inductor (130).

Abstract: An integrated circuit package and a method of fabrication of the same are introduced. An opening is formed in a substrate. An embedded heat dissipation feature (eHDF) is placed in the opening in the substrate and is attached to the substrate using a high thermal conductivity adhesive. One or more bonded chips are attached to the substrate using a flip-chip method. The eHDF is thermally attached to one or more hot spots of the bonded chips. In some embodiments, the eHDF may comprise multiple physically disconnected portions. In other embodiments, the eHDF may have a perforated structure.

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. A protective layer, an antirust layer, and a shielding layer are sequentially mounted on the conductive paste. The EMI shielding device is mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: The present invention is an internal reflective light fixture, comprising a luminescence unit, a reflection member and a cup body. The luminescence unit comprises a light-holding part for emitting a light ray. The reflection member comprises a securing part and a reflection part, wherein the reflection part is formed at one side of the securing part and forms a reflective curved surface with a first reflective layer. The cup body contains the luminescence unit and the reflection member. The cup body comprises a second reflective layer formed on the interior wall of the cup body, a first containing space and a securing trough. The securing trough is provided to fix the securing part so that the reflection part is exposed at the first containing space. The light ray is reflected to the second reflective layer by the first reflective layer and then emitted from the cup body.

Abstract: A module comprises a first insulating-substrate-side member that has a first insulating substrate, a first conductor layer provided on the first insulating substrate, and a first electronic element provided on the first conductor layer; a second insulating-substrate-side member that has a second insulating substrate, a second conductor layer provided on a lower side of the second insulating substrate, and a second electronic element provided on a lower side of the second conductor layer; and a sealing member that is provided between the first insulating substrate and the second insulating substrate. The first electronic element and the second electronic element are opposingly disposed. The first electronic element and the second electronic element are connected by an element connecting conductor post that has electric conductivity.

Abstract: An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.

Abstract: A dry-type cable wire outlet device for a submersible electrical pump includes a wire outlet box positioned in a wellbore, a cable protection pipe, a wire outlet sealing device and a cable. The wire outlet box is connected to the top of a submersible electrical pump. One end of the cable protection pipe is connected to the top of the wire outlet box, and the other end extends out of the well cover of the wellbore. The cable is positioned in the cable protect pipe and connected with the submersible electrical pump through the wire outlet box. The wire outlet sealing device is connected to the well cover, and an end of the cable protection pipe extending outside the well cover is positioned in the wire outlet sealing device. When the device is in use, the opening at the top end of the cable protection pipe is no longer exposed.

Abstract: The underground storage of operational electronic equipment utilizes a hermetically sealable container adapted for receiving electronic equipment, such as a computer hard drive. The electronic equipment is placed in the container and electrically connected via a seal maintaining feedthrough to a facility proximate the container. The hermetically sealable container is sealed up and then buried underground.

Abstract: The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages. In at least one embodiment, differential pressure is used to meter the underfill material during the underfill deposition process.

Abstract: A vacuum vessel wall element is presented and described with a fixed flange element, with a separable flange element and with a line running from the inside of the vacuum vessel to the outside, the separable flange element being separably connected to the fixed flange element, with the line being held in the separable flange element and with an annular sealing area being provided between the fixed flange element and the separable flange element.

Abstract: A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization layer with a layer of compliant dielectric material. In one embodiment, the layer of compliant dielectric material is low Young's modulus silicon dioxide, formed by sputter-deposition at low temperature, in a low pressure argon atmosphere. The interconnect may provide electrical access to a micromechanical device, which is enclosed with a capping wafer hermetically sealed to the substrate with an AuInx alloy bond.

Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.

Abstract: A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.

Abstract: A gas recycling system which has a carbon dioxide collecting device for collecting gas containing carbon dioxide from a carbon dioxide source. In the system, at least part of the gas containing sulfur hexafluoride used as an electric insulation medium in a gas-insulated electric device is replaced with the carbon dioxide obtained by the carbon dioxide collecting device.

Abstract: A fluorescent lamp capable of fully securing a portion for containing a mercury amalgam pellet and reliably preventing the mercury amalgam pellet from moving toward the inside a discharge tube, and a method for manufacturing the fluorescent lamp. The fluorescent lamp includes a glass tube having a fluorescent substance layer on the inner surface, a sealed portion formed at an end of the glass tube, a slender glass tube having an inner space that is in communication with the inside of the glass tube and is not in communication with the outside of the glass tube, and a mercury amalgam pellet contained in the slender glass tube. The slender glass tube has a small-diameter part with an inner diameter smaller than the diameter of the mercury amalgam pellet and a large-diameter part with an inner diameter larger than the diameter of the mercury amalgam pellet.

Abstract: A method for manufacturing an inexpensive lamp, which suppresses distortion of a bulb and prevents decrease in commercial value and breakage of the bulb. In a glass bulb having one end thereof communicating with an exhaust tube, an assembly of a filament, metal foils and lead wires is disposed. In this state, the whole glass bulb is heated by a burner. The end opposite to the exhaust tube of the glass bulb is pinch-sealed to form a pinch-sealed portion. Subsequently, an expanded portion is formed by charging a protective gas from the exhaust tube into the glass bulb.

Abstract: A repeater case capable of housing HDSL telecommunications modules without an excessive buildup of heat. The repeater case has a base, an open-topped housing, and a closure member that closes the housing. The closure member is provided in the form of a pair of thermal covers that share a common construction, including heat-radiating fins formed on their respective top walls and heat transferring structures positioned on the respective interior sides of their top walls. The housing includes multiple printed circuit boards to further enhance internal air flow, each of which is protected from short circuits by an acrylic plastic barrier mounted in vertically spaced apart relation from it. The spacing between each printed circuit board and its barrier provides ample space for the connection of individual conductors from a stub cable that enters the repeater case through an opening formed in the base. The spacing also enhances the air flow within the repeater case.

Abstract: Thermally insulating apparatus for housing heat sensitive electronic apparatus, comprises an open-topped box with a detachable lid. A gasket is provided to form a heat seal between the open-topped container and the lid. At least one external surface of the gasket, which is exposed to ambient conditions when the lid is removed from the box, is unreactive to the extent whereby hydrophilic particles (e.g. dust) coming into contact therewith are not contaminated and made hydrophobic. The presence of hydrophobic particles may interfere with processes where the thermally insulating apparatus is deployed, and thus maintaining inherent hydrophilic properties may be important.

Abstract: An environmentally sealed power distribution module is disclosed having a hybrid peripheral seal disposed around a power distribution panel and within an interface between a top housing and a base housing. The peripheral seal is comprised of a traditional o-ring type seal having an open segment and a gel pad type seal located within the open segment, thereby completing the peripheral seal. Plate-like power distribution bus bars are reliably sealed by the gel pad type seal as the bus bars exit the power distribution module. A sealed releasable cover is provided to access fuses and other electrical components of the power distribution module.

Abstract: An inflatable sealing system and method are provided for a low temperature electronic device such as a cooled multichip integrated circuit module. The inflatable sealing system includes a flexible bladder configured to engage at least one surface of the low temperature electronic module. Thermal insulation is disposed within the flexible bladder and a retention cover is provided to hold the flexible bladder against the electronic module. When disposed on a printed circuit board, the electronic module and printed circuit board can be surrounded by one or more inflatable bladders to prevent air from reaching multiple surfaces of the device.