Feedthrough Patents (Class 174/360)
-
Patent number: 11564339Abstract: An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.Type: GrantFiled: April 11, 2018Date of Patent: January 24, 2023Inventor: Raymundus Johannes Stikvoort
-
Patent number: 11358439Abstract: A fuel connection unit for a fuel-operated vehicle heater includes a connection unit body (12) to be mounted on a heater body (78). A fuel release line connection area (16) is positioned such that it meshes with or faces an interior (80) of the heater body (78). The fuel release line connection area (16) connects a fuel release line (104), extending in the interior (80), with a fuel feed line connection area (20) to be positioned exposed on an outer side of the heater body (78), for connecting a fuel feed line.Type: GrantFiled: October 3, 2018Date of Patent: June 14, 2022Assignee: Eberspächer Climate Control Systems GmbHInventors: Michael Haefner, Hans Jensen
-
Patent number: 11351936Abstract: A shielded wire harness has one or more of wires (30); a shielded connector (58) with one or more terminals (40) connected respectively to the wires (30), and configured to be connected to a mating connector (12); and a substantially tubular shielding member (50) configured to collectively enclose the wires (30) and to be connected to the shielded connector (58). The shielding member (50) has a main shield portion (51) made of a conductive pipe (51), and a sub-shield portion (54) connected to the conductive pipe (51) and the shielded connector (58). The sub-shield portion (54) has a braided member (52) at least partly covered by a coating (53) that provides fluid-tightness when the sub-shield portion (54) is connected to the conductive pipe (51) and the shielded connector (58). A corresponding shielding member and manufacturing method are provided.Type: GrantFiled: March 4, 2016Date of Patent: June 7, 2022Assignee: Sumitomo Wiring Systems, LtdInventors: Hiroyuki Kodama, Ventsislav Mironov
-
Patent number: 11081826Abstract: A connector (1) includes a housing (2), a first terminal (31) and a second terminal (32). The terminals (31, 32) are side by side and parallel. One end of each terminal is inserted into the housing (2) and the other end projects from the housing (2). Each of the terminals (31, 32) includes a base (33) projecting from the housing (2) and a connecting portion (34) that is wider than the base (33) toward both sides in an arrangement direction (Y) of the first and second terminals (31, 32). The connecting portion (34) of the first terminal (31) projects farther from the housing (2) than the connecting portion (34) of the second terminal (32). An insulating member (4) is at a position adjacent to the connecting portion (34) of the second terminal (32) in the arrangement direction (Y) on a surface of the base (33) of the first terminal (31).Type: GrantFiled: February 11, 2020Date of Patent: August 3, 2021Inventor: Ryuichi Fujisaki
-
Patent number: 11081817Abstract: A connector (1) includes a housing (2) and first and second terminals (31, 32). One end of each terminal (31, 32) is inserted into the housing (2) and the other end thereof projects from the housing (2). Each terminal (31, 32) includes a base (33) projecting from the housing (2) and a connecting portion (34) that is wider than the base (33) toward both sides in a (Y) direction. The connecting portion (34) of the first terminal (31) projects farther from the housing (2) than the connecting portion (34) of the second terminal (32) in an (X) direction. The base (33) includes a flat plate (330) having a thickness in a (Z) direction. A side part of the base (33) of the first terminal (31) adjacent to the connecting portion (34) of the second terminal 32 in the (Y) direction is bent with respect to the flat plate (330).Type: GrantFiled: February 11, 2020Date of Patent: August 3, 2021Inventor: Ryuichi Fujisaki
-
Patent number: 10939541Abstract: An integrated circuit is described. The integrated circuit includes a first layer, a first clock line for carrying a first clock signal, and a second clock line for carrying a second clock signal. The second clock line runs alongside the first clock line for a distance. The integrated circuit includes a shield structure for shielding the clock line from crosstalk and/or other interference. The shield structure includes a shield wall extending from the first layer. The shield wall runs between the first and second clock lines for at least a portion of the distance. The shield structure may also include a shield cage extending from the first layer and surrounding the first and second clock lines for at least a portion of the distance. The shield cage has a plurality of openings. The shield cage and/or shield wall may be connected to the ground of an AC power supply.Type: GrantFiled: March 31, 2017Date of Patent: March 2, 2021Assignee: Huawei Technologies Co., LTD.Inventors: Dmitry Petrov, Zhonggui Xiang
-
Patent number: 10874865Abstract: The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers and a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; a feedthrough ferrule; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; a hermetically sealing material between the insulator and the feedthrough ferrule; and a resin coating over the hermetically sealing material.Type: GrantFiled: November 6, 2018Date of Patent: December 29, 2020Assignee: AVX CorporationInventors: Don Dollar, Rigoberto Rios
-
Patent number: 10857369Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.Type: GrantFiled: March 26, 2019Date of Patent: December 8, 2020Assignee: Greatbatch Ltd.Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
-
Patent number: 10498127Abstract: A link box includes a housing that defines an enclosure, an electrical connector within the enclosure, an aperture formed through a wall of the housing, and a cable entry seal secured to the housing at the aperture. The cable entry seal receives a cable inserted into the housing for connection to the electrical connector. The cable entry seal includes first and second parts that are removably secured together. The first part includes a flange and an externally-threaded portion that extends outwardly from the flange. The externally-threaded portion is inserted through the aperture from within the enclosure such that the flange abuts an internal surface of the wall. The second part includes an internally-threaded body and a seal conduit that extends outwardly from the internally-threaded body. The internally-threaded body is threadingly engaged with the externally-threaded portion of the first part and the seal conduit surrounds and seals the cable.Type: GrantFiled: September 26, 2017Date of Patent: December 3, 2019Assignee: TE CONNECTIVITY CORPORATIONInventors: Alexander R. Czibur, Mahmoud K. Seraj
-
Patent number: 10490873Abstract: A transmission line includes first and second conductor patterns that serve as signal transmission paths, first and second insulating layers that hold the first and second conductor patterns therebetween, and a third conductor pattern that is arranged between the first and second conductor patterns. No signal is transmitted through the third conductor pattern. A relation 0.5w?S1?1.5w and a relation 0.5w?S2?1.5w are satisfied in a range of a relation S?2w, wherein S expresses a distance between the first conductor pattern and the second conductor pattern, w expresses a width of each of the first conductor pattern and the second conductor pattern, S1 expresses a distance between the first conductor pattern and the third conductor pattern, and S2 expresses a distance between the second conductor pattern and the third conductor pattern.Type: GrantFiled: September 28, 2017Date of Patent: November 26, 2019Assignee: YAZAKI CORPORATIONInventors: Mizuki Shirai, Hiroki Kondo
-
Patent number: 10320172Abstract: An electric wire lead-in part structure (15) includes: a conductor insertion hole (16) formed through a wall part (2Ca) of an inverter accommodating chamber; a conductor member (17) made of an electrically conductive material and inserted into the conductor insertion hole (16) in a waterproof manner and also, electrically conducted to the conductor insertion hole (16) and holding a power supply cable (11) passed therethrough; a shield grounding part (50) for electrically conducting a shield part (45) of the power supply cable (11) to the conductor member (17) at a position where the conductor member (17) is provided; and an electric wire waterproofing part (40) for waterproofing a gap between the conductor member (17) and the power supply cable (11).Type: GrantFiled: June 19, 2017Date of Patent: June 11, 2019Assignee: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.Inventors: Makoto Hattori, Hiroyuki Kamitani, Hiroto Higuchi, Takayuki Takashige, Takeo Hayashi
-
Patent number: 9969483Abstract: A system for shielding of at least one component (28) within an aircraft (10) includes a floor panel disposed at least partially between joists (38) supporting a floor (30) within the aircraft and a ground plane (44) connected to a bottom surface of the floor panel. The ground plane extends at least partially between adjacent joists. At least one bracket (52) electrically connects the ground plane to at least one of the joists.Type: GrantFiled: February 26, 2014Date of Patent: May 15, 2018Assignee: BOMBARDIER INC.Inventors: Lody Roborel De Climens, Philippe Desy, Jean-Guy Gaudreau
-
Patent number: 9853340Abstract: The present disclosure relates to coupled slow-wave transmission lines. In this regard, a transmission line structure is provided. The transmission line structure includes a first undulating signal path formed from first loop structures. The transmission line structure also includes a second undulating signal path formed from second loop structures. The second undulating signal path is disposed alongside of the first undulating signal path. Further, a first ground structure is disposed above or below either one or both of the first undulating signal path and the second undulating signal path.Type: GrantFiled: November 3, 2015Date of Patent: December 26, 2017Assignee: Qorvo US, Inc.Inventors: Dirk Robert Walter Leipold, George Maxim, Marcus Granger-Jones, Baker Scott
-
Patent number: 9793692Abstract: A cable assembly includes a grommet, a cable, and a ferrule. The grommet has a cylindrical sleeve defining a cable channel therethrough and a flange extending radially outward from the cylindrical sleeve. The cable includes one or more insulated wires, a cable shield surrounding the one or more insulated wires, and an outer jacket surrounding the cable shield. The cable extends through the cable channel of the grommet. The cable shield and the one or more insulated wires protrude from an end of the outer jacket. The cable shield has an overlap portion extending around the end of the outer jacket and surrounding and engaging the cylindrical sleeve of the grommet to electrically connect the cable shield to the grommet. The ferrule surrounds and engages the overlap portion of the cable shield to secure the overlap portion to the cylindrical sleeve of the grommet.Type: GrantFiled: August 30, 2016Date of Patent: October 17, 2017Assignee: TE CONNECTIVITY CORPORATIONInventors: Christopher Michael Pogash, Tracy Lee Smith, Glen Gutgold
-
Patent number: 9614289Abstract: A cell forming a metamaterial, comprises a patch conductor, a conductor layer arranged in parallel with the patch conductor, and a connection conductor configured to electrically connect the patch conductor and the conductor layer. The connection conductor forms a helical electrical path by a plurality of conductor lines and a plurality of vias which connect the conductor lines to the patch conductor and the conductor layer.Type: GrantFiled: August 29, 2013Date of Patent: April 4, 2017Assignee: CANON KABUSHIKI KAISHAInventor: Hitoshi Asai
-
Patent number: 9585263Abstract: A printed circuit board assembly includes a printed circuit board (PCB) having an end. The end includes surfaces defining a plurality of electrically conductive notches therein. A plurality of electrically conductive pins is provided with each pin being received in an associated notch in a press-fitted manner so as to make electrical connection with the PCB.Type: GrantFiled: October 15, 2014Date of Patent: February 28, 2017Assignee: Continental Automotive Systems, Inc.Inventor: Jennifer L. Matoy
-
Patent number: 9431699Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.Type: GrantFiled: June 10, 2014Date of Patent: August 30, 2016Assignee: Apple Inc.Inventors: Nicholas G. L. Merz, Daniel W. Jarvis, Sawyer I. Cohen
-
Patent number: 9322224Abstract: A coupler for coupling a first and a second section of a transmission line embedded in a first and a second component respectively, includes a first half-coupler including a first electrically conductive housing, a first electrically conductive structure, and a first structure of dielectric material, and a second half-coupler including a second electrically conductive housing, a second electrically conductive structure, and a second structure of dielectric material. When the first and second components are connected end-to-end, the first and second housings come into contact to form together an electromagnetic cavity, inside which the first and second conductive structures are separated from each other by the first and second dielectric structures, so as to allow the first and second conductive structures to be in electromagnetic communication with each other.Type: GrantFiled: September 21, 2011Date of Patent: April 26, 2016Assignee: VALLOUREC DRILLING PRODUCTS FRANCEInventors: Jean-Alain Chabas, Brian Minnis
-
Patent number: 9142945Abstract: An insulated glazing unit is provided. The unit includes a spacer frame separating a pair of substrates. The spacer frame has a length and a width transverse to the length. The unit further includes a conductive element passing through the width of the spacer frame. The unit further includes a first conductive component within the spacer frame. The first conductive component is in electrical communication with the conductive element. The conductive element is adapted for electrical communication with a second conductive component on a side of the width of the spacer frame opposite the first conductive component.Type: GrantFiled: June 5, 2013Date of Patent: September 22, 2015Assignee: SAGE ELECTROCHROMICS, INC.Inventors: Mark O. Snyker, Jean-Christophe Giron, Bryan D. Greer, Jerome Korus, Rino Messere, Cliff Taylor
-
Patent number: 9099800Abstract: There is provided a connector capable of realizing simple assembly and prevention of entering of foreign matter. A connector terminal (56) includes an insertion part (56a) that has a terminal metal fitting to be electrically connected with an external connection terminal, and a pin (56d) fixed to the insertion part (56a) and has a bent shape. The connector terminal (56) is held by a connector housing (55). In this situation, the connector housing (55) has a hole (57) that has a size at which the pin (56a) can penetrate from a tip side, and a guide wall (57d) formed along an outer circumference of the hole (57) and projects in a direction in which the pin (56d) projects from the connector housing (55).Type: GrantFiled: October 24, 2013Date of Patent: August 4, 2015Assignee: NSK Ltd.Inventors: Masakazu Morimoto, Tadayoshi Osakabe, Osamu Miyoshi
-
Publication number: 20150084167Abstract: An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the first insulating layer, a second metal patch provided on the first insulating layer, a second insulating layer provided on the first and second metal patches, an interconnect layer provided on the second insulating layer, a third insulating layer provided on the interconnect layer, a first via connected to the electrode plane and the first metal patch, and a second via connected to the electrode plane and the second metal patch. The second metal patch is separately adjacent to the first metal patch. The interconnect layer has a first opening and a second opening. The first via penetrates through the first opening. The second via penetrates through the second opening.Type: ApplicationFiled: August 15, 2014Publication date: March 26, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Tadahiro SASAKI, Hiroshi YAMADA
-
Patent number: 8981221Abstract: Core shield pipes and one collectively encasing braided shield tube are fixed and electrically connected using a metal bracket and a metal clamp. The metal bracket has two semi-circular members formed by dividing a circular plate sized to be covered by the collectively encasing braided shield tube into two parts. Semi-circular pipe insertion grooves are provided side by side at intervals on facing sides of the semi-circular members to face each other and the core shield pipes are inserted respectively into the pipe insertion grooves. The collectively encasing braided shield tube is mounted to cover the outer periphery of the metal bracket formed of the semi-circular members and the metal clamp is fastened to the outer periphery of the collectively encasing braided shield tube.Type: GrantFiled: October 28, 2010Date of Patent: March 17, 2015Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Masashi Sawada, Tadayoshi Asao, Koki Shiga
-
Publication number: 20140367159Abstract: A substrate structure includes: a first substrate; a second substrate including a front face disposed so as to face a front face of the first substrate, a substrate spacing holding member provided between the front faces of the substrates facing each other, and holds a spacing between the two substrates at a predetermined value; a mounted component including a signal wire mounted on the second substrate, the signal wire, including an end portion electrically connected to the second substrate and extending from the substrate to an outside along the front face of the second substrate; a through hole provided in the first substrate, the through disposing a projecting part of the mounted component therein; and a shielding member being provided on a back face side of the first substrate and covering an entirety or at least a part of an opening of the through hole.Type: ApplicationFiled: July 23, 2014Publication date: December 18, 2014Applicant: OLYMPUS MEDICAL SYSTEMS CORP.Inventors: Kazuhiko HINO, Takafumi KUBO
-
Patent number: 8841562Abstract: In order to improve a cable feedthrough comprising a housing connection piece, a cable fixing device provided on the housing connection piece, a fastening section which is provided in the housing connection piece and with which the housing connection piece can be secured to a wall section of an appliance, and a shield contact element which makes contact with a cable shield of a cable guided through the cable feedthrough, in such a manner that it is possible for the shield contact element to make reliable contact with the wall section, it is suggested that the shield contact element be fixable to the fastening section with a holding element and that the shield contact element make contact with the cable shield or with the wall section of the appliance with at least one housing contact element which is designed to dig into the wall section.Type: GrantFiled: January 19, 2012Date of Patent: September 23, 2014Assignee: Lapp Engineering & Co.Inventors: Rolf Drotleff, Daniel Mueller
-
Publication number: 20140262472Abstract: The embodiments disclose an integrated grounded grommet for anchoring a cable using a bulkhead opening, including a customized grommet mechanically bonded onto a cable creating a pressure seal, a customized grommet extended boss insertion guiding feature, a grounding path electrically bonded through the grommet to a cable shield, and a cable protection against EMI/RFI using the grounding path from the cable shield to a bulk head.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Inventors: Howard Lind, John Palahnuk
-
Patent number: 8791373Abstract: A method and apparatus are disclosed in order to provide an electromagnetic pulse shield ground path. In this regard, a shielded power feeder assembly is provided that includes a plurality of conductors comprising a neutral conductor and at least one power feeder conductor. Each conductor includes an electromagnetic pulse shield. The shielded power feeder assembly also includes a fanning bar ground block. The fanning bar ground block includes a body member defining a plurality of openings for receiving respective neutral and power feeder conductors. The fanning bar ground block also includes a plurality of barrels associated with respective openings defined by the body member and configured to be positioned in electrical contact with the shield of the conductor extending through the respective opening. The shielded power feeder assembly also includes a ground path extending from the fanning bar ground block. A corresponding method is also disclosed.Type: GrantFiled: January 9, 2013Date of Patent: July 29, 2014Assignee: The Boeing CompanyInventors: Mahlon Bruce Hull, Pete Pereira
-
Publication number: 20140138144Abstract: The invention provides a system for providing passage of fluid lines through an RF shield, the device comprising an RF shield having external and internal surfaces; a channel defined by the RF shield and extending from the external surface to the internal surface of the RF shield; a hollow cylinder rotatably communicating with said channel and extending substantially the length of the channel; a longitudinally extending region of said cylinder defining a gap adapted to receive a fluid conduit; mounting plates attached to the external surface and the internal surfaces of the RF shield; a movable member having a handle, the movable member attached to either end of the channel, the handle in slidable communication with the mounting plate so as to slide about the periphery of the plate; and a depending end of the handle rigidly attached to the cylinder which in turn is in rotatable communication with the circular plate such that the handle can be manipulated to a first position to allow loading of the conduit intType: ApplicationFiled: November 20, 2013Publication date: May 22, 2014Applicant: ETS-LINDGREN, INC.Inventors: Michael G. Hamouz, Paul V. Kolobayev, Joseph C. Weibler
-
Publication number: 20130335908Abstract: An electromagnetic interference (EMI) inhibiting device which prevents EMI from being transferred through a server cable from the outside to the inside or vice versa. Metal oxide powders packed between the cylinder and the cable act as an absorbant and dissipator of any EMI.Type: ApplicationFiled: July 18, 2012Publication date: December 19, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: WEN-KAI CHIANG
-
Patent number: 8552311Abstract: An electrical feedthrough includes a ceramic body and a ribbon via extending through the ceramic body, an interface between the ribbon via and the ceramic body being sealed using partial transient liquid phase bonding. The ribbon via extends out of the ceramic body and makes an electrical connection with an external device.Type: GrantFiled: July 15, 2010Date of Patent: October 8, 2013Assignee: Advanced BionicsInventors: Kurt J. Koester, Timothy Beerling
-
Patent number: 8461667Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.Type: GrantFiled: January 21, 2010Date of Patent: June 11, 2013Assignee: Sumitomo Electric Device Innovations, Inc.Inventors: Takeshi Hishida, Tsutomu Igarashi
-
Patent number: 8432706Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.Type: GrantFiled: December 22, 2009Date of Patent: April 30, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Chang-Sup Ryu
-
Publication number: 20130075150Abstract: A system includes a composite structure and a bushing. The composite structure includes an opening defined therethrough. The bushing includes a cylindrical body sized to be secured within the opening in an interference fit to facilitate providing electromagnetic effects protection in the composite structure. The cylindrical body is fabricated from a conductive material.Type: ApplicationFiled: September 27, 2011Publication date: March 28, 2013Inventors: Christopher L. Newbolt, Rebecca Elizabeth Ludwig (nee Ahern), James P. Irwin, Peter A. Coronado, Benjamin A. Johnson
-
Patent number: 8252683Abstract: Provided are a three-dimensional (3D) interconnection structure and a method of manufacturing the same. The 3D interconnection structure includes a wafer that has one side of an inverted V-shape whose middle portion is convex and a lower surface having a U-shaped groove for mounting a circuit, and a first electrode formed to cover a part of the inverted V-shaped one side of the wafer and a part of the U-shaped groove.Type: GrantFiled: September 9, 2010Date of Patent: August 28, 2012Assignee: Electronics and Telecommunications Research InstituteInventor: Kwon-Seob Lim
-
Publication number: 20120211274Abstract: In order to improve a cable feedthrough comprising a housing connection piece, a cable fixing device provided on the housing connection piece, a fastening section which is provided in the housing connection piece and with which the housing connection piece can be secured to a wall section of an appliance, and a shield contact element which makes contact with a cable shield of a cable guided through the cable feedthrough, in such a manner that it is possible for the shield contact element to make reliable contact with the wall section, it is suggested that the shield contact element be fixable to the fastening section with a holding element and that the shield contact element make contact with the cable shield or with the wall section of the appliance with at least one housing contact element which is designed to dig into the wall section.Type: ApplicationFiled: January 19, 2012Publication date: August 23, 2012Applicant: Lapp Engineering & Co.Inventors: Rolf Drotleff, Daniel Mueller
-
Patent number: 8247706Abstract: An enclosure of an electronic device includes an upper shell, a lower shell mounted to the upper shell, and an electrical outlet mounted to the lower shell. The lower shell includes a front plate defining an opening. The electrical outlet includes a connector and a number of wires electrically connected to the connector. An electromagnetic interference absorbing magnetic ring fits about some of the wires. The lower shell further defines a cable channel extending through an edge of the front plate and communicating with the opening. The wires pass through the cable channel and extend through the opening to enter into the lower shell, with the connector covering the opening.Type: GrantFiled: April 29, 2010Date of Patent: August 21, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Hsieh-Chou Liao
-
Patent number: 8242377Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.Type: GrantFiled: December 17, 2009Date of Patent: August 14, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyo-Jic Jung, Han Kim, Mi-Ja Han, Kang-Wook Bong, Dae-Hyun Park
-
Publication number: 20120181079Abstract: Shielding performance and protection from radiated RF energy at a cable's point of entry to an enclosure are improved when a shield of the cable is AC coupled around an entire opening of the enclosure using a discoidal capacitor. The capacitor may be electrically coupled to the shield and the enclosure around the entire inner and outer circumferences of the discoidal capacitor. Compared to traditional DC coupling or the use of a drain wire and traditional capacitor, using the discoidal capacitor lowers inductance and improves shielding of the opening itself while improving AC filtering characteristics and preventing ground loops.Type: ApplicationFiled: January 18, 2011Publication date: July 19, 2012Applicant: FISHER CONTROLS INTERNATIONAL LLCInventor: Adam J. Wittkop
-
Publication number: 20120169450Abstract: A lead-out tube for high-voltage transformers is disclosed along with a method of manufacturing a lead-out tube. The lead-out tube can include a shielding tube of an electrically conductive material which extends a hollow-cylindrically around an at least sectionally curved path in an axial direction. A hollow-cylindrical shaped electrical insulating layer can be arranged at a first radial distance around the shielding tube along the axial extent. Sectionally flexible strips can be arranged along the at least sectionally curved path adjacent to one another at a second radial distance around the shielding tube. The insulating layer can be wound from a tape-like insulating material around the sectionally flexible strips.Type: ApplicationFiled: January 13, 2012Publication date: July 5, 2012Applicant: ABB Technology AGInventor: Hartmut Brendel
-
Publication number: 20120152609Abstract: A container data center includes a container defining a wire hole therein, a cable extending through the wire hole of the container, and an EMI shielding device preventing electromagnetic radiation from entering into the container from the outside environment or leaking from the container to the outside environment through the wire hole of the container. The EMI shielding device includes a metal cylinder through which the cable extends and an effective amount of metal powder packed between the metal cylinder and the cable for shielding EMI. The metal cylinder has an end thereof inserted into the wire hole of the container and engaged with a circumferential edge of the wire hole. The disclosure further relates to an EMI shielding device.Type: ApplicationFiled: December 29, 2010Publication date: June 21, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: WEN-KAI CHIANG
-
Patent number: 8183468Abstract: An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.Type: GrantFiled: July 8, 2008Date of Patent: May 22, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Dae-Hyun Park
-
Patent number: 8153907Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.Type: GrantFiled: January 24, 2008Date of Patent: April 10, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dae-Hyun Park, Han Kim, Mi-Ja Han, Ja-Bu Koo
-
Publication number: 20120015555Abstract: The invention relates to a cable connection device for connecting a cable to a housing that is to be electromagnetically shielded, comprising a sheath, which serves to surround the cable in the region of a cable feedthrough opening in the housing and is designed to be electrically conductive at least at its surface. In order to achieve a cable connection device with a simple design which can be used for different cables and has improved shielding, the invention proposes that the sheath completely covers a cable feedthrough opening, which is associated with the housing, when viewed in a direction axial to the cable feedthrough opening, the sheath being provided with shielding structures for damping electromagnetic radiation on an inner surface, which points towards the cable to be accommodated.Type: ApplicationFiled: July 29, 2011Publication date: January 19, 2012Inventors: Peter Deimel, Nicholas E. Brownjohn
-
Publication number: 20110242788Abstract: An input/output cable port assembly and electromagnetic interference attenuation method are provided. The cable port assembly includes a cable port structure mounted to an electronics rack with an opening for input/output cables to pass therethrough, and multiple bottom ferrite inductor portions and multiple top ferrite inductor portions. The bottom and top ferrite inductor portions include first and second surfaces, respectively. The inductor portions are configured to be stacked within the cable port structure with their first and second surfaces in opposing relation to define at least one ferrite inductor with a central opening defined by the first and second surfaces for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state current on the cable(s) passing therethrough.Type: ApplicationFiled: March 31, 2010Publication date: October 6, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alma JAZE, Alan H. KNIGHT, John M. SKILLMAN, Kwok M. SOOHOO
-
Patent number: 7994434Abstract: A shielding apparatus has first and second electrically conductive sheets attached to an interior of a housing. A gap between the first and second electrically conductive sheets has a size based on a predefined desired cutoff frequency, and the widths of the first and second electrically conductive sheets are no more than twice the size of the gap. The lengths of the first and second electrically conductive sheets are at least four times the size of the gap.Type: GrantFiled: February 19, 2009Date of Patent: August 9, 2011Assignee: International Business Machines CorporationInventors: Alan F. Benner, Casimer M. DeCusatis
-
Publication number: 20110139497Abstract: A system of via structures disposed in a substrate. The system includes a first via structure that comprises an outer conductive layer, an inner insulating layer, and an inner conductive layer disposed in the substrate. The outer conductive layer separates the inner insulating layer and the substrate and the inner insulating layer separates the inner conductive layer and the outer conductive layer. A first signal of a first complementary pair passes through the inner conductive layer and a second signal of the first complementary pair passes through the outer conductive layer. In different embodiments, a method of forming a via structure in an electronic substrate is provided.Type: ApplicationFiled: December 14, 2009Publication date: June 16, 2011Applicant: QUALCOMM INCORPORATEDInventors: Xia Li, Wei Zhao, Yu Cao, Shiqun Gu, Seung H. Kang, Ming-Chu King
-
Patent number: 7839647Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.Type: GrantFiled: December 30, 2008Date of Patent: November 23, 2010Assignee: Foxconn Advanced Technology, Inc.Inventors: Wen-Chin Lee, Cheng-Hsien Lin
-
Patent number: 7629533Abstract: A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: GrantFiled: March 13, 2007Date of Patent: December 8, 2009Assignee: Temptronic CorporationInventors: Kenneth M. Cole, Sr., Michael F. Conroy, Edward Lowerre, James Pelrin
-
Publication number: 20090236141Abstract: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.Type: ApplicationFiled: September 29, 2008Publication date: September 24, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi-Ja Han, Hyo-Jic Jung
-
Publication number: 20090224376Abstract: A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector.Type: ApplicationFiled: May 8, 2008Publication date: September 10, 2009Inventors: Bok Kyu CHOI, Sang Joon LIM, Eul Chul JANG
-
Publication number: 20090146665Abstract: Shields for feedthrough pin insulators of a hot cathode ionization gauge are provided to increase the operational lifetime of the ionization gauge in harmful process environments. Various shield materials, designs, and configurations may be employed depending on the gauge design and other factors. In one embodiment, the shields may include apertures through which to insert feedthrough pins and spacers to provide an optimal distance between the shields and the feedthrough pin insulators before the shields are attached to the gauge. The shields may further include tabs used to attach the shields to components of the gauge, such as the gauge's feedthrough pins. Through use of example embodiments of the insulator shields, the life of the ionization gauge is extended by preventing gaseous products from a process in a vacuum chamber or material sputtered from the ionization gauge from depositing on the feedthrough pin insulators and causing electrical leakage from the gauge's electrodes.Type: ApplicationFiled: November 24, 2008Publication date: June 11, 2009Applicant: Brooks Automation, Inc.Inventor: Richard A. Knott