Shielded Patents (Class 174/350)
  • Patent number: 11099246
    Abstract: A medical image diagnosis system according to one embodiment includes a gantry, a couch, a reflecting plate, and a processing circuitry. The gantry is for medical imaging having a bore. The couch movably supports a top plate. The reflecting plate reflects an image output from an image output device. The processing circuitry, in a first case where the image is shown to an observer not through the reflecting plate, outputs a first image signal relating to a first image to the image output device. While in a second case where the image is shown to the observer through the reflecting plate, The processing circuitry outputs a second image signal relating to a second image to the image output device.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: August 24, 2021
    Assignee: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Takahiro Ohmure, Yu Ueda, Kazuya Tanoue
  • Patent number: 11095295
    Abstract: A spur measurement system uses a first device with a spur cancellation circuit that cancel spurs responsive to a frequency control word identifying a spurious tone of interest. A device under test generates a clock signal and supplies the clock signal to the first device through an optional divider. The spur cancellation circuit in the first device generates sine and cosine weights at the spurious tone of interest as part of the spur cancellation process. A first magnitude of the spurious tone in a phase-locked loop in the first device is determined according to the sine and cosine weights and a second magnitude of the spurious tone in the clock signal is determined by the first magnitude divided by gains associated with the first device.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 17, 2021
    Inventors: Timothy A. Monk, Rajesh Thirugnanam
  • Patent number: 11092831
    Abstract: A liquid crystal module includes a display panel, a back frame, a bezel, and a molded frame. The bezel includes an R_cover component and a B_cover component that are separate from each other. The R_cover component and the B_cover component each include a first conductor disposed on a surface of a front surface region facing the display panel; and a first extension section that extends to a position at which the first extension section is in contact with the back frame. A second conductor that overlaps a joint of the R_cover component and the B_cover component in a front view is disposed on molded frame; and a second extension section that extends to a position at which the second extension section is in contact with the back frame.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: August 17, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masato Kazama, Kazuya Honda, Yoshirou Kawasoe, Taizou Takeuchi, Takafumi Umitani
  • Patent number: 11049817
    Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 29, 2021
    Assignee: NXP B.V.
    Inventors: Chayathorn Saklang, Amornthep Saiyajitara, Chanon Suwankasab, Russell Joseph Lynch
  • Patent number: 11007656
    Abstract: A robot unit includes a robot main body that is an arm-type robot including multiple links connected to one another via at least one joint, and one or more protective housings that cover and protect at least a portion of a circumferential surface of one or more of the multiple links. One or more fastening portions that attach and detach the protective housing are provided on a circumferential surface of the one or more of the multiple links.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: May 18, 2021
    Assignee: OKUMA CORPORATION
    Inventor: Shoichi Morimura
  • Patent number: 11006373
    Abstract: A user equipment (UE) may determine an amount of energy with which the UE is able to transmit in a first network. The UE may send, to a base station, information indicating the determined amount of energy. The UE may receive, from the base station, scheduling information based on the information indicating the determined amount of energy. The base station may receive, from the UE, the information indicating the amount of energy with which the UE is able to transmit in a first network. The base station may determine scheduling information based on the information indicating the amount of energy with which the UE is able to transmit in the first network, and the scheduling information may prevent the UE from exceeding a threshold amount of energy for a time period. The base station may send, to the UE, information indicating the scheduling information.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: May 11, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Junsheng Han, Raghu Narayan Challa, Timo Ville Vintola, Reza Shahidi
  • Patent number: 10925538
    Abstract: Example headsets and electrodes are described herein. Example electrode units described herein include a housing defining a cavity, conductive paste disposed on an inner wall of the cavity and an electrode disposed in the cavity and spaced apart from the inner wall of the cavity. The electrode extends from the cavity, and the conductive paste is to shield the electrode from noise.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: February 23, 2021
    Assignee: The Nielsen Company (US), LLC
    Inventors: Marko Jovanovic, Kashyap Fruitwala, Mohammad Moradi, Batia Bertho, Reimond Bausse, Mehran Mahinpour Tirooni, Yakob Badower
  • Patent number: 10923644
    Abstract: An embedded electrode substrate for a transparent light emitting device display that includes a transparent substrate; an adhesive layer provided on the transparent substrate; and a wiring electrode portion and a light emitting device mounted portion embedded in the adhesive layer, and the wiring electrode portion comprises a first metal foil pattern, and comprises a blackening layer on both an upper surface and a side surface of the first metal foil pattern, and the light emitting device mounted portion comprises a second metal foil pattern and comprises the blackening layer only on the side surface of the second metal foil pattern.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: February 16, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Kiseok Lee, Kun Seok Lee, Yong Goo Son, Seung Heon Lee
  • Patent number: 10912529
    Abstract: A method for determining a current remaining time during a measurement for the purpose of medical imaging, an evaluation unit, a medical imaging device, and a computer program product are provided. The method provides for a permitted operating range and an item of extrapolation information regarding the critical event to be provided. The current remaining time is determined by an evaluation unit based on the permitted operating range and the item of extrapolation information.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: February 9, 2021
    Assignee: Siemens Healthcare GmbH
    Inventor: Rainer Schneider
  • Patent number: 10868415
    Abstract: An exterior member of an electrical wire includes a first tubular body and a second tubular body. The first tubular body includes a hollow portion through which the electrical wire is inserted, an opening portion from which the electrical wire is drawn out, and a vent portion which is impermeable to moisture and permeable to air. The second tubular body is provided to extend from the first tubular body and to cover an outer periphery of the electrical wire drawn from the opening portion, and is made of a material more flexible than a material of the first tubular body.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: December 15, 2020
    Assignee: Yazaki Corporation
    Inventors: Yuto Ito, Yohei Koseki
  • Patent number: 10814609
    Abstract: Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: October 27, 2020
    Assignee: Massachusetts Institute of Technology
    Inventor: Isaac Mayer Ehrenberg
  • Patent number: 10820457
    Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 27, 2020
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Daisuke Kishi, Shota Mori, Takahiro Matsuzawa, Tsutomu Hayasaka
  • Patent number: 10536762
    Abstract: A microphone device includes a case that has a circuit board therein; a microphone capsule that is apart from the case and has a plurality of sound collecting parts arranged on a surface of a sphere at predetermined intervals; pillars that support the microphone capsule and couple the first end face of the case and the microphone capsule; pillars that support the microphone capsule, and a protrusion part that is placed between the pillars and protrudes from the first end face toward the microphone capsule. The protrusion part is formed such that its diameter becomes smaller from a root coupled to the first end face toward a tip.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: January 14, 2020
    Assignee: AUDIO-TECHNICA CORPORATION
    Inventor: Yusuke Sano
  • Patent number: 10522518
    Abstract: A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: December 31, 2019
    Assignee: Bench Walk Lighting, LLC
    Inventors: Keat Chaun Ng, Bit Tie Chan, Kheng Leng Tan
  • Patent number: 10490988
    Abstract: An electrical outlet cover with a lid having a configurable protrusion or recess to accommodate different uses and weather resistance states. The electrical outlet cover includes a base coupled to an electrical outlet and a lid hingedly coupled to the base along a first side. The lid includes a frame with a central aperture and a telescoping enclosure with a flange at a front edge of a sleeve, the flange extending outward from the sleeve. The sleeve may include a ledge extending outward from the sleeve adjacent a back edge of the sleeve on at least two sides of the sleeve. The sleeve is slidably coupled within the central aperture and movable between an expanded position and a collapsed position. The flange may abut the frame in the collapsed position and the ledge may abut the frame in the expanded position.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 26, 2019
    Inventors: Jeffrey P. Baldwin, John Klein
  • Patent number: 10470345
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Heung Ye, Jung-Je Bang, Jeong-Ung Kim, Ki-Youn Jang
  • Patent number: 10386432
    Abstract: A radiofrequency (RF) shielding conduits that can be embedded within a doorframe and/or a door of a magnetic resonance imaging (MRI) room are disclosed. The RF shielding conduits can form, upon closing of door onto the doorframe, an RF shielding channel to enclose and/or allow passage of tubing of medical equipment extending from an interior of the MRI room to an environment that is external to the MRI room, while providing a RF shielding of the MRI room.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 20, 2019
    Assignee: ASPECT IMAGING LTD.
    Inventors: Shmuel Azulay, Uri Rapoport
  • Patent number: 10368165
    Abstract: A motor vehicle and/or water craft horn, comprising: at least one capacitor (C2) of about 220-10000 ?F connected in parallel at the input terminals of the horn power supply to eliminate electromagnetic interference caused by electromagnetic radiation, conduction, and coupling. Also provided are a method of eliminating motor vehicle and/or water craft horn electromagnetic interference, an electronic device for using on a motor vehicle and/or water craft, and a motor vehicle and/or water craft. The present invention solves the problem of overrun out of limit of conducted emission (CE) and radiated emission (RE) when a motor vehicle or water craft uses a horn for CIRS 25 testing, thus enabling the horn EMC index to meet the standard.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: July 30, 2019
    Inventor: Yu Wan
  • Patent number: 10349565
    Abstract: An electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 9, 2019
    Assignee: Apple Inc.
    Inventors: Kurtis J. Mundell, Sina Bigdeli
  • Patent number: 10278296
    Abstract: A shroud including a body comprising a first side, a second side opposite the first side, and a printed circuit board assembly (“PCBA”) reception unit configured to receive a PCBA unit of an electronic device, wherein the PCBA unit comprises multiple light emitting diode (“LED”) units which emit multiple light emitting diode (“LED”) signals. The shroud can also include a plurality of ribs located on the body and configured to contact a cover for the electronic device, wherein the plurality of ribs are configured to substantially isolate each of the multiple LED signals, and wherein the body and the plurality of ribs comprise a resilient material.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 30, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Bruce A. Cariker, Kevin M. Takeuchi, Takashi Kono
  • Patent number: 10257624
    Abstract: A hearing aid is described which incorporates an antenna integrated into the housing or shell. The hearing aid shell may constructed by forming an inner shell portion, disposing an antenna on an outer surface of the inner shell portion, and forming an outer shell portion around the inner shell portion. In various embodiments, the hearing aid shell may be constructed using an injection molding process or a 3D printing process.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: April 9, 2019
    Assignee: Starkey Laboratories, Inc.
    Inventors: Jay Rabel, Thomas Spaulding, Thomas Blaise Bergner
  • Patent number: 10224126
    Abstract: The present invention provides a transparent conductor that is excellent in conductivity, transparency, and low-reflection property and does not cause defects such as a moiré pattern; and a touch panel including the transparent conductor. The transparent conductor of the present invention includes an anti-reflection film provided on a surface with projections formed at a pitch equal to or shorter than the wavelength of visible light; and metal fine particles each having a particle size equal to or smaller than the pitch of the projections and being placed in bottom portions of gaps between the projections, the metal fine particles placed in the gaps between the projections constituting mesh conductive portions. The touch panel of the present invention includes the above transparent conductor.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: March 5, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Nobuaki Yamada, Kenichiro Nakamatsu
  • Patent number: 10067527
    Abstract: A conductive sheet has a structure in which a conductive adhesive layer laminated on one side of a base substrate and a light-shielding insulating layer laminated on another side of the base substrate. The base substrate has a structure in which the same kind of metal layers are formed on respective sides of a resin film. The light-shielding insulating layer of the conductive sheet has a surface having a surface resistivity of 1.0×108 ?/square or more, a gloss value of 80% or less, and an optical density of 1 or more.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: September 4, 2018
    Assignee: DEXERIALS CORPORATION
    Inventor: Daisuke Kuroda
  • Patent number: 10051765
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: August 14, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Patent number: 10015915
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 3, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Patent number: 9992875
    Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: June 5, 2018
    Assignee: Semblant Limited
    Inventor: Elizabeth Williams-Duncan
  • Patent number: 9991228
    Abstract: A semiconductor device includes an electronic component and a wiring structural body located below the electronic component. The wiring structural body includes an insulation layer and a wiring layer that is connected to an electrode terminal of the electronic component. The semiconductor device also includes a wiring shield body arranged on a side surface of the wiring structural body, an encapsulation resin covering an upper surface of the wiring structural body and a side surface of the electronic component, and a component shield body covering a surface of the encapsulation resin and continuously covering an upper surface side of the electronic component. The wiring shield body is connected to the component shield body. The wiring shield body includes an exposed side surface that is coplanar with a side surface of the component shield body.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: June 5, 2018
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Ken Miyairi
  • Patent number: 9921382
    Abstract: Example telecommunications apparatus (100) include an enclosure (103) having an enclosure base (101) and a enclosure cover (102) that join together at a sealed interface. The enclosure cover (102) is latchable to the enclosure base (101). A splice tray assembly (106) is disposed within the interior (104) of the enclosure (103). The splice tray assembly (106) includes splice trays (150) mounted to a manager insert. A splitter (192) may be provided on the manager insert. The manager insert also may include a groove plate (160) latched to abase plate (180). One or more port assemblies (107-109) enable cables to enter and/or exit the enclosure (103) through sealed cable ports (145-147). The port assemblies (107-109) may provide anchors (214, 234) for cable strength members and/or organizers (243, 244, 253, 254) for fiber tubes.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: March 20, 2018
    Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBA
    Inventors: Bart Mattie Claessens, Dirk Kempeneers, Wouter Jan Renild Foulon
  • Patent number: 9846459
    Abstract: Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: December 19, 2017
    Assignee: EntIT Software LLC
    Inventor: John Lewis
  • Patent number: 9844160
    Abstract: An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: December 12, 2017
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventor: James Lee
  • Patent number: 9819893
    Abstract: A television tuner module includes a tuner that is configured to receive a television broadcast signal; a first shield member that surrounds the tuner and a second shield member that surrounds the first shield member.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: November 14, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bright Seo, Hyun-jun Kim, Sung-soo Lee
  • Patent number: 9777126
    Abstract: The invention provides new composite materials containing aerogels blended with thermoplastic polymer materials at a weight ratio of aerogel to thermoplastic polymer of less than 20:100. The composite materials have improved thermal insulation ability. The composite materials also have better flexibility and less brittleness at low temperatures than the parent thermoplastic polymer materials.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: October 3, 2017
    Assignee: The United States of America as Represented by the Administrator of NASA
    Inventors: Martha K. Williams, Trent M. Smith, James E. Fesmire, Luke B. Roberson, LaNetra M. Clayton
  • Patent number: 9773720
    Abstract: A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first metallic plate; a first adhesive insulating layer and a second adhesive insulating layer disposed on the first metallic plate; a first metallic land for main electrode wiring disposed on the first adhesive insulating layer; and a first metallic land for signal wiring disposed on the second adhesive insulating layer. There can be provided a power module having reduced cost, reduced warpage of the whole of a substrate, stabilized quality, and improved reliability; and a fabrication method for such a power module.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: September 26, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Katsuhiko Yoshihara, Masao Saito
  • Patent number: 9748193
    Abstract: A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 29, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-ja Kim, Jun-young Ko
  • Patent number: 9640288
    Abstract: A pliable multilayer blanket configured as a particle radiation shield, the blanket including multiple layers. A first layer of the multiple layers is composed of a first material and a second layer of the multiple layers is composed of a second material, different from the first material, each layer being less than 20 mils thick. At least one of the first material and the second material is a metal or metal alloy having an atomic number (Z) of at least 29.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: May 2, 2017
    Assignee: Space Systems/Loral, LLC
    Inventor: Kit Pui Frankie Wong
  • Patent number: 9260946
    Abstract: The embodiments describe a power cell for deepwater application including an power cell housing, a capacitor bank, an electronic module, and input/output connectors, wherein the power cell housing is essentially made of an insulating material. The embodiments further describe a power cell system including a number of power cells, a frame for supporting the power cells, and electric connections, in particular, a busbar arrangement for connecting to the power cell.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: February 16, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: Boerge Sneisen
  • Patent number: 9252544
    Abstract: A plugging and unplugging module case includes a body and a positioning element. The body has a plugging and unplugging opening. The positioning element has a positioning elastic body and a second engaging unit. The positioning element is disposed outside the body. The second engaging unit is a second engaging post for engaging with the first engaging hole. The body is of lower hardness than the positioning element. Hence, the positioning element quickly engages with the body, whereas the positioning elastic body is quickly positioned at a positioning hole so as to enhance the efficiency of the assembly of the plugging and unplugging module.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: February 2, 2016
    Assignee: ALL BEST PRECISION TECHNOLOGY CO., LTD.
    Inventor: Haven Yang
  • Patent number: 9113549
    Abstract: Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: August 18, 2015
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Craig Steinbeiser, Khiem Dinh, Anthony Chiu
  • Patent number: 9040824
    Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: May 26, 2015
    Assignee: Samtec, Inc.
    Inventors: Keith Guetig, Shashi Chuganey, Travis Ellis, Eric Korff
  • Patent number: 9042119
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: May 26, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Publication number: 20150129296
    Abstract: The present invention relates to a shielding system for conductor cables as well as to a method for producing said shielding system. The system is characterized in that it comprises a corrugated tube (20) coated with one or more thin films of high electrical conductivity material (30) which are reversibly adhered to the surface of said corrugated tube (20) so that said coating can be uncoupled from the corrugated tube due to high bending values of the tube itself. The shielding system according to the present invention therefore combines the excellent shielding efficacy values of a system having thin metal films with the excellent flexibility properties of a corrugated plastic tube.
    Type: Application
    Filed: May 9, 2013
    Publication date: May 14, 2015
    Inventors: Claudio Damiano Cataldo, Marco De Giorgi, Paolo Cittadini
  • Publication number: 20150126139
    Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
    Type: Application
    Filed: December 19, 2014
    Publication date: May 7, 2015
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Publication number: 20150114708
    Abstract: A cable backplane system includes a tray having a frame with side walls surrounding a raceway. The side walls extend to a front edge of the frame. The tray includes spacers coupled to the tray located proximate to the front edge. Cable connectors are held by corresponding spacers in position relative to the backplane. The cable backplane system includes an electromagnetic radiation (EMR) absorber extending along an opening in the tray to suppress the propagation of EMR into or out of the tray.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: Tyco Electronics Corporation
    Inventor: Jared Evan Rossman
  • Publication number: 20150107890
    Abstract: A cable having a conducting member made from a nanostructure-based material, and a shielding layer made of nanostructure-based material. The shielding layer can be circumferentially situated about the conducting member so as to enhance conductivity along the conducting member. A coupling mechanism may be situated between the shielding layer and the conducting member so as to secure the shielding layer in its position on the conducting member. A method of making the cable is also disclosed.
    Type: Application
    Filed: August 29, 2014
    Publication date: April 23, 2015
    Inventors: Jennifer Mann, David S. Lashmore, Brian White, Peter L. Antoinette
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 8995146
    Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: March 31, 2015
    Assignee: Semblant Limited
    Inventors: Andrew Simon Hall Brooks, Timothy Allan Von Werne
  • Patent number: 8993886
    Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 31, 2015
    Assignee: AMX LLC
    Inventor: Phong Le
  • Publication number: 20150083481
    Abstract: Seal assemblies in which a seal member having an energizer located in a seal body groove is positioned inside a housing cavity of a housing are disclosed. The sealing member and the energizer, which can be an O-ring or a spring energizer, can be retained inside the housing cavity by positioning a portion of the energizer in a groove in the housing cavity in a locking or latching engagement. Methods of making and using seal assemblies are also disclosed.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventor: Mike Foster
  • Patent number: 8988896
    Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG
    Inventors: Detlev Wittmer, Ulrich Kaiser
  • Patent number: 8988897
    Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Edward C. Gillard, Don A. Gilliland, John S. Maas