Shielded Patents (Class 174/350)
  • Patent number: 10536762
    Abstract: A microphone device includes a case that has a circuit board therein; a microphone capsule that is apart from the case and has a plurality of sound collecting parts arranged on a surface of a sphere at predetermined intervals; pillars that support the microphone capsule and couple the first end face of the case and the microphone capsule; pillars that support the microphone capsule, and a protrusion part that is placed between the pillars and protrudes from the first end face toward the microphone capsule. The protrusion part is formed such that its diameter becomes smaller from a root coupled to the first end face toward a tip.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: January 14, 2020
    Assignee: AUDIO-TECHNICA CORPORATION
    Inventor: Yusuke Sano
  • Patent number: 10522518
    Abstract: A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: December 31, 2019
    Assignee: Bench Walk Lighting, LLC
    Inventors: Keat Chaun Ng, Bit Tie Chan, Kheng Leng Tan
  • Patent number: 10490988
    Abstract: An electrical outlet cover with a lid having a configurable protrusion or recess to accommodate different uses and weather resistance states. The electrical outlet cover includes a base coupled to an electrical outlet and a lid hingedly coupled to the base along a first side. The lid includes a frame with a central aperture and a telescoping enclosure with a flange at a front edge of a sleeve, the flange extending outward from the sleeve. The sleeve may include a ledge extending outward from the sleeve adjacent a back edge of the sleeve on at least two sides of the sleeve. The sleeve is slidably coupled within the central aperture and movable between an expanded position and a collapsed position. The flange may abut the frame in the collapsed position and the ledge may abut the frame in the expanded position.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 26, 2019
    Inventors: Jeffrey P. Baldwin, John Klein
  • Patent number: 10470345
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Heung Ye, Jung-Je Bang, Jeong-Ung Kim, Ki-Youn Jang
  • Patent number: 10386432
    Abstract: A radiofrequency (RF) shielding conduits that can be embedded within a doorframe and/or a door of a magnetic resonance imaging (MRI) room are disclosed. The RF shielding conduits can form, upon closing of door onto the doorframe, an RF shielding channel to enclose and/or allow passage of tubing of medical equipment extending from an interior of the MRI room to an environment that is external to the MRI room, while providing a RF shielding of the MRI room.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 20, 2019
    Assignee: ASPECT IMAGING LTD.
    Inventors: Shmuel Azulay, Uri Rapoport
  • Patent number: 10368165
    Abstract: A motor vehicle and/or water craft horn, comprising: at least one capacitor (C2) of about 220-10000 ?F connected in parallel at the input terminals of the horn power supply to eliminate electromagnetic interference caused by electromagnetic radiation, conduction, and coupling. Also provided are a method of eliminating motor vehicle and/or water craft horn electromagnetic interference, an electronic device for using on a motor vehicle and/or water craft, and a motor vehicle and/or water craft. The present invention solves the problem of overrun out of limit of conducted emission (CE) and radiated emission (RE) when a motor vehicle or water craft uses a horn for CIRS 25 testing, thus enabling the horn EMC index to meet the standard.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: July 30, 2019
    Inventor: Yu Wan
  • Patent number: 10349565
    Abstract: An electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 9, 2019
    Assignee: Apple Inc.
    Inventors: Kurtis J. Mundell, Sina Bigdeli
  • Patent number: 10278296
    Abstract: A shroud including a body comprising a first side, a second side opposite the first side, and a printed circuit board assembly (“PCBA”) reception unit configured to receive a PCBA unit of an electronic device, wherein the PCBA unit comprises multiple light emitting diode (“LED”) units which emit multiple light emitting diode (“LED”) signals. The shroud can also include a plurality of ribs located on the body and configured to contact a cover for the electronic device, wherein the plurality of ribs are configured to substantially isolate each of the multiple LED signals, and wherein the body and the plurality of ribs comprise a resilient material.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 30, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Bruce A. Cariker, Kevin M. Takeuchi, Takashi Kono
  • Patent number: 10257624
    Abstract: A hearing aid is described which incorporates an antenna integrated into the housing or shell. The hearing aid shell may constructed by forming an inner shell portion, disposing an antenna on an outer surface of the inner shell portion, and forming an outer shell portion around the inner shell portion. In various embodiments, the hearing aid shell may be constructed using an injection molding process or a 3D printing process.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: April 9, 2019
    Assignee: Starkey Laboratories, Inc.
    Inventors: Jay Rabel, Thomas Spaulding, Thomas Blaise Bergner
  • Patent number: 10224126
    Abstract: The present invention provides a transparent conductor that is excellent in conductivity, transparency, and low-reflection property and does not cause defects such as a moiré pattern; and a touch panel including the transparent conductor. The transparent conductor of the present invention includes an anti-reflection film provided on a surface with projections formed at a pitch equal to or shorter than the wavelength of visible light; and metal fine particles each having a particle size equal to or smaller than the pitch of the projections and being placed in bottom portions of gaps between the projections, the metal fine particles placed in the gaps between the projections constituting mesh conductive portions. The touch panel of the present invention includes the above transparent conductor.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: March 5, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Nobuaki Yamada, Kenichiro Nakamatsu
  • Patent number: 10067527
    Abstract: A conductive sheet has a structure in which a conductive adhesive layer laminated on one side of a base substrate and a light-shielding insulating layer laminated on another side of the base substrate. The base substrate has a structure in which the same kind of metal layers are formed on respective sides of a resin film. The light-shielding insulating layer of the conductive sheet has a surface having a surface resistivity of 1.0×108 ?/square or more, a gloss value of 80% or less, and an optical density of 1 or more.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: September 4, 2018
    Assignee: DEXERIALS CORPORATION
    Inventor: Daisuke Kuroda
  • Patent number: 10051765
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: August 14, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Patent number: 10015915
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 3, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Patent number: 9991228
    Abstract: A semiconductor device includes an electronic component and a wiring structural body located below the electronic component. The wiring structural body includes an insulation layer and a wiring layer that is connected to an electrode terminal of the electronic component. The semiconductor device also includes a wiring shield body arranged on a side surface of the wiring structural body, an encapsulation resin covering an upper surface of the wiring structural body and a side surface of the electronic component, and a component shield body covering a surface of the encapsulation resin and continuously covering an upper surface side of the electronic component. The wiring shield body is connected to the component shield body. The wiring shield body includes an exposed side surface that is coplanar with a side surface of the component shield body.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: June 5, 2018
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Ken Miyairi
  • Patent number: 9992875
    Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: June 5, 2018
    Assignee: Semblant Limited
    Inventor: Elizabeth Williams-Duncan
  • Patent number: 9921382
    Abstract: Example telecommunications apparatus (100) include an enclosure (103) having an enclosure base (101) and a enclosure cover (102) that join together at a sealed interface. The enclosure cover (102) is latchable to the enclosure base (101). A splice tray assembly (106) is disposed within the interior (104) of the enclosure (103). The splice tray assembly (106) includes splice trays (150) mounted to a manager insert. A splitter (192) may be provided on the manager insert. The manager insert also may include a groove plate (160) latched to abase plate (180). One or more port assemblies (107-109) enable cables to enter and/or exit the enclosure (103) through sealed cable ports (145-147). The port assemblies (107-109) may provide anchors (214, 234) for cable strength members and/or organizers (243, 244, 253, 254) for fiber tubes.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: March 20, 2018
    Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBA
    Inventors: Bart Mattie Claessens, Dirk Kempeneers, Wouter Jan Renild Foulon
  • Patent number: 9846459
    Abstract: Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: December 19, 2017
    Assignee: EntIT Software LLC
    Inventor: John Lewis
  • Patent number: 9844160
    Abstract: An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: December 12, 2017
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventor: James Lee
  • Patent number: 9819893
    Abstract: A television tuner module includes a tuner that is configured to receive a television broadcast signal; a first shield member that surrounds the tuner and a second shield member that surrounds the first shield member.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: November 14, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bright Seo, Hyun-jun Kim, Sung-soo Lee
  • Patent number: 9777126
    Abstract: The invention provides new composite materials containing aerogels blended with thermoplastic polymer materials at a weight ratio of aerogel to thermoplastic polymer of less than 20:100. The composite materials have improved thermal insulation ability. The composite materials also have better flexibility and less brittleness at low temperatures than the parent thermoplastic polymer materials.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: October 3, 2017
    Assignee: The United States of America as Represented by the Administrator of NASA
    Inventors: Martha K. Williams, Trent M. Smith, James E. Fesmire, Luke B. Roberson, LaNetra M. Clayton
  • Patent number: 9773720
    Abstract: A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first metallic plate; a first adhesive insulating layer and a second adhesive insulating layer disposed on the first metallic plate; a first metallic land for main electrode wiring disposed on the first adhesive insulating layer; and a first metallic land for signal wiring disposed on the second adhesive insulating layer. There can be provided a power module having reduced cost, reduced warpage of the whole of a substrate, stabilized quality, and improved reliability; and a fabrication method for such a power module.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: September 26, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Katsuhiko Yoshihara, Masao Saito
  • Patent number: 9748193
    Abstract: A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 29, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-ja Kim, Jun-young Ko
  • Patent number: 9640288
    Abstract: A pliable multilayer blanket configured as a particle radiation shield, the blanket including multiple layers. A first layer of the multiple layers is composed of a first material and a second layer of the multiple layers is composed of a second material, different from the first material, each layer being less than 20 mils thick. At least one of the first material and the second material is a metal or metal alloy having an atomic number (Z) of at least 29.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: May 2, 2017
    Assignee: Space Systems/Loral, LLC
    Inventor: Kit Pui Frankie Wong
  • Patent number: 9260946
    Abstract: The embodiments describe a power cell for deepwater application including an power cell housing, a capacitor bank, an electronic module, and input/output connectors, wherein the power cell housing is essentially made of an insulating material. The embodiments further describe a power cell system including a number of power cells, a frame for supporting the power cells, and electric connections, in particular, a busbar arrangement for connecting to the power cell.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: February 16, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: Boerge Sneisen
  • Patent number: 9252544
    Abstract: A plugging and unplugging module case includes a body and a positioning element. The body has a plugging and unplugging opening. The positioning element has a positioning elastic body and a second engaging unit. The positioning element is disposed outside the body. The second engaging unit is a second engaging post for engaging with the first engaging hole. The body is of lower hardness than the positioning element. Hence, the positioning element quickly engages with the body, whereas the positioning elastic body is quickly positioned at a positioning hole so as to enhance the efficiency of the assembly of the plugging and unplugging module.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: February 2, 2016
    Assignee: ALL BEST PRECISION TECHNOLOGY CO., LTD.
    Inventor: Haven Yang
  • Patent number: 9113549
    Abstract: Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: August 18, 2015
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Craig Steinbeiser, Khiem Dinh, Anthony Chiu
  • Patent number: 9042119
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: May 26, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Patent number: 9040824
    Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: May 26, 2015
    Assignee: Samtec, Inc.
    Inventors: Keith Guetig, Shashi Chuganey, Travis Ellis, Eric Korff
  • Publication number: 20150129296
    Abstract: The present invention relates to a shielding system for conductor cables as well as to a method for producing said shielding system. The system is characterized in that it comprises a corrugated tube (20) coated with one or more thin films of high electrical conductivity material (30) which are reversibly adhered to the surface of said corrugated tube (20) so that said coating can be uncoupled from the corrugated tube due to high bending values of the tube itself. The shielding system according to the present invention therefore combines the excellent shielding efficacy values of a system having thin metal films with the excellent flexibility properties of a corrugated plastic tube.
    Type: Application
    Filed: May 9, 2013
    Publication date: May 14, 2015
    Inventors: Claudio Damiano Cataldo, Marco De Giorgi, Paolo Cittadini
  • Publication number: 20150126139
    Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
    Type: Application
    Filed: December 19, 2014
    Publication date: May 7, 2015
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Publication number: 20150114708
    Abstract: A cable backplane system includes a tray having a frame with side walls surrounding a raceway. The side walls extend to a front edge of the frame. The tray includes spacers coupled to the tray located proximate to the front edge. Cable connectors are held by corresponding spacers in position relative to the backplane. The cable backplane system includes an electromagnetic radiation (EMR) absorber extending along an opening in the tray to suppress the propagation of EMR into or out of the tray.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: Tyco Electronics Corporation
    Inventor: Jared Evan Rossman
  • Publication number: 20150107890
    Abstract: A cable having a conducting member made from a nanostructure-based material, and a shielding layer made of nanostructure-based material. The shielding layer can be circumferentially situated about the conducting member so as to enhance conductivity along the conducting member. A coupling mechanism may be situated between the shielding layer and the conducting member so as to secure the shielding layer in its position on the conducting member. A method of making the cable is also disclosed.
    Type: Application
    Filed: August 29, 2014
    Publication date: April 23, 2015
    Inventors: Jennifer Mann, David S. Lashmore, Brian White, Peter L. Antoinette
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 8995146
    Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: March 31, 2015
    Assignee: Semblant Limited
    Inventors: Andrew Simon Hall Brooks, Timothy Allan Von Werne
  • Patent number: 8993886
    Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 31, 2015
    Assignee: AMX LLC
    Inventor: Phong Le
  • Publication number: 20150083481
    Abstract: Seal assemblies in which a seal member having an energizer located in a seal body groove is positioned inside a housing cavity of a housing are disclosed. The sealing member and the energizer, which can be an O-ring or a spring energizer, can be retained inside the housing cavity by positioning a portion of the energizer in a groove in the housing cavity in a locking or latching engagement. Methods of making and using seal assemblies are also disclosed.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventor: Mike Foster
  • Patent number: 8988897
    Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Edward C. Gillard, Don A. Gilliland, John S. Maas
  • Patent number: 8988896
    Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG
    Inventors: Detlev Wittmer, Ulrich Kaiser
  • Patent number: 8976539
    Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Phillip J. Edwards, Jignesh H. Shah, Lance R. Thompson, Nhan Huynh
  • Patent number: 8975517
    Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: March 10, 2015
    Assignee: Daishinku Corporation
    Inventors: Naoki Kohda, Hiroki Yoshioka
  • Patent number: 8976540
    Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: March 10, 2015
    Assignee: LG Electronics Inc.
    Inventor: Mansung Yoo
  • Patent number: 8969737
    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: March 3, 2015
    Assignee: Apple Inc.
    Inventors: Andrew B. Just, Trent Weber, Shigefumi Honjo
  • Publication number: 20150044906
    Abstract: An HDMI cable, an HDMI connector and an HDMI interface for a high-definition video/audio apparatus are provided. The HDMI interface includes the HDMI connector and the HDMI cable. The HDMI connector includes a connecting terminal having an extending cable terminal arranged in parallel in a main body. The HDMI cable includes at least one connecting unit consisting of a plurality of parallel metal wires. An insulating unit covers an outside of a face of the connecting unit, in such a manner that the metal wires are parallel and isolated from each other. The present invention is using design of single row of the connector terminal and single row of the HDMI cable, to simplify an HDMI interface structure and reduce size and weight, and manual identification is not required for pin bit definitions, which simplifies production process, reduces the manual work, and greatly improves production efficiency.
    Type: Application
    Filed: May 15, 2014
    Publication date: February 12, 2015
    Inventors: Nanlv Tian, Jianyun Tang, Minhua Lu, Shijun Liu, Ming Wang
  • Publication number: 20150027771
    Abstract: A composite electromagnetic-wave-absorbing sheet comprising (a) a first electromagnetic-wave-absorbing film 10a comprising a plastic film 11, and a single- or multi-layer thin metal film formed on at least one surface of the plastic film 12, the thin metal film 12 being provided with large numbers of substantially parallel, intermittent, linear scratches 122 with irregular widths and irregular intervals in plural directions, and (b) a second electromagnetic-wave-absorbing film 20 composed of a resin or a rubber in which magnetic particles or non-magnetic, conductive particles are dispersed.
    Type: Application
    Filed: November 29, 2012
    Publication date: January 29, 2015
    Inventor: Seiji KAGAWA
  • Publication number: 20150014047
    Abstract: A method and apparatus for EMI protection is disclosed. Particularly, the present invention is directed to an article of manufacture for electromagnetic interference shielding comprising a cylindrically-shaped sleeve constructed of a conductive fabric adapted to provide electromagnetic interference shielding by conducting at least a portion of electromagnetic radiation, wherein the cylindrically-shaped sleeve is made by rolling a piece of conductive fabric into a cylindrical shape such that opposing sides of the piece of conductive fabric are joined together resulting in the cylindrically-shaped sleeve having a seam at a junction of the opposing sides. In one embodiment, opposing sides of the piece of conductive fabric are sewn together.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 15, 2015
    Inventors: Sheldon Hutchison, Greg Halstead
  • Publication number: 20150014048
    Abstract: An electromagnetic interference shield used in room construction materials for the protection from satellite surveillance that has a first surface, a second surface where the first surface and the second surface are configured to attach to each other and where the first surface and the second surface are separable from each; a third surface where the second surface and the third surface are configured to attach to each other and where the second surface and third surface are separable from each other; a fourth surface where the third surface and fourth surface are configured to attach to each other and where the third surface and fourth surface are separable from each other.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 15, 2015
    Inventor: Kelvin Berrman Harrison
  • Patent number: 8895874
    Abstract: Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: November 25, 2014
    Assignee: Averatek Corp.
    Inventors: Sunity Kumar Sharma, Alex Newsom Beavers, Jr., Thomas Furst
  • Publication number: 20140326484
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Application
    Filed: October 12, 2012
    Publication date: November 6, 2014
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Publication number: 20140327510
    Abstract: An electronic device includes a structure. The structure includes a first set of through glass vias (TGVs) and a second set of TGVs. The first set of TGVs includes a first via and the second set of TGVs includes a second via. The first via has a different cross-sectional shape than the second via.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 6, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Daeik D. Kim, David F. Berdy, Chengjie Zuo, Mario Francisco Velez, Changhan Yun, Robert P. Mikulka, Jonghae Kim, Je-Hsiung Lan
  • Publication number: 20140318852
    Abstract: A shield structure and a wire harness are provided which can improve a working property, reduce the number of parts and lower a cost when a shield member is fixed and integrally formed. In the shield structure, a tubular electromagnetic shield member 40 is fixed to and formed integrally with a motor side connecting part 42 and an inverter side connecting part 43 by a resin molding. Specifically, the motor side connecting part 42 and the inverter side connecting part 43 are formed as electrically conductive molded products and an integral molding operation is carried out when a terminal part of the electromagnetic shield member 40 is integrally formed with the electrically conductive molded products respectively.
    Type: Application
    Filed: November 21, 2012
    Publication date: October 30, 2014
    Applicant: Yazaki Corporation
    Inventors: Hideomi Adachi, Yoshiaki Ozaki