Inserted Contact Member Patents (Class 174/368)
  • Patent number: 11122718
    Abstract: A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated for housing EMI emitting devices, the internal volume is isolated by at least 80 decibels. The data processing device further includes a thermal management system adapted to control a flow of gas through the internal volume. The data processing device further includes a chassis, adapted to mount to a frame. The chassis includes the internal volume and the thermal management system. The thermal management system is disposed outside of the internal volume.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 14, 2021
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks
  • Patent number: 11076497
    Abstract: A storage device carrier system includes a carrier assembly configured to releasably engage a storage device and configured to be releasably received within a storage device bay within an IT component. An electrical coupler assembly is configured to electrically couple the storage device to the IT component. A thermal sealing assembly is configured to reduce the leakage of cooling air from around the storage device carrier system.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 27, 2021
    Assignee: EMC IP Holding Company, LLC
    Inventors: Haifang Zhai, Yujie Zhou, Xiaoping Wu, Wei Dong
  • Patent number: 10980159
    Abstract: A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated and a communication system, disposed in the internal volume, that: determines a first EMI state of at least one device of devices disposed in the internal volume; makes a determination that the first EMI state is an EMI emitting state; and disables communications by the communication system using a high-speed connection while allowing the communications using a low-speed connection.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: April 13, 2021
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks, Chadwick Thomas Berry
  • Patent number: 10925196
    Abstract: The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: February 16, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Todd David Pleake, John Terpsma, Ketan Shah, David Carter Vandervoort, Keith Walter Kaatz
  • Patent number: 10869415
    Abstract: A system for providing electromagnetic interference (EMI) suppression includes a data processing device. The data processing device includes a payload module that suppresses EMI from an internal volume to an ambient environment by greater than 90 decibels; the internal volume adapted to house EMI emitting devices that generate EMI; and an input control system disposed within the internal volume. The input control system includes a command input device translatable along axes and adapted to mechanically input commands into the EMI emitting devices.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: December 15, 2020
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks
  • Patent number: 10765037
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: September 1, 2020
    Assignee: Chatsworth Products, Inc.
    Inventors: Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 10568239
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: February 18, 2020
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 10420258
    Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: September 17, 2019
    Assignee: CAREFUSION 303, INC.
    Inventors: Michael Rahilly, Edward Stephen Ferner, Jr., Brendan John Burgess, Scott Riley, Michael Dugan Joyce, Noe Arroyo, Chris Pedersen
  • Patent number: 10334761
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: June 25, 2019
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 10222842
    Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: March 5, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter George Ross, Michael David Marr, Darin Lee Frink, James R. Hamilton
  • Patent number: 10123462
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: November 6, 2018
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 10057994
    Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: August 21, 2018
    Assignee: INTEL CORPORATION
    Inventors: Thomas A. Boyd, Michael Z. Eckblad
  • Patent number: 9801309
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: October 24, 2017
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 9516795
    Abstract: A sheet metal cover for a printed circuit board (PCB) includes a plurality of legs continuous with a substantially planar elevated section. The legs are attached to the PCB, and electrical connections are provided between the legs and an internal ground plane of the PCB at the attachment locations. The sheet metal cover is thereby grounded, inhibiting the transmission of electromagnetic signals through the sheet metal cover. The elevated section of the sheet metal cover prevents select electronic devices on the PCB from being viewed or probed. Openings through the sheet metal cover allow heat sinks or heat generating electronic devices (e.g., inductors) to be exposed through these openings, thereby facilitating cooling of these elements by airflow. An electrically conductive gasket attached to the underside of the elevated section may contact the heat sinks, further minimizing the radiation of EMI emissions.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: December 6, 2016
    Assignee: Brocade Communications Systems, Inc
    Inventors: Alston C. Moore, Jr., Mark G. Siechen
  • Patent number: 9449478
    Abstract: Example embodiments of the present invention relate to a method and apparatus for visually and audibly indicating the setup and maintenance of a system.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: September 20, 2016
    Inventors: Kimon Papakos, Mark E Boduch
  • Patent number: 9443403
    Abstract: Example embodiments of the present invention relate to a method and apparatus for visually and audibly indicating the setup and maintenance of a system.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: September 13, 2016
    Inventors: Kimon Papakos, Mark E Boduch
  • Patent number: 8742576
    Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: June 3, 2014
    Assignee: Oracle International Corporation
    Inventors: Hiren D. Thacker, Hyung Suk Yang, Ivan Shubin, John E. Cunningham
  • Patent number: 8610002
    Abstract: Cover for electronic equipment including at least two movable metal panel elements. The panel elements are joined together along their respective edges, so they are joined together and in relation to each other immobile state form the cover. The invention is wherein the cover includes a respective connector for mechanical joining and good electric contacting along each one of the edges along which the panel elements are arranged to be joined together, in that each connector includes a respective resilient metal contacting device, which contacting device is arranged between the respectively joined together panel elements and in direct contact with both panel elements when the panel elements are in the joined together state, and thereby is compressed against the spring force of the contacting device, so that the spring force acts against the surfaces of both the respective joined together panel elements and connects them to each other electrically.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: December 17, 2013
    Assignee: Clamco Invest AB
    Inventor: Bertil Lohman
  • Patent number: 8547703
    Abstract: Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: October 1, 2013
    Assignee: Sony Corporation
    Inventors: Yoshitaka Aoki, Hitoshi Kimura
  • Patent number: 8522484
    Abstract: The present invention is a wide channel door frame cooperating with a wide width knife edge of a door and latching mechanism: to accommodate a gap between finger stock seals when the wide knife edge door is in the open position, to provide electrical connectivity between the door and door frame when the wide knife edge door is received into the wide channel door frame in the closed position, to accommodate ease of manufacturing a straight channel, to accommodate ease of cleaning the channel after installation of the finger stock seals, and to accommodate ease of closing/latching and opening/delatching the door. An alternative embodiment includes a third strip of beryllium copper finger stock seals attached to the base of the channel for increased electrical conductivity or the addition of weather seals for exterior applications. Wide channels and knife edges can be made of desirable material, for example 304 stainless steel.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: September 3, 2013
    Assignee: Gaven Industries, Inc.
    Inventor: John J. Gaviglia
  • Patent number: 8203084
    Abstract: An electrical connector assembly includes an electrically conductive cage having a cage end configured for mounting in a panel opening. The cage has a compartment for receiving a pluggable electrical component therein. The cage end has a circumference defined by an exterior surface of the cage. A retention frame extends over the cage end along at least a portion of the circumference. The retention frame includes a gasket side and a rear side. A retention opening extends through the gasket and rear sides of the retention frame. An EMI gasket is mounted on the cage end. The EMI gasket includes a length of electrically conductive cord having opposite cord ends. The cord is wrapped externally around the cage end forming a continuous band that engages the exterior surface of the cage along at least a portion of the circumference. The cord extends along and engages the gasket side of the retention frame and the cord ends extend through the retention opening and along the rear side of the retention frame.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: June 19, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Robert Harrison Wertz, Jr., Matthew Ryan Schmitt, James Charles Shiffler, Scott P. Drescher
  • Patent number: 8178792
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: May 15, 2012
    Assignee: Raytheon Company
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown
  • Patent number: 7963031
    Abstract: In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: June 21, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Naoyuki Koizumi, Kiyoshi Oi, Akihiko Tateiwa
  • Patent number: 7906735
    Abstract: A seal including a base and a conductor mounted to conduct current from a source disposed on a first side of said base to a sink disposed on a second side of said base. In the illustrative embodiment, the base is annular (ring-shaped) and fabricated of airtight, watertight and/or electrically insulating and/or conductive material such as rubber, TeflonĀ®, silver impregnated TeflonĀ®, or other suitable substance. In the illustrative embodiment, the conductor is a single strip of conductive material and the base has a recess to allow for deflection thereof. In the best mode, plural conductors are mounted within the annular base. Each conductor has a brush at each end thereof. The brushes are provided by a split(s) at the end of each strip effective to create multiple fingertips. Each strip is secured at an angle in a slot in the base and retained further by an anchor. The anchor is integral with the strip and transverse to the longitudinal axis thereof.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: March 15, 2011
    Assignee: Raytheon Company
    Inventors: James D. Strayer, Daniel P. Brown, Patricia S. Dean
  • Patent number: 7884288
    Abstract: A screened housing (1) with press-fit pins (2) for electrical contacting on an electrical support component, in particular for automobile application, is composed of two housing sections (14,15) each including a housing base (3) each with two housing edges (4) with press-fit pins (2). Above all a screened housing is achieved by the invention with press-fit pins around all four circumferential sides which can be produced simply and economically in a follow-on composite tool. Such screened housings are particularly suitable for automobile applications for screening electrical components from incoming or emitting electromagnetic radiation.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: February 8, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Frank Meyer, Wolfgang Puscher
  • Publication number: 20100263924
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Application
    Filed: June 8, 2010
    Publication date: October 21, 2010
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown
  • Patent number: 7812263
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: October 12, 2010
    Assignee: Raytheon Company
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown
  • Patent number: 7619169
    Abstract: The disclosed device is directed towards an electromagnetic compatibility clip comprising a body having a first side and a second side opposite the first side. The first side is configured to contact a top surface of a chassis separator and a bottom surface of the chassis separator. The second side of the body is configured to contact an upper module mounted on the upper surface of the chassis separator. The second side of the body is configured to contact a lower module mounted on the lower surface of the chassis separator. The body is configured to maintain electrical contact between the chassis separator, the upper module and the lower module. A locking portion is defined in the body. The locking portion is configured to interlock with the chassis separator. A compression force control element is defined in the body. At least one spring contact is defined in the body.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: November 17, 2009
    Assignee: Cisco Technologies, Inc.
    Inventors: Phong Hoang Ho, Sean P. Ryan, Stephen Aubrey Scearc
  • Patent number: 7612299
    Abstract: A shielding assembly (100) for protecting several modules from electromagnetic interference, includes a cage (40) installable on a circuit board (200), a first gasket (20), and a second gasket (50). The cage includes a front end portion (41), a cover (42), a base (48), and at least one interior wall (44). The cover, the at least one interior wall and the base cooperatively define at least two spaces (400) for receiving the modules. The first gasket encircles the front end portion of the cage. The first gasket electrically and mechanically contacts the cover and the base to provide an electromagnetic interference seal between the cage and a device in which the cage is mounted. The second gasket attaches against the cage and the circuit board respectively so as to electrically shield the modules in the cage from electromagnetic interference.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: November 3, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Jian-Ping Chen
  • Patent number: 7570495
    Abstract: An electromagnetic shielding device (ESD) is disposed on a PCB and includes a cover and a conductive rubber frame. The cover is made of a conductive material. and a through hole. The conductive rubber frame encloses the periphery region of the cover, and the partial conductive rubber frame fills in the through hole to affix the conductive rubber frame onto the cover. The conductive rubber frame contacts the PCB and is electrically connected to a ground end of the PCB. The cover and the conductive rubber frame enclose an electronic component disposed on the PCB.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: August 4, 2009
    Assignee: ASUSTeK Computer Inc.
    Inventor: Min-Che Kao
  • Patent number: 7504591
    Abstract: An electromagnetic shielding gasket is provided, which is capable of reducing the amount of projection from the inner surface of a first opposing wall having gasket holding holes and is less likely to come off through the gasket holding holes in the direction from the inner surface side toward the outer surface side of the first opposing wall. A communication device as an electronic device has a device body having a plural number of sub-casings and electromagnetic shielding gaskets 1. A first opposing wall 102a disposed on the sub-casing of the device body includes a plural number of gasket holding holes 104 and gasket guiding holes. The electromagnetic shielding gasket 1 has a gasket body 2 and a plural number of fitting parts 4 and come-off stopping parts 3. The fitting parts 4 are guided in the gasket guiding holes and then fitted in the gasket holding holes.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: March 17, 2009
    Assignee: Uber Co., Ltd.
    Inventor: Teizou Awaji
  • Patent number: 7491898
    Abstract: An arrangement for shielding a gap between a pair of adjacently disposed electrically conductive structural members in a radio frequency shielded enclosure against leakage of radio frequency. The shielding arrangement includes a first compressible shielding member and a first retaining member for positioning the first shielding member adjacent an edge portion of one of such pair of structural members. There is a second compressible shielding member and a second retaining member for positioning the second shielding member adjacent an edge of opposed one of such pair of structural members, whereby each of the first and the second shielding members is compressed by an opposed one of the first and the second retaining means for shielding such gap against the leakage of radio frequency. One of such pair of structural members may be a personnel access door.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: February 17, 2009
    Inventor: Daniel Villanella
  • Patent number: 7371967
    Abstract: A protective cable guide and separator assembly. A first handle is coupled to first ends of a plurality of RF cables and a second end is coupled to second ends of the plurality of RF cables. At least one resilient portion is between the first and second handle portions for receiving and retaining the plurality of RF cables. The resilient portion protects the RF cables and maintains consistent spacing between each RF cable relative one another.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: May 13, 2008
    Assignee: Scientific-Atlanta, Inc.
    Inventors: William G. MaHoney, G. Lucius Herrmann
  • Patent number: 7292447
    Abstract: A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: November 6, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co. Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wan-Lin Xia, Tao Li, Jun Long