Polymeric Gasket Patents (Class 174/370)
  • Patent number: 11947222
    Abstract: An electronic device is provided. The electronic device includes a first substrate having a peripheral area, a first inorganic layer disposed on the first substrate, an insulating layer disposed on the first inorganic layer and formed a recess, and a second inorganic layer disposed on the insulating layer and formed in the recess. The recess is disposed in the peripheral area. A thickness of the second inorganic layer is less than a thickness of the insulating layer.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 2, 2024
    Assignee: Innolux Corporation
    Inventors: Fiona Jhan, Lavender Cheng
  • Patent number: 11591842
    Abstract: Lightweight, glidable shielded components (e.g. doors) may be used in conjunction with accredited enclosures to provide electromagnetic, acoustic and CBR protection.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: February 28, 2023
    Inventor: Marc Cordes
  • Patent number: 11500248
    Abstract: A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: November 15, 2022
    Assignee: Innolux Corporation
    Inventors: Fiona Jhan, Lavender Cheng
  • Patent number: 11051397
    Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: June 29, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Cesar Verdugo Muñoz, Jorge Luis Pineda, Edgar Antonio Martinez, Daniel Murillo, Adrian Flores Baca
  • Patent number: 10999957
    Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 4, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Nam Gyun Yim, Eun Bae Park, Hong Seok Lee, Jong Yun Kim, Woo Sung Jung, Mi Jung Kim, Chang Ju Lee, Hee Sun Oh
  • Patent number: 10421096
    Abstract: Systems and methods for applying sealant to a seam between a first work piece and a second work piece, including applying a fillet layer of the sealant to cover the seam, applying a first flaring layer of the sealant adjacent the fillet layer and contacting the fillet layer and the first work piece, applying a second flaring layer of the sealant that contacts the second work piece, and applying at least one filling layer of the sealant so that the filling layers of the sealant in combination contact each of the first flaring layer, the fillet layer, and the second flaring layer.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: September 24, 2019
    Assignee: The Boeing Company
    Inventors: Don David Trend, Jake Boyce Weinmann, Frederick B. Frontiera
  • Patent number: 10051724
    Abstract: Embodiments disclosed herein relate to an apparatus that provides structural support and an electrical ground for components of an electronic device. Specifically, one or more embodiments of the present disclosure provide a semi-rigid member having at least one screw boss. An electronic component is coupled to the semi-rigid member. In embodiments, the electronic component is coupled to the semi-rigid member using the at least one screw boss. As a separate component, the semi-rigid member is configured to provide an electrical ground for the electronic component and also provides structural support for the electronic component.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: August 14, 2018
    Assignee: Apple Inc.
    Inventors: Derryk C. Davis, John M. Brock, Peteris K. Augenbergs
  • Patent number: 9529211
    Abstract: An eyeglass holding device constructed of a cord wherein both terminal ends of the cord are secured to a U-shaped clip. Wherein each U-shaped clip utilizes a canted coil spring attached to the inner portion of the U-shaped clip, which, when a U-shaped clip is secured to each arm of the eyeglasses creates a loop such that the eyeglasses can be secured around the head or neck of a wearer.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: December 27, 2016
    Inventors: Karen Ryder, Andrew Streett
  • Patent number: 8907229
    Abstract: Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: December 9, 2014
    Assignee: Innochips Technology Co., Ltd.
    Inventors: In-Kil Park, Dae Kyum Kim
  • Publication number: 20140268583
    Abstract: An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventor: Xueru Ding
  • Patent number: 8283576
    Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 9, 2012
    Assignee: Rittal GmbH & Co. KG
    Inventors: Michael Schell, Tobias Becker, Igor Harry Schaaf
  • Patent number: 8073503
    Abstract: A wireless device having a remote station portion, such as a cellular telephone, PDA, laptop computer, handheld computer, or the like and a removably connectable medical device portion, such as a blood glucose monitor or the like, is provided. The medical device portion is separated from the remote station portion by an isolation circuit and electromagnetic shielding to inhibit the electronics and radio frequency transmission of the remote station portion interfering with the medical device. Moreover, a control processor in the remote station portion has a battery management module to disable functions as the charge in the power source falls to provide sufficient power for operation of the medical device.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: December 6, 2011
    Assignee: Qualcomm Incorporated
    Inventors: Guilherme Luiz Karnas Hoefel, Liren Chen, Jack Steenstra, Kirk S. Taylor, Yang Zhang
  • Patent number: 7476815
    Abstract: A gasket for an electronic device for providing shielding against electromagnetic interference. The gasket is intended to be mounted between a first structural part and a second structural part of the electronic device. The gasket comprises conductive sealant paste and a carrier structure on which the sealant paste rests. The conductive sealant paste rests on the carrier structure as sealant paste areas such that the sealant paste areas are at apertures comprised by the carrier structure that perforate the carrier structure, being supported on the carrier structure and thus generating galvanic connections through said sealant paste areas at the apertures perforating the carrier structure from a first side of the carrier structure to a second side of the carrier structure.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: January 13, 2009
    Assignee: Nokia Corporation
    Inventor: Jouko Vesa
  • Publication number: 20090000818
    Abstract: According to various aspects, exemplary embodiments are provided of EMI shields, such as EMI gaskets. One exemplary embodiment includes a gasket that is deflectable into a collapsed orientation between first and second surfaces. The gasket may have a body of indefinite length and a base with a generally flat outer surface. The gasket may also include an upright portion extending generally upwardly away from the base such that the body has a generally inverted T-shaped profile collectively defined by the base and the upright portion. There may be one or more perforations adjacent the intersection of the upright portion and the base. The gasket may be deflectable between the first and second surfaces into the collapsed orientation characterized in that the upright portion bends generally downwardly towards the base with substantially continuous contact being maintained between the outer surface of the base and the second surface.
    Type: Application
    Filed: August 25, 2007
    Publication date: January 1, 2009
    Inventor: Michael Poulsen
  • Patent number: 7446265
    Abstract: An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Parker Hannifin Corporation
    Inventors: Eric G. Krohto, Lawrence J. Denefrio, Peter Jones, John C. Ariel, Matthew T. Gagnon, Douglas Nobbs, George R. Watchko, Marc E. LaRosse
  • Patent number: 7378603
    Abstract: An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: May 27, 2008
    Assignee: International Business Machines Corporation
    Inventors: Gary F. Goth, John J. Loparco, Andrew Rybak, John G. Torok
  • Patent number: 7375291
    Abstract: A strip gasket utilizing a low closure force on an enclosing face for shielding electromagnetic interference is disclosed. The strip gasket includes an outer surface and an inner surface. The inner surface provides a hollow cross section region. Bending moments are created on surface peripheries of the inner surface and the outer surface, or both, to provide a low closure force on an enclosing face. The bending moment results in an increased surface area of the strip gasket providing a low resistance. Cauchy's stress analysis reveals that a lower force is required to compress the strip gasket as compared to conventional strip gaskets.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: May 20, 2008
    Assignee: Parker-Hannifin Corporation
    Inventor: John C. Ariel
  • Patent number: 7326862
    Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a thin metal sheet, and a second member formed of an electrically-conductive composite material comprising an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: February 5, 2008
    Assignee: Parker-Hannifin Corporation
    Inventors: William G. Lionetta, Louis M. Yantosca, Jr., Daniel S. Ventura, Robert E. Stiffler, David C. Rich
  • Patent number: 7262369
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: August 28, 2007
    Assignee: Laird Technologies, Inc.
    Inventor: Gerald Robert English
  • Patent number: 7256355
    Abstract: A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: August 14, 2007
    Assignee: Research In Motion Limited
    Inventors: Herrebertus Tempelman, Robert W. Phillips
  • Patent number: 7214888
    Abstract: Described is an adaptable electromagnetic interference and radio frequency interference (EMI/RFI) shield adapted to reduce unwanted EMI/RFI at an electrically conductive equipment panel having an elongated aperture. The aperture provides external access to a mounting bracket of an expansion board assembly. The mounting bracket (e.g., for a PCI expansion board) abuts an interior surface of the equipment panel at the elongated aperture and includes an angled flange extending through the elongated aperture. The EMI/RFI shield includes an electrically conductive shield extension slidable between open and closed positions. The shield extension includes a flange receptacle for receiving the angled flange of the mounting bracket and a shielding plate. The shielding plate overlaps an adjustable portion of the elongated aperture such that in a closed position the shielding plate together with the mounting bracket cover substantially the entire elongated aperture.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: May 8, 2007
    Assignee: EMC Corporation
    Inventors: Lawrence J. Feroli, Albert F. Beinor, Jr., C. Ilhan Gundogan, W. Brian Cunningham, Michael J. Kozel