Polymeric Gasket Patents (Class 174/370)
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Patent number: 12137515Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.Type: GrantFiled: March 30, 2021Date of Patent: November 5, 2024Assignee: APTIV TECHNOLOGIES AGInventors: Scott D. Brandenburg, David W. Zimmerman, Navneet Gupta
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Patent number: 11947222Abstract: An electronic device is provided. The electronic device includes a first substrate having a peripheral area, a first inorganic layer disposed on the first substrate, an insulating layer disposed on the first inorganic layer and formed a recess, and a second inorganic layer disposed on the insulating layer and formed in the recess. The recess is disposed in the peripheral area. A thickness of the second inorganic layer is less than a thickness of the insulating layer.Type: GrantFiled: October 12, 2022Date of Patent: April 2, 2024Assignee: Innolux CorporationInventors: Fiona Jhan, Lavender Cheng
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Patent number: 11591842Abstract: Lightweight, glidable shielded components (e.g. doors) may be used in conjunction with accredited enclosures to provide electromagnetic, acoustic and CBR protection.Type: GrantFiled: August 17, 2021Date of Patent: February 28, 2023Inventor: Marc Cordes
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Patent number: 11500248Abstract: A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.Type: GrantFiled: July 31, 2020Date of Patent: November 15, 2022Assignee: Innolux CorporationInventors: Fiona Jhan, Lavender Cheng
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Patent number: 11051397Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.Type: GrantFiled: April 2, 2020Date of Patent: June 29, 2021Assignee: Skyworks Solutions, Inc.Inventors: Cesar Verdugo Muñoz, Jorge Luis Pineda, Edgar Antonio Martinez, Daniel Murillo, Adrian Flores Baca
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Patent number: 10999957Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.Type: GrantFiled: November 13, 2018Date of Patent: May 4, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gye Won Lee, Nam Gyun Yim, Eun Bae Park, Hong Seok Lee, Jong Yun Kim, Woo Sung Jung, Mi Jung Kim, Chang Ju Lee, Hee Sun Oh
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Patent number: 10421096Abstract: Systems and methods for applying sealant to a seam between a first work piece and a second work piece, including applying a fillet layer of the sealant to cover the seam, applying a first flaring layer of the sealant adjacent the fillet layer and contacting the fillet layer and the first work piece, applying a second flaring layer of the sealant that contacts the second work piece, and applying at least one filling layer of the sealant so that the filling layers of the sealant in combination contact each of the first flaring layer, the fillet layer, and the second flaring layer.Type: GrantFiled: May 21, 2018Date of Patent: September 24, 2019Assignee: The Boeing CompanyInventors: Don David Trend, Jake Boyce Weinmann, Frederick B. Frontiera
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Patent number: 10051724Abstract: Embodiments disclosed herein relate to an apparatus that provides structural support and an electrical ground for components of an electronic device. Specifically, one or more embodiments of the present disclosure provide a semi-rigid member having at least one screw boss. An electronic component is coupled to the semi-rigid member. In embodiments, the electronic component is coupled to the semi-rigid member using the at least one screw boss. As a separate component, the semi-rigid member is configured to provide an electrical ground for the electronic component and also provides structural support for the electronic component.Type: GrantFiled: January 30, 2015Date of Patent: August 14, 2018Assignee: Apple Inc.Inventors: Derryk C. Davis, John M. Brock, Peteris K. Augenbergs
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Patent number: 9529211Abstract: An eyeglass holding device constructed of a cord wherein both terminal ends of the cord are secured to a U-shaped clip. Wherein each U-shaped clip utilizes a canted coil spring attached to the inner portion of the U-shaped clip, which, when a U-shaped clip is secured to each arm of the eyeglasses creates a loop such that the eyeglasses can be secured around the head or neck of a wearer.Type: GrantFiled: August 19, 2015Date of Patent: December 27, 2016Inventors: Karen Ryder, Andrew Streett
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Patent number: 8907229Abstract: Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.Type: GrantFiled: October 14, 2011Date of Patent: December 9, 2014Assignee: Innochips Technology Co., Ltd.Inventors: In-Kil Park, Dae Kyum Kim
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Publication number: 20140268583Abstract: An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Inventor: Xueru Ding
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Patent number: 8283576Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.Type: GrantFiled: November 29, 2007Date of Patent: October 9, 2012Assignee: Rittal GmbH & Co. KGInventors: Michael Schell, Tobias Becker, Igor Harry Schaaf
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Patent number: 8073503Abstract: A wireless device having a remote station portion, such as a cellular telephone, PDA, laptop computer, handheld computer, or the like and a removably connectable medical device portion, such as a blood glucose monitor or the like, is provided. The medical device portion is separated from the remote station portion by an isolation circuit and electromagnetic shielding to inhibit the electronics and radio frequency transmission of the remote station portion interfering with the medical device. Moreover, a control processor in the remote station portion has a battery management module to disable functions as the charge in the power source falls to provide sufficient power for operation of the medical device.Type: GrantFiled: November 6, 2007Date of Patent: December 6, 2011Assignee: Qualcomm IncorporatedInventors: Guilherme Luiz Karnas Hoefel, Liren Chen, Jack Steenstra, Kirk S. Taylor, Yang Zhang
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Patent number: 7476815Abstract: A gasket for an electronic device for providing shielding against electromagnetic interference. The gasket is intended to be mounted between a first structural part and a second structural part of the electronic device. The gasket comprises conductive sealant paste and a carrier structure on which the sealant paste rests. The conductive sealant paste rests on the carrier structure as sealant paste areas such that the sealant paste areas are at apertures comprised by the carrier structure that perforate the carrier structure, being supported on the carrier structure and thus generating galvanic connections through said sealant paste areas at the apertures perforating the carrier structure from a first side of the carrier structure to a second side of the carrier structure.Type: GrantFiled: July 1, 2005Date of Patent: January 13, 2009Assignee: Nokia CorporationInventor: Jouko Vesa
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Publication number: 20090000818Abstract: According to various aspects, exemplary embodiments are provided of EMI shields, such as EMI gaskets. One exemplary embodiment includes a gasket that is deflectable into a collapsed orientation between first and second surfaces. The gasket may have a body of indefinite length and a base with a generally flat outer surface. The gasket may also include an upright portion extending generally upwardly away from the base such that the body has a generally inverted T-shaped profile collectively defined by the base and the upright portion. There may be one or more perforations adjacent the intersection of the upright portion and the base. The gasket may be deflectable between the first and second surfaces into the collapsed orientation characterized in that the upright portion bends generally downwardly towards the base with substantially continuous contact being maintained between the outer surface of the base and the second surface.Type: ApplicationFiled: August 25, 2007Publication date: January 1, 2009Inventor: Michael Poulsen
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Patent number: 7446265Abstract: An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.Type: GrantFiled: April 14, 2006Date of Patent: November 4, 2008Assignee: Parker Hannifin CorporationInventors: Eric G. Krohto, Lawrence J. Denefrio, Peter Jones, John C. Ariel, Matthew T. Gagnon, Douglas Nobbs, George R. Watchko, Marc E. LaRosse
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Patent number: 7378603Abstract: An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.Type: GrantFiled: October 28, 2005Date of Patent: May 27, 2008Assignee: International Business Machines CorporationInventors: Gary F. Goth, John J. Loparco, Andrew Rybak, John G. Torok
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Patent number: 7375291Abstract: A strip gasket utilizing a low closure force on an enclosing face for shielding electromagnetic interference is disclosed. The strip gasket includes an outer surface and an inner surface. The inner surface provides a hollow cross section region. Bending moments are created on surface peripheries of the inner surface and the outer surface, or both, to provide a low closure force on an enclosing face. The bending moment results in an increased surface area of the strip gasket providing a low resistance. Cauchy's stress analysis reveals that a lower force is required to compress the strip gasket as compared to conventional strip gaskets.Type: GrantFiled: May 18, 2006Date of Patent: May 20, 2008Assignee: Parker-Hannifin CorporationInventor: John C. Ariel
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Patent number: 7326862Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a thin metal sheet, and a second member formed of an electrically-conductive composite material comprising an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.Type: GrantFiled: January 26, 2004Date of Patent: February 5, 2008Assignee: Parker-Hannifin CorporationInventors: William G. Lionetta, Louis M. Yantosca, Jr., Daniel S. Ventura, Robert E. Stiffler, David C. Rich
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Patent number: 7262369Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.Type: GrantFiled: May 10, 2006Date of Patent: August 28, 2007Assignee: Laird Technologies, Inc.Inventor: Gerald Robert English
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Patent number: 7256355Abstract: A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.Type: GrantFiled: July 14, 2004Date of Patent: August 14, 2007Assignee: Research In Motion LimitedInventors: Herrebertus Tempelman, Robert W. Phillips
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Patent number: 7214888Abstract: Described is an adaptable electromagnetic interference and radio frequency interference (EMI/RFI) shield adapted to reduce unwanted EMI/RFI at an electrically conductive equipment panel having an elongated aperture. The aperture provides external access to a mounting bracket of an expansion board assembly. The mounting bracket (e.g., for a PCI expansion board) abuts an interior surface of the equipment panel at the elongated aperture and includes an angled flange extending through the elongated aperture. The EMI/RFI shield includes an electrically conductive shield extension slidable between open and closed positions. The shield extension includes a flange receptacle for receiving the angled flange of the mounting bracket and a shielding plate. The shielding plate overlaps an adjustable portion of the elongated aperture such that in a closed position the shielding plate together with the mounting bracket cover substantially the entire elongated aperture.Type: GrantFiled: March 30, 2006Date of Patent: May 8, 2007Assignee: EMC CorporationInventors: Lawrence J. Feroli, Albert F. Beinor, Jr., C. Ilhan Gundogan, W. Brian Cunningham, Michael J. Kozel