Abstract: An electromagnetic compatibility (EMC) housing having a first part and a second part for forming an enclosure when fitted together. The first and second parts include first and second interface surfaces respectively, for compressing a gasket interposed between the interface surfaces when the first and second parts are fitted together. At least one of the first and second interface surfaces includes a plurality of undercut regions for reducing compression of the gasket in the region when the first and second parts are fitted together.

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

Abstract: A robotic system with a robot and enclosure, the robotic system configured for explosive (EX) Zone 1 certification. Fasteners attaching a panel to a housing of the enclosure can be positioned away from a seal of the panel, with the seal sealingly engaging the panel and housing when the panel is attached to the housing. The panel overlapping a portion of the housing when attached to the housing, with at least the overlapped portion having a metallized layer and the metallized layer being electrically coupled to the panel when the panel is attached. The panel can be rotationally attached to the housing by one or more hinges. The panel can be configured to assist operators with manual manipulation of the panel by attaching detachable handles to the panel.

Abstract: A component for a cage is for holding electronic devices in a computing system. The component includes a cover with a hook, an emboss, and a main panel. The cover may be couplable to the cage by the hook and emboss. The component also includes a partition with a primary panel. The partition may be couplable to the cage by the primary panel. The cover is detachable from the partition. After the cover is detached from the partition, the cover may be rotated approximately 180 degrees and reinstalled into the cage. The cover may also include another emboss to fix the cover into the cage when the cover is installed in a rotated position. The cage may also include a top portion and a bottom portion. The top and bottom portions of the cage may include features that assist the partition and the cover to maintain a fixed position.

Abstract: Solid state and hybrid circuit protection devices include improved chemical, static discharge and impact resistant housing construction, arc-free switching operation, secure terminal assemblies and thermal management features. The solid state and hybrid circuit protection devices are ignition protected and avoid possible explosions and therefore obviate a need for conventional explosion-proof enclosures to ensure safe operation of an electrical power system in a potentially explosive environment.

Abstract: According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.

Abstract: A housing for accommodating a single or multi-part printed circuit board includes an opening in a first housing side for inserting the printed circuit board, at least one guide rail having a groove for receiving the printed circuit board and being situated on at least one first housing side wall of a group of housing side walls running perpendicularly to the first housing side. The guide rail is configured to receive a peg disposed on one of the printed circuit board parts. The guide rail runs from the first housing side towards a second housing side opposite the first housing side, so that the end of the guide rail near the first housing side is further away than the other end of the guide rail from the housing side wall which is oriented perpendicularly to the first housing side wall and is closest to the guide rail.

Abstract: An electromagnetic interference (“EMI”) sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.

Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.

Abstract: An electromagnetic wave absorber includes: a first layer having a first enclosing layer that encloses an electromagnetic wave radiator, and a first metal film formed on the first enclosing layer.

Abstract: A chassis structure including a box body is provided. The box body includes a main plate and a plurality of side plates. The main plate includes a hollow region and a bent component adjoining to the hollow region, wherein the bent component includes a folded edge connected to the hollow region. The side plates surround a periphery of the main plate and define an accommodating space. Therefore, manufacturing costs are saved, a manufacturing process is simplified, and smoothness and neatness in appearance are maintained.

Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

Abstract: Disclosed is an apparatus of housing component which includes a case which accommodates a component, a cover which covers the case, and a sealant applied on a joining surface at which the case and the cover join together, wherein a step is formed at the joining surface.

Abstract: A slide mount assembly for attachment to a wall or other structure in a location behind a mounted display and for mounting of electronics equipment. The slide mount assembly includes a base frame configured to attach to a structure and frame having a mounting flange with holes for use in securing the base frame to the structure. A slide frame is slidably attached to the base frame by at least one slide assembly. The slide frame includes flanges that are attached to a slide frame plate, each flange having a plurality of spaced apart apertures. A mounting plate is attached to the slide frame and has a planar portion. At least one mounting tab is formed on and extends outward from the upper and lower edges of the mounting plate. Each mounting tab is configured to engage with one of the mounting apertures on the slide frame.

Abstract: A housing for a circuit assembly includes a housing interior chamber, an electromagnetic radiation-impermeable partition wall that divides the housing interior chamber into (a) a first housing interior chamber partial region configured to receive a first electrical component designed as a filter component and (b) a second housing interior chamber partial region configured to receive a second electrical component, an electromagnetic radiation-impermeable cover plate, and an electromagnetic radiation-impermeable housing section directly adjacent to the first housing interior chamber region. The partition wall, the cover plate, and the housing section enclose the first housing interior chamber partial region in three dimensions, creating a complete electromagnetic shielding of the first housing interior chamber partial region from the second housing interior chamber partial region. A circuit assembly having such a housing can be cost-effectively produced and has a reduced scope.

Abstract: A method for manufacturing a bottomed cuboid battery container includes: forming a first member by folding one piece of a first flat sheet, the first member being constructed of a quadrilateral bottom surface and first paired side surfaces, the first paired side surfaces continuing from the bottom surface and being oppose each other; and forming the bottomed cuboid battery container by welding each of a second flat sheet and a third flat sheet to the first member such that the second flat sheet and the third flat sheet oppose each other and constitute second paired side surfaces. The second flat sheet and the first member are welded from one direction. The third flat sheet and the first member are welded from one direction.

Abstract: This disclosure relates to a computer case configured to fix an interface card. The computer case includes a main body, a plurality of mount brackets and a framework. The main body includes a first hole and a plurality of second holes. The plurality of second holes are located at a side of the first hole. The plurality of mount brackets are located at the first hole. The framework is conductive. The framework includes a plurality of protrusion portions and a plurality of main portions. The plurality of protrusion portions are connected to the plurality of main portions and are respectively inserted in the plurality of second holes. The framework is disposed on the main body via the plurality of protrusion portions. The plurality of main portions are respectively in contact with the plurality of mount brackets.

Abstract: A compliant electronics assembly mount frame and package are provided. The compliant frame may include a number of spring features configured to flexibly maintain and/or orient an attached PCBA inside a thermal conduction package. These spring features disposed in the compliant frame may be shaped, sized, and even tuned, to bias heat generating components attached to the PCBA evenly against a thermally controlled surface of the thermal package. The frame may be made or stamped from metal, such as sheet metal, and may be formed to include one or more integral spring features.

Abstract: A shielding case frame has a frame main body and a suction structure. The suction structure is connected with the frame main body through at least one precut structure. The precut structure has extension parts arranged on the suction structure, a pressing part connected with the extension parts and a precut part. The pressing part is connected with the frame main body through the precut part. A bottom surface or/and a top surface of the precut part is provided with a precut groove.

Abstract: An assembling component includes a frame and a cover. The frame has an opening, a first plane, and a first assembling structure. The first plane surrounds and is adjacent to the opening. An area of the opening is larger than an area of the first plane. The first assembling structure is formed on the first plane. The cover covers the opening and the first plane and has a second assembling structure. A side of the cover has a second plane parallel to the first plane. The second assembling structure is formed on the second plane. An end of the second assembling structure extends from the second plane toward another side of the cover. The second assembling structure is assembled with the first assembling structure to stop the cover from moving relative to the frame.

Abstract: In accordance with an aspect of the present disclosure, a remote control device includes a first housing; a first transmission circuit for emitting a first infrared light in a direction in which a first face of the first housing; a second transmission circuit for emitting a second infrared light in a direction in which a second face of the first housing; a window for covering at least part of the first transmission circuit and to transmit the first infrared light; a window button for covering at least part of the second transmission circuit and to transmit the second infrared light emitted; and a second housing, wherein the second housing covers a specified region of the first housing if the window button is coupled with hole of the second housing, and exposes the specified region outside the second housing if the window button is separated from the hole.

Abstract: A signal leakage proof housing for signal distributors includes a metal case and a metal cover plate. The metal case includes a plurality of signal connection terminals and a circumferential side wall having a top surface. The top surface includes a plurality of fixing protrusions arranged at intervals on and around the top surface and at least one rib on and around the top surface. The metal cover plate includes a bottom surface which includes a plurality of fixing holes on and around the bottom surface. When the metal case and the metal cover plate are assembled together, the plurality of fixing protrusions respectively pass through the corresponding plurality of fixing holes and fix with each other and each one of the at least one rib is in direct contact with the bottom surface of the metal cover plate to achieve the objective of preventing electromagnetic signal leakage.

Abstract: A shielding clip and an electronic device are provided. The electronic device includes a circuit board, an electronic element, a shielding cover and the shielding clip. The shielding clip comprises a bottom plate parallel to the circuit board. The bottom plate has a first side region and a second side region. The first side region has a first pin extending into the circuit board and a first buckle plate extending away from the circuit board to buckle the shielding cover. The second side region has a second pin extending into the circuit board and a second buckle plate extending away from the circuit board to buckle the shielding cover.

Abstract: A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.

Abstract: A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.

Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.

Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.

Abstract: A circuit shielding structure, relating to a technical field of electronics, includes a substrate, wherein: at least one radio frequency component circuit is fixed on the substrate; a wave-absorbing material layer is embedded in the substrate; a shielding wall made of wave-absorbing material is arranged on the substrate and around the radio frequency component circuit; a conductive material layer covers the shielding wall; a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer, and the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved.

Abstract: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The connector terminals are disposed at a vicinity of each of the first side and the second side. The first cover includes a first opening exposing the connector terminals therethrough, and covers the second face. The second cover includes a linking portion and a noncircular through hole, and covers the first opening across the first side and the second side. The linking portion is positioned in between the first side and the second side. The fastening member is inserted through the through hole so as to fix the second cover, the circuit substrate, and the display.

Abstract: A shielding cover includes a first frame, a second frame, a first cover and a second cover. The second frame is arranged adjacent to the first frame and defines at least one slot. The first cover covers the first frame and includes at least one first latch corresponding to the at least one slot thereon. The second cover covers the second frame and comprises at least one second latch. The at least one slot is exposed from the second cover, the at least one second latch abuts between the first frame and the second frame, the at least one first latch is latched in the at least one slot. A shielding cover assembly and an electronic device employing the shielding cover are also provided.

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

Abstract: A circuit board assembly includes a main board, a daughter board, a metal bracket, and a conductive gasket. The daughter board includes a circuit board and an electronic module with a plurality of pins connected to the circuit board. The metal bracket clamps at one side of the circuit board and the electronic module to shield the plurality of pins. The metal bracket has a connection part connecting the main board. The conductive gasket is disposed between the metal bracket and the plurality of pins.

Abstract: A shield structure includes a main body portion and a lid portion. An electronic circuit is stored in the main body portion. The lid portion is attached to the main body portion in a detachable manner, and includes a first contact portion. The main body portion includes an opening portion, a second contact portion, and a pressurizing portion. When the first contact portion moves in a direction perpendicular to a direction of the lid portion attached to the main body portion, in a state of being inserted in the opening portion, the first contact portion is elastically deformed in a first direction by contacting the second contact portion and comes into pressure contact with the second contact portion. When the first contact portion is inserted in the opening portion, the pressurizing portion contacts and pressurizes the first contact portion in a second direction opposite to the first direction.

Abstract: An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.

Abstract: A power supply module includes a circuit board and a heatsink plate. The circuit board includes a first principal surface, a second principal surface, and side surfaces. Electronic components are mounted on the first principal surface. The heatsink plate includes a plate-shaped body portion that faces the first principal surface, and a plurality of fixing portions that extend at an angle from the body portion to face the side surfaces. The fixing portions are configured to come into contact with the second principal surface to secure the body portion to the circuit board.

Abstract: A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.

Abstract: A conductive clip according to an aspect of the present invention includes a base portion and plural grip pieces. The plural grip pieces is configured to be able to grip a plate-like portion that is a part of a shield case. The grip piece includes a first portion, a second portion, a third portion, and a convex portion. In at least one press-contacted with the one surface of the plate-like portion and at least one press-contacted with the other surface of the plate-like portion among the plural grip pieces, the first portions and the second portions are provided to face each other with the position of the plate-like portion interposed therebetween, and the third portions are provided at positions where parts of distal end portions of the third portions in the extension direction do not overlap with each other when viewed from a direction perpendicular to the plate-like portion.

Abstract: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The connector terminals are disposed at a vicinity of each of the first side and the second side. The first cover includes a first opening exposing the connector terminals therethrough, and covers the second face. The second cover includes a linking portion and a noncircular through hole, and covers the first opening across the first side and the second side. The linking portion is positioned in between the first side and the second side. The fastening member is inserted through the through hole so as to fix the second cover, the circuit substrate, and the display.

Abstract: A box-shaped metal structure is formed by press-working or the like, and a resin shell is integrally molded to the periphery of the metal structure by extrusion molding a resin. A flexible circuit board for key switches is disposed on a switch-receiving surface of the metal structure. The resin shell and the box-shaped metal structure are not bonded together, but the resin fills the connecting holes in the metal structure, whereby the shell and the metal structure are kept together after molding. A casing for a portable device having a structure suitable for obtaining reduced thickness and size reduction is thereby obtained.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.

Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming a first ground plane; a first dielectric substrate layer overlaying the chassis; a first signal trace overlaying the first dielectric substrate layer; and a second dielectric layer overlaying the first signal trace.

Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.

Abstract: In one general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the knockout portion includes at least one member insertable in one or more apertures in the main portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom. In another general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the main portion includes at least one member insertable in one or more apertures in the knockout portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom.

Abstract: The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated.

Abstract: A shielding assembly comprises a pair of covers. Each cover comprises a body, an overlapping portion, and a plurality of sidewalls. The body comprises a first engaging portion, a second engaging portion and a slot defined at one end of the second engaging portion neighboring to the first engaging portion. The overlapping portion comprises a joint portion extending from the first engaging portion, a extending portion extending from the joint portion and parallel to the body, and a latching portion shaped on one end of the extending portion neighboring to the second engaging portion. The extending portion of one of the covers overlaps the second engaging portion of another one of the covers, and the latching portion of one of the covers is latched in the slot in another one of the covers.

Abstract: Provide is a shield terminal connection structure and method, which are easy and simple, for connecting a terminal part of a tubular shielding member to a shield structure. A holding part is formed by a terminal part itself of a shielding member, and then, a fixing member held by the holding part is connected to one side wall of a shield casing. When the fixing member is fixed to the one side wall of the shield casing, electrical connection to the shield member is also completed at the same time of the fixing.

Abstract: The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated.

Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided an electrical assembly, comprising: a chassis for mounting electronic components, the chassis being made from a conductive material and forming a first ground plane; a first dielectric layer overlaying the chassis; a first signal trace overlaying the first dielectric layer; and a second dielectric layer overlaying the first signal trace.

Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.