Interconnection Order Patents (Class 174/376)
  • Patent number: 11841269
    Abstract: A spectroscopic camera includes: a variable-wavelength interference filter; an image pickup element receiving light outputted from the variable-wavelength interference filter; a first circuit board where the variable-wavelength interference filter is provided; a second circuit board where the image pickup element is provided; a casing accommodating the first circuit board and the second circuit board; a first connector mounted at the first circuit board and provided with a first FG terminal electrically coupled to an external device; and a second connector mounted at the second circuit board and provided with a second FG terminal electrically coupled to the external device. The casing is electrically coupled to the first FG terminal of the first connector and the second FG terminal of the second connector without going through the first circuit board and the second circuit board, respectively.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: December 12, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Daisuke Saito
  • Patent number: 11207052
    Abstract: To reduce noise which leaks to the outside in an ultrasonic diagnostic apparatus. An internal AC wiring unit 34 is composed of internal AC wiring which is installed on the input side of a power source circuit, and a shield case 38 which accommodates it. The internal AC wiring includes an inlet, a plurality of connectors, a relay substrate, and a plurality of internal AC cables. The internal AC wiring is protected from radiation noise which is generated in a casing 22 by the shield case 38. Thereby, the noise which leaks to the outside via an external AC cable is reduced.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: December 28, 2021
    Assignee: HITACHI, LTD.
    Inventors: Hidenao Kubota, Masaharu Hirata, Yuta Tokita
  • Patent number: 10959044
    Abstract: The present invention is a precision location system for wireless devices within a host system using known location of blind spots or partial blind spots to advantageously increase the accuracy of location determination. The host system with known blind spots is particularly adept at providing the control system with precise location accuracy for determining the entering or departing of a known geofence zone by a wireless device host.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: March 23, 2021
    Inventor: Michael Gurin
  • Patent number: 10248166
    Abstract: Provided is an electronic device to which measures for reducing influence by electro-static discharge are applied. A tablet of the present disclosure includes a display module, a first metal frame that holds the display module, a second metal frame disposed on a surface opposite to a surface of the first metal frame where the display module is held, and a printed circuit board having a ground electrically connected to the first metal frame, mounting an electronic circuit, and disposed on a surface opposite to a surface of the second metal frame where the first metal frame is disposed. An electro-static current diverges to the first metal frame and the second metal frame.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: April 2, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hirotsugu Fusayasu, Masato Tobinaga
  • Patent number: 9748691
    Abstract: A low-profile, right angle connector assembly comprises six cable connectors and six board-mount connectors housed within a PCIe bracket and EMI shell. The PCIe bracket and EMI shell are braced to a low profile PCIe card. Each board-mount connector is designed to receive a cable connector and allows for the transmission and processing of high-speed data with lower latency. A removable latch mounted on the cable connectors helps ensure the cable connectors remain physically connected to the board-mount connectors. The removable latch may be replaced as needed for breakage and wear and tear.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: August 29, 2017
    Assignee: AIRBORN, INC.
    Inventors: Emad Soubh, Jason Smith, John Grant
  • Patent number: 9577383
    Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: February 21, 2017
    Assignee: CommScope Technologies LLC
    Inventors: Bernard Harold Hammond, Jr., David Patrick Murray, Ian Robert George
  • Patent number: 9191474
    Abstract: An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: November 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Kwang Song, Sung-Won Park, Yong-Lak Cho
  • Patent number: 9173333
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: October 27, 2015
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: John Song, Paul Francis Dixon
  • Patent number: 8895875
    Abstract: Provided are a braided shield member, a manufacturing method of a braided shield member and a wire harness which make it possible to demonstrate shielding performance sufficiently. The braided shield member constituting the wire harness includes a tubular body part and a tubular terminal part. The braided shield member is formed so that the terminal part is formed in a two-folded structure of an outside terminal part and an inside terminal part. Further, the braided shield member is formed so that metal wires are in a loose state inside stitches of the outside terminal part.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: November 25, 2014
    Assignee: Yazaki Corporation
    Inventors: Takashi Kato, Hidehiro Ichikawa
  • Publication number: 20140262474
    Abstract: An RF shielding device for mobile devices includes a conductive grid having horizontal and vertical wire traces in electrical contact with each other; a conductive trace disposed around the perimeter of the conductive grid, the conductive trace being in electrical contact with both ends of each of the horizontal and vertical wire traces; a first insulating film disposed on a top surface of the conductive grid; and a second insulating film disposed on a bottom surface of the conductive grid and the conductive trace. The first insulating film and the second insulating film are of a transparent material. The first and second insulating films are transparent, thus allowing viewing of the display of a mobile device on which the RF shielding device is disposed. The vertical and horizontal wire traces are spaced to form a grid that is opaque to signals in the frequency ranges utilized for mobile communication.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: CONTINENTAL ACCESSORY CORP.
    Inventors: Richard P. Koeppel, Ronald H. Koeppel
  • Patent number: 8791373
    Abstract: A method and apparatus are disclosed in order to provide an electromagnetic pulse shield ground path. In this regard, a shielded power feeder assembly is provided that includes a plurality of conductors comprising a neutral conductor and at least one power feeder conductor. Each conductor includes an electromagnetic pulse shield. The shielded power feeder assembly also includes a fanning bar ground block. The fanning bar ground block includes a body member defining a plurality of openings for receiving respective neutral and power feeder conductors. The fanning bar ground block also includes a plurality of barrels associated with respective openings defined by the body member and configured to be positioned in electrical contact with the shield of the conductor extending through the respective opening. The shielded power feeder assembly also includes a ground path extending from the fanning bar ground block. A corresponding method is also disclosed.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: July 29, 2014
    Assignee: The Boeing Company
    Inventors: Mahlon Bruce Hull, Pete Pereira
  • Publication number: 20130306363
    Abstract: A structure comprises a plurality of signal conductors, a plurality of conductive conductors respectively conducting to the signal conductors, and capacitive members or capacitive characteristics between the plurality of signal conductors. The plurality of conductive conductors respectively include contact portions configured to come into contact with another conductor. The plurality of contact portions come into contact with the other conductor to form an EBG structure comprising the plurality of signal conductors having capacitive characteristics which prevent propagation of an electromagnetic wave in a specific frequency band, the plurality of conductive conductors having inductive characteristics, and a conductor ground plate, thereby shielding against an electromagnetic wave propagating in the other conductor.
    Type: Application
    Filed: April 23, 2013
    Publication date: November 21, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Koji Yukimasa
  • Patent number: 8432706
    Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: April 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Chang-Sup Ryu
  • Patent number: 8242377
    Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: August 14, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyo-Jic Jung, Han Kim, Mi-Ja Han, Kang-Wook Bong, Dae-Hyun Park
  • Patent number: 8183468
    Abstract: An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: May 22, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Dae-Hyun Park
  • Patent number: 7911806
    Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: March 22, 2011
    Assignee: Hitachi, Ltd
    Inventors: Hiroki Funato, Liang Shao, Makato Torigoe
  • Publication number: 20100319982
    Abstract: Disclosed herein is an electromagnetic wave shielding substrate including an electromagnetic bandgap structure which is formed along the edge thereof in order to prevent electromagnetic waves from being emitted therefrom. The electromagnetic wave shielding substrate can effectively prevent the emission of electromagnetic waves.
    Type: Application
    Filed: December 30, 2009
    Publication date: December 23, 2010
    Inventors: Won Woo Cho, Dek Gin Yang, Jung Soo Kim, Hyung Ho Kim
  • Publication number: 20100108373
    Abstract: In a double-stacked electromagnetic bandgap (EBG) structure, a first conductive plane and a second conductive plane are spaced apart in parallel. At least two EBG layers are embedded in parallel between the first conductive plane and the second conductive plane. The at least two EBG layers have different stopband characteristics. A plurality of vias connect the at least two EBG layers respectively to one of the first and second conductive planes. At least the vias connecting one of the EBG layers pass through via holes in cells of another EBG layer.
    Type: Application
    Filed: November 1, 2006
    Publication date: May 6, 2010
    Applicant: Agency for Science, Technology and Research
    Inventor: Jongbae PARK
  • Patent number: 7557305
    Abstract: A connector housing for a small and portable transmitting-receiving module includes an upper housing and a lower housing. The upper housing has a top board, two side walls and a rear cover. The lower edge of the two side walls has a first wedging plate, first convex blocks, and first indentations. The lower housing has a bottom board, and the bottom board has a second wedging plate, second convex blocks, and second indentations. The second wedging plate is wedging the two side walls. The first wedging plate is wedging the bottom board. The second convex blocks are plugged into the first indentations. The first convex blocks are plugged into the second indentations. Thereby, the structure of the connector housing is stronger compared to the prior art. The housing is not easily deformed. Its structure is simple, and the manufacturing cost is reduced.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 7, 2009
    Assignee: Nextronics Engineering Corp.
    Inventors: Hou-An Su, Chin-Pao Wu
  • Patent number: 7518067
    Abstract: According to one exemplary embodiment, a structure comprises an electronic device situated over a substrate of a semiconductor die. The structure further includes a metal cage comprising a number of contacts situated over the substrate and surrounding the electronic device. The contacts form a lateral EMI shield portion of the metal cage. The structure also includes a number of vias connecting a number of metal interconnect segments to the contacts. The metal interconnect segments form a top EMI shield portion of the metal cage.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: April 14, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Mayank Gupta, Mario Pelella, Farzin Assad
  • Publication number: 20090038840
    Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 12, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Je-Gwang Yoo, Chang-Sup Ryu
  • Patent number: 7453699
    Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: November 18, 2008
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideho Inagawa, Hiroyuki Yamaguchi, Shin'ichi Nishimura, Daishiro Sekijima, Tsunao Hombo, Masafumi Kamei
  • Patent number: 7383977
    Abstract: A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) before the shield can (1) is placed on the PCB. A shield can (1) is also described.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: June 10, 2008
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Gustav Fagrenius, Fredrik Palmqvist
  • Patent number: 7301109
    Abstract: A wear resistant EMI shield includes a metallic film or multiple metallic films, and a carbon-nanotube coating (14) formed on the metallic film or multiple metallic films. The metallic films may include nickel film (12), copper film (13) and NixCu1?x (x=0.62˜0.99) (15) alloy film. In a preferred embodiment, the structure of the wear resistant EMI shield is CNT/Ni/Cu/Ni/. The thickness of metallic film is in the range from 20 to 100 nm and the thickness of carbon-nanotube coating is in the range from 10 to 200 nm. The wear resistant EMI shield may apply to various substrate surfaces (10) of electronic equipment, such as the shell of computer, play-station, wireless equipment, mobile phones, automobiles, airplanes, commercial appliance and consumer products, etc. The wear resistant EMI shield has good wear resistance, EMI shield effect, thin thickness and lightweight.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: November 27, 2007
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ga-Lane Chen
  • Patent number: 7154050
    Abstract: A cable arranging structure for exchanging electric signals between a pair of printed circuit boards includes at least a pair of electrically conductive members adapted to arrange the cable between them over the entire length thereof. The electrically conductive members show an electric potential substantially equal to that of the ground. Such a structure requires only the two electrically conductive members to be rigidly secured so that radiant noises generated by the cable can be effectively suppressed by means of the structure without the need of deforming the cable.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: December 26, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Daishiro Sekijima, Hideho Inagawa, Satoshi Sugimoto, Seiji Hayashi, Shinichi Nishimura