Abstract: A problem is to provide a planar lightwave circuit optical device capable of facilitating mounting of connection to a printed circuit board and realizing downsizing of a device chip. A planar lightwave circuit optical device of the present invention is characterized by mounting an electrical connector (FPC connector) by means of soldering on an electrode pad of an electrical wire connected to an electrical drive unit (such as a heater) in a device formed by using a planar lightwave circuit (PLC).

Abstract: A tool for opening an extruded profiled body of a power cord assembly device includes at least one pair of guides and at least one support, the pair of guides and the support being arranged in a frame, wherein a first guide of the pair of guides is arranged and shaped to releasably connect to the an interconnection area of the profiled body, and wherein a second guide of the pair of guides is arranged and shaped to releasably connect to a second interconnection area of the profiled body, said support being provided with a support member adapted to bear against a portion of the first wall opposite to a slit in the profiled body, the distance of the pair of guides relative to the support being such that the slit is widened in the area of the elongation of the profiled body where the tool is applied, thereby allowing a fiber optic cable to be introduced into the chamber.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

Abstract: An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.

Abstract: An apparatus for electrical isolation of metallic hardware is provided and includes an item of hardware and an isolation sheet disposed in contact with the item of hardware. The isolation sheet includes first and second opposing sides at least one of which is anodized.

Abstract: In one embodiment, an apparatus includes a cover panel. An adhesive layer is coupled to the cover panel. A perimeter of the adhesive layer forms at least a portion of a gasket seal extending substantially perpendicular to an inner surface of the cover panel. An inner surface of the gasket seal defines an edge of a channel. The apparatus also includes a substrate coupled to the adhesive layer. The substrate includes an outer surface having disposed thereon a connection pad region and drive or sense electrodes. The drive or sense electrodes are disposed between the substrate and the cover panel. At least a portion of the channel is disposed between the gasket seal and the connection pad region. The apparatus further includes a flexible printed circuit (FPC) electrically coupled by the connection pad region to the drive or sense electrodes. A first portion of the FPC extends through the channel.

Abstract: A housing for an electronic control device includes at least two housing parts, at least one housing base, a housing lid and an electronic connection between components disposed inside the housing and components disposed outside the housing. The connection is fixed to the base of the housing. The electronic connection is either constructed as a single-component flexible printed circuit board or as at least one partial flexible printed circuit board including at least one uniform open area of a copper conductor track outside an area covered by the housing lid. The width of the uniform region is oriented to a predefined contacting type of peripheral components and is longer than necessary for the contacting type. The invention therefore provides for a variable adaptation of generic electronics housings, thereby not necessarily requiring a novel structure of the housing with corresponding expensive individual packaging.

Abstract: An interface for an enclosure comprises at least one enclosure wall that separates an enclosure interior from an enclosure exterior, an opening in the enclosure wall, and a recess in the enclosure wall. The recess adjoins the opening. A dielectric connector is configured to securely fasten to the enclosure wall. The connector extends into the recess. A seal is situated in the recess between the enclosure wall and the connector. An inserted member is inserted through the opening and surrounded by the seal and the connector. Where the connector is securely fastened to the enclosure wall, the seal is compressed to form a moisture-resistant barrier between the enclosure interior and the enclosure exterior.

Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.

Abstract: One aspect relates to an electrical bushing for use in a housing of an active implantable medical device. The electrical bushing includes an electrically insulating base body and an electrical conducting element. The conducting element is set up to establish, through the base body, a electrically conducting connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, and the conducting element includes a cermet. The electrical bushing includes a head part, the head part includes a plug connector element, the conducting element includes a feedthrough element, and the feedthrough element and the plug connector element are connected in an electrically conductive manner through a connecting element, and the connecting element and the feedthrough element are provided as a single part and are made of the same material.

Abstract: One aspect relates to an electrical bushing for use in a housing of an active implantable medical device, whereby the electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element, whereby the conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space, whereby the conducting element is hermetically sealed with respect to the base body, and whereby the at least one conducting element includes at least one cermet. One aspect provides the base body to include a contact region, whereby the base body can be connected to the housing in a firmly bonded manner by means of the contact region.

Abstract: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing further includes at least one metallic frame element, which fixes the base body in at least one housing opening of the housing.

Abstract: A mounting structure of a semiconductor package includes a semiconductor package, a chassis having a coupling boss protruding at a position corresponding to the coupling hole, a coupling member penetrating the coupling hole and coupled to the coupling boss, and an insulation member covering around the coupling hole of the reinforcing plate and making insulation contact with the coupling member and the coupling boss. The semiconductor package includes a film substrate for interfacing transmission of signals between a circuit board and a display panel, a semiconductor chip forming an electrical contact point with the film substrate, and a reinforcing plate to which the film substrate and the semiconductor chip are directly attached. The reinforcing plate has a coupling hole.

Abstract: The present invention provides a system and method for transmitting information between a device within a housing to a second device, preferably a test or monitoring unit, outside of the housing. There are numerous issues associated with transferring information from within a sealed housing to an external device. In some cases, the use of wires inside the housing may be impractical, due to internal conditions, such as fluid flow, pressure or temperature. In one embodiment, the antenna of the external RF reading device is electrically connected to the dome of the housing. In another embodiment, the device within the housing is electrically connected to a housing component. In another embodiment, the gasket is used to pass information from within the housing to an external device.

Abstract: A packaging system having a housing for providing a hermetically sealed interior space for receiving and supporting optoelectronic components. The housing has at least one section of wall comprising a layer of liquid crystal polymer (LCP). At least one hermetically sealed electrical port is formed in the LCP wall section over a predetermined area and comprises a layer of metal adhered to and overlying the predetermined area on the of the LCP wall section. An electrode passes through the metal from the exterior of the system to the interior space to provide an electrical communication path between the optoelectronic components and the exterior of said packaging system. A solder joint is formed between the electrode and the layer of metal to provide a hermetic connection between the layer of metal and the electrode to assure that the hermeticity of the housing remains unchanged with the electrical port present.

Abstract: A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer composed of a first glass material, and a second glass sublayer formed on the first glass sublayer and composed of a second glass material that is different from the second glass material defining the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: The device includes a housing, a locking and release mechanism, an electrical connector, an optical connector, and pathological circuitry. The housing has a top, a bottom, a front, and a back. The locking and release mechanism is attached to the housing. The electrical connector is attached to the back of the housing. The optical connector is attached to the front of the housing. The pathological circuitry handles pathological conditions associated with digital video signals.

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: The cable television (CATV) jack is a surface mount jack and provides an aesthetically pleasing device for routing communications cables. An extra length of cable may be stored inside the jack, and there are multiple ports on the surfaces of the jack to provide several options for cable connections. The jack has at least one port for entry of an input cable and at least one double female connector extending out from an extension port in the jack for securing an output cable. The jack securely retains the cable and connectors to prevent broken connections. The jack is easily mounted to a surface using screws, or other means, such as adhesive.

Abstract: The electric load comprises a carrier plate (1) of a synthetic resin material, at a first side (2) of which, synthetic resin projections (30) are present, which serve as a means for coupling the electric load to a holder. The projections (30) have a leg (31) with a disc, which faces away from the plate (1), and a channel (33) accommodating a current conductor (5) of a load element (4), which is present at a first side (3) of the plate (1). The disc has a circumferential side face (35), which is covered with an electric conductor (20) as a contact, to which a respective current conductor (5) is connected. The electric load, for example a fluorescent lamp switch, is of a simple construction that can be manufactured at low costs.

Abstract: An overmolded electronic module and a method for forming the module. The method entails both overmolding a circuit board and underfilling one or more surface-mount circuit devices physically and electrically connected to the board with solder bump connections. The circuit board is supported on a heatsink that thermally contacts a surface of the device opposite the circuit board. The board is optionally then encased on the heatsink with a retainer that includes means for biasing the circuit device against the heatsink. Finally, the circuit board is overmolded with a polymeric material to form an overmolded body that encases the circuit board and the circuit device with the heatsink. The overmold process is carried out so that a portion of the overmolded body completely underfills the circuit device and encapsulates its solder bump connections.