Hermetic Sealed Envelope Type Patents (Class 174/50.5)
  • Patent number: 10574202
    Abstract: A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: February 25, 2020
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Atsushi Takano, Mitsuhiro Furukawa, Ichiro Kameyama, Tetsuya Uebayashi
  • Patent number: 10420509
    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 24, 2019
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Craig L. Schmidt
  • Patent number: 10319654
    Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 11, 2019
    Assignee: CUBIC CORPORATION
    Inventor: J. Robert Reid
  • Patent number: 10243341
    Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: March 26, 2019
    Assignee: HANGZHOU HPWINNER OPTO CORPORATION
    Inventors: Kai Chen, Jianming Huang, Huali Lu
  • Patent number: 10211177
    Abstract: A method and apparatus for incorporation of high power device dies into smaller system packages by embedding metal “coins” having high thermal conductivity into package substrates, or printed circuit boards, and coupling the power device dies onto the metal coins is provided. In one embodiment, the power device die can be attached to an already embedded metal coin in the package substrate or PCB. The power device die can be directly coupled to the embedded metal coin or the power device die can be attached to a metallic interposer which is then bonded to the embedded metal coin. In another embodiment, the die can be attached to the metal coin and then the PCB or package substrate can be assembled to incorporate the copper coin. Active dies are coupled to each other either through wire bonds or other passive components, or using a built-up interconnect.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: February 19, 2019
    Assignee: NXP USA, INC.
    Inventors: Lakshminarayan Viswanathan, Scott M. Hayes, Scott D. Marshall, Mahesh K. Shah
  • Patent number: 10183360
    Abstract: A hermetic sealing cap includes a base material, a first plated layer formed on the base material, and a second plated layer formed on the first plated layer. A surface of the base material is sectioned into a first region, a second region not adjacent to the first region inside the first region, a third region adjacent to the first region inside the first region, and a fourth region adjacent to the first region outside the first region. In the third region and the fourth region, the first plated layer is exposed to be oxidized.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: January 22, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Kazuya Nagatomo, Ken Asada
  • Patent number: 10118560
    Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: November 6, 2018
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Stephen P. Zadesky, Trent Weber, Lucy E. Browning
  • Patent number: 10103077
    Abstract: An electronic component cap for producing a package having a sealed region by being bonded to a base, having a brazing material-fused surface to which a brazing material is fused and a sealing surface corresponding to the sealed region. The brazing material-fused surface has a non-flat work surface formed by plastic working, and a ratio (Sc/Sf) of a surface area (Sc) of the brazing material-fused surface per unit area to a surface area (Sf) of the sealing surface per unit area satisfies 1<Sc/Sf?1.6. The cross-sectional shape of the work surface may be one of various shapes such as a groove shape, an approximately V shape, and a circular-arc shape. The cap has a good wettability when a brazing material is fused. Also, the brazing material does not wet-spread excessively when the brazing material is melted again for sealing work.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: October 16, 2018
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Sadatoshi Sonoda, Takuji Iwatani, Kenichi Miyazaki
  • Patent number: 10098589
    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: October 16, 2018
    Assignee: Medtronic, Inc.
    Inventors: David A Ruben, Craig L Schmidt
  • Patent number: 9972986
    Abstract: An electrical connection box applied to a wire harness includes a casing that includes an accommodating space that is formed therein and that accommodates an electronic component, and a guiding space that is partitioned horizontally lateral to the accommodating space therein via a partition wall, and that extends in a vertical direction and guides water entered therein to a vertically downside. The casing includes a water-preventing rib that is provided in the guiding space, and that guides water guided to the vertically downside in the guiding space, in a direction of avoiding from an avoidance target portion that is positioned vertically below the guiding space.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: May 15, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuhiko Ikeda, Takaaki Kakimi, Akinori Nakashima, Hirotaka Kiyota
  • Patent number: 9897247
    Abstract: A product positioning device includes a support, a first guide rail, a second guide rail, a support platform, a latching device, and a driving device. The first guide rail and the second guide rail are positioned on the support. The support platform is configured to receive a product to be positioned. The support platform is movable to an end of the first guide rail. The latching device is movable to a position holding the product to be positioned against the support platform. The driving device is movable to a position nearer the support platform. The driving device is further slidably engaged with the second guide rail. The driving device moves to the driving device position as the support platform moves to the end of the first guide rail, and the latching device moves to the latching device position as the driving device moves to the driving device position.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: February 20, 2018
    Assignee: ScienBiziP Consulting(Shenzhen)Co.,Ltd.
    Inventors: Li-Chin Lu, Jian-Hua Xiang, Li Ao
  • Patent number: 9865797
    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole over the resonator, a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole, and a third layer covering the first layer and the second layer, and the third layer sealing the gap.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: January 9, 2018
    Assignee: Yokogawa Electric Corporation
    Inventors: Takashi Yoshida, Takeshi Mishima, Shigeto Iwai, Yuusaku Yoshida
  • Patent number: 9788444
    Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 10, 2017
    Assignee: HANGZHOU HPWINNER OPTO CORPORATION
    Inventors: Kai Chen, Jianming Huang, Huali Lu
  • Patent number: 9585264
    Abstract: A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: February 28, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Nobuyuki Tanaka, Shigenori Takaya
  • Patent number: 9464789
    Abstract: A modular LED explosion-proof lamp usable in any environment includes a body, a wiring box assembly, an illumination unit and a positioning assembly. The body includes a first coupling port, a second coupling port and a third coupling port. The wiring box assembly is connected to the first coupling port, or the second coupling port or the third coupling port. The illumination unit is connected to the first coupling port, or the second coupling port or the third coupling port. The positioning assembly is connected to the first coupling port, or the second coupling port or the third coupling port. Hence the wiring box assembly, the illumination unit or the positioning assembly can be selectively connected to the first coupling port, or the second coupling port or the third coupling port. Thus the modular LED explosion-proof lamp can be assembled in a plurality of implementation fashions.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: October 11, 2016
    Assignee: LI-HONG SCIENCE & TECHNOLOGY CO., LTD
    Inventors: Ming-Tien Chien, Ching-Yuan Juan, Han-Wen Chang
  • Patent number: 9431806
    Abstract: Provided is a waterproof box capable of increasing the amount of water discharged from a double wall without reducing the rigidity of a body case. A waterproof box is provided with a body case and an upper cover attached to the body case so as to cover an opening of the body case. A peripheral wall of the body case has a double-wall structure including an outer wall and an inner wall. Liquid penetrating from a seam between the upper cover and the outer wall passes between the outer wall and the inner wall and is discharged to the outside of the body case. A wide width portion and a narrow width portion which have mutually different gaps between the outer wall and the inner wall are formed in the body case.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: August 30, 2016
    Assignee: Yazaki Corporation
    Inventor: Kouji Ueyama
  • Patent number: 9385059
    Abstract: An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: July 5, 2016
    Assignee: Infineon Technologies AG
    Inventors: Peter Ossimitz, Juergen Schaefer, Liu Chen, Markus Dinkel, Stefan Macheiner
  • Patent number: 9350318
    Abstract: A method for manufacturing an electronic device is provided, in which a base and a lid as a cover body are bonded together while forming an interior space between the base and the lid. The method includes: a step of preparing the lid including a groove communicating the interior space with the outside, the groove being in a back surface of the lid; a step of accommodating a gyro element as an electronic component in the interior space; a first bonding step of bonding the base and the lid together by seam welding at an area for bonding except for a portion corresponding to the groove; and a second bonding step of bonding the base and the lid by welding using a laser beam at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: May 24, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Shinya Aoki, Masashi Shimura
  • Patent number: 9040820
    Abstract: A solar power inverter having a sealing means includes: a main case having an opening on a front surface thereof, the opening open and closed by a main cover; an auxiliary case coupled to one side surface of the main case, and having a second opening on a front surface thereof, the second opening open and closed by an auxiliary cover; and a gasket interposed between the main case and the auxiliary case, wherein the main case and the auxiliary case are coupled to each other by coupling bolts which pass through the main case, the gasket and the auxiliary case.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: May 26, 2015
    Assignee: LSIS Co., Ltd.
    Inventor: Hyuk Il Kwon
  • Patent number: 9040819
    Abstract: One aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space. One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 26, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Mark Kempf, Goran Pavlovic
  • Patent number: 9029696
    Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: May 12, 2015
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang
  • Patent number: 9024184
    Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: May 5, 2015
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Patent number: 9025319
    Abstract: An electronics and/or gearing housing, in particular for a worm wheel of a window lifting drive, of a motor vehicle is provided. The electronics and/or gearing housing has a housing body, within which an electronic assembly is arranged, and a cover, which is joined to the housing body via ultrasonic welding.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 5, 2015
    Assignee: Brose Fahrzeugeile GmbH & Co. KG Wuerzburg
    Inventors: Andreas Schweichart, Peter Klingler
  • Patent number: 9024183
    Abstract: A seal cover includes a cover main body (10) shaped to cover an opening of a case and to be attached to a surface of the case. A seal ring holder (20A) is on the underside of the cover main body (10) and is arranged to fit into the opening. A seal ring (25) is on the outer peripheral surface of the seal ring holder (20A) and closely contacts the inner peripheral surface of the opening. An interlock connector (40) projects from the seal ring holder (20A) for connecting to the waiting connector and sets an energizing circuit in an energized state or a non-energized state upon being connected to or separated from the waiting connector. The interlock connector (40) is mounted on the seal ring holder (20A) to be movable in a direction perpendicular to a connecting direction to the waiting connector.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: May 5, 2015
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Kouji Sakakura
  • Patent number: 9018524
    Abstract: An electrical box includes one or more sides joined to form a front opening to receive an electrical device. The electrical box also includes a flange extending laterally from the one or more sides. The flange includes a blade edge configured to have an initial engagement with a surface of a wallboard when the electrical box is installed in an opening of the wallboard. When the electrical box is installed in the opening of the wallboard, the blade edge forms a vapor-tight barrier between the electrical box and the surface of the wallboard.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: April 28, 2015
    Assignee: Thomas & Betts International, Inc.
    Inventor: Cong Thanh Dinh
  • Patent number: 9012774
    Abstract: Disclosed is an exemplary a re-enterable enclosure for a cable splice. The enclosure includes a cover and a base configured for engagement with the cover, wherein the cover and the base form a cavity for enclosing the cable splice when the base and cover are in a closed position. The enclosure also includes first and second sealing members disposed in the base and the cover. The first sealing member has first and second end portions coupled by a longitudinal member, wherein each end portion includes at least two lobes separated by a gap. The second sealing member includes a third end portion having a protrusion, wherein the protrusion on the third end portion is configured for insertion into the gap between the lobes of one of the first and second end portions of the first sealing member to form an intermating seal.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: April 21, 2015
    Assignee: 3M Innovative Properties Company
    Inventor: Richard L. Simmons
  • Patent number: 9006570
    Abstract: A flame sensor apparatus and a cable assembly apparatus are provided for use in sensing characteristics of a flame within a combustion chamber. The flame sensor apparatus includes an electrical assembly remote from a sensor assembly. A cable assembly extends between the sensor assembly and the electrical assembly. The cable assembly includes two cable ends and a housing that defines an internal volume. Cable fittings are connected to the cable ends through a first seal. A second seal is located in the annular space between the electrical cable and the cable fitting opening at the first cable end. The cable assembly includes a third seal and at least one deformable sealing component located at the second cable end. The seals are configured to prevent moisture, gas, and contaminants from passing through the cable fitting opening. Additionally, a method of sealing an electrical cable and a flexible conduit is provided.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: April 14, 2015
    Assignee: General Electric Company
    Inventor: Joseph Cleary Blakemore
  • Publication number: 20150071598
    Abstract: A cable closure includes a housing that delimits an interior of the cable closure and seals off the cable closure toward the outside. The housing is formed by a covering body having shells hinged together and cable insertion regions provided on mutually opposite sides of the shells. Sealing elements are positioned at the mutually opposite sides of the covering body proximate the cable insertion regions. A closing mechanism having a latch and latch support is configured to lock the shells together. The latch support has a first end section pivotably attached to one of the shells and a second end section pivotably attached to the locking latch, which in turn has an end section serving as an actuating handle for closing and opening the cable closure.
    Type: Application
    Filed: November 12, 2014
    Publication date: March 12, 2015
    Inventors: Stefan Badura, Mike Breuer-Heckel, Lars Kittler
  • Patent number: 8975517
    Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: March 10, 2015
    Assignee: Daishinku Corporation
    Inventors: Naoki Kohda, Hiroki Yoshioka
  • Patent number: 8941017
    Abstract: An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.
    Type: Grant
    Filed: January 5, 2011
    Date of Patent: January 27, 2015
    Assignee: Seiko Epson Corporation
    Inventor: Yoji Nagano
  • Patent number: 8942001
    Abstract: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: January 27, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshio Kawai, Yuichi Yanagisawa, Hironori Ohhashi
  • Publication number: 20150021066
    Abstract: The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed.
    Type: Application
    Filed: February 28, 2012
    Publication date: January 22, 2015
    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
    Inventors: Per Hillstrom, Mikael Fardig, Daniel Fredriksson, Sofia Olsson
  • Patent number: 8937246
    Abstract: A gasket includes a first body which is attached to a first member at outside of a gap between a first seal surface formed on the first member and a second seal surface formed on a second member and which includes a reinforcing member; a second body which is extended from the first body to the gap between the first seal surface and the second seal surface; and a protrusion portion which is protruded toward the second seal surface in a state in which the first body is attached to the first member and the second member has not yet been attached to the first member, and is pressed by the second seal surface to closely attach the second body to the first seal surface in a state in which the first body is attached to the first member and the second member is attached to the first member.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: January 20, 2015
    Assignee: Fujitsu Limited
    Inventors: Shingo Yamaguchi, Satoshi Watanabe
  • Patent number: 8912454
    Abstract: Provided is a seal structure which can reduce the thickness of an electronic device, can be easily assembled and disassembles, and can exhibit an excellent seal performance. Thus, the seal structure for an electronic device, which seals a gap between a flexible wiring substrate inserted to a through-hole provided in a case member of an electronic device and the through-hole, is comprised of an annular gasket composed of a rubber elastic material, a part of which is integrally molded with the flexible wiring substrate, and a retainer plate for retaining the gasket in conjunction with the case member.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: December 16, 2014
    Assignee: Nippon Mektron, Ltd.
    Inventor: Takashi Sasaki
  • Patent number: 8902599
    Abstract: An external structure of an outdoor electronic apparatus for packaging a circuit board having a power line is provided. The external structure includes a housing having an opening and a waterproof gasket. The waterproof gasket includes a main body, a platform portion, a first protrusion, and a bushing portion. The main body covers the opening. The platform portion, located at the inner side of the main body, extends into the housing from the opening. The platform portion seals the opening and tightly fits with the housing. The first protrusion is located on the platform portion for abutting against the circuit board. The bushing portion, located at the outer side of the main body, has a channel. The channel passes through the main body and the platform portion and can be passed through by the power line. The bushing portion and the power line tightly fit to each other.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: December 2, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Po-Heng Chao, Jui-Ching Lee
  • Patent number: 8879265
    Abstract: An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: November 4, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoyuki Kishikawa, Hiroyuki Uramachi
  • Patent number: 8878060
    Abstract: An electronic device may include housing structures, electronic components, and other structures. A gap may be formed between the structures. A membrane structure may be used to bridge the gap to form and environmental seal and electrical pathway between the structures. The membrane structure may be deployed using a temporary biasing member or may be installed by forming an inflatable structure. The inflatable structure may include an elastomeric balloon that may be pressurized. Adhesive such as conductive adhesive may be used in attaching the membrane structure to the structures in the electronic device. An inflatable structure may be depressurized following installation in an electronic device to minimize residual forces.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: November 4, 2014
    Assignee: Apple Inc.
    Inventors: Derek Wright, Erik A. Uttermann, Fletcher R. Rothkopf
  • Patent number: 8872025
    Abstract: A waterproof structure of an electronic unit includes a case that defines a housing portion housing a first terminal, and a connector that includes an insulating body attached to the case. The connector includes a second terminal that is supported by the insulating body and connects a conductor end portion of a cable to the first terminal. The insulating body includes a wall portion that partitions a part of the housing portion by covering an open portion of the case. The insulating body includes a cable lead-in portion that defines a cable lead-in hole for leading the cable into the case and is joined to the wall portion. A potting resin is filled in a space between the inner periphery of the cable lead-in hole and the outer periphery of the cable and the housing portion and cured.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Jtekt Corporation
    Inventors: Toshio Tamai, Takahiro Sanada
  • Publication number: 20140313426
    Abstract: According to one embodiment, a television receiver includes a housing, a display, a first conductor, a second conductor, and an electrically conductive bonding layer. The display is in the housing. The first conductor is in the housing. The second conductor is in the housing. The electrically conductive bonding layer is between the first conductor and the second conductor. The electrically conductive bonding layer includes a compressed portion configured to be compressed in a direction in which the first conductor, the electrically conductive bonding layer, and the second conductor are stacked.
    Type: Application
    Filed: October 21, 2013
    Publication date: October 23, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Yuki Sato
  • Patent number: 8844123
    Abstract: A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: September 30, 2014
    Inventor: Chin-Chi Yang
  • Patent number: 8835762
    Abstract: An apparatus for electrical isolation of metallic hardware is provided and includes an item of hardware and an isolation sheet disposed in contact with the item of hardware. The isolation sheet includes first and second opposing sides at least one of which is anodized.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 16, 2014
    Assignee: Aerojet Rocketdyne of DE, Inc
    Inventors: Leo Gard, Karl Wefers
  • Patent number: 8835761
    Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: September 16, 2014
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Publication number: 20140252898
    Abstract: A housing for receiving an electronic circuit (4) having a plurality of components (5) having a carrier plate (7) and a housing cover (8) including a circumferentially enclosing wall (9) on the carrier plate (7) and a cover part (10) on the wall (9), which cover part (10) lies opposite the carrier plate (7). A volume compensation element (11) is attached on the carrier plate (7) in an interior (12) of the housing cover (8) which is enclosed in a pressure-tight manner from an external atmosphere. The volume compensation element (11) is elastically formed providing a variable volume for compensation of pressure fluctuations in the interior (12), which variable volume occurs with a change in position of the volume compensation element (11) relative to the carrier plate (7). A gap between the volume compensation element (11) and the carrier plate (7) is connected to the external atmosphere.
    Type: Application
    Filed: October 29, 2012
    Publication date: September 11, 2014
    Applicant: ebm-papst Mulfingen GmbH
    Inventors: Thomas Sauer, Dieter Best, Walter Matter, Joachim Berberich
  • Publication number: 20140246217
    Abstract: Disclosed is an electrical junction box including a case, and a block housed in the case. The case includes a frame, and a lower cover attached to a lower end side of the frame a joint part part of an outer wall of the frame and an outer wall of the cover an upper end of the outer wall of the lower cover is positioned more inwardly than a lower end of the outer wall of the frame and nearly the same height as a component insertion plane. At an edge portion of the block is disposed a waterproof barrier located between the component housing of the block and the joint part part and extending below the component insertion plane of a lower end of the component housing.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 4, 2014
    Applicant: Yazaki Corporation
    Inventors: Sunsoku I, Takaaki Kakimi
  • Patent number: 8817480
    Abstract: In order to provide excellent waterproofness at a low manufacturing cost to a seal structure comprising a housing to which a flexible wiring board (1) is inserted and a seal member (3) integrally formed on said flexible wiring board (1) for hermetically sealing a gap between said housing and said flexible wiring board (1), a whole surface of a sensor member (31) arranged on at least one side of said flexible wiring board (1) is coated by same material as is used in said seal member (3), at a time of integrally forming the seal member (3) on the flexible wiring board (1).
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: August 26, 2014
    Assignee: Nippon Mektron, Ltd.
    Inventor: Takahiro Hayashi
  • Publication number: 20140224517
    Abstract: Provided is a laminated film comprising a substrate, and at least one layer of film layer that is formed on at least one surface of the substrate, wherein at least one layer of the film layer contains silicon, oxygen, and hydrogen, a ratio of a total value of Q1, Q2, and Q3 peak areas to a Q4 peak area on the basis of an abundance ratio of silicon atoms having different bonding states to oxygen atoms, which are obtained by 29Si solid-state NMR measurement of the film layer, satisfies the following conditional expression (I): (total value of Q1, Q2, and Q3 peak areas)/(Q4 peak area)<1.0??(I) wherein Q1 represents a silicon atom that is bonded to one neutral oxygen atom and three hydroxyl groups, Q2 represents a silicon atom that is bonded to two neutral oxygen atoms and two hydroxyl groups, Q3 represents a silicon atom that is bonded to three neutral oxygen atoms and one hydroxyl group, and Q4 represents a silicon atom that is bonded to four neutral oxygen atoms.
    Type: Application
    Filed: June 21, 2012
    Publication date: August 14, 2014
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventor: Akira Hasegawa
  • Patent number: 8796558
    Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: August 5, 2014
    Assignee: Daishinku Corporation
    Inventors: Minoru Iizuka, Yuka Kojo
  • Patent number: 8796548
    Abstract: A utility box assembly includes a housing structure having an open upper end, a first peripheral channel around the open upper end, and a second peripheral channel disposed below the first peripheral channel and inwardly therefrom. A first sealing element is seated in the first peripheral channel, and a second sealing element is seated in the second peripheral channel. A cover is configured to cover the open upper end. The cover has an outer peripheral portion configured to engage the first sealing element, and a downward-depending flange configured to engage the second sealing element. A liquid-tight seal is provided by the compression of the first and second sealing elements within their channels when the cover is secured to the open upper end of the housing.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: August 5, 2014
    Assignee: Seahorse Industries Ltd.
    Inventors: Kevin L. Rost, Hardy L. Rost
  • Patent number: 8784078
    Abstract: An integrated-inverter electric compressor in which an inverter accommodating section (9) is provided on the periphery of a housing, an inverter that supplies driving power to an electric motor is installed in the inverter accommodating section (9), and its opening (10) is tightly sealed with a cover (13) is configured such that a groove (16) in which a liquid sealant (20) is to be filled is provided in a flange (11) around the opening (10); the liquid sealant (20) filled in the groove (16) is cured to tightly seal a joint surface between the flange (11) and the cover (13); and when the width of a joint surface (17) formed at the inner periphery of the groove (16) in the flange (11) is L1 and the width of a joint surface (18) formed at the outer periphery of the groove (16) is L2, L1<L2 holds.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: July 22, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Manabu Suzuki, Ichiro Yogo, Tomoyasu Osaki
  • Patent number: 8759677
    Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl