With Mounting Means For A Device Within Envelope Patents (Class 174/50.54)
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Patent number: 10912185Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14), a drain lead (13) and a source contact surface (15). An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.Type: GrantFiled: June 16, 2016Date of Patent: February 2, 2021Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventors: Reginald Simpson, Ronald Nehring, Mokhtar Rouabhi
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Patent number: 10883877Abstract: A spectrometer 1A includes a package 2 having a stem 4 and a cap 5, an optical unit 10A disposed on the stem 4, and a lead pin 3 for securing the optical unit 10A to the stem 4. The optical unit 10A includes a dispersive part 21 for dispersing and reflecting light entering from a light entrance part 6 of the cap 5, a light detection element 30 having a light detection part 31 for detecting the light dispersed and reflected by the dispersive part 21, a support 40 for supporting the light detection element 30 such that a space is formed between the dispersive part 21 and the light detection element 30, and a projection 11 protruding from the support 40, the lead pin 3 being secured to the projection 11. The optical unit 10A is movable with respect to the stem 4 in a contact part of the optical unit 10A and the stem 4.Type: GrantFiled: January 17, 2019Date of Patent: January 5, 2021Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takafumi Yokino, Katsumi Shibayama, Katsuhiko Kato
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Patent number: 10770871Abstract: The present disclosure relates to a switching device unit for a subsea switchgear. The switching device unit includes a fluid tight switching device housing and switching devices arranged within the switching device housing. A plurality of the switching devices are aligned with each other along two parallel lines.Type: GrantFiled: January 10, 2018Date of Patent: September 8, 2020Assignee: ABB Schweiz AGInventor: Arne Trandal
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Patent number: 10468173Abstract: A support device of an active part of a current transformer includes a plurality of insulating support legs which are composed of an electrically insulating material and which are constructed to carry the active part and to be supported on a housing base of a housing of the current transformer. A longitudinal axis of each insulating support leg forms a non-zero support angle with the direction of gravitational force or the vertical. A current transformer including a housing, an active part disposed in the housing and the support device for supporting the active part, is also provided.Type: GrantFiled: May 21, 2015Date of Patent: November 5, 2019Assignee: Siemens AktiengesellschaftInventor: Michael Gaber
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Patent number: 10211017Abstract: Various high voltage systems may benefit from a suitable relay system. For example, a relay box may be provided with a shock and vibration resistant arrangement including a sealed coil box within the sealed relay box. For example, an apparatus can include a coil box containing coils, inside pole pieces, and permanent magnets, wherein the coils, inside pole pieces, and permanent magnets can be configured to actuate an armature assembly external to the coil box. The apparatus can also include outside pole pieces configured to move a relay armature of the armature assembly responsive to energizing of the coils. Moving the relay armature can include overcoming a latching of at least one of the permanent magnets.Type: GrantFiled: August 9, 2016Date of Patent: February 19, 2019Assignee: Microsemi CorporationInventor: Syrus Tajbakhsh
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Patent number: 10184834Abstract: A spectrometer includes a package having a stem and a cap, an optical unit disposed on the stem, and a lead pin for securing the optical unit to the stem. The optical unit includes a dispersive part for dispersing and reflecting light entering from a light entrance part of the cap, a light detection element having a light detection part for detecting the light dispersed and reflected by the dispersive part, a support for supporting the light detection element such that a space is formed between the dispersive part and the light detection element, and a projection protruding from the support, the lead pin being secured to the projection. The optical unit is movable with respect to the stem in a contact part of the optical unit and the stem.Type: GrantFiled: February 3, 2015Date of Patent: January 22, 2019Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takafumi Yokino, Katsumi Shibayama, Katsuhiko Kato
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Patent number: 10139198Abstract: A precise photoelectric sighting system that is simple in shooting calibration, quick and accurate in sighting, adapts to any environmental factor, and may greatly reduce the use of sensors and realize binocular sighting. The system includes a field-of-view acquisition unit, a display unit, a ranging unit and a sighting circuit unit; and precise shooting under any environment is realized by applying the integrated precise photoelectric sighting system. The calibration method of the photoelectric sighting system enables quick and precise calibration.Type: GrantFiled: February 26, 2018Date of Patent: November 27, 2018Assignee: HUNTERCRAFT LIMITEDInventors: Lin Zhang, Chunhua Shi, Sang Su
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Patent number: 10062986Abstract: A connector of the present invention includes an inner housing and an outer housing. The inner housing has a contact holding portion holding at least one contact, and is for attachment to a substrate. The outer housing is configured as a separate body from the inner housing, is provided between a case with the substrate attached thereto and the inner housing and is fixed to the case, and suppresses rattling of the inner housing relative to the case.Type: GrantFiled: March 31, 2017Date of Patent: August 28, 2018Assignee: J.S.T. MFG. CO., LTD.Inventors: Takahiro Shibaya, Yasuo Kita, Yuichi Yoshiki
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Patent number: 9963341Abstract: A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.Type: GrantFiled: May 19, 2015Date of Patent: May 8, 2018Assignee: Rosemount Aerospace, Inc.Inventors: David P. Potasek, Robert Stuelke
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Patent number: 9899284Abstract: A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.Type: GrantFiled: June 13, 2016Date of Patent: February 20, 2018Assignee: QUALCOMM IncorporatedInventor: Mou-Shiung Lin
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Patent number: 9018524Abstract: An electrical box includes one or more sides joined to form a front opening to receive an electrical device. The electrical box also includes a flange extending laterally from the one or more sides. The flange includes a blade edge configured to have an initial engagement with a surface of a wallboard when the electrical box is installed in an opening of the wallboard. When the electrical box is installed in the opening of the wallboard, the blade edge forms a vapor-tight barrier between the electrical box and the surface of the wallboard.Type: GrantFiled: January 28, 2013Date of Patent: April 28, 2015Assignee: Thomas & Betts International, Inc.Inventor: Cong Thanh Dinh
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Patent number: 8975517Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.Type: GrantFiled: March 16, 2012Date of Patent: March 10, 2015Assignee: Daishinku CorporationInventors: Naoki Kohda, Hiroki Yoshioka
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Patent number: 8941017Abstract: An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.Type: GrantFiled: January 5, 2011Date of Patent: January 27, 2015Assignee: Seiko Epson CorporationInventor: Yoji Nagano
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Publication number: 20140376757Abstract: An improved enclosure device for protecting electronic equipment is disclosed. The enclosure device may include an adapter plate for attaching the electronic equipment to the enclosure device. The adapter plate is preferably configured to prevent damage to the electronic equipment when mounting the enclosure device to a generally vertical support. The enclosure device may include one or more inserts having an opening and a slit for receiving a cable so that the cable can be passed through the enclosure device. The insert preferably seals against the cable so that a barrier to water is created. As such, the electronic equipment may be protected from rain.Type: ApplicationFiled: June 20, 2014Publication date: December 25, 2014Inventor: Joseph Orion Engle
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Publication number: 20140041927Abstract: An electrical outlet box acoustic seal includes a seal body formed from a flexible sound suppressing material. The seal body has a front side, a rear side, and a peripheral edge. A seal rear projection extends from the seal rear side. The seal rear projection is configured to wrap around a front peripheral edge of an electrical outlet box having left and right sides, top and bottom sides, a rear side, and an open front defined by the outlet box front peripheral edge that provides access to an outlet box interior. When the outlet box is mounted in an opening formed in an architectural separation, and when the acoustic seal is installed on the outlet box, the seal rear projection inserts into a gap between the outlet box front peripheral edge and the opening of the architectural separation to assist in blocking noise transmission through the gap.Type: ApplicationFiled: August 13, 2012Publication date: February 13, 2014Applicant: STC ARCHITECTURAL PRODUCTS, LLCInventor: Paul L. Battaglia
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Publication number: 20130299209Abstract: An electronic device includes a housing, an electronic component mounted to the housing, and a first dustproof component. The electronic component includes a first part received in the housing. The first dustproof component is secured to the housing and is provided around the first part, for closing the first part.Type: ApplicationFiled: November 28, 2012Publication date: November 14, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: JI-FENG QIU
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Patent number: 8575481Abstract: The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container.Type: GrantFiled: October 15, 2009Date of Patent: November 5, 2013Assignee: NEC CorporationInventors: Masashi Hasegawa, Naoto Ozaki, Katsuya Hirano
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Publication number: 20130264088Abstract: An electrical box includes one or more sides joined to form a front opening to receive an electrical device. The electrical box also includes a flange extending laterally from the one or more sides. The flange includes a blade edge configured to have an initial engagement with a surface of a wallboard when the electrical box is installed in an opening of the wallboard. When the electrical box is installed in the opening of the wallboard, the blade edge forms a vapor-tight barrier between the electrical box and the surface of the wallboard.Type: ApplicationFiled: January 28, 2013Publication date: October 10, 2013Applicant: THOMAS & BETTS INTERNATIONAL, INC.Inventor: Cong Thanh Dinh
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Patent number: 8526196Abstract: An apparatus is provided for receiving, at least partially, an electric/electronic component in an internal housing area, in particular for commercial vehicles. A first housing component at least partially forms the internal housing area and a cover at least partially surrounds the internal housing area. The cover is designed such that at least one electrically conductive connecting element for electrically coupling the electric/electronic component to at least one additional electric/electronic component provided outside of the internal housing area is fixed by the cover. A method for assembling the apparatus is also provided.Type: GrantFiled: August 20, 2010Date of Patent: September 3, 2013Assignee: KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbHInventors: Markus Eichner, Thomas Uhland
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Patent number: 8526179Abstract: A laptop computer user thermal isolation apparatus is provided for inhibiting the transfer of waste heat from internal heat generating components to a user. The thermal isolation apparatus includes a casing substantially enclosing the heat generating components, the casing including at least one panel having a sealed enclosed cavity disposed between the heat generating components and an outer surface of the casing.Type: GrantFiled: December 11, 2008Date of Patent: September 3, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mark S. Tracy, Britt C. Ashcraft, Jeffrey A. Lev, Paul N. Walker
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Patent number: 8508917Abstract: A sealed electrical enclosure for use in hazardous locations for enclosing circuit breakers having a bottom housing and a top housing with a labyrinth joint, a serrated joint, or combination of both being formed therebetween, a first aperture extending through a first end wall of the bottom housing and positioned adjacent a first contact terminal of a first circuit breaker, the first aperture further including a first metal bus extending therethrough and in electrical contact with the first contact terminal, and a second aperture extending through a second end wall of the bottom housing and positioned adjacent a second contact terminal of the first circuit breaker, the second aperture further including a second metal bus extending therethrough and in electrical contact with the second contact terminal, and a first actuating mechanism positioned on the top housing adapted for manipulating a switch of the first circuit breaker.Type: GrantFiled: March 24, 2011Date of Patent: August 13, 2013Assignee: EGS Electrical Group, LLCInventors: Vilian Rus, Yogesh Kanole, Vijay Nadgeri
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Patent number: 8486744Abstract: The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.Type: GrantFiled: September 28, 2010Date of Patent: July 16, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng
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Patent number: 8431821Abstract: An anode substrate constituted of a conductive film forming substrate and a reinforcing substrate having different thermal expansion coefficient and being bonded together by the arrangement of adhesive layers is disclosed. The substrate can prevent creation of cracks on the conductive film forming substrate when heating and cooling the anode substrate. The adhesive layers are arranged at an interval, each of the adhesive layers being formed into a shape selected from a group consisting of a rectangular strip shape and a curved strip shape. The adhesive layers are arranged in a pattern to be symmetry with respect to a center line of the arrangement of the adhesive layers extending perpendicular to a line connecting both longitudinal ends of the arrangement of the adhesive layer. Furthermore, the adhesive layers include an outer adhesive portion located outward among remaining adhesive layers, and the outer adhesive layers are arranged shorter than the remaining adhesive layers.Type: GrantFiled: March 25, 2011Date of Patent: April 30, 2013Assignee: Futaba CorporationInventors: Toshio Suzuki, Makoto Akira, Koji Tajima, Toshimitsu Fuyuki, Eiji Morimoto, Yawara Inoue
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Publication number: 20130043055Abstract: A junction box for a photovoltaic module is provided. The junction includes a housing and a base. The housing is prepared from a first material. The base is provided in the housing and configured to mount an electronic device. The base is prepared from a second material. With the housing and the base being separated from each other and made of different materials, the junction box meets the design requirements regarding a system voltage range of 600-1,000V according to UL.Type: ApplicationFiled: August 15, 2012Publication date: February 21, 2013Inventors: Qingtai Ma, Xiaoqun Chen, Zhenhua Zhang, Feng Wang
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Patent number: 8378212Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.Type: GrantFiled: June 4, 2009Date of Patent: February 19, 2013Assignee: Raytheon CompanyInventors: James L. Sturges, Robert E. Walsh, George L. Fix
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Patent number: 8351191Abstract: Provided are a housing (10) for a portable display device (1) having a holding section (11) located on one side to the center line of the housing (10) that is provided with a weight adjusting section which sets a weight of the holding section (11) side of the housing (10) heavier than a weight of that portion of the housing (10) which is opposite the holding section (11), and whose weight is adjusted by at least one of methods of changing a type of a material for the housing (10), a specific gravity of the material, a density thereof, and an amount used thereof, mixing a weight adjusting substance (14) in the material, and mounting a weight adjusting substance to the housing (10), and a portable display device.Type: GrantFiled: March 27, 2011Date of Patent: January 8, 2013Assignee: Brother Kogyo Kabushiki KaishaInventor: Mitsuo Hirota
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Patent number: 8344263Abstract: A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described.Type: GrantFiled: July 20, 2006Date of Patent: January 1, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Moritz Engl, Florin Oswald
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Patent number: 8227692Abstract: A system for enclosing an instrument, module or other assembly in an explosion-proof housing. The system includes an upper housing portion that includes a first threaded portion and, optionally, a transparent window portion; a lower housing portion that has a second threaded portion that is structured and arranged to cooperate with the first threaded portion to provide a tight, air- and water-tight fit; and an inner mounting assembly for supporting an instrument, module, electrical circuit, electrical device, display device, or other assembly. In pertinent part, the lower housing portion includes integrated bosses that provide horizontal surfaces for supporting the inner mounting assembly and for releasably attaching the inner mounting assembly to the lower housing portion.Type: GrantFiled: April 13, 2009Date of Patent: July 24, 2012Assignee: Precision Digital CorporationInventors: Erik Dahlgren, Scott M. Ewen, Joseph F. Ryan, Jose Umana
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Patent number: 8174839Abstract: A mounting structure of a semiconductor package includes a semiconductor package, a chassis having a coupling boss protruding at a position corresponding to the coupling hole, a coupling member penetrating the coupling hole and coupled to the coupling boss, and an insulation member covering around the coupling hole of the reinforcing plate and making insulation contact with the coupling member and the coupling boss. The semiconductor package includes a film substrate for interfacing transmission of signals between a circuit board and a display panel, a semiconductor chip forming an electrical contact point with the film substrate, and a reinforcing plate to which the film substrate and the semiconductor chip are directly attached. The reinforcing plate has a coupling hole.Type: GrantFiled: December 11, 2009Date of Patent: May 8, 2012Assignee: Samsung SDI Co., Ltd.Inventors: Dae-Young Kim, Jang-Ho Moon
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Publication number: 20120067611Abstract: A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.Type: ApplicationFiled: September 20, 2011Publication date: March 22, 2012Applicant: DAISHINKU CORPORATIONInventor: Naoki KOHDA
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Patent number: 8087165Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.Type: GrantFiled: February 26, 2010Date of Patent: January 3, 2012Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin
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Patent number: 8071878Abstract: A display assembly for a portable terminal inhibits the penetration of foreign matter from an exterior environment into the interior of the portable terminal. The display assembly includes a display for mounting in an open-faced compartment enclosed by a bottom/top cover plate. A resilient seal component of the display assembly is positioned between the display and the compartment, the seal component including a body including a base portion connected to a top portion by side portions for defining an interior channel for engaging the sides of the display, once received therein. A top portion of the seal component is adapted for overlapping a portion of the top surface of the display and the base portion for overlapping at least a portion of the bottom surface of the display.Type: GrantFiled: July 29, 2008Date of Patent: December 6, 2011Assignee: Psion Teklogix Inc.Inventors: Alan Mangaroo, Bo Xu
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Publication number: 20110240327Abstract: The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container.Type: ApplicationFiled: October 15, 2009Publication date: October 6, 2011Applicant: NEC CORPORATIONInventors: Masahi Hasegawa, Naoto Ozaki, Katsuya Hirano
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Publication number: 20110164347Abstract: A generally prismatic package (1) for an electrical device in the form of supercapacitive element (2) having an electrical property with a predetermined value. Package (1) includes an insulating element in the form of a generally rectangular-prismatic liquid crystal polymer (LCP) housing (3) for supporting element (2). More specifically, element (2) is mounted to the insulating element such that, following surface mounting of element (2) to a substrate, in the form of a printed circuit board (not shown), the electrical property remains within a predetermined tolerance.Type: ApplicationFiled: September 9, 2009Publication date: July 7, 2011Inventors: Phillip Brett Aitchison, Alexander Bilyk, Allan Godsk Larsen, John Chi Hung Nguyen, Andrzej Kucharzewski
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Patent number: 7915527Abstract: The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.Type: GrantFiled: April 5, 2007Date of Patent: March 29, 2011Assignee: Rockwell Collins, Inc.Inventors: Nathan P. Lower, David M. Brower, Ross K. Wilcoxon
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Patent number: 7906725Abstract: An object is to sufficiently keep the airtightness in a vacuum container even when it is made smaller. A photomultiplier tube 1 comprises a flat sheet-like lower substrate 4, a casing-like frame 3b erected on the lower substrate 4, an upper substrate 2 including a frame 3a airtightly joined to an opening part of the frame 3b while holding a low-melting metal therebetween, and a frame-like projection 25b arranged in parallel with the frame 3b on the inner side of the frame 3b on the lower substrate 4.Type: GrantFiled: June 28, 2006Date of Patent: March 15, 2011Assignee: Hamamatsu Photonics K. K.Inventors: Hideki Shimoi, Hiroyuki Sugiyama, Hiroyuki Kyushima
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Publication number: 20100263900Abstract: A Full Authority Digital Controller (FADEC) has a stamped housing body, a FADEC circuit assembly within the housing body, and a cover. An electrical connector is mounted to the housing body.Type: ApplicationFiled: December 4, 2009Publication date: October 21, 2010Inventors: Gregory DiVincenzo, Jeffry K. Kamenetz, Jay H. Hartman, Luke T. Orsini
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Publication number: 20100258331Abstract: A system for enclosing an instrument, module or other assembly in an explosion-proof housing. The system includes an upper housing portion that includes a first threaded portion and, optionally, a transparent window portion; a lower housing portion that has a second threaded portion that is structured and arranged to cooperate with the first threaded portion to provide a tight, air- and water-tight fit; and an inner mounting assembly for supporting an instrument, module, electrical circuit, electrical device, display device, or other assembly. In pertinent part, the lower housing portion includes integrated bosses that provide horizontal surfaces for supporting the inner mounting assembly and for releasably attaching the inner mounting assembly to the lower housing portion.Type: ApplicationFiled: April 13, 2009Publication date: October 14, 2010Applicant: PRECISION DIGITAL CORAPORATIONInventors: Erik Dahlgren, Scott M. Ewen, Joseph F. Ryan, Jose Umana
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Publication number: 20100206602Abstract: A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process.Type: ApplicationFiled: October 17, 2008Publication date: August 19, 2010Applicant: BARUN ELECTRONICS CO., LTD.Inventors: Sang Chul Lee, Sung-Wook Kim
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Publication number: 20090266573Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.Type: ApplicationFiled: April 25, 2008Publication date: October 29, 2009Inventors: David B. Engmark, Gary M. Grose, Todd H. Schaefer, Thomas I. Ceballos, Andrew J. Ries
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Patent number: 7566829Abstract: In an electrical junction box, an electrical junction box main body is housed in a housing case consisting of an under case member and an upper case member, and a wire harness having its one end connected to the electrical junction box main body is led out to the outside of the housing case. The under case member has a pair of holding arms provided therein, which temporarily hold the wire harness to be led out roughly in a desired lead-out direction, the wire harness being led out from the under case member, in a state where the electrical junction box main body is temporarily housed in the under case member. The upper case member has guide ribs provided therein, which guide the wire harness in the desired lead-out direction, the wire harness being led out roughly in the desired lead-out direction by the pair of holding arms in the under case member, in an assembled state of the under case member and the upper case member.Type: GrantFiled: August 29, 2007Date of Patent: July 28, 2009Assignee: Yazaki CorporationInventors: Makoto Nakayama, Katsuya Hashimoto, Hirofumi Mizuno
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Patent number: 7535716Abstract: An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing.Type: GrantFiled: May 23, 2007Date of Patent: May 19, 2009Assignee: ADC Telecommunications, Inc.Inventors: Larry G. Fischer, Eric S. Moreau, Gregory Martell
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Patent number: 7465888Abstract: A cast-in element for forming a leadthrough for conduits includes a jacket tube (12; 42, 43; 62) having a thread-shaped outer profile (13; 44, 45; 63), and a base member (14; 51) with a receiving space (16) for receiving stop elements (17; 52) with an end of the base member (14; 51) forming and surrounding a through-opening (15) and having, in a region of the through-opening (15), a thread-shaped inner profile (18) corresponding to the thread-shaped outer profile (13; 44, 45; 63) of the jacket tube (12; 42, 43; 62).Type: GrantFiled: October 25, 2006Date of Patent: December 16, 2008Assignee: Hilti AktiengesellschaftInventors: Marco Fischer, Thomas Monden
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Publication number: 20080115399Abstract: A waterfowl feeding decoy having a body mounted to a motor, and a box member that includes a pivotally attached top member such that opening the top member allows access to a chamber disposed within the box member, and closing the top member forms a watertight seal between the top member and the box member. A power source is disposed in the chamber, and electrical wires extend from the power source up through an aperture and are electrically connected to the motor. The box member serves as a watertight storage means for the power source and further serves as an anchor for anchoring the decoy at a selected location.Type: ApplicationFiled: November 9, 2007Publication date: May 22, 2008Inventor: Chris F. Walker
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Publication number: 20080007907Abstract: A computer housing includes a shell having a side opening, a first side wall and a second side wall, and a support bracket rotatably mounted on the shell and having a head portion, a tail portion, and a support portion. Thus, when the support bracket is rotatable to a closed position, the tail portion of the support bracket is rested on the second side wall of the shell, and the support portion of the support bracket is received in an inside of the shell, and when the support bracket is rotatable to an open position, the tail portion of the support bracket is detached from the second side wall of the shell, and the support portion of the support bracket is detached from the inside of the shell.Type: ApplicationFiled: July 6, 2006Publication date: January 10, 2008Inventors: Wen-Hao Lin, Wei-Jen Lee
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Patent number: 7283363Abstract: A computer casing has a frame, two fixing panels arranged inside the frame, and two side panels assembled on opposing sides of the frame. The frame, the fixing panels and the side panels are all made of aluminum. The frame includes a top panel, a bottom panel, a front panel and a rear panel fixed together by means of soldering. The computer casing is secured in entirety and has large dissipation area. Additionally, the computer casing is easily classified and recycled in the case of expiration.Type: GrantFiled: January 20, 2006Date of Patent: October 16, 2007Assignee: Stirring Enetrprise Co., Ltd.Inventor: Cheng-Ping Lee
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Patent number: 7282641Abstract: A card case accommodates a card or the like in a hollow portion formed as a result of attachment of a cover member to a bottom member. The cover member has such a structure as to allow reversal of its opposite sides in its attachment to the bottom member. Reversal of the opposite sides of the cover member changes the depth of a planar recess portion of the cover member, the planar recess portion partially constituting the hollow portion. Accordingly, the card case can cope with encapsulation of cards of different thicknesses.Type: GrantFiled: March 30, 2005Date of Patent: October 16, 2007Assignee: R & B 21Inventor: Takashi Ueno
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Patent number: 7219420Abstract: A protective assembly for a printed-circuit electronics card having a metal substrate and a metal screening cover electrically connected to the substrate. The substrate includes a recessed gutter in which the edge of the cover is accommodated. The edge is crimped onto the substrate in the gutter.Type: GrantFiled: March 15, 2005Date of Patent: May 22, 2007Assignee: Valeo VisionInventors: Jean Marc Nicolaï, Marc Duarte, Dung Kong-A-Siou
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Patent number: 7212411Abstract: A screwless clip mounted computer drive.Type: GrantFiled: January 26, 2004Date of Patent: May 1, 2007Assignee: Axxion Group CorporationInventor: Dave Williams
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Patent number: 7164193Abstract: An optical semiconductor apparatus has an eyelet having a through hole, an insulating member provided in the through hole, a semiconductor optical element, and a submount on which the semiconductor optical element is mounted. The insulating member supports a plurality of lead terminals. The submount has a first portion supported by the eyelet, a second portion supported by the eyelet, and a third portion disposed between the first portion and the second portion and located above the insulating member. The semiconductor optical element is provided on the third portion of the submount.Type: GrantFiled: May 20, 2005Date of Patent: January 16, 2007Assignee: Sumitomo Electric Industries, Ltd.Inventors: Seiji Takahashi, Takeshi Okada