Hollow Lead Surrounding Another Lead (e.g., Concentric Type) Patents (Class 174/50.55)
  • Patent number: 9780430
    Abstract: A terminal connection comprises an HF conductor and a terminal apparatus. The terminal apparatus comprises an HF conductor receiving element comprising an HF conductor receiving hole. At least one solder deposit is arranged between the HF conductor and the HF conductor receiving element of the terminal apparatus to establish an electrically conductive connection. There is also an insertion sleeve comprising a receiving opening into which the HF conductor is inserted. The insertion sleeve is inserted into the HF conductor receiving hole in the HF conductor receiving element via an insertion opening on the plug-in side. The insertion sleeve is undeformable and/or is formed from a dielectric. It may also be adapted, in terms of the circumferential lateral face thereof, to an inner face of the HF conductor receiving hole. It may also comprise a receiving channel, which is used for receiving the at least one solder deposit.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: October 3, 2017
    Assignee: Kathrein-Werke KG
    Inventors: Mario Günther, Thomas Haunberger, Johannes Schaller, Manfred Stolle
  • Patent number: 8552293
    Abstract: An electrical feedthrough assembly for providing connection to components of a compressor. The electrical feedthrough assembly includes a housing having an inner surface defining a channel. A sealed wire assembly is provided in the channel. The sealed wire assembly includes a body having an outer surface defining a groove and a plurality of wires sealingly passing through the body. An o-ring fits in the groove to provide a hermetic seal between the body and the inner surface of the housing.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: October 8, 2013
    Assignee: Bristol Compressors International, Inc.
    Inventor: John W. Tolbert, Jr.
  • Patent number: 8431821
    Abstract: An anode substrate constituted of a conductive film forming substrate and a reinforcing substrate having different thermal expansion coefficient and being bonded together by the arrangement of adhesive layers is disclosed. The substrate can prevent creation of cracks on the conductive film forming substrate when heating and cooling the anode substrate. The adhesive layers are arranged at an interval, each of the adhesive layers being formed into a shape selected from a group consisting of a rectangular strip shape and a curved strip shape. The adhesive layers are arranged in a pattern to be symmetry with respect to a center line of the arrangement of the adhesive layers extending perpendicular to a line connecting both longitudinal ends of the arrangement of the adhesive layer. Furthermore, the adhesive layers include an outer adhesive portion located outward among remaining adhesive layers, and the outer adhesive layers are arranged shorter than the remaining adhesive layers.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: April 30, 2013
    Assignee: Futaba Corporation
    Inventors: Toshio Suzuki, Makoto Akira, Koji Tajima, Toshimitsu Fuyuki, Eiji Morimoto, Yawara Inoue
  • Patent number: 8378212
    Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: February 19, 2013
    Assignee: Raytheon Company
    Inventors: James L. Sturges, Robert E. Walsh, George L. Fix
  • Patent number: 8153478
    Abstract: A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: April 10, 2012
    Assignee: STATS ChipPAC Ltd.
    Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
  • Patent number: 7989931
    Abstract: An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: August 2, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
  • Patent number: 6924432
    Abstract: A firewall damper fitting for data transmission lines having a damper body and a vertically sliding cover plate. The cover plate and the damper body having protruding lip portions which allow removable access to data lines while providing an effective damper which retards heat and fire through a sleeve without damaging the data transmission lines.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: August 2, 2005
    Inventor: Thomas V. Connors
  • Patent number: 6235989
    Abstract: In general submerged pumps are lowered into a trench by means of the power cable (12) which passes into the pump head (10). In order to avoid an unnecessary loading on the power cable (12) the invention proposes providing a protective hose which surrounds the power cable (12) and which is secured to the pump head (10) and by means of which the submerged pump can be lowered without in that case loading the power cable.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: May 22, 2001
    Assignee: EMU Unterwasserpumpen GmbH
    Inventor: Michael Suthmann