Lead-in Insulated From Metal Wall Patents (Class 174/50.56)
  • Patent number: 11783971
    Abstract: A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10?6 K?1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10?6 K?1. The ceramic member has a maximum coefficient of thermal expansion of 8-10?6 K?1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: October 10, 2023
    Assignee: KISTLER HOLDING AG
    Inventors: Giovanni Mastrogiacomo, Hans Beat Maerki, Thomas Cadonau
  • Patent number: 11631546
    Abstract: A capacitor and a method for producing a capacitor are disclosed. In an embodiment, a capacitor includes a winding having a cathode foil, an anode foil, separators arranged therebetween and a projection region in which the cathode foil projects beyond the anode foil, wherein, in the projection region, a plurality of layers of the cathode foil are arranged to form a bundle and are directly electrically connected to one another.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: April 18, 2023
    Assignee: TDK ELECTRONICS AG
    Inventors: Norbert Will, Fabio Augusto Bueno De Camargo Mello
  • Patent number: 10544970
    Abstract: The disclosure provides a control device which can be installed within a cold room, and within a refrigerated or air-conditioned environment in general, without the electronics for managing the various components becoming damaged. The disclosed device is easy to install and/or retrofit and requires no burdensome wiring, ducts, cables and connections.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: January 28, 2020
    Assignee: CAREL INDUSTRIES S.P.A.
    Inventors: Luigi Nalini, Giancarlo Tasinato, Stefano Tobio
  • Patent number: 10299399
    Abstract: The waterproof case includes a case body, which defines an inner space for accommodating an electrically functional component. The waterproof case includes at least one opening, and at least one plug, which is mounted in the opening to form a part of a wall of the inner space. The plug includes at least one terminal conduit forming a feedthrough for a terminal. The plug is arranged in the opening to form with the case body an external space, and the external space is filled with an electrically insulating material for sealing the waterproof case.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: May 21, 2019
    Assignee: FRIWO GERÄTEBAU GMBH
    Inventors: Taner Yilmaz, Christopher Carsten Janse
  • Patent number: 9980414
    Abstract: A power converter arrangement comprising: a housing having first and second chambers separated by a separating body; a power semiconductor module; and a device. The capacitor is electrically conductively connected to power semiconductor module by a connecting device. Power semiconductor module, the connecting device and connection elements of the capacitor are arranged in first chamber. The capacitor reaches through the separating body between the first and second chambers into second chamber for cooling of the capacitor. The separating body has a first cutout through which the capacitor reaches. A flat, elastic sealing body which runs peripherally around the first cutout and reaches into the region of the first cutout and surrounds the capacitor there in sealing fashion, is arranged on a surface of the separating body. A pressing body presses the sealing body against the separating body and terminates in sealing fashion there.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 22, 2018
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventor: Mathieu Hebert
  • Patent number: 9899142
    Abstract: The present disclosure relates to a tank of a high-voltage generator including a tank body and a tank lid. There is an opening in the tank lid. The opening is connected to the bellows so as to counteract the volume change of the transformer oil and avoid generation of bubbles. The tank includes a positive transformer, a negative transformer, a bellows, and other components. The high-voltage winding is embedded in the PCBs. The outer insulating bushing is covered by the PCBs so as to improve the insulativity between the turns of the high-voltage winding. In addition, oil barriers may be placed between the positive and the negative transformers, or between the transformers and the ground so as to eliminate the bridge breakdown effect and make the electric field uniform. By means of said measures, the present disclosure improves the stability of the high-voltage generator.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: February 20, 2018
    Assignee: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD
    Inventors: Yunhua Zhang, Jieyong Meng, Qingchang Chen, Yihong Liu, Shilin Shen
  • Patent number: 9820400
    Abstract: A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface thereof a glass unit (2) that seals a plurality of lead terminals therein. The glass unit (2) is disposed in a wall surface of the housing (10) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit (2) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit (2) and metal that forms the wall surface.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: November 14, 2017
    Assignee: NEC SPACE TECHNOLOGIES, LTD.
    Inventors: Rieka Ouchi, Yasuhiro Ishii, Hideki Tanaka
  • Patent number: 9558889
    Abstract: The embodiments relate to a capacitor device for a conductor loop in a device for the in-situ production of heavy oil and bitumen from oil-sand deposits, characterized by a housing and a capacitor unit arranged therein to compensate for the inductive voltage drop along the conductor loop, wherein there are two connection interfaces, wherein each connection interface is designed for mechanical and electrically conductive connection between the capacitor unit and a conductor element of the conductor loop.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: January 31, 2017
    Assignee: Siemens Aktiengesellschaft
    Inventors: Dirk Diehl, Andreas Koch
  • Patent number: 8927862
    Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: January 6, 2015
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Derek John Boettger
  • Patent number: 8881935
    Abstract: A metal housing part having multiple through openings, a glass filling being situated in each of the openings, each glass filling closing an opening hermetically sealed and enveloping a contact end, which extends through the opening and the glass filling and whose two ends protrude out of the glass filling and the opening, and to a method for manufacturing the metal housing part. The housing part is configured as trough-shaped, having a base wall, side walls, and a flange. Because of the trough-shaped design, the housing part maintains its original shape even when the housing part is subjected to high temperatures.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: November 11, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Ulrich Trescher, Eckhard Schaefer
  • Patent number: 8759677
    Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Patent number: 8742257
    Abstract: A cable cap of a control cable has a small-diameter portion and a large-diameter portion on an outer tube side, and a large-diameter portion on a tip side. A bracket includes a cutout groove, into which the small-diameter portion of the cable cap can be inserted from above, an engaging projection that is formed in such a manner as to project from an inner wall of the cutout groove toward another inner wall opposite to the inner wall, and an engaging recess to be engaged with an edge portion of an outer peripheral surface of the large-diameter portion on the outer tube side in a state in which the outer tube side of the control cable is inclined around the small-diameter portion as a fulcrum engaged with the engaging projection by operating force from the outside.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: June 3, 2014
    Assignees: U-Shin Ltd., Mazda Motor Corporation
    Inventors: Takashi Uda, Satoshi Yoshihara, Shigeharu Yokoyama
  • Patent number: 8604341
    Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: December 10, 2013
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Derek John Boettger
  • Patent number: 8581118
    Abstract: A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33, 43 of housings 31, 41 in which a wire member 20 is inserted is configured to include a covering C that includes a spacer member 11 disposed on one side of the through hole, secures the spacer member 11, the wire member 20 and the housings 31, 41 to each other and seals them.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: November 12, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kasuga, Hidehiko Mishima, Kazuya Maruyama
  • Patent number: 8378212
    Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: February 19, 2013
    Assignee: Raytheon Company
    Inventors: James L. Sturges, Robert E. Walsh, George L. Fix
  • Patent number: 8378239
    Abstract: A power terminal feed-through includes a housing body, a plurality of conductive pins, and a seal structure that hermetically seals the conductive pins to the housing body and electrically insulates the conductive pins from the housing body. The seal structure includes a first material fused to one of the housing body and the conductive pin, and a second material fused to the other one of the housing body and the conductive pin. The first and second materials may be properly chosen to match thermal expansion of the housing body and the conductive pins, respectively.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: February 19, 2013
    Assignee: Emerson Electric Co.
    Inventors: Gabe Lakner, Jian Sun, Prasad S. Khadkikar
  • Patent number: 8011970
    Abstract: This invention is directed to systems and methods for providing a port in an electronic device housing that is electrically isolated from a conductive portion of a connector inserted in the port. In some embodiments, the connector may include a non-conductive flange or ring operative to contact the housing and the portions of the housing within the port. In some embodiments, a thin layer of non-conductive material may be applied to the portions of the housing within the port to prevent conductive portions of the connector from coming into contact with the housing (e.g., and grounding the conductive portion). This invention may be of particular interest when the conductive portion that may come into contact with the housing is not used to ground the connector.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: September 6, 2011
    Assignee: Apple Inc.
    Inventors: Stephen Brian Lynch, Emery Sanford, Cameron Frazier
  • Publication number: 20110139484
    Abstract: A method for fabricating a hermetic electrical feedthrough includes engraving a circuitous groove into a surface of an electrically conductive monolithic slab so that the interior of the circuitous groove forms a pin. A dielectric material is formed in the circuitous groove. The pin is then electrically isolated from the surrounding material and provides electrical access through the hermetic feedthrough.
    Type: Application
    Filed: December 8, 2010
    Publication date: June 16, 2011
    Applicant: ADVANCED BIONICS, LLC
    Inventors: Kurt J. Koester, Timothy Beerling
  • Patent number: 7771240
    Abstract: This invention is directed to systems and methods for providing a port in an electronic device housing that is electrically isolated from a conductive portion of a connector inserted in the port. In some embodiments, the connector may include a non-conductive flange or ring operative to contact the housing and the portions of the housing within the port. In some embodiments, a thin layer of non-conductive material may be applied to the portions of the housing within the port to prevent conductive portions of the connector from coming into contact with the housing (e.g., and grounding the conductive portion. This invention may be of particular interest when the conductive portion that may come into contact with the housing is not used to ground the connector.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: August 10, 2010
    Assignee: Apple Inc.
    Inventors: Stephen Brian Lynch, Emery Sanford, Cameron Frazier
  • Patent number: 7759774
    Abstract: An apparatus on a wafer, comprising; a first metal layer of a wall, a second metal layer of the wall, a third metal layer of the wall comprising; one or more base frames, a fourth metal layer of the wall comprising; one or more vertical frame pairs each on top of the one or more base frames and having a pass-thru therein, a fifth metal layer of the wall comprising; one or more top frames each over the pass-thru; and a metal lid.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: July 20, 2010
    Assignee: Intel Corporation
    Inventors: David Fraser, Brian Doyle
  • Publication number: 20080245545
    Abstract: Metal-sealing material-feedthrough, especially for devices which are subjected to high pressures, include at least one metal pin located in a sealing material in a feedthrough opening in a base body, whereby the at least one metal pin is enveloped at least partially by a conductive component element, so that a conductive connection may be created on the one hand between the component element and the metal pin and whereby on the other hand the component element is in contact with the base body, so that a conductive connection can be established between the component element and the base body, the component element possessing a design form to the extent that the component element with respect to its contour essentially follows the contour of the inside wall of the feedthrough opening along a section S.
    Type: Application
    Filed: April 3, 2008
    Publication date: October 9, 2008
    Inventor: Ramdohr Bjorn
  • Patent number: 7164142
    Abstract: Electrical lead-through systems from atmospheric into vacuum environments are presented. Electrical feed-through structures (EFTS) comprised of a multiplicity of parallel connection lines used to operate e-beam tip-array sources in high vac environments for chip lithography are disclosed. In one embodiment, an EFTS comprises a sheet of insulating material having conductive tracks extending along potions of the sheet and a vacuum seal separating one portion from another portion of the sheet so as to maintain a pressure differential among multiple portions of the sheet.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: January 16, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Jimmy Vishnipolsky, Efim Vinnitsky, Eliyahu Almog
  • Patent number: 7145076
    Abstract: A feedthrough terminal pin assembly includes an outer ferrule hermetically sealed through a braze joint to an insulator seated within the ferrule is described. The insulator is also hermetically brazed to at least one terminal pin. The terminal pin is provided with a braze retention structure such as an annular groove that prevents braze material from filleting past the groove. Similarly, either the ferrule or the insulator is provided with a retention structure such as an annular groove that prevents braze material spill out from the insulator/ferrule interface. In that manner, the braze retention structures keep braze material from accumulating in unwanted areas where it could adversely affect hermeticity as well as proper attachment of an EMI filter to the feedthrough assembly.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: December 5, 2006
    Assignee: Greatbatch, Inc.
    Inventors: Scott Knappen, Robert Naugler, Haytham Hussein, Thomas Shipman, Richard Brendel, Christine Frysz
  • Patent number: 6956167
    Abstract: A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the holder body. The lid members are arranged so as to be consistent with an arrangement of surrounding wall members, which are to be sealed with the lid members in a lump to define the envelopers, and the temporary holding of the lid members by the holder body is realized such that lid members can be separated from the lid members after the surrounding wall members are completely sealed with the lid members, without the lid members being removed from the surrounding wall members.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: October 18, 2005
    Assignee: NEC Compound Semiconductor Devices, Ltd.
    Inventors: Toshimichi Kurihara, Takashi Ueda
  • Patent number: 6861586
    Abstract: A welding apparatus having a metal enclosure and a plastic end panels affixed to the enclosure to contain therein the various electrical components of the welding apparatus. There is an internal negative electrical stud within the metal enclosure that has a high voltage applied to the stud. A protective, non-conductive electrical shield is located between the electrical stud and other conductive components within the welding apparatus to prevent arcing between the electrical stud and those conductive components as well as to prevent arcing between the electrical stud and the metal enclosure itself.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: March 1, 2005
    Assignee: Illinois Tool Works Inc.
    Inventor: James J. Cigelske, Jr.
  • Patent number: 6852925
    Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: February 8, 2005
    Assignee: Medtronic, Inc.
    Inventors: William D. Wolf, Joseph F. Lessar, Lynn M. Seifried, Lea A. Nygren
  • Patent number: 6841731
    Abstract: A terminal assembly and terminal installation. In one embodiment, the terminal assembly includes a body having a longitudinal opening therethrough and a shoulder. The terminal assembly is installed in an aperture adapted to receive and join the body to a wall with a joining process material. The terminal assembly includes a current-conducting pin extending longitudinally through the opening in the body, and a dielectric seal between the body and the pin. The shoulder of the body is configured to prevent the migration of debris toward the pin during installation.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: January 11, 2005
    Assignee: Emerson Electric Co.
    Inventor: Jim Zanello
  • Patent number: 6809259
    Abstract: This invention aims to provide a through terminal capable of maintaining air-tightness stably and an X-ray tube having the through terminal. The through terminal includes a tubular member, a plate member formed of an insulating ceramic material and bonded to an inner periphery of the tubular member in a hermetically sealed state, and pins extending through the plate member so that the portions thereof fitted through the plate member are located inside metallic tubes respectively and bonded to the plate member in a hermetically sealed state through the tubes. The tubular member is provided on an inner periphery thereof with a stepped portion for abutment thereagainst of a plate face of the plate member. The tubular member is formed of an alloy including at least iron, nickel, and cobalt.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: October 26, 2004
    Assignee: GE Medical Systems Global Technology Company, LLC
    Inventors: Gorur N. Sridhar, Uma Sridharan, Manohar G. Kollegal
  • Patent number: 6797887
    Abstract: A glass terminal for high-speed optical communication. The glass terminal includes an eyelet member provided with an inserting hole, a signal lead being inserted into the inserting hole and sealed with the eyelet member using glass filled in the inserting hole and an optical element mounting block fixed to the eyelet member. The optical element mounting block having such a size to cover a range where the inserting hole is arranged. The optical element mounting block is provided with a coaxial hole arranged coaxially with the inserting hole and having a diameter larger than that of the signal lead, the signal lead extending into the coaxial hole. The optical element mounting block also includes a said surface partially cut off so that an outer peripheral surface of the signal lead in the coaxial hole is partially exposed.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: September 28, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tetsuya Kojima, Yoshihiko Nakamura
  • Publication number: 20040182590
    Abstract: A soldered feed-through device that is inserted into a bulkhead opening has one or more sets of laterally protruding and symmetrically distributed teeth that cut through the bulkhead material as the feed-through is inserted into the bulkhead opening. The teeth automatically center the feed-through device within the bulkhead opening and resist tilting of the feed-through and its through-hole conductor so that application of solder to the area between the feed-through and the inner periphery of the opening produces a solder joint having uniform radial thickness of preferably about 0.14 mm (0.0055 in.).
    Type: Application
    Filed: February 9, 2004
    Publication date: September 23, 2004
    Inventors: Thaddeus E. Nordquist, Eric Lawrence Nordquist, Kevin T. Luce
  • Publication number: 20040079544
    Abstract: The hermetically sealed electrical feed-through device has a circular metal disk (11, 21) with a conductive isolated pin (13, 23) hermetically sealed in a through-going circular opening (O, O′) by a glass seal (17, 27) and a conductive ground pin (15, 25) connected with a rear side of the metal disk (11, 21) adjacent to the through-going circular opening and extending approximately parallel to the isolated pin. The isolated pin (13, 23) has an oval or elliptical section (13a, 23a) extending through the glass seal (17, 27), whereby different bridge wires of different lengths are connectable on the front side of the metal disk between the front surface of the metal disk and the isolated pin (13, 23). In one embodiment the pins are straight and the through-going circular opening is offset in the metal disk; in another embodiment the pins are bent and the through-going circular opening (O,O′) is centrally positioned in the metal disk (11,21).
    Type: Application
    Filed: October 21, 2002
    Publication date: April 29, 2004
    Inventor: Neil Heeke
  • Publication number: 20040079545
    Abstract: The hermetically sealed electrical feed-through device has a circular metal disk (11) with a conductive angular or bent isolated pin (13) hermetically sealed in an oval or elliptical through-going opening (O) whose center coincides with the center of the circular metal disk. The angular or bent isolated pin (13) is sealed in the oval or elliptical opening (O) by means of a glass-to-metal seal (17). An angular or bent ground pin (15) is connected to the rear side of the circular metal disk (11) adjacent to the opening (O) and extends approximately parallel to the isolated pin (13). Because the through-going opening (O) has an elliptical or oval cross-section section, different bridge wires of different lengths are connectable on the front side of the metal disk (11) between the front surface of the circular metal disk (11) and the angular or bent isolated pin (13). The isolated and ground pins both have circular transverse cross-sections.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 29, 2004
    Inventor: Neil Heeke
  • Patent number: 6586675
    Abstract: A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating material, for example, in a gap between the insulating material and the ferrule, or directly to the side of the insulating material and abutting the surface of the ferrule. If the ground wire is coupled or brazed in a gap, the gap may be formed by a notch in either the insulating material, the ferrule or both.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: July 1, 2003
    Assignee: Morgan Advanced Ceramics, Inc.
    Inventors: David Joseph Bealka, Pedro Henrique Da Costa
  • Patent number: 6433275
    Abstract: The invention is a watertight plastic housing for an electrical device, having a base 2, a lid 12 of a size and shape to be friction-induced welded 13 to base 2. The housing has a fixed male-threaded nipple 1, which is hollow (opening 5), permitting wires 10 to pass through a housing wall. When the housing base is friction-induced welded to the lid, a prior art washer is externally seated on the nipple, the nipple is inserted into a hole 15 of a prior art junction box 16, and the nipple is secured to the junction box with a prior art nut, the housing and housing-to-junction box substantially provides a watertight seal.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: August 13, 2002
    Inventors: Kenneth W. Rittmann, Albert D. Rittmann
  • Publication number: 20020100599
    Abstract: The invention is a watertight plastic housing for an electrical device, having a base 2, a lid 12 of a size and shape to be friction-induced welded 13 to base 2. The housing has a fixed male-threaded nipple 1, which is hollow (opening 5), permitting wires 10 to pass through a housing wall. When the housing base is friction-induced welded to the lid, a prior art washer is externally seated on the nipple, the nipple is inserted into a hole 15 of a prior art junction box 16, and the nipple is secured to the junction box with a prior art nut, the housing and housing-to-junction box substantially provides a watertight seal.
    Type: Application
    Filed: January 26, 2001
    Publication date: August 1, 2002
    Inventors: Kenneth W. Rittmann, Albert D. Rittmann
  • Publication number: 20020092663
    Abstract: A glass-sealed electrical fitting for an automotive fuel tank is mounted on a flange which supports an internal fuel pump and fuel level sensor within the fuel tank. In one form, the glass seal surrounds a plurality of pins longitudinally disposed within an elongated housing which penetrates a fuel tank wall. An outer surface of the housing engages rigidly to the flange, and an inner surface of the housing engages to the glass seal. In another form each pin is sealed to a housing by a separate glass seal.
    Type: Application
    Filed: January 18, 2001
    Publication date: July 18, 2002
    Inventor: Daniel A. Gilmour
  • Publication number: 20020066583
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
    Type: Application
    Filed: March 7, 2001
    Publication date: June 6, 2002
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Patent number: 6245993
    Abstract: Hermetically sealed electrical leads emanating from the neck portion of a conductive housing extend through a sleeve member that includes conductive and non-conductive parts. The sleeve member is dimensioned to firmly engage the neck portion of the housing. When so engaged, the electrical leads extend through longitudinal openings in the non-conductive part. In that way, a substantial extent of the leads is shielded. Moreover, the extent to which the leads can be laterally moved with respect to their hermetic seals is thereby significantly restricted.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 12, 2001
    Assignee: Agere Systems Guardian Corp.
    Inventors: John Philip Franey, Boris Roman Wirstiuk, Robert D. Yadvish