Abstract: In various examples, a component is for use in an implantable medical device. The component includes a pin including a first material attached to a lead including a second material different from the first material of the pin. At least a portion of the lead includes a channel in which at least a portion of the pin sits, the channel including a channel opening defined at least partially by opposing first and second channel sides extending a channel length. At least a first joint is formed along at least a portion of the first channel side. The first joint includes the second material of the lead deformed to at least partially close the channel opening to retain the pin within the channel to attach the lead to the pin. In some examples, the first material includes molybdenum and the second material includes aluminum.

Abstract: A cable breakout assembly is provided, including a feeder cable, a breakout structure having a first end threadedly engaged with a cable nut having a single-port cable gland through which the feeder cable extends, a central conduit which houses the sections of the feeder cable passing there through, and an opposed second end threadedly engaged with a cable nut having a multi-port cable gland, whose number of ports corresponds to the number of splices of the feeder cable. A plurality of environmentally sealed, flexible conduits are provided, each having a first end that interfaces with and extends from a respective port of the multi-port gland, and a second end adapted to interface with an external device, wherein each flexible conduit houses a respective spliced section of the feeder cable therein.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.

Abstract: Terminal pins that include a refractory metal partially welded to a terminal block of a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A metallization that includes a composite of alternating metal and metal oxide layers for incorporation into feedthrough filter capacitor assemblies is described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A mobile terminal comprises: a case forming appearance of the mobile terminal, and having a printed circuit board (PCB) therein; and a connection terminal mounted to the case, and configured to electrically connect the PCB to an external device, wherein the connection terminal comprises: an external terminal supported by an outer surface of the case; and an internal terminal elastically contacting a terminal of the PCB, connected to the external terminal, and supported by an inner surface of the case.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A high-pressure-resistant hermetic seal terminal includes an eyelet which has a through hole and a lead which is electrically insulated and hermetically sealed via a glass material in the through hole. The glass material is welded in a manner to extend on a lower surface of the eyelet from an end of the through hole to surroundings of the end of the through hole. Preferably, the eyelet has a counterbore, in the lower surface, extending in a region around and surrounding the through hole, and the glass material is welded to the inside of the counterbore.

Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: Embodiments of an electronic device apparatus are disclosed. One apparatus includes a housing structure having an inner surface and an outer surface. A plurality of electrical feed-throughs extend through the housing structure from the outer surface to the inner surface. Each of the feed-throughs includes an outer surface cross-section and an inner surface cross-section and a pass through cross-section. The pass through cross-section of the feed-through is located at a portion of the feed-through that extends through the housing structure. The outer surface cross-section is located where the feed-through is exposed on the outer surface, and the inner surface cross-section located where the feed-through is exposed on the inner surface. The feed-through cross-section is less than the outer surface cross-section and the inner surface cross-section.

Abstract: An apparatus on a wafer, comprising; a first metal layer of a wall, a second metal layer of the wall, a third metal layer of the wall comprising; one or more base frames, a fourth metal layer of the wall comprising; one or more vertical frame pairs each on top of the one or more base frames and having a pass-thru therein, a fifth metal layer of the wall comprising; one or more top frames each over the pass-thru; and a metal lid.

Abstract: An optoelectronic component and an optical sub-assembly for optical communication. The optoelectronic component has a housing and one end formed with an opening. An optoelectronic device is located in the housing and faces the opening. A barrel is combined with the optoelectronic component to form the optical sub-assembly, and the barrel has a lens configuration facing the opening. The lens can enter the housing through the opening to approach the optoelectronic device. Thus, the manufacturing costs of the optoelectronic component and the optical sub-assembly can be lowered, and the optical coupling efficiency of the optical sub-assembly can be enhanced. In addition, a film covers the surface of the optoelectronic device to improve the device reliability.

Abstract: A feedthrough terminal pin assembly includes an outer ferrule hermetically sealed through a braze joint to an insulator seated within the ferrule is described. The insulator is also hermetically brazed to at least one terminal pin. The terminal pin is provided with a braze retention structure such as an annular groove that prevents braze material from filleting past the groove. Similarly, either the ferrule or the insulator is provided with a retention structure such as an annular groove that prevents braze material spill out from the insulator/ferrule interface. In that manner, the braze retention structures keep braze material from accumulating in unwanted areas where it could adversely affect hermeticity as well as proper attachment of an EMI filter to the feedthrough assembly.

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Abstract: A terminal assembly and terminal installation. In one embodiment, the terminal assembly includes a body having a longitudinal opening therethrough and a shoulder. The terminal assembly is installed in an aperture adapted to receive and join the body to a wall with a joining process material. The terminal assembly includes a current-conducting pin extending longitudinally through the opening in the body, and a dielectric seal between the body and the pin. The shoulder of the body is configured to prevent the migration of debris toward the pin during installation.

Abstract: The invention provides a lead structure having a lead of low resistance material disposed within a surrounding sleeve or collar of low expansion material which is bonded at one end to the lead. The sleeve or collar is bonded on its outer surface to an insulating wall through which the lead structure extends. The lead is preferably copper and the sleeve or collar is preferably a nickel-alloy. The lead is hermetically sealed to the surrounding sleeve, and the sleeve is hermetically sealed to the insulating wall to provide a hermetic structure which does not detract from the use of high conductivity electrical lead materials which are often not employable in conventional hermetic sealed leads or packages. A plurality of lead structures can be employed in one or more walls of a circuit package.

Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body.

Abstract: An electronic enclosure having a cover and a base member reduced in height by providing the necessary height on the decoupling area around and generally in the same vertical space as is occupied by the thickness of glass provided to hermetically seal the enclosure. The glass is formed inside and kept away from the decoupling area by an inner ring fixed to the base member, or by a tool which is removed after the glass has been applied to seal the enclosure.