Abstract: A solid electrolytic capacitor including a capacitor element, a first anode lead, a second anode lead, and a carrier wire. The capacitor element includes a sintered, porous anode body; a dielectric layer overlying the sintered, porous anode body; and a cathode overlying the dielectric layer that includes a solid electrolyte. The first and second anode leads each have an embedded portion positioned within the anode body and an external portion extending longitudinally from a surface of the anode body in an x-direction, while the carrier wire is positioned external to the anode body. Further, a first portion of the carrier wire is connected to the external portions of the first and second anode leads, while a second portion of the carrier wire extends longitudinally away from the surface of the anode body in the x-direction. Such an arrangement reduces the ESR and leakage current of the capacitor.

Abstract: A resistor and a manufacturing method thereof are disclosed. Since a ceramic tube formed of a ceramic material is used and the ceramic tube is joined to sealing electrodes by use of brazing rings, joining strength and durability of the resistor are considerably improved. The resistor may be stably used at a high voltage due to excellent heat dissipation characteristics thereof.

Abstract: A flexible device has a flexible panel, a driver, and a restraining component. The flexible panel includes a main region and a driver bonding region outside the main region. The driver is electrically connected to the driver bonding region. The restraining component is disposed adjacent to the driver bonding region. Rigidity of the restraining component is greater than rigidity of the flexible panel, and coefficient of thermal expansion of the restraining component is smaller than coefficient of thermal expansion of the flexible panel.

Abstract: An electronic device includes a shielding member, an electric circuit, and a filter capacitor. The electric circuit has an output line and is arranged inside the shielding member. The filter capacitor is arranged outside the shielding member to be connected to the output line.

Abstract: A structure of a panel which can be thinned down to about a panel thickness of a PDP and a manufacturing method thereof are provided. A gas filling hole is provided to a surface of a rear glass substrate of a PDP, the surface coming in contact with a front glass substrate of the PDP. Vacuuming and filling of a discharge gas are performed through the gas filling hole. After filling of the discharge gas, a mechanism for lifting solder iron up and down and supplying solder provided inside a chamber inserts a tip of an ultrasonic soldering iron into the gas filling hole to start supplying a solder which is a material for a plug sealant. When a series of forming steps of the plug sealant are finished, the ultrasonic soldering iron is retreated before the solder is solidified to finish formation of the plug sealant.

Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.

Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.

Abstract: The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.

Abstract: A power terminal feed-through incorporates a metallic body through which extend one or more current conducting pins that are hermetically sealed to the metallic body by a glass-to-metal seal. The metallic body includes an annular lip with a protrusion. During welding installation of the power terminal feed-through, the protrusion serves to assist in the welding process, better controlling the location and definition of the weld between the metallic body and a housing, and to focus the welding heat at the protrusion, thereby protecting the glass-to-metal seal. The glass-to-metal seal can be a single glass insert through which the current conducting pins extend, thereby reducing the pin circle diameter and the overall size of the power terminal feed-through.

Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.

Abstract: A signal adapter comprising an explosion proof housing, a circuit member disposed on an inside of the explosion proof housing, a signal input connector electrically connected to the circuit member, a signal output connector electrically connected to the circuit member, and a seal disposed on the inside of the explosion proof housing and around the circuit member, creating an explosion proof seal between the signal input connector and the signal output connector.

Abstract: A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.

Abstract: The current invention provides a optical MEM device and system with an angled lid for hermetically sealing an active MEMS structure. The lid is sealed through an asymmetric seal formed with sealing rings having an asymmetric distribution of solder wetting surfaces which tilts the lid, when the lid and a substrate are soldered together. The asymmetric distribution wetting surfaces can be provided by forming one or more edge features, by patterning portions of the sealing rings or both. Preferably, the lid is transparent to one or more wavelengths of light in a range of 300 to 3000 Angstroms and hermetically seals a grating light valve structure having a plurality of movable ribbon for modulating light through the lid.

Abstract: A hermetic terminal assembly including a body member with a bottom portion and a surrounding boundary or flange portion with at least one current conducting pin sealed in an opening in the bottom portion. The hermetic terminal assembly may include an over-surface stratum or disk disposed in close fit relation in said body member in facing relation with said bottom and flange portions and/or an electrically insulating coating.

Abstract: A hermetic terminal assembly including a body member with a bottom portion and a surrounding boundary or flange portion with at least one current conducting pin sealed in an opening in the bottom portion and an over-surface stratum or disk disposed in close fit relation in said body member in facing relation with said bottom and flange portions and having disk retention means therefore, and preselectively sized and positioned fuse-like burn-off apertures in the current conducting pin to interrupt current conductivity at selected times, temperatures and amperage density.