Foil Or Flat Lead-in Patents (Class 174/50.64)
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Patent number: 11123929Abstract: In an example, a data unit includes a data unit mounting having a circuitry region, a registration portion, and a retaining feature. Circuitry comprising a data source to provide at least one additive manufacturing parameter is arranged on the circuitry region of the mounting. The data unit mounting is to be removably mounted on a receiving portion of an additive manufacturing build material component, such that the registration portion is to be received in a corresponding guide portion of the receiving portion of the additive manufacturing build material component, and the retaining feature is prevent removal of the data unit from the receiving portion unless deformed. Deformation of the retaining feature to effect removal of the data unit from the receiving portion may be a permanent deformation.Type: GrantFiled: May 12, 2016Date of Patent: September 21, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ismael Chanclon Fernandez, Xavier Alonso Becerro, Ernesto Alejandro Jones Poppescou, Jorge Castano Aspas, Salvador Sanchez Ribes, Luis Garcia Garcia, Carmen Blasco
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Patent number: 11064732Abstract: A cartridge for an electronic smoking device includes a heat source comprising a bulb-encased heating element. The heat source is disposed inside a compartment of the cartridge. The compartment extends from an air flow tube. The housing includes a storage area for retaining inhalant material. The cartridge includes a threaded connector that attaches to a control unit that has a power supply such as a batter. The cartridge avoids direct contact between the inhalant material and any metal components of the cartridge by either eliminating metal components or by encasing the metal components in glass, quartz, or ceramic.Type: GrantFiled: December 13, 2018Date of Patent: July 20, 2021Assignee: Healthier Choices Management Corp.Inventors: Gilbert Cyphert, Edwin Balder, Daniel Julia, Jeffrey E. Holman
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Patent number: 8642886Abstract: In a seal structure sealing a housing for passing a signal line therethrough, the seal structure includes: a first case; a second case joined to the first case to define the housing, and provided with a recess portion through which the signal line passes at a joining surface joining the first case; a first seal member arranged on a bottom surface of the recess portion, and mounting the signal line; a second seal member including a gelatinous composition arranged to cover the signal line arranged on the first seal member; and a third seal member arranged between the first and second cases, and pushing the second case.Type: GrantFiled: February 24, 2011Date of Patent: February 4, 2014Assignee: Fujitsu LimitedInventors: Shingo Yamaguchi, Satoshi Watanabe, Kohei Choraku, Shigehiro Fujii, Katsumi Adachi, Yoshito Fukata
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Patent number: 8525024Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).Type: GrantFiled: September 30, 2009Date of Patent: September 3, 2013Assignee: NOK CorporationInventors: Hiroaki Kaneda, Takeshi Yamada
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Publication number: 20130206445Abstract: Sealing performance between a sealing member and a reinforcing plate adhered to a wiring unit is prevent from being deteriorated. An FPC 1 is integrated with a sealing member 2, and a cover 3 is attached to a front end portion. On upper and lower surfaces of the FPC 1, reinforcing plates 12 each having a shape of a rectangular flat plate are arranged and adhered in an opposing manner interposing the FPC 1. The sealing member 2 is formed of elastic material such as rubber, and is fixedly attached to the FPC 1 such that the sealing member 2 covers the reinforcing plates 12 adhered to the upper and lower surfaces of the FPC 1 together with the FPC 1 located along front edges and rear edges of the reinforcing plates 12.Type: ApplicationFiled: October 14, 2011Publication date: August 15, 2013Applicant: YAZAKI CORPORATIONInventors: Kazunori Miura, Takatoshi Suzuki
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Patent number: 8378212Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.Type: GrantFiled: June 4, 2009Date of Patent: February 19, 2013Assignee: Raytheon CompanyInventors: James L. Sturges, Robert E. Walsh, George L. Fix
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Patent number: 8129622Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.Type: GrantFiled: May 21, 2009Date of Patent: March 6, 2012Assignee: Medtronic, Inc.Inventors: William John Taylor, Brad C. Tischendorf
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Patent number: 7107676Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.Type: GrantFiled: November 5, 2003Date of Patent: September 19, 2006Inventor: Elmer G. Fridrich
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Patent number: 6812404Abstract: Feed through assemblies and methods for their manufacture are provided. The feedthrough assemblies include a ferrule, an insulating material contacting the ferrule, and a terminal extending through the ferrule and having first and second areas separated by an area contacting the insulating material. A brazing material contacts the insulating material and the terminal's first area, and a conductive material covers the terminal's second area. The presence of the conductive material causes current density to be dispersed away from the brazing material.Type: GrantFiled: October 14, 2003Date of Patent: November 2, 2004Assignee: Medtronic, Inc.Inventor: Gonzalo Martinez
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Patent number: 6674001Abstract: A solder glass which has, by weight: about 60 to 67% Sb2O3; about 27 to 32% B2O3; and from greater than 0 to 10% ZnO. The glass has a softening point between 388 and 466° C., depending on the ZnO content. The glass can be employed as a molten seal in electrical devices such as tungsten halogen or metal halide lamps.Type: GrantFiled: February 23, 1995Date of Patent: January 6, 2004Assignee: Osram Sylvania Inc.Inventors: Richard C. Marlor, Paul W. Salvi
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Patent number: 6307150Abstract: A vacuum seal suitable for use with field emission arrays is described. This seal has high reliability because the expansion coefficients of the metal and the glass are closely matched. Materials traditionally used for cathode and gate lines continue to be employed. To achieve this, a gap is introduced into each conductive line near the edges of the display. This gap is bridged by a material having an expansion coefficient that more closely matches that of the glass used for the seal and is the only material that contacts the seal. The bridge may be in the form of a deposited layer or it may be a discrete wire. A description of how the structure is manufactured is also provided.Type: GrantFiled: October 8, 1999Date of Patent: October 23, 2001Assignee: Industrial Technology Research InstituteInventors: Wen-Chun Wang, Chun-hui Tsai, Chih-Hao Tien