Abstract: Systems are provided for a heat exchanger assembly. In one example the system may include a top plate, a fluid inlet and a fluid outlet, a bottom plate coupled to the top plate, a perforated plate positioned between the top plate and the bottom plate having an underside facing the bottom plate and including perforations shaped to generate an impingement jet onto the bottom plate, and at least one of the following: the top plate comprising a portion being inclined with respect to a longitudinal axis of the heat exchanger assembly; the perforated plate being inclined with respect to the longitudinal axis or a lateral axis of the heat exchanger assembly; and the heat exchanger assembly further comprising a flow control plate.

Abstract: A guide panel comprised of unitized construction that includes a guidance slot, an engagement structure, a power-data transmission alignment structure, and electrostatic discharge components.

Abstract: Aspects of the present disclosure relate to selectable and interchangeable covers, frames, and lids for a plurality of different telecommunications module frames. The selectable covers can vary, for example, with respect to size, shape, and number arrangement, and configuration of ports to provide for different selectable combinations of module assemblies.

Abstract: The in-vehicle camera comprises a lens barrel; a circuit board on which an image processing circuit is mounted, the image processing circuit performing image processing to recognize a subject from video signals; and a housing which includes an intake vent and an exhaust vent and accommodates therein the circuit board such that the image processing circuit and the lens barrel are away from each other in the left-right direction. The in-vehicle camera is configured such that a ventilation passage connecting the intake vent and an exhaust vent is formed between an inner face on a side of the installation face of the housing and the circuit board in a path that is away from the lens barrel and passes through a region in which the image processing circuit is disposed.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: An electronic equipment chassis comprises a chassis housing and two or more cooling compartments in the chassis housing. At least a first one of the two or more cooling compartments in the chassis housing utilizes a first type of cooling for a first set of electronic equipment housed therein, and at least a second one of the two or more cooling compartments in the chassis housing utilizes a second type of cooling for a second set of electronic equipment housed therein. The first type of cooling comprises liquid immersion cooling and the second type of cooling comprises non-liquid immersion cooling.

Abstract: An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: A housing includes: a housing body, having a cavity therein, with a first through hole in an outer wall thereof. The first through hole is in communication with the cavity, a first separate plate and a second separate plate are provided in the cavity, a gap between the first separate plate and an inner wall at one side of the cavity is in communication with the first through hole. A first recess for placing a water absorption device is provided between the first separate plate and the second separate plate, a bottom of a second recess between the second separate plate and the inner wall at another side of the cavity is in communication with the first through hole. A partial bottom of second recess close to first through hole is at a lower position than another partial bottom of second recess away from first through hole.

Abstract: A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

Abstract: An electronic component connector cooling device can include a base portion and a conduit portion extending from the base portion. The conduit portion can have a cooling channel. The electronic component connector cooling device can further include a housing coupling interface formed in the base portion and operable to facilitate coupling the electronic component connector cooling device to a housing that at least partially forms an enclosure about an electronic component. The electronic component connector cooling device can also include a connector coupling interface formed in the base portion and operable to facilitate coupling a connector to the electronic component connector cooling device. The connector can operably connect the electronic component to a component external to the enclosure. The electronic component connector cooling device can further include an inlet port formed in the conduit portion and in fluid communication with the cooling channel.

Abstract: A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.

Abstract: A liquid dispensing system includes a liquid container and a one way user-actuated dispensing valve for dispensing contained liquid. The liquid container further includes a two way vent which allows for ventilation of the contained liquid/gas in response to changes in air pressure outside of the liquid container.

Abstract: An intelligent power module packaging structure includes an insulated heat dissipation substrate, a plurality of power devices, a control chip, a lead frame, and an encapsulant. The insulated heat dissipation substrate has a first surface and a second surface opposite to the first surface. The power devices are disposed on the first surface. The control chip is disposed on the first surface. The control chip provides a gate driver function for driving the power devices and a pulse width modulation function. The lead frame is bonded onto the first surface. The power devices are electrically connected to the control chip and the lead frame. The encapsulant at least encapsulates the power devices, the control chip, and a portion of the lead frame, and the second surface is entirely or partially exposed outside the encapsulant.

Abstract: A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.

Abstract: A method for converting a computing device from a first configuration to a second configuration is provided. A power supply unit of the computing device is moved from a first location at a second end of the computing device to a second location at a first end of the computing device. The power supply unit is rotated such that a power interface of the power supply unit is visible from the first end of the computing device. A set of fans of the computing device is rotated such that airflow direction of the set of fans matches an airflow direction of the power supply unit at the second location. Converting the computing device from the first configuration to the second configuration can allow communication ports to be accessed from a front end or from a rear end of the computing device.

Abstract: A metal mask is disposed on a copper base plate. A solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste on each of copper plates of the copper base plate. A semiconductor element and a conductive component are placed on the respective patterns of the solder pastes. A metal mask is disposed on the copper base plate. Then, a solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste covering each of the semiconductor element and the conductive component. A large-capacity relay board is disposed so as to come into contact with a corresponding pattern of the solder paste. A power semiconductor device is completed by performing heat treatment under a temperature condition of 200° C. or higher.

Abstract: Semiconductor assemblies using edge stacking and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise stacked semiconductor packages including a base substrate having a base surface, a side substrate having a side surface orthogonal to the base surface, and a die stack disposed over the base surface and having an outermost die with an outermost surface orthogonal to the side surface. The side substrate can be electrically coupled to the die stack via a plurality of interconnects extending from the side surface of the side substrate to the first surface of the first substrate or the third surface of the outermost die. The semiconductor packages can further comprise a conductive material at an outer surface of the side substrate, thereby allowing the semiconductor packages to be electrically coupled to neighboring semiconductor packages via the conductive material.

Abstract: A camera module for a vehicular vision system includes a lens barrel having a plurality of optical elements accommodated therein, a front camera housing portion that accommodates at least one printed circuit board therein, and a rear camera housing portion mated with the front camera housing. The imager is optically aligned with an optical axis of the optical elements. A heat transfer element is disposed between and in thermal conductive contact with a thermoelectric device and the printed circuit board. Circuitry of the camera module is electrically connected to the imager and the thermoelectric device and is electrically connected to electrical connecting elements that electrically connect to a wire harness of a vehicle when the camera module is disposed at the vehicle. The thermoelectric device is electrically powered to draw heat from the imager printed circuit board to the rear camera housing portion.

Abstract: A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Abstract: An electronic unit for a hand-held power tool, having a mounting frame having an accommodation space into which a circuit board carrying a plurality of electronic components is inserted and at least one heat sink for the heat dissipation of waste heat arising at the electronic components. A slot section with at least one insertion slot, oriented perpendicular to the printed circuit board, for mounting an electronic component along a direction of insertion is formed on the mounting frame. The at least one heat sink is associated with the slot section.

Abstract: Screening a batch of integrated circuits (IC) may be done with test patterns provided in a sequence of test vectors. The sequence of test vectors may be fetched from a memory coupled to a tester and then one or more bits from each test vector may be provided to the tester. A test pattern is formed by updating a latch in a periodic manner with a bit value from a same bit position from each of the sequence of test vectors. The test pattern may then be applied to an input pin of a device under test and a resulting signal may be monitored on an output pin of each one of the batch of ICs. A slow speed ICs may be screened by treating each IC that passes both a fast pattern test and a slow speed pattern test as a failure, for example.

Abstract: Provided is a wiring unit in which oil bubbles are prevented from being generated. A wiring unit includes: a wire harness; and a rectifying member that is located above the wire harness and is provided with a rectifying plate that is located inside a through hole that penetrates through the rectifying member in a top-bottom direction, and that has a plate surface that is inclined relative to a vertical direction.

Abstract: A housing for measuring instruments has a sealing element with conductor guides for guiding insulated conductors therethrough. The sealing element is prefabricated. The conductor ends of the conductors are at least partly stripped. A transition point between the insulated conductor and the partly stripped conductor end is located in the conductor guide within the sealing element.

Abstract: An object of the invention is to provide a power conversion device which secures insulation and is miniaturized still more without being affected by electromagnetic noises. A power conversion device according to the invention includes a power semiconductor module which converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal, and a resin cover portion which includes an insulating portion disposed between the DC positive terminal and the DC negative terminal. The cover portion holds a metal member which covers the DC positive terminal and the DC negative terminal.

Abstract: According to one embodiment, an outdoor unit is provided with a housing, an outdoor heat exchanger, and a communication unit. The housing has a ventilation opening and contains the outdoor heat exchanger. The communication unit is disposed within the housing at a position facing the ventilation opening and performs contactless data communication with a nearby information terminal.

Abstract: A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.

Abstract: A connector is mateable with a mating connector along a predetermined direction. The connector comprises a mated-state detection member and a holding mechanism which includes a reference surface, insulating portions and an insulating external wall. Each of the insulating portions projects from the reference surface by a first predetermined length in the predetermined direction. The insulating external wall projects beyond the reference surface in the predetermined direction and surrounds the insulating portions in a plane perpendicular to the predetermined direction. The mated-state detection member is held by the holding mechanism and is movable between a projecting position and a receding position in the predetermined direction. The mated-state detection member at the projecting position projects from the reference surface by a second predetermined length which is shorter than the first predetermined length.

Abstract: Circuitry of a fiber node which is configured to couple to an optical link and an electrical link may comprise an electrical-to-optical conversion circuit for transmitting on the optical link. The circuitry may be operable to receive signals via the optical link. The circuitry may select between or among different configurations of the electrical-to-optical conversion circuit based on the signals received via the optical link. The signals received via the optical link may be intended for one or more gateways served by the fiber node or may be dedicated signals intended for configuration of the circuitry. The circuitry may be operable to generate feedback and insert the feedback into a datastream received from one or more gateways via the electrical link prior to transmitting the datastream onto the optical link.

Abstract: Screening a batch of integrated circuits (IC) may be done with test patterns provided in a sequence of test vectors. The sequence of test vectors may be fetched from a memory coupled to a tester and then one or more bits from each test vector may be provided to the tester. A test pattern is formed by updating a latch in a periodic manner with a bit value from a same bit position from each of the sequence of test vectors. The test pattern may then be applied to an input pin of a device under test and a resulting signal may be monitored on an output pin of each one of the batch of ICs. A slow speed ICs may be screened by treating each IC that passes both a fast pattern test and a slow speed pattern test as a failure, for example.

Abstract: A jewelry storage, display or travel case has an upper planar layer of a pliable plastic sheet and clings to a lower plastic sheet for insertion of delicate jewelry there between. The lower plastic sheet is stiffened by a backing layer so that the upper pliable layer can be peeled away without disturbing the support provided to delicate jewelry stored within. The laminate of the 2 plastic sheets and the backing layer is optionally flexible enough to roll for packing, or can be stiffer for forming rigid pages in a binder or packing in a strong stack. The case can have transparent plastic pliable sheets on opposite side of the backing layer, each being capable being peeled away from a lower plastic sheet laminated to opposing sides of the backing layer.

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.

Abstract: An electronic device includes a main body, two air guiding plates, and a cover. The main body includes a bottom plate and two side plates extending up from opposite sides of the bottom plate. A number of mounting tabs extend from an inner side of each side plate, arranged in a row. A circuit board is supported on the bottom plate, and includes a number of electronic components located between the two rows of mounting tabs. A cutout is defined in a top of each mounting tab. A number of hooking slots are defined in a bottom of each air guiding plate. Top walls of the hooking slots of each air guiding plate are respectively supported by bottom walls of the cutouts of the corresponding row of mounting tabs. The cover is covered on a top of the main body and abuts tops of the air guiding plates.

Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

Abstract: An apparatus and method for temperature induced warpage compensation in an integrated circuit package is disclosed. The apparatus consists of bonded layers of material having different thermal coefficients of expansion. The bonded layers are bonded to the top of the integrated circuit package. By appropriate choice of temperature coefficients the layers of material can compensate for either convex or concave warpage. In some embodiments, the layers of material have apertures therein allowing compensation for more complex warpages. As well, in some embodiments the top layer of material does not have a planar cross-section. A method is also disclosed for manufacturing an integrated circuit package assembly. The apparatus and method provide an alternative to methods of dealing with IC package warpage known in the art.

Abstract: A networking enclosure with removable and interchangeable sides includes a housing with an internal cavity for receipt of electrical devices and first, second, and third openings. The enclosure also includes first, second, and third sets of panels corresponding to each of the openings. The first set of panels includes at least two panels with different configurations and being selectively engageable with the housing to substantially close the first opening. The second set of panels includes at least two panels with different configurations and being selectively engageable with the housing to substantially close the second opening. Similarly, the third set of panels includes at least two panels having different configurations and being selectively engageably with the housing to substantially close the third opening. The panels can be solid or include apertures such as knockouts, louvers, or a combination thereof.

Abstract: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular housing. The customized storage container also encloses a second row of interconnector modules positioned adjacent to the first, open end of the rectangular housing. At least one air vent is positioned along a side of the rectangular housing and adjacent to a second, closed end of the rectangular housing. According to one exemplary embodiment, the storage container can comprise a single printed circuit board for supporting the first and second row of interconnector modules. In another exemplary embodiment, the storage container can comprise two printed circuit boards for supporting the first and second rows interconnector modules.

Abstract: A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover.

Abstract: This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are connected to the avionic rack on the one hand electrically (C3-C4) and on the other hand fluidically (36?-37, 45?-44) to a system of pipes (30a, 30b) on at least one cold source for a cooling fluid (30). A heat-dissipating electronic board (35) is equipped with a dissipated-heat collector plate (61-65), in which fluid circulation channels are implemented, connected via quick-disconnect fluidic couplings (42, 39) to quick-disconnect fluidic couplings of the system of pipes. These devices allow the equipment to be removed from or inserted into the rack (32-EE) or the electronic board (35) to be removed from or inserted into the electrical equipment (33-35).

Abstract: An enclosure that includes a box structure that includes a plurality of sides defining a sealed chamber for containing a heat producing component. At least one of the sides of the box structure includes a panel. The panel includes two outer sheets and an inner layer of material sandwiched between the two outer sheets. The two outer sheets and the inner layer of material collectively define a plurality of fluid flow channels extending from a first end of the two outer sheets to a second end of the two outer sheets. Heat generated by the heat producing component is transferred to at least one of the outer sheets which transfers the heat to fluid flowing through the fluid flow channels. The panel can be the main load bearing path of the box structure.

Abstract: A system for suppressing an overheat condition in an electrical housing includes an electrical housing that defines a housing area including one or more electrical devices; a suppression fluid container containing a suppression fluid; a valve configured to regulate the flow of the suppression fluid from the suppression fluid container to the housing area; at least one sensor configured to sense at least one of temperature and smoke; and a controller communicatively connected to the at least one sensor and the valve, the controller configured to receive signals from the at least one sensor indicating an overheat condition in the housing area; and in response to the received signals indicating the overheat condition in the housing area, control the valve to allow the suppression fluid to flow from the suppression fluid container into the housing area, in order to suppress the overheat condition in the housing area.

Abstract: A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A power converting apparatus includes a housing, a cable, and a grommet supporting member. The housing includes a housing base, a main body, and an air duct. The housing base has a first surface and a second surface and includes a through hole. The main body includes a plurality of electronic components on the first surface of the housing base. The air duct is disposed on the second surface of the housing base, and cooling air flows through the air duct. The cable is disposed through the through hole of the housing base so as to be wired between the main body and the air duct. The grommet supporting member is in the air duct or the main body. The grommet supporting member supports a grommet through which the cable is disposed. The grommet supporting member is not integral with the housing base.

Abstract: A server includes a chassis, a motherboard, a number of data storage devices, a number of system fans, and a power supply mounted in the chassis. The system fans generate an airflow flowing through the chassis, from a front portion of the chassis to a rear portion of the chassis. The power supply includes a power fan causing an airflow directed rearwards through the front portion of the chassis to prevent a disturbance with the airflow from the system fans.

Abstract: According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.

Abstract: A cabinet to be interposed between an above ground or underground sump and the control panel for said sump. All electrical connections between the control panel for the operation of the sump or lift station and the sump or lift station itself are disposed within this cabinet. The cabinet has two abutting closed sections, an A section having an open bottom and at least one vented side and a vented door; and a B section having a bottom panel and non-perforated sides and door. A pair of aligned intermediate rear panels close off each section, the only connection between said sections being a cable entry seal disposed in aligned openings in each intermediate rear panel for the passage of cabling from the A section to be mounted for termination in the B section. Any conventional cabling termination means can be employed in the B section.

Abstract: An electronic device and housing thereof are provided. The electronic device includes housing, a partition, multiple electronic elements, and a fan. The housing has a side edge, where the side edge is provided with a slit. The partition is disposed in the case, is separated by a distance with the slit, and divides the interior of the case into a first and a second space. The partition has a through hole, the second space is in communication with the first space through the through hole, and the first space is in communication with the outside of the case through the slit. The electronic elements and the fan are disposed in the second space, and an air outlet of the fan is adjacent to the through hole, so that air in the second space can be driven to flow from the first space to the outside through the slit.