With Electrical Device Patents (Class 174/520)
  • Patent number: 11837525
    Abstract: A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: December 5, 2023
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Harald Kobolla, Marco Lederer, Rainer Popp
  • Patent number: 11677225
    Abstract: In an electric junction box, both first locking portions and second locking portions are provided in one accommodation portion. The first locking portions are capable of locking an FL holder when the FL holder is inserted from an upper opening toward a lower opening. The second locking portions are capable of locking an FL holder when the FL holder is inserted from the lower opening toward the upper opening. Accordingly, the FL holders can be inserted into the same accommodation portion from the upper opening and the lower opening.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: June 13, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Kei Tomita, Kengo Ishida, Yukihiro Koyama
  • Patent number: 11611141
    Abstract: Disclosed is a portable electronic device including a front cover that forms a front face of the electronic device, a rear cover that forms a rear face of the electronic device, a bezel that surrounds a space formed by the front cover and the rear cover, a display device that is embedded in the space and includes a screen region that is exposed through the front cover, a metal structure that is positioned within the space and includes a first face facing the front cover and a second face facing the rear cover, a non-metal structure that is positioned within the space to partially overlap with the metal structure and includes a first surface facing the front cover and a second surface facing the rear cover, and a metal filler extending from the first surface to the second surface of the non-metal structure through a portion of the non-metal structure.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: March 21, 2023
    Inventors: Kwonho Son, Sangin Baek, Bongsuk Choi, Gyeongtae Kim, Minsung Lee
  • Patent number: 11509103
    Abstract: Provided are an electrical junction box for which the time required for production is short, and a method for manufacturing the electrical junction box. An electrical junction box houses an electric device. A plurality of external devices are connected to each other via the electric device housed in the electrical junction box. The electrical junction box includes a housing box and a connector. The housing box is provided with an insertion port 40 into which the connector is inserted, and an opposite opening that is opposite to the insertion port. The insertion port and the opposite opening have the same axial direction. Inside the housing box, a component can be attached to the connector.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 22, 2022
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hiroki Yoshihara
  • Patent number: 11508527
    Abstract: A capacitor, an assembly comprising a capacitor and a busbar and a method for manufacturing a capacitor are disclosed. In an embodiment a capacitor includes a winding element and a terminal having a first part of a first material and a second part of a second material, the second material being different than the first material, wherein the first part is electrically contacted to the winding element, and wherein the second part is an external contact of the capacitor.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: November 22, 2022
    Assignee: TDK ELECTRONICS AG
    Inventors: Péter Urbán, Róbert Bösze, Dezsö Rauch, Krisztián Elekes, Ottó Klug
  • Patent number: 11508696
    Abstract: A semiconductor device includes a first electronic component, a second electronic component, a third electronic component, a plurality of first interconnection structures, and a plurality of second interconnection structures. The second electronic component is between the first electronic component and the third electronic component. The first interconnection structures are between and electrically connected to the first electronic component and the second electronic component. Each of the first interconnection structures has a length along a first direction substantially parallel to a surface of the first electronic component and a width along a second direction substantially parallel to the surface and substantially perpendicular to the first direction. The length is larger than the width. The second interconnection structures are between and electrically connected to the second electronic component and the third electronic component.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: November 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu
  • Patent number: 11488896
    Abstract: An object is to provide a technique capable of enhancing electrical characteristics and reliability of a semiconductor device. The semiconductor device includes a plurality of semiconductor chips, a plurality of electrodes each being electrically connected to each of the plurality of semiconductor chips, a sealing member, and a joint part. The sealing member covers the plurality of semiconductor chips, and parts being connected to the plurality of semiconductor chips, of the plurality of electrodes. The joint part is disposed outside the sealing member to electrically connect parts which are not covered by the sealing member, of the plurality of electrodes.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: November 1, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yukimasa Hayashida, Shigeru Hasegawa, Ryo Tsuda, Ryutaro Date, Junichi Nakashima
  • Patent number: 11325488
    Abstract: A housing for an electrical connector includes a first set of orifices receiving a plurality of first pins, a second set of orifices receiving a plurality of second pins, a first draining device evacuating a fluid from the first set of orifices, and a second draining device evacuating a fluid from the second set of orifices. The second pins having a voltage higher than the first pins. The first set of orifices and the second set of orifices extend through the housing from a first interface of the housing toward a second interface of the housing in a connecting direction. The first draining device and the second draining device are isolated from each other and prevent fluid communication between the fluid from the first set of orifices and the fluid from the second set of orifices.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: May 10, 2022
    Assignee: Tyco Electronics France SAS
    Inventors: Bruno Dupont, Tehuai Chin
  • Patent number: 11217930
    Abstract: A seal cover (1) is provided for closing an opening portion (10) in a device in which a standby connector (11) is disposed. The standby connector (11) includes male terminals 11B for switching a state of an energizing circuit between a conductive state and a non-conductive state. Female terminals (23B), a shaft seal (25) and an O-ring (23D) are arranged in such a positional relationship that a time point when the shaft seal (25) is compressed maximally, a time point when the O-ring (23D) is compressed maximally and a time point when the female terminals (23B) are resiliently deformed maximally do not overlap with each other when the seal cover (1) is mounted on the opening portion (10).
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: January 4, 2022
    Inventor: Isao Wakimoto
  • Patent number: 11217981
    Abstract: Embodiments of the present disclosure relate to a busway and a corresponding electrical component. The busway includes a profile and a conductor. The profile is disposed on a first side, a second side and a third side, wherein the first side and the second side are parallel to each other, the third side is parallel to an extending direction of the busway and adjacent to the first side and the second side, and at least a part of the profile on the first side and the second side is planar. The conductor is disposed within a space defined by the first side, the second side and the third side, and the conductor is U-shaped and opens towards a fourth side that is parallel to the third side and adjacent to the first side and the second side. According to embodiments of the present disclosure, a fast, reliable electrical connection can be achieved.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 4, 2022
    Assignee: Schneider Electric Industries SAS
    Inventors: Xianfeng Song, Jianliang Huang, Shiqi Cheng, Suman Shrestha
  • Patent number: 11196405
    Abstract: An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: December 7, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kouji Ishikawa, Akio Katsube, Takehito Ishihara, Takeshi Ono
  • Patent number: 11178785
    Abstract: A metal enclosure of a mobile device, a production method for the metal enclosure, and a mobile device are disclosed. The metal enclosure of a mobile device includes a housing, where at least one gap is disposed on the housing, and the at least one gap divides the housing into at least two electrically insulated parts. The metal enclosure further includes an insulation film attached to a surface of the housing. In the foregoing embodiments, the gap is provided on the housing, so that the housing is divided into the at least two electrically insulated parts. Each gap is filled with an insulation object, and the gap on the surface of the housing and the insulation object in the gap form a partition.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: November 16, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Wenming Shi, Wangchun Lv, Yongxiang Wang, Kaiwen Huang
  • Patent number: 11178779
    Abstract: A display device including a display module having defined thereon a folding region, a first non-folding region disposed on one side of the folding region, and a second non-folding region disposed on an opposite side of the folding region; a fixing member disposed under the folding region of the display module; and a first flexible printed circuit board disposed between the folding region of the display module and the fixing member. The first flexible printed circuit board includes a (1-1) portion overlapping with the fixing member, and the (1-1) portion of the first flexible printed circuit board is attached to the fixing member.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: November 16, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jin Yong Sim, In Soo Park
  • Patent number: 11127336
    Abstract: A gate on array (GOA) unit, a gate driver circuit, and a display device are provided. The GOA unit includes a driver circuit, a pull-down circuit, and a pull-down control circuit, the driver circuit is configured to output a first signal from an output end of the GOA unit. The pull-down circuit is connected with the driver circuit and at least one voltage end that provides a voltage signal, the pull-down circuit is configured to input the voltage signal into a control end of the driver circuit to drive the driver circuit to be in an off state when the GOA unit outputs an off signal. The pull-down control circuit is connected with the pull-down circuit and the driver circuit, and is configured to control the pull-down circuit to input the voltage signal to the control end of the driver circuit.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 21, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Xingchen Shang Guan
  • Patent number: 11083097
    Abstract: A pressure equalization element for equalizing the pressure of an interior space of a housing, in particular of an electric, motor or gearing housing, of a tank or the like, with respect to an outer side, is specified. The pressure equalization element includes a hole which is formed in a wall of the housing, a diaphragm which is attached on the interior space side in the region of the hole and which closes off the hole with respect to the outer side of the housing in water-tight but air-permeable fashion, and a holding structure which is formed on the housing in the region of the hole and which serves for accommodating an impact guard. The impact guard is connectable, on the outer side of the housing, to the holding structure and protects the diaphragm against mechanical action. A housing having the pressure equalization element is also specified.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: August 3, 2021
    Assignee: Vitesco Technologies GmbH
    Inventors: Nikolaus Kerner, Edward Kotowicz
  • Patent number: 10999947
    Abstract: A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, and an oil-tight seal member. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The printed circuit board is disposed in the interior space. The oil-tight seal member is disposed between the metal base and the resin case to surround the printed circuit board. The electronic component is included in a control circuit for the transmission. The metal base and the oil-tight seal member are at a hydrogen bonding state, and the rein case and the oil-tight seal member are at a covalent bonding state.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: May 4, 2021
    Assignee: DENSO CORPORATION
    Inventors: Ryuhei Katsuse, Yosuke Matsuo, Keisuke Atsumi
  • Patent number: 10978248
    Abstract: Film capacitor includes capacitor unit that has capacitor elements, upper bus bar, and lower bus bar. Capacitor elements have upper end electrodes and lower end electrodes that are connected to upper bus bar and lower bus bar, respectively. Film capacitor further includes case containing capacitor unit and being filled with filler resin, cooling plate near capacitor unit, and plate springs. Cooling plate is connected to a cooler and discharges heat generated from capacitor elements into the cooler. Plate springs apply an elastic force to capacitor unit in a direction toward cooling plate.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: April 13, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuki Koyama, Akihiro Ozaki
  • Patent number: 10957637
    Abstract: A device and method for fabrication thereof is provided which results in corrosion resistance of metal flanges of a semiconductor package, such as a quad flat no-lead package (QFN). Using metal electroplating (such as electroplating of nickel (Ni) or nickel alloys on copper flanges of the QFN package), corrosion resistance for the flanges is provided using a process that allows an electric current to reach the entire backside of a substrate to permit electroplating. In addition, the method may be used to directly connect a semiconductor die to the metal substrate of the package.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: March 23, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Nazila Dadvand
  • Patent number: 10943428
    Abstract: Various aspects described or referenced herein are directed to improved access panel assembly safety mechanisms which may be incorporated into various gaming machine designs in order to help mitigate or facilitate reductions in safety hazards associated with such gaming machines and/or components thereof.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: March 9, 2021
    Assignee: AGS LLC
    Inventors: Adam Daniel Ambrecht, Kevin Lee Hohman
  • Patent number: 10931800
    Abstract: A method for manufacturing a housing is disclosed. The method includes: roughening a first surface of the housing; placing the housing into a mold and performing an injection molding to form a plastic layer on the first surface and closely bonded to the housing; and defining a plurality of slots by cutting through the housing by means of milling without milling a part or all of the plastic layer, wherein the plastic layer is configured to keep a connecting portion between adjacent slots defined in the housing undeformed during the milling. A mobile terminal is also disclosed.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 23, 2021
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Patent number: 10893575
    Abstract: In one embodiment, a wireless access point comprises a housing that defines a plurality of externally-facing apertures. The access point also comprises a radio module that is removably coupled to one of the externally-facing apertures of the housing and includes one or more antennas. The access point further comprises a motherboard module that is removably coupled to one of the externally-facing apertures of the housing and includes a motherboard that controls the one or more antennas of the radio module. The access point yet further comprises a power supply module that is removably coupled to one of the externally-facing apertures of the housing and supplies power to the motherboard and radio modules.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: January 12, 2021
    Assignee: Cisco Technology, Inc.
    Inventor: Thomas Paul Spivey
  • Patent number: 10873179
    Abstract: Junction boxes and partitions for junction boxes are disclosed. The junction boxes have a central area for installation of a driver or another such component and at least one wrap-around compartment in which wire connections can be made. In many cases, the junction box may have two wrap-around compartments, often mirror images of one another, that provide separate spaces for high- and low-voltage wire connections. The interior walls or partitions that create the compartments may be carried by and arise from the base of a junction box, or they may be carried by a separate piece that inserts over the driver, fully encloses or caps it, and also carries partition portions to create fully-divided compartments when used in combination with a junction box base that has no partitions of its own.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: December 22, 2020
    Assignee: Elemental LED, Inc.
    Inventors: Gilberto Lopez-Martinez, Daniel South, Andrew Lassen, David Greenspan
  • Patent number: 10868896
    Abstract: An electronic device includes a first device housing and a second device housing. A hinge couples the first device housing to the second device housing. The first device housing is pivotable about the hinge relative to the second device housing. The hinge separates a first chamber defined by the first device housing and a second chamber defined by the second device housing. A flexible substrate passes through the first chamber and the second chamber. The flexible substrate spans the hinge, either by passing through or around a hinge housing. The flexible substrate deforms to a curvilinear deformed state within one or both of the first chamber or the second chamber when the first device housing and the second device housing pivot about the hinge from a closed position to an axially displaced open position.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: December 15, 2020
    Assignee: Motorola Mobility LLC
    Inventors: Christopher Carlson, Steve Emmert
  • Patent number: 10847953
    Abstract: A connection structure for an external connection bus bar configured to connect the external connection bus bar to an external connection electrode terminal of a power storage element stack including power storage elements including electrode terminals. The connection structure includes: the external connection bus bar including one end part to be connected to the external connection electrode terminal; a receiving connector that houses the external connection bus bar and is fixed to the power storage element stack, and that includes a connector terminal to be connected to the external connection bus bar and to connect the external connection bus bar to an outside; and a fixing member that is provided to one end of the power storage element stack and fixes the receiving connector. The external connection bus bar includes a flexible part that is configured to expand and contract in a direction where the power storage elements are arranged.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: November 24, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Taiji Yanagida, Yoshiaki Kuroyanagi, Koichi Tanaka
  • Patent number: 10834839
    Abstract: Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Theron Lee Lewis, Timothy Jennings, Timothy Younger, David Braun, John R. Dangler, Jennifer I. Bennett, James Bielick, Stephen Hugo
  • Patent number: 10644489
    Abstract: Junction boxes and partitions for junction boxes are disclosed. The junction boxes have a central area for installation of a driver or another such component and at least one wrap-around compartment in which wire connections can be made. In many cases, the junction box may have two wrap-around compartments, often mirror images of one another, that provide separate spaces for high- and low-voltage wire connections. The interior walls or partitions that create the compartments may be carried by and arise from the base of a junction box, or they may be carried by a separate piece that inserts over the driver, fully encloses or caps it, and also carries partition portions to create fully-divided compartments when used in combination with a junction box base that has no partitions of its own.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: May 5, 2020
    Assignee: Elemental LED, Inc.
    Inventors: Gilberto Lopez-Martinez, Daniel South, Andrew Lassen, David Greenspan
  • Patent number: 10631420
    Abstract: A housing of metal combined with plastic used for an electronic device includes a metal frame and a plastic connecting member. The metal frame comprises a middle frame portion, an inner surface of the middle frame portion forming at least one metal rib. The plastic connecting member comprises a plastic base portion formed on one side surface of the metal rib, and the plastic base portion and the metal rib together form a reinforcing bar to greatly increase a strength of the finished housing.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: April 21, 2020
    Assignees: SHENZHEN FUTAHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Yi Xiong, Wei Deng, Kun-Hua Chen, Jin-Hua Li
  • Patent number: 10630822
    Abstract: A portable electronic device such as a handheld electronic device is provided. The device may have upper and lower portions. The upper portion may have clips that attach to springs on the lower portion. The device may have a housing with a bezel. A prong on the springs may ground the bezel. A vibrator mounting bracket may hold a vibrator in place within the housing. The vibrator mounting bracket may have an end that engages the housing. A threaded insert may be welded to the spring. A screw that passes through a hole in the vibrator mounting bracket may be screwed into the threaded insert to attach the vibrator to the housing. An elastomeric member may bias the vibrator towards the bracket. An acoustic module may serve as a subassembly for the device. Components such as an antenna, dock connector, microphone, and speaker may be attached to the acoustic module.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 21, 2020
    Assignee: Apple Inc.
    Inventors: Adam D. Mittleman, Kenneth A. Jenks, Karen Y. Cheng
  • Patent number: 10525934
    Abstract: A system and method for triggering a silent alarm notification in the event the vehicle occupant comes under attack and needs to discretely signal for help. The system includes an integrated silent vehicle alarm that is triggered by the vehicle occupant by entering a pre-programmed silent alarm sequence. The silent alarm sequence is entered using OEM-installed manually actuatable devices such as door or steering wheel switches located within the vehicle. These manually actuatable devices have dual functions: a primary vehicle related function (such as opening/closing a window) and a secondary function as input devices for the silent alarm sequence. In this way the silent alarm signal utilizes devices already present in the vehicle and requires no new installation or placement of new devices. The silent alarm notification is wirelessly sent to a remote facility for vehicle tracking and emergency response.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: January 7, 2020
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Matthew E. Gilbert-Eyres, Matt Neely, Eric T. Hosey, Huong T. Chim
  • Patent number: 10496558
    Abstract: Systems, apparatus, and methods for a reconfigurable integrated system integrated onto a single circuit board are described herein. An embodiment includes a CPU host and microprocessor which attach and manage internal and external peripheral devices. Data received from sensors may include video data. Any data input may be routed by the system so as to be output at any display connected to the system. The enclosure of the integrated system may be a conformal heat sink design that enables a passively cooled system. The data may be in analog or digital format for output by the reconfigurable integrated system.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: December 3, 2019
    Assignee: SYNEXXUS, INC.
    Inventors: Gregory Emil Glaros, John T. Reep, James M. Wimbrow
  • Patent number: 10498115
    Abstract: An irrigation control box can include a housing base having a first sidewall, a second sidewall, a top sidewall, a bottom sidewall, and a back wall. The box can include at least one hinge post. An offset hinge assembly can include a hinge assembly frame defining a hinge assembly interior, a first attachment structure positioned at least partially within the hinge assembly interior and configured to releasably attach to the at least one hinge post, and a rotational attachment point. A facepack can include at least one hinge point configured to mate with the rotational attachment point. In some cases, the facepack is configured to rotate about rotational attachment point of the offset hinge assembly with respect to the housing base when the housing base and facepack are each attached to the offset hinge assembly.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 3, 2019
    Assignee: Hunter Industries, Inc.
    Inventor: Michael F. Paul
  • Patent number: 10483725
    Abstract: A carrier rail housing comprises: a carrier rail receiving opening into which the holding legs of a carrier rail are insertable; a locking mechanism to secure the holding legs in a desired mounting position and comprising locking slides to interlock with the carrier rail housing in a locking position; a plug-in contact element arranged inside the carrier rail housing to face the carrier rail receiving opening; and a bus connector into which plug-in contacts of the plug-in contact element are insertable, the bus connector being connectable to a plug-in contact element of at least one additional carrier rail housing, wherein each of the locking slides comprises a first end that comprises a holding section that extends in sections into the carrier rail receiving opening in the locking position, so that the bus connector is secured between the holding sections of the locking slides and the plug-in contact element.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: November 19, 2019
    Assignee: Pilz GmbH & Co. KG
    Inventor: Lothar Merz
  • Patent number: 10356954
    Abstract: A cabinet structure, in which an electronic apparatus is placed, where the cabinet structure includes a base and two cabinets, the base includes a first side face, a second side face, and a third side face, there is an included angle separately between the second side face and the first side face and between the third side face and the first side face, the base is fastened using the first side face, the cabinets are installed on and fastened to the second side face and the third side face respectively, and the two cabinets are arranged in a V shape and form an angle. A container data center using the cabinet structure is further provided.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 16, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Yu Bao
  • Patent number: 10334745
    Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 25, 2019
    Assignee: APPLE INC.
    Inventors: Scott A. Myers, Mattia Pascolini, Richard Hung Minh Dinh, Trent Weber, Robert Schlub, Josh Nickel, Robert Hill, Nanbo Jin, Tang Yew Tan
  • Patent number: 10284742
    Abstract: An exposure apparatus according to an embodiment includes: a board that includes a first surface on which a light emitting element is arranged and a second surface opposite to the first surface; a lens member on which light from the light emitting element is incident; a holder that holds the lens member; and an insulation sheet formed of an insulation material. The board includes an abutment part provided on a second surface of the board. The insulation sheet is fixed to the holder while being in contact with the abutment part.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: May 7, 2019
    Assignee: Oki Data Corporation
    Inventor: Manabu Kida
  • Patent number: 10277019
    Abstract: An electric circuit apparatus capable of enhancing connection workability is provided. An electric circuit apparatus includes: a connector that transmits one or a driving current and a signal to an electric circuit unit; a substrate connected to the connector; a first case member forming an housing space for the substrate and forming an opening portion; and an intermediate member interposed between the connector and the first case member, in which the intermediate member includes a connector-side opening portion through which the connector passes, a seal surface with the connector, and a fix in portion to be fixed on the first case member, and the fixing portion is formed so as to absorb a positional tolerance between the connector and the opening portion of the first case member.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: April 30, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Masashi Kosuga
  • Patent number: 10205807
    Abstract: An electronic device is provided. The electronic device includes a first plate, a second plate having a flat surface and being at least partially formed of a polymer material, a housing, which encloses a space between the first plate and the second plate, is at least partially formed of a metal material, and includes a side member that is integrally formed with the second plate, wherein the side member has a first portion adjacent to a peripheral portion of the second plate, and the first portion has a first surface substantially facing in the second direction, contacts the peripheral portion of the second plate, and has a second surface facing in a third direction different from the first direction and the second direction.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: February 12, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seungjae Bae, Taedoo Choung
  • Patent number: 10182503
    Abstract: An electronic device may include a window member, a display member, a first coupling member, and a second coupling member. The window member may have a dome shape which is convex in a first direction, and may include an outer surface including a curved surface, an inner surface including a curved surface and facing the outer surface, and a connecting surface connecting the inner surface and the outer surface. The display member may display an image toward the inner surface and may include a curved surface. The first coupling member may be disposed between the window member and the display member to cover at least a portion of the inner surface and to couple the display member to the window member. The second coupling member may be disposed to cover an edge of the display member and couple the display member to the window member.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: January 15, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong-ho Kim, Minsoo Kim, Kyubong Jung
  • Patent number: 10090654
    Abstract: A junction box assembly and a retaining system configured to facilitate access to the eyelet terminal and the bottom housing assembly is provided. The junction box assembly includes a top cover removably attached to the bottom housing assembly. The bottom housing assembly includes an eyelet terminal for receiving an electric connection. An eyelet terminal cover covers the eyelet terminal. The retaining system is configured to removably retain the eyelet terminal cover to the top cover. The retaining system includes a locking structure disposed on the top cover. A key is configured to releasably engage the locking structure. A tether may be secured to the key on a first end and the eyelet terminal cover on a second end so as to allow the eyelet terminal cover to be coupled to the top cover or the eyelet terminal cover to be removed from the top cover.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 2, 2018
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Nathan Like, Akihiro Maximilian Matsumura, Aaron Mark Steffka
  • Patent number: 9905947
    Abstract: In examples of the present disclosure, a vented electrical terminal block may include a body that may be configured to support a plurality of electrical terminals In examples, the body may include a plurality of side walls that may extend from the body. The body may include a plurality of apertures extending through the body. A cavity may be defined by an underside of the body. The cavity may receive a cavity fluid. In examples, at least one side wall may include an opening for receiving a sealing fluid, and apertures may be configured to vent said cavity fluid from the cavity when sealing fluid is introduced into the cavity via the opening.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: February 27, 2018
    Assignee: Lear Corporation
    Inventors: Ferran Juanes Ribas, Montserrat Piñol Pedret, Enric Aparicio Rollan
  • Patent number: 9905366
    Abstract: A lead terminal for a capacitor which is less likely to be broken even when the capacitor implemented on a substrate is continuously subjected to vibration, has excellent in vibration resistance and lifetime characteristics and capable of being manufactured inexpensively, is provided. The lead terminal 1 for a capacitor has an aluminum wire 2 having a round bar portion 2a and a flat portion 2b, and a metal wire 3 welded to the round bar portion 2a of the aluminum wire 2. Furthermore, the lead terminal 1 for a capacitor has a curved portion 2c at a boundary section between the round bar portion 2a and the flat portion 2b, and a curvature radius R of the curved portion 2c is set to be equal to or greater than 0.5 mm.
    Type: Grant
    Filed: September 25, 2016
    Date of Patent: February 27, 2018
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Hirotsugu Ashino, Takahiro Yoshida
  • Patent number: 9899818
    Abstract: Provided is a circuit assembly that includes a circuit board that has a connection opening, a plurality of busbars that are laminated on one surface side of the circuit board via an adhesive sheet, a coil that has a main portion and a plurality of lead terminals, the coil being arranged on the other surface side of the circuit board by the lead terminals being connected to the plurality of busbars that are exposed through the connection opening, and a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent. The adhesive sheet has sheet openings through which the plurality of busbars are exposed and the plurality of lead terminals are connected to the plurality of busbars, the adhesive sheet covering a gap between the plurality of busbars, the gap being located in the connection opening.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: February 20, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takehito Kobayashi, Yoshikazu Sasaki, Shigeki Yamane, Tomohiro Ooi, Yukinori Kita
  • Patent number: 9806506
    Abstract: A high voltage equipment box for a rail vehicle includes a box body and electric equipment arranged in the box body, two ends of the box body in a width direction of the vehicle extend to respective skirt plates, and an avoidance gap is provided at a bottom of each of the two ends of the box body, a bottom of each of the skirt plates is fixed at the respective avoidance gap, a top of the box body extends to a position above a bottom beam of a vehicle body, and a bottom of the box body is flush with a bottom plate of the vehicle body and forms a part of the bottom plate of the vehicle body.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: October 31, 2017
    Assignee: CRRC QINGDAO SIFANG CO., LTD.
    Inventors: Hongbo Wang, Yongzhen Qin, Lin Tao, Xiankai Zhang, Yongming Zhang, Jinghai Jiao, Guangwei Xu, Buzhao Niu
  • Patent number: 9674989
    Abstract: Disclosed are an apparatus for cooling a server cabinet and a server cabinet apparatus. The apparatus for cooling a server cabinet includes: a bracket a heat-exchange device, and an air-ducting device; where the bracket is positioned below one or a plurality of server cabinets, the heat-exchange device is installed on a side surface of the bracket, the air-ducting device is installed in the bracket, the heat-exchange device and the air-ducting device are parallelly arranged, the heat-exchange device cools hot air produced by the server cabinet to obtain cold air, and the air-ducting device blows the cold air to the server cabinet to cool the server cabinet. The server cabinet apparatus includes: an apparatus for cooling a server cabinet and at least one server cabinet. With the apparatus for cooling a server cabinet, each of the servers in a data center are effectively cooled, and resources are saved.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: June 6, 2017
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Haitao Zhang, Haitao Zhou, Yidi Wu, Dianlin Li
  • Patent number: 9673723
    Abstract: In a circuit adapted to supply a voltage Vs an electronic device, such as a load or a light source said voltage Vs is led to a circuit (ACG) that is able to derive a voltage VACG from Vs where VACG?Vs. The circuit consist in a first embodiment of three serial coupled diodes (D1,D2,D3) and two capacitors (C1,C2), and where the capacitor (CI) is coupled in parallel with tow of the diodes (D1,D2) and the capacitor (C2) is coupled in parallel with the diodes (D2,D3). In this way an Asymmetric Current Generator (ACG) is provided, that from a normal periodic source voltage Vs can derive two voltages both of which are suitable for a rechargeable battery or a light source. In this way a cost effective voltage in which the voltage required for the electronic device is beneficial for recharging the battery or strengthen the light for a LED light source leading to save in current cost and a fast recharging of the rechargeable battery and gaining light from the light source.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: June 6, 2017
    Inventors: Milan Mancic, Nicholas Møller
  • Patent number: 9514864
    Abstract: A flexible solid-state resistor comprises a string of ceramic resistors that can be used to charge the capacitors of a linear transformer driver (LTD) used in a pulsed power machine. The solid-state resistor is able to absorb the energy of a switch prefire, thereby limiting LTD cavity damage, yet has a sufficiently low RC charge time to allow the capacitor to be recharged without disrupting the operation of the pulsed power machine.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: December 6, 2016
    Assignee: Sandia Corporation
    Inventors: Brian Stoltzfus, Mark E. Savage, Brian Thomas Hutsel, William E. Fowler, Keven Alan MacRunnels, David Justus, William A. Stygar
  • Patent number: 9496091
    Abstract: An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: November 15, 2016
    Assignee: ELNA CO., LTD.
    Inventors: Hiroshi Yanaka, Naoto Iwano, Kaori Matsumura, Hikaru Santsuka, Naozumi Kimura, Hidekazu Mizushima
  • Patent number: 9431331
    Abstract: A semiconductor device has a plurality of bumps formed over a carrier. A semiconductor die is mounted to the carrier between the bumps. A penetrable film encapsulant layer having a base layer, first adhesive layer, and second adhesive layer is placed over the semiconductor die and bumps. The penetrable film encapsulant layer is pressed over the semiconductor die and bumps to embed the semiconductor die and bumps within the first and second adhesive layers. The first adhesive layer and second adhesive layer are separated to remove the base layer and first adhesive layer and leave the second adhesive layer around the semiconductor die and bumps. The bumps are exposed from the second adhesive layer. The carrier is removed. An interconnect structure is formed over the semiconductor die and second adhesive layer. A conductive layer is formed over the second adhesive layer electrically connected to the bumps.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: August 30, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Byung Tai Do, Reza A. Pagaila, Linda Pei Ee Chua
  • Patent number: 9404647
    Abstract: An optical assembly including a mounting board and an LED coupled to the mounting board. An optic component, for example a lens, is coupled to the mounting board and encloses the LED. A shield member including 5 VA rated material is positioned to have a first surface in contact with the mounting board and a second surface in contact with the optic component.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: August 2, 2016
    Assignee: Hubbell Incorporated
    Inventor: Jason Edward Duckworth
  • Patent number: 9373449
    Abstract: The solid electrolytic capacitor of the present invention includes an anode, a dielectric layer formed on the anode, and a solid electrolyte layer formed on the dielectric layer. The solid electrolyte layer includes an oxide of valve metal. It is beneficial that the solid electrolyte layer contains a salt of valve metal in addition to the oxide of valve metal. Furthermore, it is beneficial that the oxide of valve metal is vanadium pentoxide.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: June 21, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuo Tanaka, Takeshi Sano