Abstract: An electric circuit device comprises an electric connecting member comprising a support member made of an electrically insulating material and a plurality of electrically conductive members buried in the support member and being isolated from one another. The ends of one side of the electrically conductive members are exposed at one surface of the support member, and the ends on the other side of the electrically conductive members are exposed at another surface of the support member. A first electric circuit component has connecting regions connected to the one set of ends of the electrically conductive members, and a second electric circuit component has connecting regions connected to the other set of ends of the electrically conductive members. Some of the electrically conductive members can be arranged in a zigzag pattern, and the pattern of the exposed ends of at least one electrically conductive member is wave-like or S-like.

Abstract: A device is proposed to detect firm and reliable adhesive bonding and electrical connection between electrode arrays on two circuit boards by sandwiching a layer of an anisotropically electroconductive adhesive composition, in which the adhesive composition is formulated with an epoxy resin capable of changing color by complete curing and at least one of the circuit boards is prepared of a substrate having an opening or made from a transparent material in the vicinity of the electrode array so as to facilitate visual see-through inspection of the adhesive layer to detect complete curing of the adhesive composition.

Abstract: In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.

Abstract: Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive material advantageously has a cutout (24) therein located to expose at least a portion of the substrate lying between a pair of metallized areas (16). The cutout (24) serves to confine a quantity of adhesive (26) deposited therein which serves to secure the chip to the substrate without any physical bond between the metallized areas and the bond sites on the chip while maintaining the anisotropically conductive material in compression.

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

Abstract: External connections are made in an electronic device (11) having on an upper surface an array of contact pads (12) by providing successively over the electronic device a first anisotropic member (13), a first flat insulator member (14) having on an upper surface a first conductor pattern (29), a second flat anisotropic conductor member (15), and a second flat insulator member (17) having on an upper surface a second conductor pattern (30). The two flat insulator members contain an array of conductive vias (25, 26) extending between opposite surfaces. The first anistropic conductor member (13) and a first array of conductive vias (25) extending through the first insulative member (14) interconnects a first plurality of contact pads (12) on the electronic device (11) to the first conductor pattern (29) which includes a peripheral array of contact pads (32) to which external connections are made.

Abstract: A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.

Abstract: An apparatus for splicing and sealing plural conductive wires comprising a support member and a flexible sealant held in the interior of the support member and a method for splicing and sealing plural conductive wires employing the apparatus are provided.

Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Electrically conductive polymerizable precursor is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.

Abstract: A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.

Abstract: An apparatus and method for splicing light conductors in composite cables, in particular marine cables, comprising a plurality of spliced cable sections of power conductors and sections of light conductors. With a view to uninterrupted armouring along the entire length and thus the ability to maintain a sufficient tensile and flexural strength, the splice of the light conductors is provided at a distance from the splice of the power conductors and with a cross-sectional contour which essentially corresponds to the cable cross-section. Then the armouring is wound uninterruptedly around the cable and encloses the splices of the power conductors as well as the light conductors.

Abstract: A nuclear qualified in-containment electrical connection comprises an insulated, sheathed instrument lead having electrical conductors extending from one end thereof to provide two exposed lead wires, a watertight cable having electrical conducting wires therein and extending from one end of the cable to provide two lead wires therefrom, two butt splice connectors each connecting the ends of respective ones of the lead wires from the instrument lead and cable, a length of heat shrinkable plastic tubing positioned over each butt splice connector and an adjacent portion of a respective lead wire from the cable and heat shrunk into position, a length of heat shrinkable plastic tubing on the end portion of the instrument lead adjacent the lead wires therefrom and heat shrunk thereon and a length of outer heat shrinkable plastic tubing extending over the end portion of the instrument lead and the heat shrinkable tubing thereon and over the butt splice connectors and a portion of the cable adjacent the cable lead l

Abstract: A molded electrical connector for connecting electrical conductors comprises a molding section in which a plurality of metallic circuits are arranged in parallel with one another at predetermined intervals and are fixedly molded with resin such that first end portions of the metallic circiuts are exposed as connecting terminals. The molded electrical connector further comprises a connecting section which comprises the connecting terminals. The connecting section is molded with resin simultaneously when the molding section is formed. Electrical conductors are placed on the connecting terminals of the metallic circuits and welded together.

Abstract: An insert part for sealing a cable junction having a flange of heat-conductive material and a block of heat-fusable material connected to the flange also has a support member, preferably of heat-conductive material, projecting from the block. The support member has a part within the block shaped to provide a pair of opposed concave surfaces, positioned so that the concave surfaces open in opposite directions. The block may comprise a relatively thick central part and webs extending outwardly from the corners of that central part. Preferably, two flanges are provided, one on each side of the support member.

Abstract: The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition.

Abstract: A wiring harness is disclosed for deploying electrical wires along a wall such as in a modular wall panel system for separating work areas. The wall has an elongate compartment defining a raceway for housing the wires. A first power block is positioned in the raceway at a first location and includes a given number of wires extending therefrom into the raceway. A second power block is positioned in the raceway at a second location longitudinally spaced from the first power block. The second power block has a different number of wires extending therefrom into the raceway toward the first power block. Splicing connectors electrically couple at least some of the wires between the two power blocks.

Abstract: A longitudinally divided cable sleeve is composed of a flexible foil envelope having longitudinal closure elements along each longitudinal edge and has structural elements or support members for supporting the envelope as it is wrapped around a cable splice or region. Preferably, the flexible foil is composed of a plurality of layers including a plastic layer, a reinforcing layer and at least metal foil layer, which all adhere to one another by adhering layers.

Abstract: A device for connecting the grounding shield layer of a cable in a splice connection. A flat strap, such as a mesh of metallic wires, is wrapped at least 270.degree. around the shield layer. The ends of the strap or braid are folded over, forming two generally parallel tails. The central portion of the braid is secured to the shield with a constant force spring, and the free ends of the braid are fastened to the shield layer on the opposite side of the splice. A second braid may be used in a similar manner to bridge the connection across the splice. By providing two tails emanating from a single braid, current surges in the shield layer are divided along two current paths, reducing current density and minimizing failures in the cable shield connection.

Abstract: A heat-shrinkable, wrap around sleeve is formed of a cross-linked corrugated layer of polyolefin extending between two cross-linked layers of homogeneous plastic material with an elongation at least equal to that of the corrugated polyolefin layer. Preferably, the corrugations extend at an angle, which is preferably a right angle, to the longitudinal edges of the sleeve and in the direction of stretching of the sleeve prior to it being heat-shrunk onto the joint.

Abstract: Disclosed herein is a waterproof joint for a joint section of a plurality of wires of a wireharness, each wire having a conductor and an insulating cover surrounding the conductor, and the joint section comprises a connecting portion of the conductors and the insulating covers of the wires near the connecting portion.

Abstract: Polymeric electrically conductive apparatus such as electric connectors are disclosed. These connectors employ a polymeric conductive material such as a conductive epoxy having conductive particles dispersed therein sufficient to establish electrical conductivity. These conductive materials are at least initially deformable such that electrical conductors may be inserted within an envelope containing the conductive material and electrical continuity for a prescribed circuit can be verified before structurally affixing the conductors to the envelope. Embodiments having radially collapsible envelopes for forming splice connectors and multicontact configurations employing rigid dielectric housings are disclosed.

Abstract: A connecting structure for an electronic part employs an improved anisotropic electrically conductive layer. The layer includes a hot melt type insulative adhesive, heat resilient particles and carbon particles. Each of the heat resilient particles is made of thermoplastic resin and is plated with metal such as gold, nickel or the like. Each of the carbon particles is melted by a heat pressure and brings about an electric conductivity when it is dried and hardened. Thus, the anisotropically conductive layer disclosed in this invention does not include hard particles at all. Namely, an electronic part such as a solar battery cell or a semiconductor device is not damaged by particles of the conductive layer. In addition, the connecting structure employing the aforementioned layer improves the security of adherence and the reliability of the electric conductivity.

Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.

Abstract: An apparatus for supporting a cable splice in a cable splice enclosure includes a rectangular cradle portion of flexible net having first and second parallel, opposite longitudinal sides and first and second parallel, opposite transverse sides; the transversed sides interconnecting the first and second longitudinal sides. The cradle portion has first and second sleeves disposed longitudinally thereon with the first and second sleeves being parallel and spaced apart from each other. A cover portion of flexible net has first and second opposite cover sides, with the first cover side being connected to the cradle portion. A connector is on the second cover side of the cover portion and is releasably connectable with the cradle portion.

Abstract: A display device includes a display panel having electrodes with a plurality of terminals, a driver circuit having electrodes corresponding to the display panel electrodes, and an anisotropic conductive film for electrically connecting the display panel electrodes with the driver circuit electrodes. The connecting part of each of the driver circuit electrodes to be connected with each of the display panel electrodes includes a first connecting portion and a second connecting portion, where the first connecting portion is more narrow than the second connecting portion.

Abstract: To electrically connect a plurality of connecting terminals of an electronic component, e.g., a liquid crystal display device (LCD) to a printed circuit board, a plurality of wiring patterns are first formed on the printed circuit board. These wiring patterns have similar shapes to those of the connecting terminals, and have a signal transmission function. Thereafter, a plurality of dummy patterns are formed outside both outermost wiring patterns on the printed circuit board. These dummy patterns have no signal transmission function. Finally, the connecting terminals of the electronic component are electrically connected via an anisotropically conductive sheet to both the wiring patterns and dummy patterns.

Abstract: An apparatus for joining a plurality of lead wires with a corresponding plurality of flat type electric wires. The apparatus comprises a plurality of connector terminals, each having a first caulking portion for securing the round wire to a first end of the connector terminal, and a clasping portion for securing the flat wire to a second end of the connector terminal, the clasping portion comprising a first and second spring portion, a projecting portion projecting from the clasping portion toward the flat wire, and second caulking portion for compressing the flat electric wire between the first and second spring portion by securing the first spring portion to the second spring portion. The projecting portion may receive solder so that the flat type electric wire can be spot welded to the connector terminal. To prevent short circuits between the connector terminals, a comb-like spacer may separate the connector terminals, or the exterior of each connector terminal may be insulated.

Abstract: A connector terminal for joining a round type electric wire with a flat type electric wire. The connector terminal comprises a first crimpable portion for securing the round wire to a first end of the connector terminal, and a clasping portion for securing the flat wire to a second end of the connector terminal, the clasping portion comprising a first and second spring portion, a projecting portion projecting from the clasping portion toward the flat wire, and second crimpable portion for compressing the flat electric wire between the first and second spring portion by securing the first spring portion to the second spring portion. The projecting portion may receive solder so that the first type electric wire can be spot welded to the connector terminal. The resulting connection is extremely compact, reliable, and provides a stable electrical connection over time.

Abstract: A forced encapsulation system and method that can be advantageously used to encapsulate cable splices e.g., multiconductor communications cables. Containment means are formed around a substrate comprising part of at least one cable, and secured to the cable, thereby forming an enclosure into which liquid encapsulant can be introduced under pressure and in which the encapsulant can be maintained at pressure above ambient pressure. In a preferred embodiment, the containment means comprise a containment bag formed in situ from an elastomer sheet and sealed to the cable sheaths, with a reinforcing outer enclosure surrounding the containment bag.

Abstract: An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16).

Abstract: An electrical power distribution system is disclosed which includes flat undercarpet power cable. The cable includes portions of the cables spliced to one another to effect a continuation of the power distribution. A covering for the spliced joint of the two cables includes two foam layers having double backed adhesive thereon which, when placing the two facing surfaces together, adhesively affixes the two foam layers together. The outer surfaces, which include adhesive, adhere a protective sheet of insulative material thereto.

Abstract: In accordance with one embodiment of the invention, a process for interconnecting the circuitry of two substrates comprises the step of terminating the circuitry on bonding pads that are arranged in parallel rows with the first row of each substrate being nearest an edge of the substrate. The bonding pads of the two first rows of the two substrates are joined by conductors of a dielectric tape that bridges the two substrates. The conductors overlap the edges of the dielectric tape and are organized to permit them to be bonded to corresponding bonding pads of the two substrates, for example, by soldering. The two second rows of bonding pads are joined by conductors on a second dielectric tape which is wide enough to cover two first rows of bonding pads and thereby provide electrical insulation.

Abstract: A resilient open ended reenterable splice cover is provided having an enlarged central section and cable sealing means at both ends with the central section having a cross-sectional area smaller than the cross-sectional area of the metal splice which it is designed to cover. Even though an interference fit is provided between the splice and the splice cover, the cover is removable so as to provide reentry to the splice. A lubricating medium is contained within the splice cover. The splice cover may be provided in a kit which includes a mating deformable metal splice or terminal. The kit is designed to be used in the field so as to provide a submersible reenterable splice assembly for insulated electric cables.

Abstract: Electro-mechanical connections for flat conductor cables and similar articles are produced with flanged hollow rivets which puncture the cable or cables to be connected and then are compressed into an eyelet configuration which clamps and is secured to the cable. Apparatus and procedures for achieving this result are disclosed.

Abstract: A flexible splice for a submarine cable of the type comprising a plurality of conductors (21, 22, 23) insulated by paper impregnated with oil under pressure (24) inside an oil-tight sheath (20) protected by at least one layer of armoring, the splice being characterized in that it comprises a flexible sheath (2) connected on either side of the interconnections (41, 42, 43) between said conductors to two rigid connection sleeves (1, 1') fittable around respective centering rings (7, 7') bonded to the oil-tight sheath (20) of the cable and then bonded to said sleeves, said flexible sheath being divided into two lengths (2, 2') which are interconnected by means of an inner ring (15) which they overlap prior to being bonded together and covered with a tubular shell (4) constituting an oil-tight sheath which is bonded at each end to said connection sleeves (1, 1'), said sleeves including at least one orifice (33) closable by means of a stopper (30) in order to put the splice under oil pressure.

Abstract: A moisture resistant splice assembly for communications and electrical cables is provided. The assembly employs a moisture activatable encapsulant.

Abstract: Electro-mechanical connections for flat conductor cables and similar articles are produced with flanged hollow rivets which puncture the cable or cables to be connected and then are compressed into an eyelet configuration which clamps and is secured to the cable. Apparatus and procedures for achieving this result are disclosed.

Abstract: An electrical cable connection comprising a plurality of core connections, each having an electrically insulating and sealing core enclosure which comprises a fire-resistant inorganic fiber material layer, and a shrunk sleeve thereover, together with a cable sealing enclosure which surrounds the core enclosure and has sufficient length to seal the cable sheath.

Abstract: A method of manufacturing an electrically conductive adhesive bond between electrically conductive parts whose surfaces to be bonded exhibit a certain surface roughness, the surfaces to be bonded each being provided with a layer of at least one transition element of the first and/or second transition series of the periodic system of elements, which layer has a surface roughness in the .mu.m-range, such a quantity of an electrically non-conductive adhesive being used to form the adhesive bond that the raised portions of the transition-element-layer are still in contact with each other.

Abstract: A method and apparatus for enclosing a splice joining at least first and second cable segments prevents water from entering the splice. The apparatus includes a flexible reservoir sealingly attachable to a sealing surface of an end plate assembly. The end plate assembly is sealingly attachable to the cable segments. The pressurized splice closure sections sealingly engage one another and the end plates. The method includes forming a reservoir about the splice, sealing the reservoir to the first and second conductor segments or to the end plates, forming an opening in the reservoir, pouring a curable encapsulant into the reservoir, working the encapsulant into intersitices between the conductors in the cable segments, sealing the reservoir, enclosing the reservoir in a splice closure and pressurizing the splice closure. This method combines a curable encapsulant such as a two-part polyurethane with a pressurized closure such as a 2-type, gas pressurized closure.

Abstract: A structure of joining two printed circuit boards with solder. A reserve solder layer is applied on a pattern of first joint leads of the printed circuit on a base plate of the first board. A pattern of high thermal conductivity similar to the pattern of second joint leads of the second printed circuit board, is formed on the opposite or back surface of the base plate thereof substantially superposed with the second joint leads. To join the first and second boards, the second board is turned upside down and then the second joint lead pattern is put on the solder layer in registry with the first joint lead pattern of the first board. And it is at a point on each patch of the thermal conductivity pattern that heat is then applied thereto to obtain the structure between the joint leads of the two printed circuit boards.

Abstract: Electrical joint compounds for the protection of electrical connections are formed from a solution of polymer dissolved in solvent with or without conductive filler. Partially cured thermosetting polymers are preferred as they flow under service conditions to better seal the electrical joints. Thermosetting polymers which cure by an addition mechanism are preferred over those which cure by condensation, and polyimides are most preferred.

Abstract: An arrangement for forming a joint between electrical cables comprises a connector arrangement, e.g. a crimp connector, a fusible block capable of being positioned to enclose the connector and a heat-shrinkable sleeve having a recovery temperature at least 10.degree. C. above the melting point of the fusible block. Preferably the fusible block is formed from a number of interlocking component parts. The arrangement is particularly suitable for forming joints between submarine cables, and may include a tubular shield portion for connecting the shields and shielded cables.

Abstract: A cable closing method and the resultant cable closing constructed by enclosing the cable area to be closed with a flexible waterproof enclosure, wrapping the cable with a water-activatable urethane resin impregnated cloth to span the area enclosed by the flexible waterproof enclosure, wetting the water-activatable urethane resin impregnated cloth to activate the resin and permitting the urethane resin to cure.

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

Abstract: The long term water intrusion resistance of cable splice systems that use a gelable encapsulant that is pressurized prior to geletion can be improved by providing pressurization means that maintain the pressure on the cured encapsulant above a given pressure p.sub.2 >p.sub.o, where p.sub.o is the ambient pressure. Absent such pressurization means, the pressure on the encapsulant typically decreases with time due to creep or relaxation of nominally rigid components, e.g., a polymeric closure around the encapsulated splice, or varies due to differential thermal contraction. The pressurization means comprises one or more energy storage elements, e.g., an elastic member such as a spring, or a volume of compressed gas.

Abstract: A branch-off seal between a heat-recoverable sleeve, such as a tubular or wrap-around sleeve made from cross-linked polymeric material, and two or more substrates such as electrical cables is effected by using one or more clips the outer legs of which are positioned over the outer surface of the sleeve so as to form an appropriate number of conduits and applying heat to cause the sleeve to shrink aobut the substrates positioned within the conduits. The preferred clips are formed as a trident, the central leg of which extends into the heat-recoverable sleeve and is provided with a layer of a hot-melt adhesive or another sealant so as to enhance the seal formed at the branch-off.

Abstract: An exposed portion of an electrical cable is sealed by applying a sealant material to the exposed cable and then placing the ends of a split unitary cover over the sealant material in overlapped disposition. The cover is then compressed into contact with the sealant material. In repairing a damaged cable sheath, a reinforcing member may be placed over the sealant material prior to placing the cover thereover.

Abstract: An electrically conducting hot melt adhesive is located at limited contact regions of a flexible circuit support, which typically carries a large scale integrated circuit (LSI) chip. A non-conducting hot melt adhesive is disposed between the limited contact regions at the non-contact regions. The resulting electrical connector can then be brought into contact with the corresponding areas of flexible or rigid circuit supports and through the application of heat and pressure, fuse the respective members so as to establish circuit paths between their limited contact regions via the electrically conducting hot melt adhesive. Heat and pressure are applied to the conducting hot melt adhesive in the same way as for an electrically non-conducting hot melt adhesive after contacting limited contact regions of another flexible circuit support or a rigid circuit support with the molten adhesive. Subsequently, the molten adhesive is left to cool so as to solidify.

Abstract: An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18).