Abstract: A method for generating cavitation resistance in a liquid, a portion of which can be in contact with a surface is disclosed. The disclosed method can be carried out by pressure-treating the liquid, the liquid portion in contact with the surface, and/or the surface for a sufficient time to develop resistance to cavitation. The disclosed method can be carried out when the surface is made of a material having a surface roughness that is greater than the rc of the liquid. Suitable surfaces include borosilicate glass, drawn glass, copper, lead, steel, cast iron, metal alloys and concrete. The surfaces can be ship and boat propeller surfaces, the interior of fuel lines and fuel storage containers or any other surface where cavitation can occur.

Abstract: An active corrosion protection circuit for a brake disc-pad unit of a motor vehicle includes one of a metal disc and a pad adapted to selectively block the disc. A direct electric voltage source and an electric conductor connectable to the electric voltage source and one of the disc and the pad forms an electric circuit causing a monopolar current flux between the disc and the pad when the pad blocks the disc so that the action of the current is localized in a contact zone between the disc and the pad.

Abstract: In a process for producing a semiconductor member, and a solar cell, making use of a thin-film crystal semiconductor layer, the process includes the steps of: (1) anodizing the surface of a first substrate to form a porous layer at least on one side of the substrate, (2) forming a semiconductor layer at least on the surface of the porous layer, (3) removing the semiconductor layer at its peripheral region, (4) bonding a second substrate to the surface of the semiconductor layer, (5) separating the semiconductor layer from the first substrate at the part of the porous layer, and (6) treating the surface of the first substrate after separation and repeating the above steps (1) to (5).

Abstract: Resistance to corrosion of aluminum metallization on semiconductor devices during wafer sawing process is provided by a sacrificial anode containing magnesium in contact with the integrated circuit wafer and the dicing saw. A relatively thin film or disc of magnesium directly in contact with the surface of the dicing blade makes use of cooling water to serve as the electrolyte between the magnesium and aluminum surfaces, and in turn corrosion is transferred to the magnesium anode in preference to the aluminum of the semiconductor device.

Abstract: This invention is to reduce the influence of a gas generated by an anodizing reaction. A silicon substrate (101) to be processed is horizontally held. A negative electrode (129) is arranged on the upper side of the silicon substrate (101), and a positive electrode (114) is brought into contact with the lower surface of the silicon substrate (101). The space between the negative electrode (129) and the silicon substrate (101) is filled with an HF solution (132). The negative electrode (129) has a number of degassing holes (130) to prevent a gas generated by the anodizing reaction from staying on the lower side of the negative electrode (129).

Abstract: A novel method and apparatus to apply a corrosion protection in the form of a zinc (or other sacrificial anodic material) tape to a tubular member such as pipe or coiled tubing to used as an underground or underwater pipeline or flow line is disclosed. The zinc tape is applied with sufficient heat and pressure to form a metallurgical bond between the zinc tape and underlying metal pipe. This allows the zinc tape to act simultaneously as a continuous protective metal barrier to the normal scrapes and nicks the pipe experiences during installation and as a sacrificial anode. The novel apparatus preheats the zinc tape with a nozzle containing heated gas such as nitrogen as it approaches the pipe surface. At the point of contact with the pipe surface, the nozzle continues heating the tape and pipe surface while a plurality of pressure rollers exert sufficient force on the zinc tape to form a metallurgical bond between the zinc tape and the pipe surface.