Abstract: A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

Abstract: The present invention relates to an apparatus and a method for manufacturing metal foil by electroforming.

Abstract: The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.

Abstract: A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

Abstract: An improved method and apparatus for quickly and efficiently updating the original source volume and original target volumes after the original source volume has become temporarily unavailable. The original target volume is characterized as a source volume while the original source volume is temporarily unavailable. Transfer lists of different data blocks are generated. Data blocks not originally found on a source are copied to the target. Data blocks included on a target that were not found on the source are removed. By focusing upon specific data blocks, this technique avoids the use of filer overhead and other computational resources that would be expended if the entire volume were recopied.

Abstract: A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence of one of a cathodic item and an anode, and an anodic item and a cathode, a surface of the item using means for reducing the thickness of a diffusion layer depleted in metal ions adjacent the surface of the item, which means include a wiping roller extending perpendicular to the transport direction over the entire width of the item and in contact with the item; and moving the electrolyte in a direction substantially perpendicular to a plane of the item so as to direct the electrolyte only toward the perforations in the item and to convey the electrolyte through the in the item under pressure.

Abstract: The electrodes have jet openings which jet the electrolyte to the steel strip, that is to say, the electrode is integrated with the nozzle which jets an electrolyte.

Abstract: A method and an apparatus for the continuous chromium-plating of elongated members such as bars and the like: the bar to be plated is fed and rotated through at least one tubular shaped chromium-plating anode into which an electrolytic solution suitable for depositing a layer of chromium on the bar, as the latter advances through the said anode, is supplied. The electrolytic solution is supplied into the anode from the bottom upwards, through sets of holes over the bottom and the upper surfaces of the anode; the bottom holes communicate with a pressure balancing and flow distribution chamber for the electrolytic solution. This results in an electrolytic flow upwardly directed in a perpendicular direction to the longitudinal axis of the bar, the temperature of which may be controlled by changing the flow rate of the electrolytic solution circulating inside the anode.

Abstract: The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.

Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer and rinse systems for use with the continuous plating system.

Abstract: A method and apparatus for performing high speed chemical treatment of v type cylinder blocks. First the cylinder bores of one bank are treated. Then those of the other bank are treated. This permits a simple but compact treating plant.

Abstract: Arranged in a series are an electrolyte tank capable of holding one of a number of substrates, each substrate having a conducting film thereon, and a cathode so that the cathode and substrate face each other in an electrolyte, an anodizing chamber for anodizing the substrate, a pretreatment chamber for calcining a photoresist mask put on part of the conducting film, and a post-treatment chamber for washing and drying the anodized substrate. A substrate transportation mechanism is provided for serially transporting the substrates one by one from the pretreatment chamber to the post-treatment chamber via the anodizing chamber. In the anodizing chamber described above, a formation voltage is increased to a value such that an oxide film with a desired thickness is formed so that the value of a current flowing through an aluminum alloy film as the conducting film is kept constant with the current density ranging from 3.0 mA/cm.sup.2 to 15.0 mA/cm.sup.2.

Abstract: An apparatus for spraying electroplating of metal onto a panel surface that moves through a plating chamber employs roller brushes positioned between electrolyte spray heads and the panel. Metal anodes are positioned to contact the fluffy, absorbent outer layer of the roller brushes while they are being wet by the electrolyte to provide for electrical contact between the anodes and the panel being plated. A suitable power supply has its positive terminal connected to the anodes and its negative terminal connected to the moving panel.

Abstract: The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: Arranged in a series are an electrolyte tank capable of holding one of a number of substrates, each substrate having a conducting film thereon, and a cathode so that the cathode and substrate face each other in an electrolyte, an anodizing chamber for anodizing the substrate, a pretreatment chamber for calcining a photoresist mask put on part of the conducting film, and a post-treatment chamber for washing and drying the anodized substrate. A substrate transportation mechanism is provided for serially transporting the substrates one by one from the pretreatment chamber to the post-treatment chamber via the anodizing chamber. In the anodizing chamber described above, a formation voltage is increased to a value such that an oxide film with a desired thickness is formed so that the value of a current flowing through an aluminum alloy film as the conducting film is kept constant with the current density ranging from 3.0 mA/cm.sup.2 to 15.0 mA/cm.sup.2.

Abstract: Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.

Abstract: Improved apparatus for carrying encapsulated electronic components, having a conveyor belt defined by a horizontal web with a pluraity of identical, flexible tines depending from both sides of the edge of the web. The web is formed into a continuous, endless loop adapted to be carried on a pair of vertical pulleys rotatable on horizontal shafts. Projecting cams, on the face of the web of the belt remote from the dependent tines, engage mating indentations in the periphery of the two pulleys guiding and imparting movement to the belt. The opposing groups of tines are urged apart, by spreader cams, at the beginning and end of the passage of the belt between the lower faces of the two pulleys. Parts to be plated are brought into the space between the tines which, upon exiting from the cams as the conveyor moves entrap the part between them and causing them to move through the plating tanks and treatment stations positioned along the path of the conveyor.

Abstract: A base for a printed circuit board is continuously produced by an apparatus comprising at least one degreasing vessel, at least one water pre-washing vessel, at least one electrodeposition coating vessel, at least one electrodepositing liquid-recovering vessel, at least one water post-washing vessel, and a transporting device for intermittently transporting the base successively through the above-mentioned vessels, which apparatus is provided with a device for conveying the base to a predetermined position above one of the above-mentioned vessels, stopping the base at that position, introducing the base into the vessel, keeping the base in the vessel for a predetermined time, and withdrawing the base from the vessel.

Abstract: A ventilating system for a high speed electroplating apparatus having a pretreating section, a plating section and a post treating section for electroplating a workpiece sequentially transferred from each section by a conveyor. Each section has a cover which together completely enclose the apparatus except for inlet and outlet areas. An exhaust fan is positioned in a duct connected to the enclosed treating sections for exhausting the accumulated gases to the atmosphere outside the work area.

Abstract: A method for cleaning cathode and/or anode plates which are obtained in the electrolytic refining of metals and which are lifted in groups suspended on bars or lugs from the electrolytic bath and thereafter the plates are washed by passing in succession through the washing operation individually or in pairs inclined in substantially V-manner with respect to each other. Additionally, three or more plates, inclined away from each other substantially in fan manner, may pass through the washing operation. The flat sides of the plates are sprayed at least partially by nozzles which execute a relative movement along the flat sides.

Abstract: A device for continuously plating selected portions of objects including an electroplating bath, a conveyor disposed for movement above the electroplating bath where retainer devices are provided to be carried by the conveyor in spaced relation above the electroplating bath. The retainer devices include a base having a connector to connect the base to the conveyor so that the retainer is disposed between the conveyor and the electroplating bath where the base includes retaining device to releasably receive the object to be electroplated with the portion of the item to be electroplated extending downwardly from the bottom of the base to be received in the electroplating bath as the retainer moves with the conveyor.

Abstract: A plating apparatus for automatic plating of objects to be plated such as IC lead frames in a plural number in considerably high speed as a whole process line in which plural number of aligned object to be plated in the form of strips is conveyed laterally at a time on the conveyed line which is formed with aligning rollers group and the feed rollers group, while conveying, the objects to be plated are carried out pre-treatment and after-treatment, between both of treatments, the plating treatment is carried out by injection of plating liquid to the objects to be plated, and as loading a vacuum apparatus moving with arc-shaped track is employed for transferring plural objects to be plated in one on a conveyor line.

Abstract: The present invention deals with the continuous metal exchange for workpieces such as a printed circuit board which can take place in a plating tank. The workpieces are conveyorized for continuous horizontal transport into and out of a plating tank. Opposite ends of the tank are provided with slots to receive and discharge the workpieces which are sealed, in the instance illustrated, by opposed rollers or an open slot of small area to prevent leakage in excess of the pump capacity. The workpieces are suspended at their upper portion by a non-conductive hanger, the lower portion of which is rendered conductive. When the workpiece enters the plating tank the conductive portion of the hanger suspending the workpiece from the conveyor, makes contact to energize bus bars thereby converting the workpiece to a cathode (or anode if metal is to be removed). A plating solution is inside of the tank and provided with anodes or cathodes energized for metal exchange.

Abstract: An electrolysis device for electrolytic deposition of a metal on at least one surface of the tape which has been precoated with a metal provides an electrolytic metal deposition band in which there is a first electrode for connection to a first voltage source. A tape drive is provided for moving the tape through the bath including first guide rollers defining a single loop for the tape through the bath. A second electrode is provided in the tape path and mounted to contact the tape above the entrance to the bath and over an area of the one metallized surface and is connected to a second source potential. Second guide rollers along the tape path downstream of the bath, including a second guide roller contact the metallized surface and is connected to a third source potential.

Abstract: A continuous plating machine using a cooperating pair of endless tractor tread conveyor means to transport printed circuit boards through a plurality of process stations to complete stripping, cleaning, activation, plating and intermediate rinse cycles of the board terminals. The PC boards are captured between the opposing treads or shoes which serve as a masking means to protect the portions of the boards that don't require plating. The boards are electrically connected back through the conveyor means to the electrical current source.

Abstract: Surface treating apparatus comprising treating bath means; a carrier bar having devices for vertically suspending workpieces; lifting means provided at the sides of the bath means for vertically conveying the carrier bar and dipping said workpieces into and out of said bath means, the lifting means also including means for conveying the carrier bar in a substantially horizontal direction; loading means rotatable between a horizontal and a vertical position and adapted to removably receive the carrier bar having workpieces attached in the horizontal position for loading the carrier bar onto the lifting means in the vertical position; unloading means rotatable between a horizontal and a vertical position and adapted to receive the carrier bar supporting finished workpieces in the vertical position, the workpieces being released from the carrier bar when the unloading means is in a horizontal position; and returning conveyor means between the loading and unloading means so that the carrier bar moves from the loa