Mechanical Working Patents (Class 204/217)
  • Patent number: 11138148
    Abstract: An information processing apparatus communicates with a server that manages files and enables an application that can open the files managed by the server to operate thereon. To search the files managed by the server, the information processing apparatus receives specification of conditions that represent attribute information of the files, manages log information of the files opened by the application, and displays a list of the managed log information on a screen of the information processing apparatus. The list of the managed log information displays, as information on each of the files included in the list, at least one piece of attribute information relating to the specified conditions from among a plurality of pieces of attribute information that is associated with each of the files.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: October 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Kazuya Nakashima
  • Patent number: 10391564
    Abstract: A hybrid cutting apparatus and a method of cutting a groove are provided. The hybrid cutting apparatus includes: a main body that is connected with a rotation shaft of a machine tool; a grooving tool that is coupled to one side of the main body and for forming a groove at an interior circumference of a workpiece; and a tool position control means that controls a position of the grooving tool to correspond to a cutting surface position of the workpiece.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 27, 2019
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Jong-Kweon Park, Berend Denkena, Oliver Bertram, Dominik Dahlmann
  • Patent number: 9956631
    Abstract: A machine for machining a workpiece having a first central longitudinal axis passing through a workpiece plane that is disposed orthogonally relative to the first central longitudinal axis is provided. The machine includes a chuck or fixture on which the workpiece is disposable, a grinding spindle having a body, a wheel supporting an abrasive and an insulator electrically isolating the wheel from the body, the wheel being operable to remove material from the workpiece, the grinding spindle having a second central longitudinal axis about which the grinding spindle rotates, the second central longitudinal axis of the grinding spindle passing through the workpiece in the workpiece plane so as to create a continuous gear tooth on the workpiece and an electrochemical grinding (ECG) element configured to execute ECG processing on the grinding spindle and the workpiece to soften the workpiece as the gear tooth is being created by the grinding spindle.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: May 1, 2018
    Assignee: SIKORSKY AIRCRAFT CORPORATION
    Inventor: Edward H. Bittner
  • Patent number: 9597743
    Abstract: A machine for machining a workpiece having a central longitudinal axis is provided. The machine includes a chuck or fixture on which the workpiece is disposable, a grinding spindle to remove material from the workpiece, the grinding spindle having a central longitudinal axis about which the grinding spindle rotates and being disposed with the central longitudinal axes intersecting one another so as to create a continuous gear tooth on the workpiece and an electrochemical grinding (ECG) element configured to execute ECG processing on the grinding spindle and the workpiece to soften the workpiece as the gear tooth is being created by the grinding spindle.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: March 21, 2017
    Assignee: SIKORSKY AIRCRAFT CORPORATION
    Inventor: Edward H. Bittner
  • Patent number: 9457493
    Abstract: Provided is a method for producing a cylindrical nanoimprinting mold such that the outer peripheral surface of a cylindrical aluminum substrate is uniformly polished, and it is possible to effectively take advantage of the outer peripheral surface. The method forms an oxide film at the outer peripheral surface (14) of an aluminum substrate (10) after polishing the entire outer peripheral surface (14) of the cylindrical aluminum substrate (10) by means of a polishing body (26), wherein the polishing body (26) is moved in the axial direction to polish in a manner such that at least a portion of the polishing body (26) is protruding beyond the first end (10a) side and second end (10b) side of the aluminum substrate (10), and the portion of the polishing body (26) protruding beyond the aluminum substrate (10) is disposed on and supported by a cylindrical first support member (18); and second support member (20).
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: October 4, 2016
    Assignee: MITSUBISHI RAYON CO., LTD.
    Inventors: Shinya Shakagoori, Makoto Ookawa, Kazuya Takanashi, Katsumi Hara
  • Patent number: 9403228
    Abstract: A method and apparatus for electromechanical grinding is provided. An pulsed alternating waveform is applied between an anodic workpiece and cathodic grinding wheel to physically remove and electrochemically remove material from the anodic workpiece.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: August 2, 2016
    Assignee: FARADAY TECHNOLOGY, INC.
    Inventors: E. Jennings Taylor, Maria E. Inman
  • Patent number: 8871065
    Abstract: The invention relates to an equipment for the surface treatment of parts (4), that comprises a plurality of treatment vats arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be processed and having their axes (XX?) rotatingly mounted horizontally so that the major portion of each drum (2) is submerged in the processing liquid contained in the corresponding vat, and a conveyor line (14) for supplying each drum (2) with parts to be processed and for removing from said drum the parts already processed, characterized in that the conveying process is carried out along a general axis (ZZ?), and in that the axes (XX?) of the drums are parallel relative to each other and parallel to the general axis (ZZ?) of the conveyor line.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: October 28, 2014
    Assignee: Tornos Management Holding SA
    Inventor: Frédéric Vacheron
  • Patent number: 8268135
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: September 18, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N Korovin, Brian L Mueller
  • Publication number: 20110290663
    Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 1, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Yuefeng Luo, William Edward Adis
  • Patent number: 7378004
    Abstract: An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: May 27, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian Uzoh, Bulent Basol, Homayoun Talieh
  • Patent number: 7374644
    Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: May 20, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler
  • Patent number: 7329335
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: February 12, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7252746
    Abstract: An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: August 7, 2007
    Assignee: Cook Incorporated
    Inventor: Darin G. Schaeffer
  • Patent number: 7194505
    Abstract: The present invention provides a shared information processing system, such that information can be shared between a plurality of clients and a server with a chat system is constructed, and it is possible to acquire from a server or other clients information about files frequently used by a user registered at a client, or update information thereof, and to display this information. A client terminal 200 includes a link file registration component 211 that notifies a server terminal 100 of registration information for link files, a link file manager 212 that acquires and manages information pertaining to link files, and a link file status display component 213 that displays information pertaining to link files; and a server terminal 100 includes a link file information notification component 102 that acquires information pertaining to link files and sends this information to the client terminal 200.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: March 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Ai Yano, Ryuichi Matsukura, Kazuo Sasaki
  • Patent number: 7125477
    Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: October 24, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Paul Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine Manens, Rashid Mavliev, Stan Tsai
  • Patent number: 6974525
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: December 13, 2005
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N. Korovin, Brian L. Mueller
  • Patent number: 6939457
    Abstract: A contact-discharge truing/dressing method and a device therefor, capable of very simply conducting truing/dressing of a superabrasive grindstone, especially a superabrasive grindstone having a metal binder. The contact-discharge truing/dressing method brings a rotated conductive grindstone into contact with a pair of electrodes to which a DC voltage or pulse voltage is applied, and subjecting the conductive grindstone to an intermittent truing/dressing by contact discharge produced when opening/closing a circuit of a positive electrode, electrode chips, a grindstone binder, electrode chips, a negative electrode, and parts of the side surfaces of dual-ring rotary electrodes insulated by an insulation layer being used as a pair of electrodes.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: September 6, 2005
    Assignee: Japan Science and Technology Corporation
    Inventor: Masahiro Mizuno
  • Patent number: 6736952
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: May 18, 2004
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N. Korovin, Brian L. Mueller
  • Patent number: 6706158
    Abstract: The present invention discloses an apparatus having a platen; a polishing pad disposed over the platen; a slurry dispenser disposed over the polishing pad; a cathode connected electrically to the polishing pad; a wafer carrier disposed over the polishing pad; an anode connected electrically to the wafer carrier; and a power supply connected to the anode and the cathode. The present invention further discloses a method to remove a surface layer from a wafer using a polishing pad, a slurry, and an electrical current.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: March 16, 2004
    Assignee: Intel Corporation
    Inventor: Sujit Sharan
  • Patent number: 6630059
    Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: October 7, 2003
    Assignee: Nutool, Inc.
    Inventors: Cyprian Emeka Uzoh, Homayoun Talieh, Bulent Basol, Douglas W. Young
  • Patent number: 6562227
    Abstract: An electromachining apparatus includes a mandrel for supporting a workpiece next to a cutter mounted on an arbor. The workpiece is powered as an anode and the cutter is powered as a cathode, and a coolant is circulated therebetween. The cutter is rotated and plunge twisted into the workpiece to form a twisted slot therein, with adjacent ones of such slots forming twisted blanks therebetween. The individual blanks may then be subsequently machined to final shape such as an airfoil configuration.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: May 13, 2003
    Assignee: General Electric Company
    Inventors: Michael Scott Lamphere, Roger Barrie Etherington, Bin Wei
  • Patent number: 6531037
    Abstract: There is disclosed a removable electrode for electrolytic dressing grinding in which the electrode is disposed opposite to a processing surface of a conductive grinding wheel via a gap, a conductive liquid is passed through between the electrode and the conductive grinding wheel to apply a voltage thereto, the grinding wheel is dressed by electrolysis and a workpiece is simultaneously ground, the electrode comprising: an electrode support member 12 having a surface 12a disposed opposite to the processing surface of the grinding wheel via a constant gap; a conductive foil 14 detachably attached to and along the opposite surface of the electrode support member; and a conductive terminal 16 for contacting the conductive foil to apply the voltage to the conductive foil. Even when a deposit is built up on a cathode surface, the cathode surface can be cleaned in a short time. Even after repeated use, an electrode shape does not change.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: March 11, 2003
    Assignee: Riken
    Inventor: Hitoshi Ohmori
  • Patent number: 6464855
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a platen, a conductive element disposed adjacent the platen and a polishing surface disposed adjacent the conductive element. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing surface while causing relative motion between the workpiece and the polishing surface. A voltage source is configured to effect an electric potential difference between the metallized surface on the workpiece and the conductive element so that an electric field is produced between the metallized surface and the conductive element. The apparatus further includes a solution application mechanism configured to supply an electrolytic solution to the polishing surface.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: October 15, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Saket Chadda, Chris Barns
  • Publication number: 20020074238
    Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.
    Type: Application
    Filed: September 28, 2001
    Publication date: June 20, 2002
    Inventors: Steven T. Mayer, Robert J. Contolini, Eliot K. Broadbent, John S. Drewery
  • Patent number: 6328872
    Abstract: The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conductive material and another chamber can be used for polishing the semiconductor substrate. The plating/depositing process can be performed using brush plating or electro chemical mechanical deposition and the polishing process can be performed using electropolishing or chemical mechanical polishing. The present invention further provides a method and apparatus for intermittently applying the conductive material to the semiconductor substrate and also intermittently polishing the substrate when such conductive material is not being applied to the substrate.
    Type: Grant
    Filed: April 3, 1999
    Date of Patent: December 11, 2001
    Assignee: Nutool, Inc.
    Inventors: Homayoun Talieh, Cyprian Emeka Uzoh
  • Patent number: 6217725
    Abstract: A resilient dielectric wiper blade is mounted between electrodes and a workpiece, particularly in an anodizing operation, to wipe bubbles of oxygen from the anodic work surface, to remove a surface layer of excessively heated electrolytic solution and replace with fresh cooler solution, and in the case of flexible strip processing, to stabilize the strip between cathodes. The resilient dielectric wiper blade is preferably used with perforated electrodes to facilitate removal of overheated electrolytic solution and replace with freshly circulated solution.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: April 17, 2001
    Assignee: Electroplating Technologies Ltd.
    Inventors: Erik S. Van Anglen, Harold M. Keeney, James L. Forand
  • Patent number: 6143156
    Abstract: The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: November 7, 2000
    Assignee: CAE Vanguard, Inc.
    Inventor: Ming Jason Zhang
  • Patent number: 5667646
    Abstract: A dressing apparatus comprises at least two electrode pieces each having an arcuate inner surface and being arranged around a grinding stone to define a gap therebetween. A gap adjusting mechanism adjusts the gap between the arcuate inner surface of each of the electrodes and the grinding stone and maintains the gap between the arcuate inner surface of each electrode and the grinding stone equal to each other.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: September 16, 1997
    Assignee: Seiko Seiki Kabushiki Kaisha
    Inventor: Katsura Tomotaki
  • Patent number: 5587064
    Abstract: For the purification of heavy metal-containing wastewater, a process according to the invention deposits heavy metal deposits on a cathode or cathodes which are mechanically removed. For this purpose the invention provides an apparatus having a device for the mechanical removal of the heavy metal deposits on the cathode or cathodes.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: December 24, 1996
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: G unther Hambitzer, Winfried B oke, Armin Oertel
  • Patent number: 5462649
    Abstract: A resilient dielectric wiper blade is mounted between a cathodic workpiece and an anode to wipe bubbles of hydrogen from the surface, sever dendritic material, if such is present as the coating thickens, and to remove a surface layer of partially depleted electrolytic solution and replace with fresh solution. The resilient dielectric wiper blade is preferably used with perforated anodes.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: October 31, 1995
    Assignee: Electroplating Technologies, Inc.
    Inventors: Harold M. Keeney, Erik S. Van Anglen, James L. Forand
  • Patent number: 5453174
    Abstract: Thick layers of hard dense chromium coatings are formed on metal substrates by an electrolytic brush plating operation in which a lead-tin anode is closely positioned to a cathodic workpiece in full anode wrap relationship and the surface of the cathodic workpiece is wiped by an open construction wiper to remove hydrogen bubbles and/or outwardly extending dendritic coating material with minimum contact with and force upon the coating surface. The open wiper construction allows free access to the coated surface at all times of fresh undepleted coating electrolyte and allows hydrogen bubbles and dendritic material to be discharged unimpeded from the wiper structure.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: September 26, 1995
    Assignee: Electroplating Technologies Ltd.
    Inventors: Erik S. Van Anglen, Harold M. Keeney
  • Patent number: 5288382
    Abstract: An optical fine processing apparatus for forming a structure having a high aspect ratio even on a workpiece having high heat conductivity. Light, such as a laser beam, is irradiated onto the workpiece in an electrolytic solution through a light guide to deposit a substance such as a metal or a polymer. A plurality of removal electrodes are allowed to have an electric potential for removing a part of the deposited substance. The removal electrodes are disposed in a rotation ring which is rotatable about the optical axis of the irradiating light onto the sample so as to adjust the width of a predetermined pattern to be scraped by changing the rotation angle of the removal electrodes with respect to the optical axis. By scanning the light guide and the removing electrodes above the workpiece surface, it is possible to form any desired pattern on the workpiece.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: February 22, 1994
    Assignee: Seiko Instruments, Inc.
    Inventors: Masataka Shinogi, Toshihiko Sakuhara, Masayuki Suda, Fumiharu Iwasaki, Akito Ando
  • Patent number: 5246555
    Abstract: This invention relates to a work bed for a grinding apparatus provided with a work table (9) which moves in a direction of X-axis and in a direction of Y-axis, comprising X-axis and Y-axis set to an upper surface of the work table (9), and a conductive dresser member (13) and a measuring reference member (14) provided on the upper surface of the work table (9) with operating surfaces thereof being parallel with the X-axis or Y-axis.
    Type: Grant
    Filed: August 27, 1991
    Date of Patent: September 21, 1993
    Assignee: Nissei Plastics Industrial Co., Ltd.
    Inventor: Kazutoshi Takayama
  • Patent number: 5194126
    Abstract: The invention relates to a method and a device for the electroerosive dressing of grinding wheels having an electrically conductive bond. The dressing tool comprises a cylindrical electrode pair divided into two, the electrodes (2, 3) of which have a different polarity and are separated from one another by insulation (4). A voltage circuit is directed via the two electrodes (2, 3). The voltage may either be a direct-current voltage of an alternating-current voltage. The dressing tool rotates and is pressed against the grinding wheel (1) with a constant force. The two dressing electrodes (2, 3) are supplied with current from a generator (7) via brushes (5,6) in such a way that it flows through the electrode (3) into the grinding wheel (1and from the latter back into the other electrode (2).
    Type: Grant
    Filed: October 17, 1991
    Date of Patent: March 16, 1993
    Assignee: Wendt GmbH
    Inventor: Juri A. Packalin
  • Patent number: 5110428
    Abstract: Semiconductor wafers, in particular, silicon wafers, with differently poled front and rear sides and high geometrical quality can be fabricated by double-sided polishing if the wafer surfaces are differently polarized during the polishing process. This can be achieved in a simple fashion, in that during polishing, an electric field is set up between the upper and lower polishing plates. This can be accomplished by providing the upper polishing plate between the plate surface and the polishing cloth with a thin conductive layer insulated with respect thereto, on which a voltage can be impressed, while both polishing plates are grounded to the frame.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: May 5, 1992
    Assignee: Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
    Inventors: Helene Prigge, Josef Lang
  • Patent number: 5108561
    Abstract: A method of dressing for a conductive grindstone, a dressing system for this method and a dressing electrode used in this method. According to the preferred embodiment, this method comprises reciprocating a dressing electrode, which is formed of a metal having large chemical affinity with the super abrasive grains of the grindstone, in a direction being vertical to the moving direction of the grindstone, while the electrode is brought into contact with the ground surface of the grindstone with a predetermined pressure and applying a voltage between the electrode and the grindstone so as to provide a positive pole on the grindstone, while a conductive processing fluid is flown on the portion of the electrode contacting with the grindstone. Therefore, electrochemical action, chemical action, mechanical operation and electro-discharge operation are cooperated in a dressing process.
    Type: Grant
    Filed: December 10, 1990
    Date of Patent: April 28, 1992
    Assignee: Applied Magnetic Lab Co., Ltd.
    Inventor: Akio Kuromatsu
  • Patent number: 5100528
    Abstract: A continuous silver refining cell comprises a tank containing an electrolyte, at least one vertical cathode disk mounted on a rotating horizontal shaft placed above the tank so that slightly less than half of the disk is immersed in the electrolyte, at least one anode basket containing impure silver anodes immersed in the electrolyte adjacent the cathode disk, and a diaphragm separating the cathode disk from the anode basket to form cathode and anode compartments. A scraper is provided for continuously removing pure silver crystals from the cathode and directing it to the side of the cell. A chain tubular conveyor may be provided for continuously or semi-continuously withdrawing a mud containing gold and other precious metals from the bottom of the cell.
    Type: Grant
    Filed: March 14, 1990
    Date of Patent: March 31, 1992
    Assignee: Noranda, Inc.
    Inventors: Pierre L. Claessens, Bernard H. Morrison, John L. Cromwell, Paul Spira
  • Patent number: 5091067
    Abstract: An apparatus and a method of machining optical components such as lens is disclosed. The apparatus comprises an optical raw stock or material, a rotatable holding shaft for holding the optical raw stock, a machining tool having a machining surface thereof held by a rotatable machining shaft and arranged opposite to a surface to be machined of the optical raw stock, an electrically conductive tool as the machining tool, an electrode arranged at a certain distance from the machining surface of the conductive tool, an electrolytic power supply source for applying a positive voltage to the conductive tool and a negative voltage therefrom to the electrode, respectively, and a coolant supplying unit having a nozzle and for spraying weakly conductive coolant between the conductive tool and the electrode, thereby performing the machining of the optical raw stock or material.
    Type: Grant
    Filed: July 26, 1990
    Date of Patent: February 25, 1992
    Assignee: Olympus Optical Company Limited
    Inventors: Kazuo Ushiyama, Masaki Watanabe, Keiji Uchiyama, Hisayuki Takei, Noriaki Takahashi, Akimi Matsuzawa, Kiyoshi Ooshiro, Hajime Tamura
  • Patent number: 5071525
    Abstract: A method of grinding a lens and an apparatus therefor during dependent machining in which an electrically conductive grinding tool which rotates and a workpiece slide in close contact with each other on the work surface of the electrically conductive grinding tool. An anode is applied to the electrically conductive grinding tool, whereas a cathode is applied to an electrode which does not move together with the workpiece, while a fixed distance is maintained between the work surface of the electrically conductive grinding tool and the electrode. Grinding is thus performed with the aid of a weakly charged coolant fed between the electrically conductive grinding tool and the cathode.
    Type: Grant
    Filed: July 6, 1990
    Date of Patent: December 10, 1991
    Assignee: Olympus Optical Co. Ltd.
    Inventor: Kazuo Ushiyama
  • Patent number: 5045161
    Abstract: A method and apparatus for electrolytically assisting the mechanical shaping of a workpiece is provided which is particularly useful for precision machining. A tool is used comprising an electrically conductive (copper alloy) tool shank, a cutting tool of an electrically insulating material (reinforced ceramic), and means for flooding a gap, between the tool shank and the localized electrically conductive surface layer to be shaped, with a stream of electrolyte. With the electrolyte flowing, and a low voltage, direct current applied across the gap using the localized, electrically conductive surface layer as the anode and the tool shank as the cathode, the structure of the localized, electrically conductive surface layer of the workpiece just ahead of the tool is weakened structurally sufficiently to be removed easily by the cutting tool in discrete form and carried away from the tool by the stream of electrolyte.
    Type: Grant
    Filed: January 17, 1990
    Date of Patent: September 3, 1991
    Assignee: National Research Council
    Inventor: Gavin McGregor
  • Patent number: 5032238
    Abstract: A method of electropolishing and grinding the both surfaces of a circular workpiece comprises polishing and grinding the both surfaces of a circular workpiece with a pair of grindingstones which are so arranged as to oppose the polishing/grinding surfaces, the body material of the polishing/grinding surface of the grindingstones being composed of an electric conductive material wherein the grindingstones are connected to the positive pole of a power source and an electrode located in the vicinity of the grindingstones is connected to the negative pole, and a voltage is applied across the positive and negative poles, whereby a dressing operation to the polishing/grinding surfaces is conducted by the electrolysis of the pair of grindingstones during the polishing and grinding operation.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: July 16, 1991
    Assignee: Asahi Glass Co., Ltd.
    Inventors: Kazuhiko Ishimura, Ikuo Nagasawa, Shigeru Muramoto, Naohiro Hotta
  • Patent number: 4839005
    Abstract: In a method of fabricating an aluminum surface for applying mirror-smooth fabrication to the surface of aluminum or aluminum alloy by combining an electrolytic anode dissolving effect to the surface and a polishing effect of removing the protruded portions of passivated films formed on the surface to be fabricated by lapping with abrasive grains, the voltage between the aluminum material and the tool electrode is set within 2.1.+-.0.3 V, an electrolyte at less than 10% concentration is used as a passivation type electrolyte, the urging pressure of the tool electrode to the surface is set to less than 2.0 kgf/cm.sup.2 and free abrasive grains with the average grain size of less than 1.0 .mu.m are used as the abrasive grains. The temperature of the electrolyte is preferably set to lower than 15.degree. C. The polishing material may comprise non-woven abrasive cloth made of ultrafine fibers.
    Type: Grant
    Filed: April 28, 1988
    Date of Patent: June 13, 1989
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Kenichi Katsumoto, Shigeo Isoda, Takahiro Yuuki, Shiro Koike, Yutaka Yamamoto, Suguru Motonishi, Tadashi Kawaguchi, Tetsuya Gotoh, Shiro Horiguchi
  • Patent number: 4830719
    Abstract: A method for the etching of chromium-coated piston rings comprises the steps of producing relative movement and rubbing contact between the chromium-coated surface of a piston ring which is anodic and a cathode having a porous material on the rubbing surface thereof, supplying an electrolyte to the porous material between the anodic ring surface and the cathode, establishing an electrical potential therebetween and supplying an electrical current for a period of time during the relative movement.
    Type: Grant
    Filed: June 22, 1988
    Date of Patent: May 16, 1989
    Assignee: AE PLC
    Inventors: David R. Adams, Johnathan D. Philby, Alan D. Pope, David F. Spence, David R. Eastham
  • Patent number: 4713149
    Abstract: The invention relates to a method and apparatus for electroplating an object using a carbon fiber material as the anode and wherein during the plating operation relative motion is maintained between the object to be plated and the anode.
    Type: Grant
    Filed: November 21, 1986
    Date of Patent: December 15, 1987
    Inventor: Shigeo Hoshino
  • Patent number: 4641007
    Abstract: A rotating electrode tool made of polycrystalline synthetic diamonds in a metal foundation is used in the electro-erosive machining and mechanical grinding of a metal bonded, electrically non-conductive hard material such as synthetic diamonds or boron nitrides in an electrically conductive metal matrix. The tool is first used to electro-erosively machine the workpiece. When a signal is obtained from the machining current or voltage indicating that no further electroerosive removal is possible, the tool automatically mechanically grinds the workpiece to remove nonconductive particles not removed by spark erosion.
    Type: Grant
    Filed: June 1, 1983
    Date of Patent: February 3, 1987
    Inventor: Horst Lach
  • Patent number: 4609450
    Abstract: Method and apparatus for combined electrolytic-abrasive polishing: providing a tool electrode rotatable by means of a rotational drive and having a liquid-permeable visco-elastic polishing member attached to the surface of a conductive disk-like tool base; contacting the visco-elastic polishing member with a free curved surface of a workpiece, with the rotational axis of the tool electrode in tilted state relative to a plane averaging undulations on the free curved surface, to contact only peripheral portions of the visco-elastic polishing member retaining abrasive grains with the workpiece; supplying an electrolyte to polishing portions between the visco-elastic polishing member and workpiece; and conducting current for electrolysis across the visco-elastic polishing member and workpiece. The apparatus can perform the combined electrolytic-abrasive polishing automatically along free curved surface of a work by the use of an automatic two-dimensional feed mechanism.
    Type: Grant
    Filed: March 26, 1985
    Date of Patent: September 2, 1986
    Assignees: Agency of Industrial Science and Technology, Nakagami Kogyo Kabushiki Kaisha
    Inventors: Kouichi Seimiya, Kenji Nakagami
  • Patent number: 4559115
    Abstract: Efficient, high-precision machining of ceramic materials is achieved by supplying onto a workpiece of a ceramic material a liquid electrolyte having components at least one of which is normally inert to but becomes chemically reactive with the ceramic material at an elevated temperature, and applying to a limited zone of interface between the liquid electrolyte and the workpiece, localized energy of a magnitude sufficient to heat the liquid electrolyte and the ceramic material there to the elevated temperature and to remove from the workpiece the locally heated ceramic material in a form at least partially chemically degenerated with that electrolytic component. The limited zone acquiring the localized energy is displaced in a scanning manner from one region to another on the workpiece along numerically programmed path to consecutively remove the ceramic material along the path from the workpiece.
    Type: Grant
    Filed: May 30, 1984
    Date of Patent: December 17, 1985
    Assignee: Inoue-Japax Research Incorporated
    Inventor: Kiyoshi Inoue
  • Patent number: 4534831
    Abstract: A method of and apparatus for forming a 3D-shaped article, such as a die or mold, utilizing an electroforming process in which a metal layer is electroformed on an electroforming mold and removed therefrom to form the desired article. The removal is facilitated by mirror-finishing anodizing the shaped electroforming mold and thereafter anodizing to form an oxide film thereon. The electroforming apparatus utilizes a worktank having a first and a second region separated by a partition. The partition has a plurality of apertures which provide communication between the first region with the second region, the latter having an anodic electrode and a source of the electroforming metal. The electroforming mold supported by a shank is introduced into the first region and reciprocated longitudinally of the axis of the shank with a stroke not less than the dimension of the electroforming surface of the mold in the direction of that axis.
    Type: Grant
    Filed: September 23, 1983
    Date of Patent: August 13, 1985
    Assignee: Inoue-Japax Research Incorporated
    Inventor: Kiyoshi Inoue
  • Patent number: 4532019
    Abstract: A grinding wheel having a circumferential rim and a plurality of electrically conductive zones and non-grinding zones therebetween the rim. A method of using such a grindstone as disclosed. Further, certain alternative methods of making such a grindstone are disclosed.
    Type: Grant
    Filed: April 30, 1982
    Date of Patent: July 30, 1985
    Assignee: Nicco Machine Tool Company Ltd.
    Inventor: Akio Kuromatsu
  • Patent number: 4528074
    Abstract: Disclosed is a method of producing a grinding wheel by electroplating. A part of the outer peripheral portion of a grinding wheel body is immersed in a plating solution. While rotating the grinding wheel body at a low speed, electric current is supplied to flow between an anode disposed in the plating solution and a cathode contacting the grinding wheel body, so that a pre-plating layer of uniform thickness is formed on the outer peripheral surface of the grinding wheel body. Plating operation is continued while adhering abrasive grains to the pre-plating layer to further cause a precipitation of a plating layer to temporarily fix the abrasive grains. The abrasive grains are then pressed by a pressing roller so as to be forcibly embedded into the pre-plating layer by making an effective use of plastic deformation of the pre-plating layer, thereby to obtain a uniform projection height of the abrasive grains from the surface of the grinding wheel.
    Type: Grant
    Filed: March 1, 1984
    Date of Patent: July 9, 1985
    Assignee: Nissin Machine Works, Limited
    Inventors: Masakazu Miyashita, Akira Kanai, Junichi Yoshioka, Koichi Koizumi, Fukuo Hashimoto, Michimasa Daito, Takashi Hasebe