Abstract: A manufacturing process for making aircraft engine parts utilizes reusable reconfigurable smart memory polymer mandrel tooling, low temperature metal deposition, and composite part lay-up with resin coated conformable braided carbon fiber sleeves, to fabricate both metal internal engine parts and non-metal external parts for turbine engines.

Abstract: An apparatus for processing a front face of a semiconductor wafer is provided. The apparatus includes a main chamber, at least one loading port connected to the main chamber for introducing the wafer to the main chamber, at least one stack of wafer processing modules, and a transfer mechanism for transferring the wafer between the loading port and the processing modules. The at least one stack of wafer processing modules includes three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50 cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module.

Abstract: A barrel reactor (100) comprises a rotatable barrel (102); a first roller (110) located outside of the barrel (102) and arranged to facilitate rotation of the barrel, wherein the roller (110) comprises at least part of a first electrode; and a second electrode (120). A plasma is formed between the electrodes (110, 120). The second electrode (120) may also comprise a roller and the barrel (102) may be mounted on the rollers (110, 120). The spacing between, or positions of, the electrodes (110, 120) may be adjusted so as to accommodate different barrels (102) and/or to change the plasma distribution within the barrel (102).

Abstract: Aspects of the disclosure are directed toward systems and methods for performing deionization of a fluid. A capacitive deionization (CapDI) module including a fluid inlet and a fluid outlet can be placed in a fluid flow system. The CapDI module can include a plurality of CapDI cells arranged in series with one another. A power MOSFET polarity circuit can receive power from a switching regular and provide bidirectional electrical power to the CapDI module for performing deionization and module regeneration processes. A controller can control the providing the electrical power from the switching regulator to the power MOSFET polarity circuit based on a signal received from a conductivity sensor positioned in the fluid flow path.

Abstract: The present disclosure relates to an apparatus for electroplating an element. The apparatus may comprise a cathode cage assembly. The cathode cage assembly may include a cage member and at least one electrically conductive wire extending along at least a portion of the cage member. The wire may be arranged to form at least one volume within the cage member for retaining an element within the cage member. The cage member and the wire permit a degree of movement of the element during an electroplating process while retaining the element within the volume.

Abstract: A system, an apparatus and a method for adjusting a weir control the rate and/or speed at which drilling fluid feeds a separator. Multiple separators are typically used in parallel to process fluid returning from the well. A distribution manifold directs fluid to each separator. The weir is positioned within a feeder on an inlet end of the separator and connects to an attachment plate within the feeder. The distribution manifold or other flow control mechanism operates in combination with the weir. Adjustment apparatuses control the height of the weir to determine the rate the fluid flows onto the separator. The adjustment apparatuses provide mechanical and/or automated operation of the weir. Various profiles of the weir and adjustments of the height of the weir within the feeder increase and/or decrease the speed of the fluid as the fluid spills into the separator.

Abstract: A hydrogen molecule remixing device includes a base, a first gas and water channelling disc, an anode, a cathode, an ion membrane, a second gas and water channelling disc, a cover, a cationic water outlet connector and a connector. In practice, the source water is electrolyzed in the anode cavities of the anode to form oxygen molecules, ozone and anionic water, and electrolyzed in the cathode cavities of the cathode to form hydrogen molecules and cationic water. The hydrogen molecules are carried by the cationic water into the collecting and guiding chambers of the second gas and water channelling disc, so that the hydrogen molecules and the cationic water produce a blending reaction, and more hydrogen molecules are dissolved into the cationic water.

Abstract: Apparatuses and methods are provided for depositing a metal layer on a wafer. A secondary weir is positioned at a region below the primary weir such that overflowed plating solution over the primary weir during electroplating flows in a substantially azimuthally uniform manner. Methods are provided for electroplating wafers by increasing flow rate between wafer processes while plating solution flows over a primary weir, remains in contact with the overflowing plating solution, and flows onto the secondary weir such that overflow is substantially azimuthally uniform.

Abstract: In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.

Abstract: A substrate processing method of performing a predetermined processing by supplying a processing liquid to a processing region of a substrate and using processing target ions in the processing liquid, includes: arranging a template to face the substrate, the template including a passage configured to distribute the processing liquid, a direct electrode, and an indirect electrode, and the substrate including a counter electrode, which matches with the direct electrode, installed in the processing region; supplying the processing liquid to the processing region through the passage; and performing the predetermined processing on the substrate by applying a voltage to the indirect electrode to cause the processing target ions to migrate to the counter electrode side while applying a voltage between the direct electrode and the counter electrode to oxidize or reduce the processing target ions that have migrated to the counter electrode side.

Abstract: A method for producing cavities in a turbomachine disk, the cavities extending between first and second lateral surfaces of the disk, the method including positioning a ring facing the first surface, the ring including an inner periphery including protrusions complementary in shape to the cavities that are to be produced; circulating an electrolyte close to the protrusions on the ring; activating a first translational movement of the ring towards the second surface; activating a rotation of the disk; generating an electric current pulse in the electrolyte when the ring is substantially at the first surface, the pulse resulting in the ionic dissolution of the disk at the protrusions; reducing the speed of rotation to a first reduced speed, when the ring is substantially at the first surface, for a first period of time; and stopping the first translation of the ring when the ring is beyond the second surface.

Abstract: An electronic circuit is made by selectively depositing an electrically conductive material seed layer conformally upon a three-dimensional substrate via the plurality of apertures of a three-dimensional mask. The substrate is then plated with more of the same electrically conductive material, or a different electrically conductive material, on the seed layer. In the case of electroplating, a nonconductive support structure is incorporated into a conductive clamp for making electrical connection to the seed layer. An environmentally protective layer may be deposited upon the electrically conductive material to such an extent that the electronic circuit remains solderable. The three-dimensional mask may be fabricated by an additive manufacturing technique.

Abstract: Provided is an electrode capable of increasing a degree of freedom in machining shape with a simple structure, an electrochemical machining apparatus using the electrode, an electrochemical machining method, and a product machined by the method. An electrode 4 has a core tube 41 formed of a material by which a second hole 101b having a direction or a curvature different from that of a first hole 101a having a predetermined curvature can be formed continuously from the first hole 101a and a coating 42 fixed to an outer periphery of the core tube 41.

Abstract: Lead is recycled from lead paste of lead acid batteries in a process that employs alkaline desulfurization followed by formation of plumbite that is then electrolytically converted to pure lead. Remaining insoluble lead dioxide is removed from the lead plumbite solution and reduced to produce lead oxide that can be fed back to the recovery system. Sulfate is recovered as sodium sulfate, while the so produced lead oxide can be added to lead paste for recovery.

Abstract: In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.

Abstract: The invention relates to a one-piece metal component including an electroformed metal body, the external surface of the body including, only over or to a predetermined depth, less trapped hydrogen than the rest of the electroformed metal body causing a hardening relative to the rest of the body in order to improve the wear resistance of the one-piece component while preserving a relative magnetic permeability of less than 10 and the ability to be driven or pressed fit.

Abstract: A method and apparatus for plasma modifying a workpiece such as a medical barrel, medical barrel, vial, or blood tube is described. Plasma is provided within the lumen of the workpiece. The plasma is provided under conditions effective for plasma modification of a surface of the workpiece. A magnetic field is provided in at least a portion of the lumen. The magnetic field has an orientation and field strength effective to improve the uniformity of plasma modification of the generally cylindrical interior surface 16 of the generally cylindrical interior surface 16.

Abstract: Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.

Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.

Abstract: A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate.

Abstract: A method for obtaining distance measurements for a plating ring assembly and related device are provided. Embodiments include attaching a measurement device to a plating ring assembly, the plating ring assembly including: an outer ring, wherein the measurement device is attached to the outer ring and configured to rotate along the outer ring, a seal extending from a bottom surface of the outer ring along a circumference of the plating ring assembly, contact fingers located along the circumference of the plating ring assembly, between the outer ring and the seal, rotating the measurement device along the circumference of the outer ring by rotating the measurement device or the plating ring assembly; and obtaining critical dimensions of and between the seal and contact fingers with the measurement device.

Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. Also typically present is an edge flow element configured to direct electrolyte into a corner formed between the substrate and substrate holder. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet.

Abstract: Provided are a cylinder plating apparatus and a cylinder plating method, in which the distance between an insoluble electrode and a cylinder to be processed can be kept constant regardless of the diameter of the cylinder to be processed, and the surface area of the insoluble electrode is increased to reduce the current density of the insoluble electrode, thereby being capable of reducing burden on the insoluble electrode. The cylinder plating apparatus is configured to plate an outer peripheral surface of the cylinder to be processed in such a manner that a pair of the insoluble electrodes each having a shape in which at least a lower part thereof is curved inward and being constructed such that at least the lower part has a comb-like portion are brought close to both side surfaces of the cylinder to be processed with predetermined intervals.

Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

Abstract: A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

Abstract: A method for obtaining distance measurements for a plating ring assembly and related device are provided. Embodiments include attaching a measurement device to a plating ring assembly, the plating ring assembly including: an outer ring, wherein the measurement device is attached to the outer ring and configured to rotate along the outer ring, a seal extending from a bottom surface of the outer ring along a circumference of the plating ring assembly, contact fingers located along the circumference of the plating ring assembly, between the outer ring and the seal, rotating the measurement device along the circumference of the outer ring by rotating the measurement device or the plating ring assembly; and obtaining critical dimensions of and between the seal and contact fingers with the measurement device.

Abstract: Disclosed herein are methods and apparatuses for electroplating which employ seed layer detection. Such methods and related apparatuses may operate by selecting a wafer for processing, measuring from its surface one or more in-process color signals having one or more color components, calculating one or more metrics, each metric indicative of the difference between one of the in-process color signals and a corresponding set of reference color signals, determining whether an acceptable seed layer is present on the wafer surface based on whether a predetermined number of the one or more metrics are within an associated predetermined range which individually corresponds to that metric, and either electroplating the wafer when an acceptable seed layer is present or otherwise designating the wafer unacceptable for electroplating. The foregoing may then be repeated for one or more additional wafers to electroplate multiple wafers from a set of wafers.

Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Abstract: A roll-to-roll electroless plating system, including a plating tank containing plating solution, and a web advance system for advancing a web of media along a web-transport path that passes through the plating tank. One or more fluid guides are positioned within the plating tank to redirect plating fluid containing gas bubbles introduced by a gas bubble source away from the web of media as it is advanced through the plating solution in the plating tank.

Abstract: An anodizing apparatus configured to perform an anodization on a metallic material to be processed provided with a projecting portion on a surface thereof, includes: an electrolysis tank configured to store electrolytic solution for anodization; a first electrode portion formed of a metal and electrically connected to the material in an immersed state immersed in the electrolytic solution in the electrolysis tank; a second electrode portion formed of a metal and opposing the material in the immersed state; an electrode apparatus configured to apply a predetermined voltage between the first and second electrode portions; a retaining device configured to retain and rotate the material in the immersed state; and a first injection device configured to inject the electrolytic solution toward a predetermined area deviated from the material in a storage space in the electrolysis tank so that the material is deviated from a line in the direction of injection.

Abstract: A method for providing a superconducting surface on a laser-driven niobium cathode in order to increase the effective quantum efficiency. The enhanced surface increases the effective quantum efficiency by improving the laser absorption of the surface and enhancing the local electric field. The surface preparation method makes feasible the construction of superconducting radio frequency injectors with niobium as the photocathode. An array of nano-structures are provided on a flat surface of niobium. The nano-structures are dimensionally tailored to interact with a laser of specific wavelength to thereby increase the electron yield of the surface.

Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. The apparatus used to practice electroplating may be designed to have a geometric configuration that makes it difficult for air to travel and become trapped under the substrate. By using such apparatus, electroplating can occur at higher rates of substrate rotation than would otherwise be acceptable. The higher rate of substrate rotation allows electroplating to occur at higher limiting currents, which in turn increases throughput. The disclosed embodiments are particularly useful in the context of electrolytes that otherwise exhibit a relatively low limiting current (e.g., electrolytes having a low concentration of metal ions), though the embodiments are not so limited.

Abstract: A method includes rotating a first motor part around a first structure substantially similar to a second motor part. The method also includes applying a first current to the first structure to electro-chemically machine the first motor part.

Abstract: The liquid diffuser adapter is intended to be attached to the arbor wheel of a center fed, wet stone fabrication machine to facilitate dust elimination. The adapter contains a fastener, a plurality of diffusing channels, and a protective coating. The fastener includes a main body, a flange, and a receptive cavity. The flange is concentrically and adjacently connected to the main body. The receptive cavity traverses through the flange and partially into the main body. The receptive cavity contains an opening, a threaded portion, and a hub portion. The threaded portion is used to attach the adapter to the arbor wheel through the opening; the hub portion allows for water to flow into the device and be redirected into the plurality of diffusing channels; the plurality of diffusing channels is radially positioned about the receptive cavity, connecting the hub portion to the exterior environment and thus the cutting disk.

Abstract: Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced.

Abstract: Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder.

Abstract: An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.

Abstract: Disclosed herein are electroplating systems for forming a layer of metal on a wafer which include an electroplating module and a wafer edge imaging system. The electroplating module may include a cell for containing an anode and an electroplating solution during electroplating, and a wafer holder for holding the wafer in the electroplating solution and rotating the wafer during electroplating. The wafer edge imaging system may include a wafer holder for holding and rotating the wafer through different azimuthal orientations, a camera oriented for obtaining multiple azimuthally separated images of a process edge of the wafer while it is held and rotated (the process edge corresponding to the outer edge of the layer of metal formed on the wafer), and image analysis logic for determining an edge exclusion distance, wherein the edge exclusion distance is a distance between the wafer's edge and the process edge.

Abstract: The invention relates to an equipment for the surface treatment of parts (4), that comprises a plurality of treatment vats arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be processed and having their axes (XX?) rotatingly mounted horizontally so that the major portion of each drum (2) is submerged in the processing liquid contained in the corresponding vat, and a conveyor line (14) for supplying each drum (2) with parts to be processed and for removing from said drum the parts already processed, characterized in that the conveying process is carried out along a general axis (ZZ?), and in that the axes (XX?) of the drums are parallel relative to each other and parallel to the general axis (ZZ?) of the conveyor line.

Abstract: An electroplating apparatus includes an anode configured to electrically communicate with an electrical voltage and an electrolyte solution. A cathode module includes a cathode that is configured to electrically communicate with a ground potential and the electrolyte solution. The cathode module further includes a wafer in electrical communication with the cathode. The wafer is configured to receive metal ions from the anode in response to current flowing through the anode via electrodeposition. The electroplating apparatus further includes at least one agitating device interposed between the wafer and the anode. The agitating device is configured to apply a force to gas bubbles adhering to a surface of the wafer facing the agitating device.

Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.

Abstract: An apparatus and method for removing contaminant species from water by electrocoagulation are described. Alternating grounded, rotating, planar circular electrodes and stationary planar electrodes function as a Tesla fluid pump when placed in contact with the contaminated water, causing the water to flow between the rotating and stationary electrodes. An insoluble abrasive material introduced into the water removes scale from the electrodes while the water is pumped thereby. A direct electric current is caused to flow between each pair of rotating and stationary electrodes, thereby producing electrocoagulation of the contaminants in the water flowing therebetween. The electrocoagulated materials may be separated from the treated water by filtration or by permitting the treated water to stand for a chosen period.

Abstract: An improved galvanic processing device includes disk shaped electrodes made from a metal which have circumferential segments aligned at an angle ? relative to the plane of the circumference of the electrode. The circumferential segments may have portions aligned at a different angle ? relative to the plane of the circumference of the electrode.

Abstract: It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S12), then in light of such result, a sequential operations such as a first test operation (step S14) in which no energization is carried out for plurality of operating pattern candidates and a second test operation (step S16) under the energized condition are carried out, and then the optimum operating conditions are registered (step S18).

Abstract: A system and method is described for electropolishing tubular metallic prostheses. In one aspect, the system provides a continuously changing set of points of contact between anode and prosthesis. In another aspect, the cathode is given a conical shape to correct for current concentrations that would otherwise exist and unevenly affect the amount of electropolishing over the length of the prosthesis.

Abstract: An apparatus for treating a workpiece with a liquid has a vessel holding a body of the liquid, a mount provided with a holder for carrying the workpiece, and a lifter for shifting the mount with the holder and the workpiece from an upper position above the body of liquid into a lower position with the workpiece immersed in the body of liquid. An inverting mechanism is coupled with the lifter for rotating the mount, holder, and workpiece through about 180° above the body of liquid on movement from the upper position toward the lower position and from the lower position into the upper position.

Abstract: An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

Abstract: Disclosed is an electrode arrangement for the defined rounding or deburring of edges of electrically conductive components, in particular turbine components, by means of electrochemical machining with at least one working electrode (5), which has a tubular electrode carrier, through which an electrolyte inflow line (10) is provided, the electrode carrier having on the front end a closure (13, 18), which is arranged such that the electrolyte inflow line in the axial direction of the electrode carrier is closed, and at least one outlet opening (19) being arranged in the radial direction. Also disclosed is a self-centering electrode arrangement and an installation for the defined rounding or deburring of edges of electrically conductive components by means of electrochemical machining with at least one corresponding electrode arrangement and also a method using the electrode arrangements and the described installation.

Abstract: To provide a small active oxygen generating device capable of efficiently continuously generating active oxygen while supplying oxygen in the air. In the active oxygen generating device in which water is made to exist between an anode and a cathode composed of a base material containing a conductive polymer and by turning on electricity between the anode and the cathode, the conductive polymer deoxidizes the oxygen dissolved in the water to generate active oxygen, the cathode is rotatably installed about a conductive horizontal axis with part of the surface being projected over the surface of the water.

Abstract: Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder.