Abstract: A process for removal of heavy metals at contamination level (50-500 mg/L) using ultrasonic energy and electrolysis, as a measure to decontaminate industrial waste, is described.

Abstract: The invention relates to the metalworking field, particularly to electrochemical sizing machining, and can be used for manufacturing of machine workpieces having an intricate profile and shaping furniture from chromium-containing steels and alloys operating in aggressive environment under excessive friction. Technical effect: improving machining accuracy by forming a lustrous layer on the machined surface and reduction of concentration of hexavalent toxic chromium ions in a waste electrolyte solution.

Abstract: The invention is related to the field of pulsed electrochemical machining of steels and alloys and can be used for performing various precision copying and piercing operations for manufacturing intricate profile surfaces of machine and tool workpieces made of hard-to-machine materials. The method comprises the steps of applying microsecond current pulse packages synchronized with an instant when the machining electrode and a workpiece are moved to a minimum distance towards each other, measuring at least one concordant voltage and current value in each pulse, calculating corresponding values of an interelectrode gap resistance, and adjusting the machining process in accordance with the changes of the interelectrode gap resistance.

Abstract: The invention relates to electrochemical pulse machining (ECM) of high alloy steel, alloys and conducting composite materials that include components with substantially different electrochemical properties. In particular, the invention can be used to perform various copy-piercing operations when producing intricately shaped surfaces of machines and tools made of WC—Co, WC—TiC—Co alloys. The method comprises machining at low interelectrode gaps using anode or bipolar high-frequency current pulses supplied in bursts which are synchronized with the moments of maximum convergence between an oscillating tool electrode and a workpiece, and additional singular pulses of opposite polarity supplied during pauses between pulse bursts, wherein a ratio of parameters for the pulses of normal and opposite polarity is adjusted based on the initial electrolyte acidic value.

Abstract: A system and method for electrochemically machining a work-piece contains a fixture capable of receiving a work-piece and securing the work-piece to the fixture. An electrolyte source is also provided. In addition, the system contains a rotary drive subassembly capable of receiving a portion of the work-piece therein, motion of the rotary drive assembly being determined by a received control signal, wherein frequency and amplitude of the control signal increases and decreases motion of the rotary drive subassembly, and wherein the control signal is a trapezoidal waveform.

Abstract: Device and method suitable for the electrochemical processing of an object. The device is provided at least with a chamber for accommodating an electrolyte, means for supporting the object to be processed in this chamber, electrodes arranged in this chamber, and control means for applying an electric current between the object to be processed and the electrodes.

Abstract: There are provided apparatuses for increasing dryness of a substance. The apparatuses comprise at least one module, each of the module(s) comprising at least two electrodes adapted to submit the substance to an electric current. The electrodes are also adapted to compress the substance. There are also provided processes for increasing dryness of a substance.

Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.

Abstract: A vibrator has a large strength of a standing wave even with a low driving voltage, thereby improving the accuracy of component separation. A device according to the present invention includes a substrate having a channel groove provided in an upper surface of the substrate, a seal provided above the substrate so as to cover an upper opening of the channel groove, a projection provided on an outer side wall opposite to the channel groove, and a vibrator causing the projection to warp and vibrate in a depth direction of the channel groove. The warping vibration of the projection is amplified due to effect of leverage, and generates a large stress on the outer wall of the channel groove having the projection provided thereon. Consequently, the strength of a standing wave in the channel groove increases even for a low driving voltage, thereby improving the accuracy of component separation.

Abstract: In an anodic oxidation apparatus and an anodic oxidation method and a panel for a display device manufactured by them, a large target substrate is treated by a smaller component.

Abstract: In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be made possible with smaller constituent elements. The electrical contact with the target substrate by a contact member is realized by a plurality of contact members or by the movement of a contact member to change the electrical contact position. The target substrate is manufactured in advance so as to have such a structure that portions thereof to be in contact with the plural contact members are connected to portions of a conductive layer on a treatment part thereof respectively.

Abstract: Disclosed herein are processes for detecting the location of an interface between phases. In one embodiment, the process comprises: introducing a reaction mixture into a vessel wherein the reaction mixture is the product of an at least two phase interfacial reaction, and a difference in densities between at least two of the phases is less than or equal to about 1 g/cc, separating the reaction mixture into the phases with an interface located therebetween, measuring electrical inductance of the reaction mixture at different latitudinal locations; and determining the location of the interface.

Abstract: A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.

Abstract: There are provided a method and apparatus for forming interconnects by embedding a metal such as copper (Cu) into recesses for interconnects formed on the surface of a substrate such as a semiconductor substrate. The method of the present invention includes the steps of: providing a substrate having fine recesses formed in the surface; subjecting the surface of the substrate to plating in a plating liquid; and subjecting the plated film formed on the surface of the substrate to electrolytic etching in an etching liquid.

Abstract: The present invention provides a method of detecting a short incident in an electrochemical cell (e.g., a Simons electrochemical fluorination cell or bipolar flow cell) using means for detecting vibration to detect vibration of an external piece on the cell. The present invention further provides a system for detecting a short incident in an electrochemical cell.

Abstract: An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anodes (1), (2), and (3) are powered by power supplies (13), (12), and (11), respectively. Electrolyte (34) is pumped by pump (33) to pass through filter (32) and reach inlets of liquid mass flow controllers (LMFCs) (21), (22), and (23). Then LMFCs (21), (22) and (23) deliver electrolyte at a set flow rate to sub-plating baths containing anodes (3), (2) and (1), respectively. After flowing through the gap between wafer (31) and the top of the cylindrical walls (101), (103), (105), (107) and (109), electrolyte flows back to tank (36) through spaces between cylindrical walls (100) and (101), (103) and (105), and (107) and (109), respectively.

Abstract: Transition metals (T) of Group VIII (Co, Rh and Ir) have been prepared as semiconductor alloys with Sb having the general formula TSb.sub.3. The skutterudite-type crystal lattice structure of these semiconductor alloys and their enhanced thermoelectric properties results in semiconductor materials which may be used in the fabrication of thermoelectric elements to substantially improve the efficiency of the resulting thermoelectric device. Semiconductor alloys having the desired skutterudite-type crystal lattice structure may be prepared in accordance with the present invention by using vertical gradient freeze techniques, liquid-solid phase sintering techniques, low temperature powder sintering and/or hot-pressing. Measurements of electrical and thermal transport properties of selected semiconductor materials prepared in accordance with the present invention, demonstrated high Hall mobilities (up to 8000 cm.sup.2.V.sup.-1.s.sup.-1), good Seebeck coefficients (up to 400 .mu.VK.sup.-1 between 300.degree. C.

Abstract: A support structure for supporting continuous prebaked anodes in an aluminium smelting cell comprises a pair of side plates (3) and a pair of end plates (4) connected together to form an enclosed superstructure. The supporting structure includes at least one pair of spaced cross-plates (8, 9) that are configured to provide wedging surfaces which act to support an anode (14) therebetween. Electrical current is fed to the anodes via the cross-plates. Respective pairs of cross-plates supporting adjacent anodes may be spaced to define heat exchange passages which can be used to control the temperature of the support structure. A method for operating an aluminium smelting cell at variable amperage by positive and controlled extraction of heat from the cell is also described.

Abstract: A printed circuit board plating line which includes a plurality of trucks mounted on trolleys for linear movement above a series of spaced cleaning, plating and etching tanks for transportation of printed circuit board material through the tanks under continuous computer control. The cleaning, plating and etching operations are arranged in two groups of tanks. Following the traverse of the first group of tanks, the printed circuit boards are removed from their respective plating racks which depend from the moveable trucks, and sent through an inspection operation which ensures the image plated thereon is accurate. The boards are then removed on truck suspended racks and proceed through the second group of tanks for image plating. The continuous printed circuit board manufacturing line minimizes the quantity of work in process, requires only a few personnel of relatively unskilled background, and is environmentally clean and non-polluting.

Abstract: A method and apparatus for reducing electrowinnable metal ion concentration to a low level in a process stream and recovering the metal electrolytically. Low concentration metal ions from the process stream are recovered in an ion exchanger and then recaptured from the ion exchanger into a relatively small volume of regeneration fluid. The regeneration fluid, pregnant with the metal ions, is electrolyzed in a particulate bed electrolytic cell to a relatively low level of metal ion concentration, and the regeneration fluid is then available for reuse in a further ion exchanger regeneration.

Abstract: The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of their minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus (10) of the present invention addresses these problems by providing a cathode cell (20) having a cell chamber (22), a cathode (23) and an anode (26) electrically isolated from each other and connected to an electrical power source (24). During the plating process, the cathode (23) is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.

Abstract: The invention relates to depositing a metal on small-sized objects by electrolytic means. The objects are maintained in suspension in an electrolyte containing the metal to be deposited and which flows in a closed circuit while passing between two electrodes which are alternately anode and cathode, the anode being protected by a mobile screen able to assume two positions. The temperature of the electrolyte and the concentration of ions of said metal therein are maintained constant.

Abstract: The operation of a moving particle electrode in an electrolytic cell is monitored by detecting vibration or displacement created by impingment of the solid moving particles against a solid surface producing a signal or alarm whenever the vibration or displacement decreases or otherwise changes an undesirable degree. Vibration or displacement decrease is caused by reduced movement of the particles associated with or part of the electrode.

Abstract: Methods for integrating alloy components into individual powder metallurgy particles, as opposed to the conventional side-by-side mixture of the separate powder particles of each individual component, are disclosed. Both simultaneous and sequential methods for consolidating electro-deposition particles are described. Additionally, electro-chemical displacement and chemical deposition methods are described for the production of binary component powders which can be used in conjunction with electro-deposition methods. As many as four different component metals and/or non-metals may be incorporated into consolidated powders for use in the powder metallury production of alloys.

Abstract: Method and apparatus are disclosed for electrolytically producing very uniform coatings of a desired material on discrete microsized particles. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with a powered cathode for a time sufficient for such to occur.

Abstract: Electrolytic methods for making high density copper powder starting with copper powder of lower apparent density are disclosed. Copper powder of lower apparent density is used as a cathode for the formation of copper powder having a desired relatively high apparent density. According to one embodiment, an integral two-phase process is provided in which copper powder of relatively lower apparent density is formed by electrodeposition, and the powder so-formed is then used in a second phase electrodeposition process as a cathode on which copper powder of the desired relatively high apparent density is formed.