Abstract: A washing appliance includes a treating chamber, a sprayer emitting liquid into the treating chamber, and a recirculation circuit including a centrifugal separator and an electrocoagulation unit both fluidly coupled to the recirculation circuit.

Abstract: The invention provides an electrochemical cell based on a new chemistry for a flow battery for large scale, e.g., gridscale, electrical energy storage. Electrical energy is stored chemically in quinone molecules having multiple oxidation states, e.g., three or more. During charging of the battery, the quinone molecules at one electrode are oxidized by emitting electrons and protons, and the quinone molecules at the other electrode are reduced by accepting electrons and protons. These reactions are reversed to deliver electrical energy. The invention also provides additional high and low potential quinones that are useful in rechargeable batteries.

Abstract: The invention discloses a method for simultaneously removing SO2 and NOx in flue gas: uniformly mixing a water-soluble ruthenium salt with ammonia water to obtain an aqueous solution of a ruthenium-amine complex; subjecting the flue gas and the aqueous solution of the ruthenium-amine complex to a countercurrent contact reaction under the temperature of 5-60° C., pH of 7.5-12 to obtain a solution A and purified gas; discharging the solution A of the step (2) into a crystallization tank to crystallize and separate an ammonium salt to obtain a solution B, returning the solution B to replace the aqueous solution of the ruthenium-amine complex. The invention utilizes the ruthenium-amine complex having a strong capability of complexing with NO as well as residual oxygen in the flue gas to carry out liquid phase catalytic oxidation to convert the NOx into ammonium nitrate, and the removal efficiency of the NOx and the SO2 is high.

Abstract: A system to remove sodium and Sulfur from a feed stream containing alkali metal sulfides and polysulfides in addition to heavy metals. The system includes an electrolytic cell having an anolyte compartment housing an anode in contact with an anolyte. The anolyte includes alkali metal sulfides and polysulfides dissolved in a polar organic solvent. The anolyte includes heavy metal ions. A separator includes an ion conducting membrane and separates the anolyte compartment from a catholyte compartment that includes a cathode in contact with a catholyte. The catholyte includes an alkali ion-conductive liquid. A power source applies a voltage to the electrolytic cell high enough to reduce the alkali metal and oxidize Sulfur ions to allow recovery of the alkali metal and elemental sulfur. The ratio of sodium to Sulfur is such that the open circuit potential of the electrolytic cell is greater than about 2.3V.

Abstract: An abrasive wire including a steel core and a coating including a binder and abrasive particles, the binder being formed by at least one iron alloy layer containing, by weight percent in relation to the weight of the binder: between 0 and 3% oxygen, advantageously between 0 and 2%; and between 0.3% and 9% of at least one element selected from the group including carbon, boron an phosphorous.

Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Abstract: Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: The embodiments herein relate to methods and apparatus for forming graphitic material from a carbon oxide feedstock in an electroplating chamber containing molten inorganic carbonate as electrolyte. Carbon dioxide flows into a reaction chamber containing one or more cathodes, one or more anodes, and a molten carbonate electrolyte. The carbon dioxide and/or carbonate reduces at the cathode to form graphitic material, which may be removed from the surface of the cathode through various mechanisms. The graphitic material is then separated out from the electrolyte.

Abstract: Disclosed is a device designed for a continuous production of graphene flakes by an electrochemical method. The device consists of an electrochemical unit for generating graphene flakes by an electrochemical exfoliation; a filtration unit for separating the graphene flakes from an electrolyte solution; a guiding path connected to the electrochemical unit and transports the graphene flakes and the electrolyte solution into the filtration unit; a grading collection unit for accepting the separated graphene flakes from the filtration unit and separating the graphene flakes by size. The device can achieve the effect of producing high-quality graphene flakes in mass production electrochemically, continuously and quickly.

Abstract: Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first and second surfaces of the metal layer. Typically, the laminated metal structure is removed from a larger laminated sheet of metal. The laminated metal structure is subjected to alternating current electrolytic deburring and cleaning to remove any burrs along the perimeter edge. After deburring and cleaning, a sealer, which is a phosphate compound, is deposited on the perimeter edge of the laminated metal structure where the metal is exposed using alternating current.

Abstract: Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

Abstract: A manufacturing method of a support for a planographic printing plate including at least an alkaline etching step of dissolving an aluminum surface layer of an aluminum web with an alkaline solution during a surface roughening treatment on a surface of the aluminum web continuously traveling, the manufacturing method comprising: a circulating step of cyclically using the alkaline solution between a treatment tank for the etching and an alkaline solution reservoir during adjusting composition concentration of the alkaline solution; and a filtering step of filtering the alkaline solution cyclically used so as to remove solid matter in the alkaline solution.

Abstract: The fuel provision system uses hydrogen and oxygen from a hydrogen container and an oxygen container as energy source for a power unit to deliver work and for a fuel cell to produce electricity In the mean time, the water resulted from the power unit and the fuel cell is stored in a water tank and then electrolyzed in an electrolytic tank to produce hydrogen and oxygen. The hydrogen and oxygen are separated by an exchange membrane and recycled to the hydrogen and oxygen containers. The power unit is one of combustion engine accompanied by a generator and a battery, a furnace or an industrial cutting/welding device with a fuel tank, and an electrothermal device. The water tank is capable of adjusting the volume of output water flow and overflowing excessive water.

Abstract: In a method for reducing a solid feedstock (110), such as a solid metal compound, feedstock is arranged on upper surfaces of elements (60, 80, 81) in a bipolar cell stack contained within a housing (25). A molten salt electrolyte is circulated through the housing so that it contacts the elements of the bipolar stack and the feedstock. A potential is applied to terminal electrodes (50, 60) of the bipolar stack such that the upper surfaces of the elements become cathodic and the lower surfaces of the elements become anodic. The applied potential is sufficient to cause reduction of the feedstock. The invention also provides an apparatus for implementing the method.

Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.

Abstract: A metal-containing material is introduced in the container with an anode inserted therein, the container is introduced in a tank filled with an electrolyte, with a cathode opposed to it, and direct current is passed through ((+) anode and (?) cathode) to recover the desired metal.

Abstract: Electrodeposition painting systems may include an electrodeposition bath containing an electrodeposition paint solution, wherein the electrodeposition paint solution is in contact with an electrodeposition bath anode that charges the paint such that it electrocoats parts submerged therein to form electrocoated parts, a rinse tank that rinses the electrocoated parts, wherein a rinse tank reservoir of the rinse tank is capable of fluid communication with the electrodeposition bath, a filter that filters the electrodeposition paint solution to separate filtered water from the paint, and an ionizer assembly including one or more electrodes in contact with the filtered water and a power supply connected to the one or more electrodes, wherein the power supply causes a plurality of electrode ions from the one or more electrodes to enter the filtered water to produce filtered water including electrode ions such that the filtered water including electrode ions flows into and sterilizes the electrodeposition paint solu

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

Abstract: The present invention is directed to methods and apparatuses for removing bubbles from a process liquid. The process liquid can comprise a plating solution used in a plating tool. The process liquid is supplied to a tank. A plurality of streams of the process liquid are directed towards a surface of the process liquid from below. This can be done by feeding the process liquid to a flow distributor comprising a plurality of openings providing flow communication between an inner volume of the flow distributor and a main volume of the tank. Before leaving the tank through an outlet, the process liquid flows through a flow barrier.

Abstract: In one embodiment of the present invention an electrolytic cell is provided comprising a containment vessel; a first electrode; a second electrode; a source of electrical current in electrical communication with the first electrode and the second electrode; an electrolyte in fluid communication with the first electrode and the second electrode; a gas, wherein the gas is formed during electrolysis at or near the first electrode; and a separator; wherein the separator includes an inclined surface to direct flow of the electrolyte and the gas due to a difference between density of the electrolyte and the combined density of the electrolyte and the gas such that the gas substantially flows in a direction distal to the second electrode.

Abstract: System and methods are disclosed for filtering wastewater. In one embodiment, a water filtering system comprises a first filtering stage and a second filtering stage. The first filtering stage receives a flow of wastewater, and uses electrocoagulation to separate suspended particles from the wastewater and produce filtered wastewater. The second filtering stage receives the filtered wastewater from the first filtering stage, and uses mechanical filtering to remove suspended particles from the filtered wastewater and produce filtered water that is substantially free from suspended particles.

Abstract: Disclosed is an electrolysis system for producing one or more gases for an internal combustion engine for enhancing combustion. The system uses stacked electrode plates including neutral plates for generating an oxygen and hydrogen gas mixture. The stacked plates substantially fill an electrolysis cell containing an electrolytic solution which is recycled and cooled.

Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.

Abstract: This invention provides a membrane-mediated electropolishing apparatus for polishing and/or planarizing metal work-pieces. The work-piece is wetted with a low-conductivity fluid. The wetted work-piece is contacted with a first side of a charge-selective ion-conducting membrane, wherein the second side contacts a conductive electrolyte solution in electrical contact with a electrode. Current flow between the electrode and the work-piece electropolishes metal from the work-piece.

Abstract: Apparatuses and methods for removing carbon dioxide and other pollutants from a gas stream are provided. The methods include obtaining hydroxide in an aqueous mixture, and mixing the hydroxide with the gas stream to produce carbonate and/or bicarbonate. Some of the apparatuses of the present invention comprise an electrolysis chamber for providing hydroxide and mixing equipment for mixing the hydroxide with a gas stream including carbon dioxide to form an admixture including carbonate and/or bicarbonate.

Abstract: A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.

Abstract: A recovery system for platinum electrolytic baths operating at low current densities is disclosed. An oxidizing system is provided in a closed-loop recirculation system for platinum plating at low current densities. The oxidizing system reoxidizes Pt+2 ions, which are typically formed at low current densities, to Pt+4 ions by using oxidizers, for example peroxide. A sensor may be also provided to detect the relative concentration of [Pt+2] ions to [Pt+4] ions and to tailor the relative concentrations to a predetermined level.

Abstract: Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrode-position cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

Abstract: Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed.

Abstract: A workpiece processing station is disclosed. The workpiece processing station has particular applicability in an electroplating process for semiconductor wafers. The apparatus includes a work processing bowl having an outer bowl and an inner cup positioned at a location slightly below the upper rim of the bowl. An annular space is provided between the sides of the processing bowl and the fluid cup. Fluid is provided to the fluid cup through an opening in the bottom of the fluid cup. The fluid overflows the fluid cup and drains down the open annular space between the process bowl and the fluid cup and passes through the opening in the bottom of the process bowl and into a fluid reservoir. A reservoir is preferably used as both the supply and the return for the process fluid.

Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.

Abstract: A method for material removal and planarization of a substrate includes formation of a weak passivating film on overburden to be removed in the presence of an electrolyte bath and an applied electric potential. An engineered polishing substrate is brought into compliance with the weak passivating film, and using low pressure to minimize shear stress realized at the surface of the substrate, material removal is controlled by mechanical contact between the polishing substrate and the weak passivating film. The weak passivating film is periodically reformed, and mechanical contact continued until desired material removal and substrate planarization is achieved.

Abstract: There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water that enables efficient production of electrolyzed water that has excellent washing and sterilizing effects. There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water, which includes an electrolyzer provided with a strong alkaline reductive electrolyzed water-producing chamber, an acidic water-producing chamber and a partitioning membrane, wherein a flow path diffusing device is provided in the electrolyzer, and a gap between the cathode plate and the anode plate of 0.1 mm to 1 mm.

Abstract: An apparatus and method for electrowinning metal from ionic solutions is provided wherein ionic solution is subject to nanofiltration. An electrowinning cell (10) includes a reservoir (12) adapted to receive an ionic solution (14). During operation, metal ions in solution (14) electroplate onto cathode (18). Nanofilter (20) is in fluid communication with the reservoir and receives solution (14) from a location (22) proximate to the cathode (18). Retentate (52) is formed as a first portion (26) of the solution (14) which passes through the membrane (21) of the filter (20). Permeate (54) is formed as a second portion (28) of the solution (14) which passes through the membrane (21) of the filter (20) to a second region (29) on the opposite side of membrane (21) from the first region (27). Permeate (54) has a second concentration of metal ions lower than the first concentration in first portion (26). Retentate (52) is returned to the reservoir (12) to intermix with solution (14).

Abstract: An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.

Abstract: A plating system comprises: a plating unit which plates a water; a plating solution storage tank which stores a plating solution; and a plating solution supply system which supplies the plating solution in the plating solution storage tank to the plating unit. A dissolved oxygen removing unit which removes dissolved oxygen from the plating solution flowing in the plating solution supply system is provided in the middle of the plating solution supply system.

Abstract: The present invention relates to an electrowinning cell adapted to recover metal ions from a solution as their corresponding elementary metals. The electrowinning cell includes a reservoir and a filter in fluid communication with the reservoir. The filter is operative to receive a solution containing metal ions from a location proximate to the cathode and to retain a first portion of the solution having a first concentration of metal ions and to remove a second portion of the solution having a second concentration of metal ions lower than the first concentration. The electrowinning cell additionally includes return means operative to return the first portion of the solution to the reservoir. The present invention also relates to a method of concentrating metal ions in a solution for use in an electrochemical cell and to a system for reducing metal ions in a solution to their corresponding elementary metals.

Abstract: The present invention relates to a nuclear fuel electrorefiner having a vessel containing a molten electrolyte pool floating on top of a cadmium pool. An anodic fuel dissolution basket and a high-efficiency cathode are suspended in the molten electrolyte pool. A shroud surrounds the fuel dissolution basket and the shroud is positioned so as to separate the electrolyte pool into an isolated electrolyte pool within the shroud and a bulk electrolyte pool outside the shroud. In operation, unwanted noble-metal fission products migrate downward into the cadmium pool and form precipitates where they are removed by a filter and separator assembly. Uranium values are transported by the cadmium pool from the isolated electrolyte pool to the bulk electrolyte pool, and then pass to the high-efficiency cathode where they are electrolytically deposited thereto.

Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

Abstract: A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.

Abstract: The present invention is directed to a new water treatment device comprising an electrolytic tank to put water in, an electrode provided in the electrolytic tank, a water treating path for pouring, from a pool storing water, the water into the electrolytic tank and returning to the pool the water in the electrolytic tank, a residual chlorine sensor for measuring the residual chlorine concentration of the water, and a circulating pump provided on the downstream side of the electrolytic tank on the water treating path in order to circulate the water, and capable of simply and efficiently sterilizing water stored in pools of various sizes from a swimming pool to a home bathtub.

Abstract: A method and apparatus for electropolishing a workpiece without immersing the workpiece in a bath of electrolytic solution. The workpiece is held in an atmospheric environment, while electrolytic solution is discharged from a reservoir in the form of a plurality of jet streams onto the surface of the workpiece. A voltage difference is applied across the workpiece and the jet streams, thereby inducing a current to flow, between the workpiece acting as anode and the jet streams acting as cathode. The workpiece may be rotated about an axis and moved linearly along the same axis while the jet streams of electrolytic solution are discharged onto the workpiece. Anodic dissolution causes polishing of the workpiece surface. The electrolytic solution may be collected after discharge and recycled back into the reservoir, after being filtered and cooled.

Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

Abstract: An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a central aperture. A jet is passed through the central apertures of the base section of the anode cup and through the membrane allowing plating solution to be directed at the center of a wafer being electroplated.

Abstract: An apparatus for electroplating and deplating an object out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the object and to contain a plating solution so that the object is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable conductor at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable conductor and to the object. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulating pump and heating and cooling elements for the plating solution may be provided.

Abstract: The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.