Abstract: A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

Abstract: Provided is a method of manufacturing a semiconductor device according to the present invention, a ring-shaped electrode plate 18 with an opening having a diameter smaller than a diameter of a semiconductor wafer W is disposed between a first electrode plate 14 and a second electrode plate 16, the semiconductor wafer W is arranged between the ring-shaped electrode plate 18 and the second electrode plate 16, and a glass film is formed on a glass film forming scheduled surface in a state where a potential lower than a potential V2 of the second electrode plate 16 is applied to the ring-shaped electrode plate 18.

Abstract: A device for metalizing wafers, in particular microchip wafers, in an electrolyte, contains a plurality of holder arrangements. Each holder arrangement has a chamber for the electrolyte which is separate from the electrolyte-receiving chambers in other holder devices, a ring acting as cathode, and an anode system as the anode being associated with each wafer.

Abstract: An active method for decanting the dispersed phase in the continuous phase of an emulsion. According to the method, repulsive forces created by an electric field are used on the drops constituting the dispersed phase. The electric field scans the reservoir containing the emulsion, enabling the dispersed phase to be concentrated in a determined region of the reservoir, for the recovery and/or analysis of the emulsion. A device implements the method.

Abstract: The present invention provides a permanent and cost-effective composite electrode for electrolytically producing alkaline water, comprising an electrode core made of steel, a filler densely packed around the electrode core, said filler capable of creating a mildly aqueous and alkaline environment to motivate formation of a layer of magnetite over a surface of the electrode core, and a housing enclosing the filler, said housing having a pore size selected such that very low permeation of gas and liquid takes place. The invention also provides an apparatus comprising the composite electrode, and the use of the alkaline water produced by the apparatus of the invention. According to the invention, no additional undesired side products, such as toxic chlorine gas and other pollutants, are produced and discharged to the environment.

Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet with the electrode members piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to an analyte, the other ends located on the bottom surface side of the insulation sheet being connected to an electrodes of a transducer.

Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet with the electrode members piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to an analyte, the other ends located on the bottom surface side of the insulation sheet being connected to an electrodes of a transducer, at least the one ends of the electrode members being made of a mixture of conductive particles and an insulating material.

Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet in portions piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to the analyte, other ends located on the bottom surface side of the insulation sheet being connected to the electrodes of the transducer, recesses for trapping the analyte being formed in the top surface of the insulation sheet so as to correspond to the electrode members, the one ends of the electrode members being exposed at a bottom of the recesses.

Abstract: Electrodes for transferring a charge, the electrodes have a plurality of members for making electrical contact. The electrodes are suitable for treating aqueous, substantially aqueous and nonaqueous fluids including wastewater, solvents and gases. Water may be treated using the electrodes to provide higher dissolved oxygen or lower levels of contaminants after treatment. The electrodes may be useful in precipitation reactions such as electrowinning methods. The electrodes may also be capable of altering biological characteristics of organisms such as algae and bacteria.

Abstract: An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.

Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.

Abstract: An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

Abstract: A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.

Abstract: An electrolytic bath includes a shell, an upper cover joined on an upper end of the shell, an outer supporting member held in the shell, a hollow cylindrical positive electrode plate held in the outer supporting member, a hollow cylindrical negative electrode plate held in the positive electrode plate, an inner supporting member held in the negative electrode plate, a lower cover joined on a lower end of the shell, and a base member on a bottom of the lower cover; a space exists between the positive and the negative electrode plates; the electrolytic bath has a waste water outlet and a water outlet hole for acid waste water and alkaline water to flow out therethrough respectively; because the electrode plates are hollow cylindrical and completely open, they can't change shape easily, and there is no need for a separating plate, and scale can't form on the electrode plates easily.

Abstract: An electrolytic method for treatment of water to increase the dissolved oxygen content, the method including: (a) contacting the water with at least one first electrode device; (b) providing at least one second electrode device in non-physical, electrical contact with the water; (c) introducing an oxidant to the water, and (d) passing an electric current between the second electrode device and the first electrode device, so as to establish an electric field in the water of sufficient strength and duration to effect the electrolytic dissociation of the water to produce dissolved oxygen and/or hydrogen species.

Abstract: A method and apparatus measures the presence of total residual oxidant species in aqueous environments. More specifically, the apparatus is operable to measure hypohalites (e.g., hypochlorite and hypobromite) in water containing halide salts using electrochemistry. The apparatus can be a sensor having four electrodes—a reference electrode, a working electrode, and two auxiliary electrodes. The fourth electrode, i.e., the second auxiliary electrode, can be used to generate ionized water near and in contact with the working electrode. The ionized water can clean the working electrode to minimize effects due to scaling or biofilm formation. As such, the working electrode does not need the capability to clean itself. Thus, other elements, originally believed to be unsuitable for use in saline aqueous environments, can be used for the electrodes, for example, gold.

Abstract: A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.

Abstract: The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.

Abstract: Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positions between positioning elements of the module are fixed so that the transport system does not need to be recalibrated when the processing chamber is removed and replaced with another processing chamber. The processing chamber includes a paddle device for agitating processing liquid at a process surface of the workpiece. The paddle device, the processing chamber, and electrodes within the processing chamber are configured to reduce the likelihood for electrical shadowing created by the paddles at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the paddles reciprocate relative to the workpiece.

Abstract: A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a spring-like design which ensures an adequate connection is made and complete plating of the airfoil blades occurs.

Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.

Abstract: A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.

Abstract: A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.

Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.

Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: A sensor including at least one electrode (3, 4) which is made of electrically conductive plastic and is connected to one end of an electrical conductor (5, 6). The electrode (3, 4) and conductor (5, 6) are surrounded by an insulating housing (2, 22), except that the electrode has an exposed surface (7, 8) for contacting an aggressive or corrosive medium inside the housing. The other end (11, 12) of the electrical conductor protrudes from the housing (2, 22). The housing (2, 22) is made of an electrically insulating plastic material which is joined to the electrode (3, 4) in a sealed manner. In a preferred embodiment, the housing (2, 22) forms a valve seat and seal for a bottom drain valve of a fluid container.

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and an inner surface of the container form a reaction chamber that holds a reaction medium therein. The reaction medium is supplied to the reaction chamber through a supply passage formed in the container. The reaction medium is drained from the reaction chamber through a drain passage formed in the container.

Abstract: Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.

Abstract: The invention relates to an electrodeposition device, having two or more emission electrodes that can be connected to a common electrical supply line and an electrically insulating electrode holder, wherein the electrode holder is made of plastic and receives the electrodes, the electrical connections thereof and a contact surface for the connection to the electrical supply line.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A cathode arrangement having a mounting rail (1) and a cathode plate (2) bonded to the mounting rail (1). Two parallel, flanges extending in its longitudinal direction are formed on the underside (5) of the mounting rail (1). The cathode plate (2) is accommodated and bonded to the flanges (8, 9) by explosion welding between the parallel flanges. A full-surface metal-to-metal bond is thus obtained, which has very good current-conducting properties at the contact surfaces between the flanges (8, 9) and the cathode plate (2). The ends of the mounting rail (1) projecting over the cathode plate (2) have a flangeless design and have oblique surfaces (6, 7) intersecting in the shape of a wedge on the underside.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.

Abstract: An anode box sized and configured for retaining an anode plate therein is disclosed for use in an electrolytic tank of the type used for electrowinning or electrorefining. The anode box is unitarily formed, thereby rendering the device more resistant to degradation typically caused by the harsh environment of the electrolytic tank. The anode box is also formed with spacer structures which protect and isolate the anode plate from contact with the diaphragm, when used, and from contact with adjacent cathode frames. The anode box may include other elements, such as a port through which liberated gases may be withdrawn.

Abstract: A basket, for use in the reduction of UO2 to uranium metal and in the electrorefining of uranium metal, having a continuous annulus between inner and outer perforated cylindrical walls, with a screen adjacent to each wall. A substantially solid bottom and top plate enclose the continuous annulus defining a fuel bed. A plurality of scrapers are mounted adjacent to the outer wall extending longitudinally thereof, and there is a mechanism enabling the basket to be transported remotely.

Abstract: A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pressurized air between the diaphragm and a backing plate. As the air is injected, and the diaphragm becomes more spheroid, the jaws are moved a substantially equal distance away from the center axis of the workholding region. The workpiece, which typically incorporates or is mounted on a circular shaft, is placed in the center of the workholding region, and the air pressure is removed, causing the diaphragm to return to its original flat shape and the jaws to snap back to their original positions resting against the shaft.

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.

Abstract: A method and apparatus turbulently exposes water flowing through a water system to a plurality of electrodes of an ion generator and provides a self-contained tank through which water flows. The generally cylindrical containment tank includes a tangential inlet pipe and an elliptical base having an outlet pipe. An aspect ratio, inlet pipe diameter versus containment tank diameter, is defined to achieve optimum ionization. A tank cover serves as the non-electrical conducting head for a plurality of electrodes which extend downwardly from the underside of the cover. The electrodes are functionally configured to maximize water flow between them. The rate of water flow within the containment tank is defined such that residence time of flow within the tank likewise optimizes water ionization. A sight glass allows for visualization of the container contents, and in particular anode wastage or wear, during operation.

Abstract: A rack suitable for holding a flexible substrate panel, the rack having a plurality of clamps for providing current to a panel clamped to the rack, the clamps being positioned to uniformly distribute current to the substrate. Seven clamps are used to hold a flexible substrate panel bearing a copper seed or other conductive layer in place on the rack wherein one tautens the substrate while attaching the clamps so as to clamp the substrate in a “wrinkle free” manner. The seven clamps are arranged with 3 clamps on each of the left and right sides and one clamp on the bottom, the clamps making electrical contact with conductive layers of both the front and back surfaces of the substrate panel. The arrangement of the clamps provides adequate support to the substrate, provides for a good and uniform current distribution on the substrate, and allows a relatively large amount of current to flow through the panel without burning off the conductive/seed layers.