Work Container Patents (Class 204/287)
  • Patent number: 9978882
    Abstract: Provided is a method of manufacturing a semiconductor device according to the present invention, a ring-shaped electrode plate 18 with an opening having a diameter smaller than a diameter of a semiconductor wafer W is disposed between a first electrode plate 14 and a second electrode plate 16, the semiconductor wafer W is arranged between the ring-shaped electrode plate 18 and the second electrode plate 16, and a glass film is formed on a glass film forming scheduled surface in a state where a potential lower than a potential V2 of the second electrode plate 16 is applied to the ring-shaped electrode plate 18.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: May 22, 2018
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Shinichi Nagase, Atsushi Ogasawara, Koji Ito
  • Patent number: 9506164
    Abstract: A device for metalizing wafers, in particular microchip wafers, in an electrolyte, contains a plurality of holder arrangements. Each holder arrangement has a chamber for the electrolyte which is separate from the electrolyte-receiving chambers in other holder devices, a ring acting as cathode, and an anode system as the anode being associated with each wafer.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: November 29, 2016
    Inventor: Markus Hacksteiner
  • Patent number: 8992755
    Abstract: An active method for decanting the dispersed phase in the continuous phase of an emulsion. According to the method, repulsive forces created by an electric field are used on the drops constituting the dispersed phase. The electric field scans the reservoir containing the emulsion, enabling the dispersed phase to be concentrated in a determined region of the reservoir, for the recovery and/or analysis of the emulsion. A device implements the method.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: March 31, 2015
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Nicolas Sarrut, Hubert Jeanson
  • Publication number: 20140290482
    Abstract: The present invention provides a permanent and cost-effective composite electrode for electrolytically producing alkaline water, comprising an electrode core made of steel, a filler densely packed around the electrode core, said filler capable of creating a mildly aqueous and alkaline environment to motivate formation of a layer of magnetite over a surface of the electrode core, and a housing enclosing the filler, said housing having a pore size selected such that very low permeation of gas and liquid takes place. The invention also provides an apparatus comprising the composite electrode, and the use of the alkaline water produced by the apparatus of the invention. According to the invention, no additional undesired side products, such as toxic chlorine gas and other pollutants, are produced and discharged to the environment.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 2, 2014
    Applicant: ECOSPEC GLOBAL TECHNOLOGY PTE LTD
    Inventor: Hwee Hong Chew
  • Patent number: 8691062
    Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet with the electrode members piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to an analyte, the other ends located on the bottom surface side of the insulation sheet being connected to an electrodes of a transducer, at least the one ends of the electrode members being made of a mixture of conductive particles and an insulating material.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: April 8, 2014
    Assignees: Japan Aviation Electronics Industry, Limited, National University Corporation Tohoku University
    Inventors: Atsushi Suda, Tatsuo Kimura, Ryota Kunikata, Kumi Inoue, Tomokazu Matsue
  • Patent number: 8691061
    Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet with the electrode members piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to an analyte, the other ends located on the bottom surface side of the insulation sheet being connected to an electrodes of a transducer.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: April 8, 2014
    Assignees: Japan Aviation Electronics Industry, Limited, National University Corporation Tohoku University
    Inventors: Atsushi Suda, Tatsuo Kimura, Ryota Kunikata, Tomokazu Matsue
  • Patent number: 8470144
    Abstract: An electrode device for an electrochemical sensor chip includes an insulation sheet having an insulating property and including a top surface and a bottom surface opposite to each other in a thickness direction, and electrode members having a conductivity and held by the insulation sheet in portions piercing the insulation sheet in a thickness direction, one ends of the electrode members located on the top surface side of the insulation sheet being connected to the analyte, other ends located on the bottom surface side of the insulation sheet being connected to the electrodes of the transducer, recesses for trapping the analyte being formed in the top surface of the insulation sheet so as to correspond to the electrode members, the one ends of the electrode members being exposed at a bottom of the recesses.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: June 25, 2013
    Assignees: Japan Aviation Electronics Industry, Limited, National University Corporation Tohoku University
    Inventors: Atsushi Suda, Tatsuo Kimura, Ryota Kunikata, Kosuke Ino, Tomokazu Matsue
  • Publication number: 20130134053
    Abstract: Electrodes for transferring a charge, the electrodes have a plurality of members for making electrical contact. The electrodes are suitable for treating aqueous, substantially aqueous and nonaqueous fluids including wastewater, solvents and gases. Water may be treated using the electrodes to provide higher dissolved oxygen or lower levels of contaminants after treatment. The electrodes may be useful in precipitation reactions such as electrowinning methods. The electrodes may also be capable of altering biological characteristics of organisms such as algae and bacteria.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 30, 2013
    Applicant: IOGENYX PTY LTD
    Inventor: Andrew Peter Musson
  • Patent number: 8277619
    Abstract: An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: October 2, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Liang Chang, Shau-Lin Shue
  • Patent number: 8252154
    Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: August 28, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventor: Chien-Pang Cheng
  • Patent number: 8221600
    Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: July 17, 2012
    Assignee: SunPower Corporation
    Inventor: Kalyana Bhargava Ganti
  • Patent number: 8168057
    Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: May 1, 2012
    Assignee: NEXX Systems, Inc.
    Inventors: Arthur Keigler, Qunwei Wu, Zhenqiu Liu, John Harrell
  • Publication number: 20120043216
    Abstract: An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
    Type: Application
    Filed: August 19, 2010
    Publication date: February 23, 2012
    Applicant: International Business Machines Corporation
    Inventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
  • Patent number: 8099861
    Abstract: A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: January 24, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Chieh Chang, Ying-Lang Wang, Kei-Wei Chen, Shih-Ho Lin, Chun-Chang Chen
  • Patent number: 7993502
    Abstract: An electrolytic bath includes a shell, an upper cover joined on an upper end of the shell, an outer supporting member held in the shell, a hollow cylindrical positive electrode plate held in the outer supporting member, a hollow cylindrical negative electrode plate held in the positive electrode plate, an inner supporting member held in the negative electrode plate, a lower cover joined on a lower end of the shell, and a base member on a bottom of the lower cover; a space exists between the positive and the negative electrode plates; the electrolytic bath has a waste water outlet and a water outlet hole for acid waste water and alkaline water to flow out therethrough respectively; because the electrode plates are hollow cylindrical and completely open, they can't change shape easily, and there is no need for a separating plate, and scale can't form on the electrode plates easily.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: August 9, 2011
    Assignee: Hung Hsing Electric Co., Ltd.
    Inventor: Ping Huang
  • Publication number: 20110089049
    Abstract: An electrolytic method for treatment of water to increase the dissolved oxygen content, the method including: (a) contacting the water with at least one first electrode device; (b) providing at least one second electrode device in non-physical, electrical contact with the water; (c) introducing an oxidant to the water, and (d) passing an electric current between the second electrode device and the first electrode device, so as to establish an electric field in the water of sufficient strength and duration to effect the electrolytic dissociation of the water to produce dissolved oxygen and/or hydrogen species.
    Type: Application
    Filed: February 16, 2009
    Publication date: April 21, 2011
    Applicant: IOGENYX PTY LTD
    Inventor: Andrew Peter Musson
  • Publication number: 20110000797
    Abstract: A method and apparatus measures the presence of total residual oxidant species in aqueous environments. More specifically, the apparatus is operable to measure hypohalites (e.g., hypochlorite and hypobromite) in water containing halide salts using electrochemistry. The apparatus can be a sensor having four electrodes—a reference electrode, a working electrode, and two auxiliary electrodes. The fourth electrode, i.e., the second auxiliary electrode, can be used to generate ionized water near and in contact with the working electrode. The ionized water can clean the working electrode to minimize effects due to scaling or biofilm formation. As such, the working electrode does not need the capability to clean itself. Thus, other elements, originally believed to be unsuitable for use in saline aqueous environments, can be used for the electrodes, for example, gold.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 6, 2011
    Applicant: ADA TECHNOLOGIES, INC.
    Inventor: Kent Douglas HENRY
  • Patent number: 7803257
    Abstract: A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: September 28, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Shih-Chieh Chang, Ying-Lang Wang, Kei-Wei Chen, Shih-Ho Lin, Chun-Chang Chen
  • Patent number: 7682493
    Abstract: The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: March 23, 2010
    Assignee: Yamamoto-MS Co., Ltd.
    Inventors: Wataru Yamamoto, Katsunori Akiyama, Fumio Harada, Yutaka Tsuru
  • Patent number: 7393439
    Abstract: Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positions between positioning elements of the module are fixed so that the transport system does not need to be recalibrated when the processing chamber is removed and replaced with another processing chamber. The processing chamber includes a paddle device for agitating processing liquid at a process surface of the workpiece. The paddle device, the processing chamber, and electrodes within the processing chamber are configured to reduce the likelihood for electrical shadowing created by the paddles at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the paddles reciprocate relative to the workpiece.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: July 1, 2008
    Assignee: Semitool, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Daniel J. Woodruff, Nolan Zimmerman, James J. Erickson
  • Patent number: 7384522
    Abstract: A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a spring-like design which ensures an adequate connection is made and complete plating of the airfoil blades occurs.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: June 10, 2008
    Assignee: United Technologies Corporation
    Inventors: Dean N. Marszal, Kevin J. Castonguay
  • Patent number: 7347920
    Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.
    Type: Grant
    Filed: July 12, 2004
    Date of Patent: March 25, 2008
    Assignee: The Board of Trustees of the University of Alabama
    Inventors: Banqiu Wu, Ramana G. Reddy, Robin D. Rogers
  • Patent number: 7285195
    Abstract: A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: October 23, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Dmitry Lubomirsky, Bo Zheng, Lily L. Pang
  • Patent number: 7267749
    Abstract: A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: September 11, 2007
    Assignee: Semitool, Inc.
    Inventors: Gregory J. Wilson, Paul R. McHugh, Kyle M. Hanson
  • Patent number: 7264699
    Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: September 4, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Akira Kuibira
  • Patent number: 7214297
    Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: May 8, 2007
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Anzhong Chang, John O. Dukovic
  • Patent number: 7204918
    Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: April 17, 2007
    Assignee: Modular Components National, Inc.
    Inventor: Steven P. Glassman
  • Patent number: 7204920
    Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: April 17, 2007
    Assignee: LSI Logic Corporation
    Inventors: Byung-Sung Leo Kwak, Gregory Frank Piatt, Hiroshi Mizuno
  • Patent number: 7138039
    Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: November 21, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Vincent E. Burkhart, Harald Herchen, Joseph Yahalom
  • Patent number: 7122101
    Abstract: A sensor including at least one electrode (3, 4) which is made of electrically conductive plastic and is connected to one end of an electrical conductor (5, 6). The electrode (3, 4) and conductor (5, 6) are surrounded by an insulating housing (2, 22), except that the electrode has an exposed surface (7, 8) for contacting an aggressive or corrosive medium inside the housing. The other end (11, 12) of the electrical conductor protrudes from the housing (2, 22). The housing (2, 22) is made of an electrically insulating plastic material which is joined to the electrode (3, 4) in a sealed manner. In a preferred embodiment, the housing (2, 22) forms a valve seat and seal for a bottom drain valve of a fluid container.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: October 17, 2006
    Assignee: Xomox International GmbH & Co.
    Inventor: Wolfgang Gonsior
  • Patent number: 7087144
    Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: August 8, 2006
    Assignee: Applied Materials, Inc.
    Inventor: Harald Herchen
  • Patent number: 7067045
    Abstract: An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: June 27, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Arthur Keigler, Harald Herchen, Vincent E. Burkhart, Son N. Trinh
  • Patent number: 7045045
    Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: May 16, 2006
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Akira Kuibira
  • Patent number: 6881321
    Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: April 19, 2005
    Assignee: The University of Alabama
    Inventors: Banqiu Wu, Ramana G. Reddy, Robin D. Rogers
  • Patent number: 6855235
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: February 15, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Craig Brodeur, Quinwei Wu, Peter Kimball, Vincent Burkhart
  • Patent number: 6843897
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: January 18, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Vincent Burkhart
  • Publication number: 20040216996
    Abstract: A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and an inner surface of the container form a reaction chamber that holds a reaction medium therein. The reaction medium is supplied to the reaction chamber through a supply passage formed in the container. The reaction medium is drained from the reaction chamber through a drain passage formed in the container.
    Type: Application
    Filed: June 4, 2004
    Publication date: November 4, 2004
    Applicant: UNISIA JECS CORPORATION
    Inventors: Masato Sasaki, Yuzuru Morioka, Sachiko Sugita, Masazumi Ishikawa
  • Patent number: 6740164
    Abstract: Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: May 25, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Wataru Okase, Takenobu Matsuo
  • Patent number: 6616817
    Abstract: The invention relates to an electrodeposition device, having two or more emission electrodes that can be connected to a common electrical supply line and an electrically insulating electrode holder, wherein the electrode holder is made of plastic and receives the electrodes, the electrical connections thereof and a contact surface for the connection to the electrical supply line.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: September 9, 2003
    Assignee: Ing. Walter Hengst GmbH & Co. KG
    Inventors: Heiko Schumann, Stephen Ahlborn, Harald Blomerius
  • Publication number: 20030085119
    Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Applicant: Innovative Technology Licensing, LLC
    Inventors: Greg Davis, Alex Moffatt, D. Morgan Tench, John T. White
  • Patent number: 6531038
    Abstract: A cathode arrangement having a mounting rail (1) and a cathode plate (2) bonded to the mounting rail (1). Two parallel, flanges extending in its longitudinal direction are formed on the underside (5) of the mounting rail (1). The cathode plate (2) is accommodated and bonded to the flanges (8, 9) by explosion welding between the parallel flanges. A full-surface metal-to-metal bond is thus obtained, which has very good current-conducting properties at the contact surfaces between the flanges (8, 9) and the cathode plate (2). The ends of the mounting rail (1) projecting over the cathode plate (2) have a flangeless design and have oblique surfaces (6, 7) intersecting in the shape of a wedge on the underside.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: March 11, 2003
    Assignee: KM Europa Metal AG
    Inventors: Gunter Knies, Reinhardt Ax
  • Patent number: 6521103
    Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: February 18, 2003
    Assignee: Surface Finishing Technologies, Inc.
    Inventors: John Scott Harris, Kam Sourivongs, Dale Jackson
  • Patent number: 6478937
    Abstract: An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: November 12, 2002
    Assignee: Applied Material, Inc.
    Inventors: Donald J. K. Olgado, Jayant Lakshmikanthan
  • Patent number: 6391170
    Abstract: An anode box sized and configured for retaining an anode plate therein is disclosed for use in an electrolytic tank of the type used for electrowinning or electrorefining. The anode box is unitarily formed, thereby rendering the device more resistant to degradation typically caused by the harsh environment of the electrolytic tank. The anode box is also formed with spacer structures which protect and isolate the anode plate from contact with the diaphragm, when used, and from contact with adjacent cathode frames. The anode box may include other elements, such as a port through which liberated gases may be withdrawn.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: May 21, 2002
    Assignee: EnviroTech Pumpsystems, Inc.
    Inventors: Forrest B. Day, Michael Rytting, Steven S. Davis
  • Patent number: 6365019
    Abstract: A basket, for use in the reduction of UO2 to uranium metal and in the electrorefining of uranium metal, having a continuous annulus between inner and outer perforated cylindrical walls, with a screen adjacent to each wall. A substantially solid bottom and top plate enclose the continuous annulus defining a fuel bed. A plurality of scrapers are mounted adjacent to the outer wall extending longitudinally thereof, and there is a mechanism enabling the basket to be transported remotely.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: April 2, 2002
    Assignee: The United States of America as represented by the Department of Energy
    Inventors: Steven D. Herrmann, Robert D. Mariani
  • Patent number: 6355148
    Abstract: A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pressurized air between the diaphragm and a backing plate. As the air is injected, and the diaphragm becomes more spheroid, the jaws are moved a substantially equal distance away from the center axis of the workholding region. The workpiece, which typically incorporates or is mounted on a circular shaft, is placed in the center of the workholding region, and the air pressure is removed, causing the diaphragm to return to its original flat shape and the jaws to snap back to their original positions resting against the shaft.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: March 12, 2002
    Assignee: Seagate Technology LLC
    Inventor: Dustin A. Cochran
  • Publication number: 20020023833
    Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.
    Type: Application
    Filed: June 13, 2001
    Publication date: February 28, 2002
    Inventors: Eiji Saito, Masatoshi Suzuki, Minoru Tazoe, Makoto Ito, Yuji Segawa
  • Patent number: 6350385
    Abstract: A method and apparatus turbulently exposes water flowing through a water system to a plurality of electrodes of an ion generator and provides a self-contained tank through which water flows. The generally cylindrical containment tank includes a tangential inlet pipe and an elliptical base having an outlet pipe. An aspect ratio, inlet pipe diameter versus containment tank diameter, is defined to achieve optimum ionization. A tank cover serves as the non-electrical conducting head for a plurality of electrodes which extend downwardly from the underside of the cover. The electrodes are functionally configured to maximize water flow between them. The rate of water flow within the containment tank is defined such that residence time of flow within the tank likewise optimizes water ionization. A sight glass allows for visualization of the container contents, and in particular anode wastage or wear, during operation.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: February 26, 2002
    Inventors: William Holt, John V. Kraft
  • Patent number: 6299745
    Abstract: A rack suitable for holding a flexible substrate panel, the rack having a plurality of clamps for providing current to a panel clamped to the rack, the clamps being positioned to uniformly distribute current to the substrate. Seven clamps are used to hold a flexible substrate panel bearing a copper seed or other conductive layer in place on the rack wherein one tautens the substrate while attaching the clamps so as to clamp the substrate in a “wrinkle free” manner. The seven clamps are arranged with 3 clamps on each of the left and right sides and one clamp on the bottom, the clamps making electrical contact with conductive layers of both the front and back surfaces of the substrate panel. The arrangement of the clamps provides adequate support to the substrate, provides for a good and uniform current distribution on the substrate, and allows a relatively large amount of current to flow through the panel without burning off the conductive/seed layers.
    Type: Grant
    Filed: May 3, 2000
    Date of Patent: October 9, 2001
    Assignee: Honeywell International Inc.
    Inventors: Raj Kumar, Cheryle Rattey
  • Patent number: 6267853
    Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: July 31, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Yezdi Dordi, Muhammad Atif Malik, Henan Hao, Timothy H. Franklin, Joe Stevens, Donald Olgado