Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.

Abstract: An electrolytic system for generating hydrogen gas includes a pair of electrodes and an electrolyte. The electrolyte includes colloidal silver, colloidal magnesium, and a nano-metal comprising nano-nickel, nano-iron or a nano-nickel-iron alloy. The electrodes include a first electrode of a non-magnetic material. A second electrode includes an electrode precursor of a magnetic material or an electro-magnet. When in its magnetic state, the electrode precursor exerts a magnetic force of sufficient strength to pull the nano-metal of the electrolyte onto at least a portion of its surfaces, to form the second electrode.

Abstract: The present invention relates to a device for contacting a wafer during submersion in a liquid. The device comprises a main body fixed to a transportation device; an electrical contact for contacting the wafer and a pressure element for pressing the electrical contact towards the wafer.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: Described herein is an apparatus is capable of generating hydrogen and oxygen gases from water containing little or no electrolyte. The apparatus includes a container and at least one electrolysis assembly comprising one or more permanent magnets which are covered with at least one pair of porous conductive electrodes separated by a non conductive insulator. The assembly is connected to the leads of a direct current power supply. After the container is filled with water to cover the electrodes, application of voltage from the power supply results in the generation of hydrogen and oxygen gases. This apparatus and method provides a means of producing and distributing hydrogen on-site, simply and inexpensively, since it uses very little energy and liquefaction, transportation, and delivery costs can be avoided.

Abstract: On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which moveably rests against the inner walls of the respective cavity by means of power-actuated guide elements (2), with the guide body being connected to a flexurally soft and torsionally stiff guide linkage (5) coupled to a feed and rotary drive. Control of the movement of the guide body is accomplished in dependence of at least one wall thickness measured with a measuring device (13, 14) during feed movement.

Abstract: A machining apparatus is provided. The machining apparatus includes a discharge machining head assembly and a slide assembly supporting the head assembly. The machining apparatus also includes an electromagnet configured to support the slide assembly in a position on a work piece to machine an area. The slide assembly permits linear displacement of the head assembly generally parallel to the supporting work piece surface.

Abstract: The present invention is an electropolishing/grinding device for an inner surface of a long tube, including at least one long tube, one electrode, at least two partitions, one fixed magnet mechanism, one driving apparatus and an axial driven mechanism. The fixed magnet mechanism and the driving apparatus form a magnetic levitation effect, which uses magnetic repulsiveness and magnetic attraction to keep the partitions away from the inner surface and avoid an eccentric situation. One of the two partitions has a plurality of springs, a plurality of protruding objects and a plurality of abrasive devices interconnected and firmly touching the inner surface of the tube for grinding.

Abstract: A component carrier for holding at least one component (12), in particular for surface coating by electrodeposition, having at least one holding magnet (31), the magnetic field lines of which run through the component (12) in a region close to a contact surface (36), having a diaphragm (16), which accommodates the at least one component (12) in a holding position (38) with respect to the at least one holding magnet (31) on at least one contact surface (36) of an electrically conductive housing (14), the pole axis of the at least one holding magnet (31) being positioned transversely with respect to the contact surface (36), in which component carrier a resulting magnetic holding force which acts on the at least one component (12) in the holding position (38) can be reduced by displacement of the at least one holding magnet (36) out of the holding position (38) or by displacement of the at least one component (12) out of the holding position (38) or by a relative movement of the at least one component (12) and